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TB6592FL/flg 2006-3-6 1 toshiba bi-cd integrated ci rcuit silicon monolithic TB6592FL/flg dual-bridge driver ic for dc motors the TB6592FL/flg is a dual-bridge driver ic for dc motors with output transistors in an ld mos structure with low on-resistance. two input signals, in1 and in2, can be used to select one of four modes such as cw, ccw, short brake, and stop mode. a pwm drive system supports high heat efficiency driving. features ? power supply voltage for motor: vm 6 v (max) ? power supply voltage for control: v cc = 2.7 v to 6.0 v ? output current: i out = 0.8 a (max) ? low on- resistor: 1.5 ? (typ.) (upper side + lower side combined @ vm = 5 v, v cc = 5 v) ? direct pwm control ? standby system (power saving) ? cw/ccw/short brake/stop function modes ? built-in thermal shutdown circuit ? small-size leadless package: qon24-p-0505-0.50 * this product has a mos structure and is sensitive to electrostatic discha rge. when handling this product, ensure that the environment is protecte d against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. weight: 0.05 g (typ.) TB6592FLg: the TB6592FLg is a pb-free product. the following conditions apply to solderability: *solderability 1. use of sn-37pb solder bath *solder bath temperature = 230 c *dipping time = 5 seconds *number of times = once *use of r-type flux 2. use of sn-3.0ag-0.5cu solder bath *solder bath temperature = 245 c *dipping time = 5 seconds *number of times = once *use of r-type flux
TB6592FL/flg 2006-3-6 2 block diagram pin functions pin name pin no functional description remarks gnd 21 small-signal gnd pin gnd for small-signal power supply (v cc ) ain1 18 control signal input 1 (channel a) ain2 17 control signal input 2 (channel a) apwm 16 pwm control signal input pin (channel a) input pwm signal astby 15 standby control input pin (channel a) channel a circuit is in standby (power save) state while this signal is low. ao1 13 output pin 1 (channel a) channel a connect to motor coil pin ao2 11 output pin 2 (channel a) channel a connect to motor coil pin pgnd 10 gnd pin for motor gnd for motor power supply (vm) vm 14 motor power supply pin vm (ope) = 2.5 v to 5.5 v bo2 8 output pin 2 (channel b) channel b connect to motor coil pin bo1 5 output pin 1 (channel b) channel b connect to motor coil pin bstby 4 standby control input pin (channel b) channel b circuit is in standby (power save) state while this signal is low. bpwm 3 pwm control signal input pin (channel b) input pwm signal bin2 2 control signal input 2 (channel b) bin1 1 control signal input 1 (channel b) v cc 22 small-signal power supply pin v cc (ope) = 2.7 v to 5.5 v note: pins 6, 7, 9, 12, 19, 20, 23 and 24 are nc (not connected) pins. v cc bstby bin1 bin2 bpwm bo1 bo2 vm gnd astby ain1 ain2 apwm ao1 ao2 pgnd control logic (channel b) control logic (channel a) bridge driver (channel b) bridge driver (channel a) tsd 22 1 2 3 4 5 8 14 21 18 17 16 15 13 11 10
TB6592FL/flg 2006-3-6 3 input/output function (common for channel a and b) input output in1 in2 stby pwm o1 o2 mode h h h h l l l short brake h l h cw/ccw l h h l l l short brake h h l ccw/cw h l h l l l short brake h l l h l off (high impedance) stop h h/l h/l l l off (high impedance) standby operating description ? pwm control function speed can be controlled by inputting the high-lev el or low-level pwm signal to the pin pwm. when pwm control is provided, normal operat ion and short brake operation are repeated. to prevent penetrating current, dead ti me (t2 and t4) is provided in the ic. note: be sure to set the pwm pin to high if the pwm control function is not used. vm gnd pwm on off t2 = 400 ns (typ.) out1 out2 m pwm on t5 vm gnd out1 out2 m vm gnd pwm off on t4 = 400 ns (typ.) out1 out2 m vm m gnd pwm on t1 out1 out2 vm gnd pwm off t3 out1 out2 m t2 gnd v m output voltage waveform (out1) t1 t3 t5 t4
TB6592FL/flg 2006-3-6 4 ? switching characteristics of output transistors the switching characteristics between the pwm in put and the output transi stors are shown below. < typical value > item typical value unit t plh 1000 t phl 1000 t r 100 t f 100 ns ? input pins input pins ain1, ain2, pwm, stby have internal pull-down resistors that are connected to ground. in1, in2, pwm stby output voltage (a01, a02, b01, b02) 90% 10% 50% t plh t r 50% t phl 90% 10% pwm input (apwm, bpwm) t f 100 k ? 100 k ? 100 k ? to next circuit v cc 100 k ? 200 k ? 100 k ? to next circuit v cc
TB6592FL/flg 2006-3-6 5 absolute maximum ratings (ta = 25c) characteristics symbol rating unit remarks vm 6 supply voltage v cc 6 v input voltage v in ? 0.2 to 6 v in1, 2, stby and pwm pins output current i out 0.8 a power dissipation p d 0.78 (note 1) w operating temperature t opr ? 20 to 85 c storage temperature t stg ? 55 to 150 c note 1: this rating is obtained when the product is m ounted on a 50 30 1.6 mm glass-epoxy pcb of which 40% or more is occupied by copper. operating range (ta = ? 20 to 85 c) characteristics symbol min typ. max unit supply voltage (v cc ) v cc 2.7 3.0 5.5 v supply voltage (vm) vm 2.2 ? 5.5 v output current iout ? ? 0.6 a pwm frequency fpwm ? ? 100 khz
