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revisions ltr description date (yr-mo-da) approved a drawing updated to reflect current requirements. - ro 02-04-18 r. monnin b make a change to footnote 1/ under table i. make changes to +v out test under table i. add new footnote 2/ to the ?v out test under table i. - ro 06-12-08 r. monnin c add device type 02 and rha desi gnator ?r? requirements. add case outline h. add paragraphs 1.4.1, 1.5, 3.2.3, 4.4.4.1, and table iib. make changes to 1.2, 1.2.2, 1.3, table i, and figure 1. add a footnote 4/ to the i s test as specified under table i. make changes to cmrr, psrr tests, footnote 1/ for device type 01 as specified under table i. - ro 09-12-09 c. saffle d in table i, add the word ?mode? after di sabled in the conditions column for i s test. in table i, add ? ? ? to v os , i ib , and i os max limits column. in table i, under footnote 4/, add the words ?disabled mode? at beginning of note. delete the burn in and group c end point limits from table iib. - ro 10-02-22 c. saffle e add device type 03 tested at low dose rate. make changes to paragraphs 1.2.2, 1.5, 4.4.4.1 and table i. - ro 11-09-08 c. saffle rev sheet rev sheet rev status rev e e e e e e e e e e e e of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 pmic n/a prepared by rick officer dla land and maritime columbus, ohio 43218-3990 http://www.landandmaritime.dla.mil standard microcircuit drawing this drawing is available for use by all departments and agencies of the department of defense checked by rajesh pithadia approved by michael frye microcircuit, linear, 160 mhz, rail-to-rail amplifier with disable, monolithic silicon drawing approval date 96-03-29 amsc n/a revision level e size a cage code 67268 5962-96839 sheet 1 of 12 dscc form 2233 apr 97 5962-e415-11
standard microcircuit drawing size a 5962-96839 dla land and maritime columbus, ohio 43218-3990 revision level e sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope. this drawing documents two product assurance cl ass levels consisting of high reliability (device classes q and m) and space application (device class v). a choice of case outli nes and lead finishes are available and are reflected in the part or identifying number (pin). when availabl e, a choice of radiation hardness assuranc e (rha) levels is reflected in the pin. 1.2 pin. the pin is as sh own in the following example: 5962 r 96839 02 v h a federal stock class designator rha designator (see 1.2.1) device type (see 1.2.2) device class designator case outline (see 1.2.4) lead finish (see 1.2.5) \ / (see 1.2.3) \/ drawing number 1.2.1 rha designator. device classes q and v rha marked devices meet the mil-prf-38535 specified rha levels and are marked with the appropriate rha designator. device class m rha marked devices meet the mil-prf-38535, appendix a specified rha levels and are marked with the appropriate rha designator. a dash (-) indicates a non-rha device. 1.2.2 device type(s). the device type(s) identify the circuit function as follows: device type generic number circuit function 01 ad8041 160 mhz rail-to-rail amplifier with disable 02 ad8041 radiation hardened, 160 mhz rail-to-rail amplifier with disable 03 ad8041 radiation hardened, 160 mhz rail-to-rail amplifier with disable 1.2.3 device class designator. the device class designato r is a single letter identifying the product assurance level as follows: device class device requirements documentation m vendor self-certification to the r equirements for mil-std-883 compliant, non- jan class level b microcircuits in accordance with mil-prf-38535, appendix a q or v certification and qua lification to mil-prf-38535 1.2.4 case outline(s). the case outline(s) are as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style p gdip1-t8 or cdip2-t8 8 dual-in-line h gdfp1-f10 or cdfp2-f10 10 flat pack 1.2.5 lead finish. the lead finish is as specified in mil-prf-38535 for device classes q and v or mil-prf-38535, appendix a for device class m.
standard microcircuit drawing size a 5962-96839 dla land and maritime columbus, ohio 43218-3990 revision level e sheet 3 dscc form 2234 apr 97 1.3 absolute maximum ratings. 1/ supply voltage ( +v s to ?v s ) ...................................................................................................... +12.6 v input common mode range (v in ) ................................................................................................. ? v s internal power dissipation (p d ) .................................................................................................... 1. 3 w 2/ junction temperature (t j ) ............................................................................................................ +175 ? c storage temper ature ra nge ................................................................................................... ........ -65 ? c to +125 ? c lead temperature range (soldering, 60 seconds) ........................................................................ +300 ? c thermal resistance, junction-to-case ( ? jc ) : case h .................................................................................................................... ................. 45 ? c/w case p .................................................................................................................... .................. 37 ? c/w thermal resistance, junction-to-ambient ( ? ja ) : case h .................................................................................................................... ................. 190 ? c/w case p .................................................................................................................... .................. 88 ? c/w 3/ 1.4 recommended operating conditions. supply voltage ( ? v s ) .................................................................................................................... ? 2.5 v (+5 v / 0 v) to ? 5 v operating ambient temperature range (t a ) ................................................................................. -55 ? c to +125 ? c 1.4.1 operating perfo rmance characteristics. input / output characteristics : (t a = +25 ? c, ? v s = ? 2.5 v, r l = 2 k ? to 0 v) output current (v o = -2 v to +2 v) ........................................................................................... 50 ma input common m ode voltage range .......................................................................................... -2.5 v to +1.5 v dynamic performance: (t a = +25 ? c, ? v s = ? 2.5 v, r l = 2 k ? to 0 v) -3 db small signal bandwidth (v o ? 0.5 v pp , g = 1) ................................................................. 160 mhz bandwidth for 0.1 db flatness (g = +2, r l = 150 ? ) ................................................................. 30 mhz slew rate (g = -1, v o = 2 v step) ............................................................................................. 160 v/ ? s full power response (v o = 2 v pp ) ........................................................................................... 24 mhz noise /distortion performance: (t a = +25 ? c, ? v s = ? 2.5 v, r l = 2 k ? to 0 v) total harmonic distortion (f c = 5 mhz, v o = 2 v pp , g = +2, r l = 1 k ? ) .................................. -72 db input voltage no ise (f = 10 khz) .......................................................................................... ...... 16 nv/ hz disable characteristics: (t a = +25 ? c, ? v s = ? 2.5 v, r l = 2 k ? to 0 v, v o = 2 v pp at 10 mhz, g = +2) turn off time (r f = r l = 2 k ? ) ................................................................................................. 120 ns turn on time (r f = r l = 2 k ? ) ................................................................................................. 230 ns off isolation ( disable pin tied to ?v s , r l = 100 ? , f = 5 mhz, g = +2, r f = 1 k ? ) .............. 70 db off voltage (dev ice disabl ed) ............................................................................................. ....... ? +v s ? 2.5 v on voltage ( device enabl ed) ............................................................................................... ...... open or +v s _____ 1/ stresses above the absolute maximum rating may cause pe rmanent damage to the device. extended operation at the maximum levels may degrade performance and affect reliability. 2/ maximum internal power dissipation is specified so that the junction temper ature does not exceed +175 ? c. in product application, additional power dissipation created by output load current must not allow internal power dissipation absolute maximum limit to be exceeded. 3/ derate at 9 mw/ ? c for t a ? 32 ? c.
standard microcircuit drawing size a 5962-96839 dla land and maritime columbus, ohio 43218-3990 revision level e sheet 4 dscc form 2234 apr 97 1.5 radiation features. device type 02: maximum total dose available (dose ra te = 50 ? 300 rads(s i)/s) .............................................. 100 krads(si) 4/ device type 03: maximum total dose available (dose rate ? 10 mrads(si)/s ) ..................................................... 50 krads(si) 5/ 2. applicable documents 2.1 government specification, standards, and handbooks. the following specificat ion, standards, and handbooks form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of thes e documents are those cited in t he solicitation or contract. department of defense specification mil-prf-38535 - integrated circuits, manufacturing, general specification for. department of defense standards mil-std-883 - test met hod standard microcircuits. mil-std-1835 - interface standard electronic component case outlines. department of defense handbooks mil-hdbk-103 - list of standard microcircuit drawings. mil-hdbk-780 - standard microcircuit drawings. (copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence. in the event of a conflict between the text of this drawing and the references cited herein, the te xt of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirements. the individual item requiremen ts for device classes q and v shall be in accordance with mil-prf-38535 and as specified herein or as modified in th e device manufacturer's qualit y management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described her ein. the individual item requirements for device class m shall be in accordance with mil-prf-38535, appendix a for non-jan class level b devices and as specified herein. 3.2 design, construction, and physical dimensions. the desig n, construction, and physical dim ensions shall be as specified in mil-prf-38535 and herein for device classes q and v or mil-prf-38535, appendix a and herein for device class m. 3.2.1 case outlines. the case outlines shall be in accordance with 1.2.4 herein. 3.2.2 terminal connections and block diagram. the terminal con nections and block diagram shall be as specified on figure 1. 3.2.3 radiation exposure circuit. the radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. _____ 4/ for device type 02, this part may be dose rate sensit ive in a space environment and may demonstrate enhanced low dose rate effects. radiation end point limits for the noted parameters are guaranteed only for the conditions specified in mil-std-883, method 1019, condition a. 5/ for device type 03, radiation endpoi nt limits for the noted parameters are guar anteed for the condition specified in mil-std-883, method 1019, condition d.