TB6592FL/flg 2006-3-6 6 electrical characteristics (unless otherwise specified, v cc = 3 v, vm = 5 v, ta = 25c) characteristics symbol test condition min typ. max unit i cc (stp) stop mode ? 0.7 1.2 i cc (w) cw/ccw mode ? 0.7 1.2 i cc (sb) short break mode ? 0.7 1.2 ma i cc (stb) ? ? 10 supply current i m (stb) (standby mode) ? ? 1 a v inh 2 ? v cc + 0.2 v input voltage v inl ? 0.2 ? 0.8 hysteresis voltage v in (his) (not tested) ? 0.2 ? v i inh 5 15 25 control circuit input current i inl ? ? 1 a v insh 2 ? v cc + 0.2 v input voltage v insl ? 0.2 ? 0.8 v i insh 5 10 20 a standby circuit input current i insl ? ? 1 i o = 0.2 a, v cc = vm = 5 v ? 0.3 0.4 output saturating voltage v sat (u + l) i o = 0.6 a, v cc = vm = 5 v ? 0.9 1.2 v i l (u) ? ? 1 output leakage current i l (l) vm = 6 v ? ? 1 a v f (u) i o = 0.6 a ? 1 ? diode forward voltage v f (l) i o = 0.6 a ? 1 ? v pwm frequency f pwm ? ? 100 khz pwm control circuit minimum clock pulse width t w (pwm) ? ? 10 s tr ? 100 ? tf ? 100 ? t plh (pwm) ? 1000 ? output transistor switching t phl (pwm) (not tested) ? 1000 ? ns thermal shutdown circuit operating temperature t sd (not tested) ? 170 ? c thermal shutdown hysteresis ? t sd (not tested) ? 20 ? c
TB6592FL/flg 2006-3-6 7 typical application diagram note 1: the power supply capacitor should be connected as close as possible to the ic. note 2: when connecting the motor pins through the capacitor for reducing noise, connect a resistor to the capacitor to limit the charge current. note 3: avoid using common impedance for gnd and pgnd. note 4: utmost care is necessa ry in the design of the output, v cc , v m , and gnd lines since the ic may be destroyed by short-circuiting between outputs, air contamination f aults, or faults due to improper grounding, or by short-circuiting between contiguous pins. a in2 a in1 gnd ao1 ao2 a stb y tb6592 microcontroller gnd 3 v v dd vm vm note 2 note 3 port2 port3 port4 pgnd v cc a pwm pwm bo1 bo2 3~5 v port1 bin2 bin1 bstby port6 port7 port8 bpwm port5 note 1 note 1 m note 2 m pwm
TB6592FL/flg 2006-3-6 8 requests concerning use of qon outline drawing of package when using qon, take into account the following items. caution (1) do not carry out soldering on the island sections in the four corners of the package (indicated by the hatched sections in the figure for the lower surface, above left) with the aim of increasing mechanical strength. (2) the projecting island sections on the package surfaces (indicated by the hatched sections in the figures for the upper and lower surfaces above) must be electrically insulated fr om outside when used. note: ensure that the island sections (indicated by t he hatched sections in the fi gure for the lower surface, above left) do not come into contact with solder from through-holes on the board layout. ? when mounting or soldering, take care to ensure that neither static electricity nor electrical overstress is applied to the ic. (measures to prevent electrostatic di scharge, leaks, etc.) ? when incorporating the ic into a se t, adopt a set design that does not apply voltage directly to the island section. upper surface lower surface
TB6592FL/flg 2006-3-6 9 package dimensions weight: 0.05 g (typ.) do not carr y out solderin g at the four corners of the package.
TB6592FL/flg 2006-3-6 10 notes on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the device characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1] the absolute maximum ratings of a semiconductor de vice are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic fa ilure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, caus ing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse ca pacity, fusing time and in sertion circuit location, are required. [3] if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. [4] do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
TB6592FL/flg 2006-3-6 11 points to remember on handling of ics (1) thermal shutdown circuit thermal shutdown circuits do not necessarily prot ect ics under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or ic breakdown before operation. (2) heat radiation design in using an ic with large current flow such as power amp, regulator or dr iver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (t j ) at any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, de terioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation with peripheral components. (3) back-emf when a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back- emf. if the current sink capability of the power supply is small, the device?s motor power supply and output pins might be exposed to conditions beyond maximum ratings. to avoid this problem, take the effect of back-em f into consideration in system design.
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