standard microcircuit drawing size a 5962-96839 dla land and maritime columbus, ohio 43218-3990 revision level e sheet 5 dscc form 2234 apr 97 3.3 electrical performance characteristics and postirradiati on parameter limits. unless otherwise specified herein, the electrical performance characteristics and pos tirradiation parameter limits are as specified in table i and shall apply over th e full ambient operating temperature range. 3.4 electrical test requirements. the electrical test requirements shall be the s ubgroups specified in table iia. the elect rical tests for each subgroup are defined in table i. 3.5 marking. the part shall be marked with the pin listed in 1.2 herein. in add ition, the manufacturer's pin may also be marked. for packages where marking of the entire smd pin is not feasible due to space limitat ions, the manufacturer has the option of not marking the "5962-" on the device. for rha produc t using this option, the rha des ignator shall still be marked. marking for device classes q and v shall be in accordance with mil-prf-38535. marking for device class m shall be in accordance with mil-prf-38535, appendix a. 3.5.1 certification/compliance mark. t he certification mark for device classes q and v shall be a "qml" or "q" as required i n mil-prf-38535. the compliance mark for device class m s hall be a "c" as required in mil-prf-38535, appendix a. 3.6 certificate of complianc e. for device classes q and v, a certificate of compliance shall be required from a qml-38535 listed manufacturer in order to supply to the requirements of th is drawing (see 6.6.1 herein). for device class m, a certifica te of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in mil-hdbk-103 (see 6.6.2 herein). the certificate of compliance submitted to dla land and maritime -va prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's pr oduct meets, for device classes q and v, the requirements of mil-prf-38535 and herein or for device class m, the requirements of mil-prf-385 35, appendix a and herein. 3.7 certificate of conf ormance. a certificate of confo rmance as required for device classes q and v in mil-prf-38535 or for device class m in mil-prf-38535, appendix a shall be provided wi th each lot of microcircuits delivered to this drawing. 3.8 notification of change for device class m. for device class m, notification to dla l and and maritime -va of change of product (see 6.2 herein) involving devices acquired to this dr awing is required for any change that affects this drawing. 3.9 verification and review for device class m. for devic e class m, dla land and maritime, dla land and maritime?s agent, and the acquiring activity retain the option to review the manufacturer's faci lity and applicable re quired documentation. offs hore documentation shall be made available on shore at the option of the reviewer. 3.10 microcircuit group assignment for device class m. de vice class m devices covered by this drawing shall be in microcircuit group number 49 (s ee mil-prf-38535, appendix a).
standard microcircuit drawing size a 5962-96839 dla land and maritime columbus, ohio 43218-3990 revision level e sheet 6 dscc form 2234 apr 97 table i. electrical performance characteristics. test symbol conditions 1/ 2/ 3/ -55 ? c ? t a ?? +125 ? c unless otherwise specified group a subgroups device type limits unit min max quiescent supply current i s 1,2,3 all 6.1 ma m,d,p,l,r 1 02 6.1 m,d,p,l 1 03 6.1 disabled mode 4/ 1,2,3 all 1.7 m,d,p,l,r 1 02 1.7 m,d,p,l 1 03 1.7 input offset voltage v os 1,2,3 all ? 9.5 mv m,d,p,l,r 1 02 ? 9.5 m,d,p,l 1 03 ? 9.5 common mode rejection ratio cmrr v cm = -1 v to 2.5 v 1,2,3 all 70 db m,d,p,l,r 1 02 70 m,d,p,l 1 03 70 power supply rejection ratio psrr v s = ? 2.5 v to ? 5.0 v 1,2,3 all 68 db m,d,p,l,r 1 02 68 m,d,p,l 1 03 68 input bias current i ib 1,2,3 all ? 3.4 ? a m,d,p,l,r 1 02 ? 3.4 m,d,p,l 1 03 ? 3.4 input offset current i os 1,2,3 all ? 0.7 ? a m,d,p,l,r 1 02 ? 0.7 m,d,p,l 1 03 ? 0.7 see footnotes at end of table.
standard microcircuit drawing size a 5962-96839 dla land and maritime columbus, ohio 43218-3990 revision level e sheet 7 dscc form 2234 apr 97 table i. electrical performanc e characteristics ? continued. test symbol conditions 1/ 2/ 3/ -55 ? c ? t a ?? +125 ? c unless otherwise specified group a subgroups device type limits unit min max open loop gain a ol r l = 1 k ? 1,2,3 all 15 kv/v m,d,p,l,r 1 02 15 m,d,p,l 1 03 15 positive output swing voltage +v out r l = 1 k ? 1,2,3 all 1.75 v m,d,p,l,r 1 02 1.75 m,d,p,l 1 03 1.75 r l = 50 ? 1,2,3 all 1.45 m,d,p,l,r 1 02 1.45 m,d,p,l 1 03 1.45 negative outp ut swing voltage -v out r l = 1 k ? 1,2,3 all -2.15 v m,d,p,l,r 1 02 -2.15 m,d,p,l 1 03 -2.15 r l = 50 ? 1,2,3 all -1.5 m,d,p,l,r 1 02 -1.5 m,d,p,l 1 03 -1.5 1/ unless otherwise specified, v s = ? 2.5 v and load resistance (r l ) = 2 k ? to 0.0 v. this is equivalent to +v s = +5 v, -v s = 0 v, and load resistance (r l ) = 2 k ? to 2.5 v. 2/ device type 02 supplied to this drawing has been characte rized through all levels m, d, p, l, r of irradiation. device type 03 supplied to this drawing has been characteriz ed through all levels m, d, p and l of irradiation. however, device type 02 is only tested at the r level and device type 03 is only tested at l level. pr e and post irradiation values a re identical unless otherwise specified in table i. when perfo rming post irradiation electrical measurements for any rha level, t a = +25 ? c. 3/ for device type 02, this part may be dose rate sensit ive in a space environment and may demonstrate enhanced low dose rate effects. radiation end point limits for the noted parameters are guaranteed only for the conditions specified in mil-std-883, method 1019, condition a for device type 02. device type 03 has been tested at a low dose rate. for device type 03, radiation endpoint limits for the noted parameters are guarant eed for the condition specified in mil-std-883, method 1019, condition d 4/ disabled mode: the device has an active low disable bar pin which can be used to three stat e the output of the part and also lower its supply current. if the disable bar pin is left fl oating, the part is enabled and will perform normally. if the dis able pin is pulled to 2.5 v (minimum) below the positive supply , the output of the device will be disabled and the i s supply current will drop to i s disabled specification in table i. for best isolation, the disable pin should be pulled to as low as possible, ideally the -v s supply rail.
standard microcircuit drawing size a 5962-96839 dla land and maritime columbus, ohio 43218-3990 revision level e sheet 8 dscc form 2234 apr 97 notes: nc = no connection. disable has an active low input. figure 1. terminal connections and block diagram.
standard microcircuit drawing size a 5962-96839 dla land and maritime columbus, ohio 43218-3990 revision level e sheet 9 dscc form 2234 apr 97 4. verification 4.1 sampling and inspection. for device classes q and v, sampling and inspection procedures shall be in accordance with mil-prf-38535 or as modified in the device manufacturer's q uality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or functi on as described herein. for device class m, sampling and inspection procedures shall be in accordance with mil-prf-38535, appendix a. 4.2 screening. for device classes q and v, screening shall be in accordance with mil-prf-38535, and shall be conducted on all devices prior to qualification and technology conform ance inspection. for device class m, screening shall be in accordance with method 5004 of mil-std-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 additional criteria for device class m. a. burn-in test, method 1015 of mil-std-883. (1) test condition b. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring acti vity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicab le, in accordance with the intent specified in method 1015 of mil-std-883. (2) t a = +125 ? c, minimum. b. interim and final electrical test parameter s shall be as specified in table iia herein. 4.2.2 additional criteria for device classes q and v. a. the burn-in test duration, test cond ition and test temperature, or approved alte rnatives shall be as specified in the device manufacturer's qm plan in accordance with mil-prf-3853 5. the burn-in test circuit shall be maintained under document revision level control of the device manufacturer's technology review board (trb) in accordance with mil-prf-38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, bi ases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of mil-std-883. b. interim and final electrical test parameter s shall be as specified in table iia herein. c. additional screening for device class v beyond the requ irements of device class q shall be as specified in mil-prf-38535, appendix b. 4.3 qualification inspection for device classes q and v. qualification inspection for device classes q and v shall be in accordance with mil-prf-38535. inspections to be performed sh all be those specified in mil-prf-38535 and herein for groups a, b, c, d, and e inspecti ons (see 4.4.1 through 4.4.4). 4.4 conformance inspection. technology conformance inspection for classes q and v shall be in accordance with mil-prf-38535 including groups a, b, c, d, and e inspections and as specified herein. quality conformance inspection for device class m shall be in accordance with mil-prf-38535, append ix a and as specified herein. inspections to be performed for device class m shall be those specified in method 5005 of mi l-std-883 and herein for groups a, b, c, d, and e inspections (see 4.4.1 through 4.4.4). 4.4.1 group a inspection. a. tests shall be as specif ied in table iia herein. b. subgroups 4, 5, 6, 7, 8, 9, 10, and 11 in table i, method 500 5 of mil-std-883 shall be omitted.
standard microcircuit drawing size a 5962-96839 dla land and maritime columbus, ohio 43218-3990 revision level e sheet 10 dscc form 2234 apr 97 table iia. electrical test requirements. test requirements subgroups (in accordance with mil-std-883, method 5005, table i) subgroups (in accordance with mil-prf-38535, table iii) device class m device class q device class v interim electrical parameters (see 4.2) --- --- 1 final electrical parameters (see 4.2) 1,2,3 1/ 1,2,3 1/ 1,2,3 2/ group a test requirements (see 4.4) 1,2,3 1,2,3 1,2,3 group c end-point electrical parameters (see 4.4) 1 1 1,2,3 2/ group d end-point electrical parameters (see 4.4) 1 1 1,2,3 group e end-point electrical parameters (see 4.4) --- 1 1 1/ pda applies to subgroup 1. 2/ delta limits as specified in table iib shall be computed with reference to the previous interim electrical parameters. de lta parameters are excluded from pda. table iib. burn-in and operating life test delta parameters. 1/ parameter delta limits units i s ? 1 ma v os ? 1 mv ? i ib ? 0.5 ? a 1/ deltas are perfo rmed at room temperature. 4.4.2 group c inspection. the group c in spection end-point electrical parameters sha ll be as specified in table iia herein. 4.4.2.1 additional criteria for device class m. st eady-state life test conditions, method 1005 of mil-std-883: a. test condition b. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in ac cordance with the intent specified in method 1005 of mil-std-883. b. t a = +125 ? c, minimum. c. test duration: 1,000 hours, except as permitted by method 1005 of mil-std-883.
standard microcircuit drawing size a 5962-96839 dla land and maritime columbus, ohio 43218-3990 revision level e sheet 11 dscc form 2234 apr 97 4.4.2.2 additional criteria for device classes q and v. the steady-state life test duration, test condition and test tempera ture, or approved alternatives shall be as spec ified in the device manufacturer's qm plan in accordance with mil-prf-38535. the test circuit shall be maintained under document revision level control by the device manufacturer's trb in accordance with mil-prf-38535 and shall be made available to the acquiring or prep aring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of mil-std-883. 4.4.3 group d inspection. the group d in spection end-point electrical parameters sha ll be as specified in table iia herein. 4.4.4 group e inspection. group e inspection is required onl y for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. end-point electrical parameters shall be as specified in table iia herein. b. for device classes q and v, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in mil-prf-38535 for the rha level being tested. for device class m, the devices shall be subjected to radiation hardness assured tests as specified in mil-prf-3 8535, appendix a for the rha level being tested. all device classes must meet the postirradiation end-point electr ical parameter limits as defined in table i at t a = +25 ? c ? 5 ? c, after exposure, to the subgroups specified in table iia herein. 4.4.4.1 total dose irradiation testing. total dose irradiation testing shall be performed in accordance with mil-std-883 method 1019, condition a for device type 02, condi tion d for device type 03, and as specified herein. 5. packaging 5.1 packaging requirements. the requi rements for packaging shall be in accordance with mil-prf-38535 for device classes q and v or mil-prf-38535, appendix a for device class m. 6. notes 6.1 intended use. microcircuits conforming to this drawi ng are intended for use for government microcircuit applications (original equipment), design applic ations, and logistics purposes. 6.1.1 replaceability. microcircuits covered by this drawin g will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 substitutability. device class q devices will replace device class m devices. 6.2 configuration control of smd's. all proposed changes to existing smd's wi ll be coordinated with the users of record for the individual documents. this coordination will be a ccomplished using dd form 1692, engineering change proposal. 6.3 record of users. military and indu strial users should inform dla land and maritime when a system application requires configuration control and which smd's are applicable to that syst em. dla land and maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectroni c devices (fsc 5962) should contact dla land and maritime -va, telephone (614) 692-0544. 6.4 comments. comments on this drawing should be direct ed to dla land and maritime -va, columbus, ohio 43218-3990, or telephone (614) 692-0540. 6.5 abbreviations, symbols, and definitions. the abbrevia tions, symbols, and definitions used herein are defined in mil-prf-38535 and mil-hdbk-1331.
standard microcircuit drawing size a 5962-96839 dla land and maritime columbus, ohio 43218-3990 revision level e sheet 12 dscc form 2234 apr 97 6.6 sources of supply. 6.6.1 sources of supply for device classes q and v. sour ces of supply for device classes q and v are listed in qml-38535. the vendors listed in qml-38535 have subm itted a certificate of compliance (s ee 3.6 herein) to dla land and maritime -va and have agreed to this drawing. 6.6.2 approved sources of supply for device class m. appr oved sources of supply for class m are listed in mil-hdbk-103. the vendors listed in mil-hdbk-103 have agreed to this drawin g and a certificate of complia nce (see 3.6 herein) has been submitted to and accepted by dla land and maritime -va.
standard microcircuit drawing bulletin date: 11-09-08 approved sources of supply for smd 5962-96839 are listed below for immediate acquisition information only and shall be added to mil-hdbk-103 and qml-38535 during th e next revision. mil-hdbk-103 and qml-38535 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been subm itted to and accepted by dla land and maritime -va. this information bulletin is superseded by the next dated revision of mil-hdbk-103 and qml-38535. dla land and maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/programs/smcr/ . standard microcircuit drawing pin 1/ vendor cage number vendor similar pin 2/ 5962-9683901mpa 24355 (2) ad8041sq 5962r9683902vha 24355 (4) ad8041sl/qmlr 5962r9683902vpa 24355 (4) ad8041sq/qmlr 5962l9683903vha 24355 (4) ad8041sl/qmll 1/ the lead finish shown for each pin representing a hermetic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine its availability. 2/ caution. do not use this number for item acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. vendor cage vendor name number and address 24355 analog devices (2) route 1 industrial park p.o. box 9106 norwood, ma 02062 point of contact: 804 woburn street wilmington, ma 01887-3462 24355 analog devices (4) route 1 industrial park p.o. box 9106 norwood, ma 02062 point of contact: 7910 triad center drive greensboro, nc 27409-9605 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin.

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