protection products 1 www.semtech.com protection products smf05 and smf12 tvs diode array for esd and latch-up protection description features circuit diagram schematic & pin configuration revision 01/22/08 the smf series tvs arrays are designed to protect sen- sitive electronics from damage or latch-up due to esd and other voltage-induced transient events. they are designed for use in applications where board space is at a premium. each device will protect up to four lines. they are unidirectional devices and may be used on lines where the signal polarities are above ground. tvs diodes are solid-state devices designed specifically for transient suppression. they feature large cross-sec- tional area junctions for conducting high transient cur- rents. they offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. the smf series devices may be used to meet the immu- nity requirements of iec 61000-4-2, level 4. the small sc70 package makes them ideal for use in portable elec- tronics such as cell phones, pda?s, notebook comput- ers, and digital cameras. applications mechanical characteristics ? cellular handsets and accessories ? cordless phones ? personal digital assistants (pda?s) ? notebooks & handhelds ? portable instrumentation ? digital cameras ? peripherals ? mp3 players ? transient protection for data lines to iec 61000-4-2 (esd) 15kv (air), 8kv (contact) iec 61000-4-4 (eft) 40a (5/50ns) ? small package for use in portable electronics ? protects four i/o lines ? working voltage: 5v and 12v ? low leakage current ? low operating and clamping voltages ? solid-state silicon-avalanche technology ? eiaj sc70-5l package ? molding compound flammability rating: ul 94v-0 ? marking : marking code ? packaging : tape and reel per eia 481 1 2 34 5 2 1345 sc70-5l (top view)
2 ? 2008 semtech corp. www.semtech.com protection products smf05 and smf12 absolute maximum rating electrical characteristics g n i t a rl o b m y se u l a vs t i n u 0 2 / 8 = p t ( r e w o p e s l u p k a e p ) sp k p 0 0 2s t t a w i ( e g a t l o v d r a w r o f k a e p f 0 2 / 8 = p t , a 1 = ) sv p f 5 . 1 v ) r i a ( 2 - 4 - 0 0 0 1 6 c e i r e p d s e ) t c a t n o c ( 2 - 4 - 0 0 0 1 6 c e i r e p d s e v d s e 0 2 5 1 v k e r u t a r e p m e t g n i r e d l o s d a e lt l ) s d n o c e s 0 1 ( 0 6 2 o c e r u t a r e p m e t g n i t a r e p ot j 5 2 1 + o t 5 5 - o c e r u t a r e p m e t e g a r o t st g t s 0 5 1 + o t 5 5 - o c 2 1 f m s r e t e m a r a pl o b m y ss n o i t i d n o cm u m i n i ml a c i p y tm u m i x a ms t i n u e g a t l o v f f o - d n a t s e s r e v e rv m w r 2 1v e g a t l o v n w o d k a e r b e s r e v e rv r b i t a m 1 =3 . 3 1v t n e r r u c e g a k a e l e s r e v e ri r v m w r c 5 2 = t , v 2 1 =1a e g a t l o v g n i p m a l cv c i p p t , a 1 = p s 0 2 / 8 =9 1v e g a t l o v g n i p m a l cv c i p p t , a 8 = p s 0 2 / 8 =5 2v t n e r r u c e s l u p k a e pi p p t p s 0 2 / 8 =8a e c n a t i c a p a c n o i t c n u jc j d n a s n i p o / i n e e w t e b d n u o r g v r z h m 1 = f , v 0 = 0 65 7f p 5 0 f m s r e t e m a r a pl o b m y ss n o i t i d n o cm u m i n i ml a c i p y tm u m i x a ms t i n u e g a t l o v f f o - d n a t s e s r e v e rv m w r 5v e g a t l o v n w o d k a e r b e s r e v e rv r b i t a m 1 =6 v t n e r r u c e g a k a e l e s r e v e ri r v m w r c 5 2 = t , v 5 =0 1a e g a t l o v g n i p m a l cv c i p p t , a 1 = p s 0 2 / 8 =5 . 9v e g a t l o v g n i p m a l cv c i p p t , a 2 1 = p s 0 2 / 8 =5 . 2 1v t n e r r u c e s l u p k a e pi p p t p s 0 2 / 8 =2 1a e c n a t i c a p a c n o i t c n u jc j d n a s n i p o / i n e e w t e b d n u o r g v r z h m 1 = f , v 0 = 0 5 15 7 1f p
3 ? 2008 semtech corp. www.semtech.com protection products smf05 and smf12 typical characteristics non-repetitive peak pulse power vs. pulse time 0 10 20 30 40 50 60 70 80 90 100 110 0 25 50 75 100 125 150 ambient temperature - t a ( o c) % of rated power or i pp power derating curve pulse waveform smf05 insertion loss s21 0.01 0.1 1 10 0.1 1 10 100 1000 pulse duration - t p (s) peak pulse power - p pk (kw) 0 10 20 30 40 50 60 70 80 90 100 110 0 5 10 15 20 25 30 time (s) percent of i pp e -t td = i pp /2 waveform parameters: tr = 8s td = 20s 0 5 10 15 20 25 30 02468101214 peak pulse current - i pp (a) clamping voltage - v c (v) smf12 smf05 waveform parameters: tr = 8s td = 20s clamping voltage vs. peak pulse current capacitance vs. reverse voltage 0 20 40 60 80 100 120 140 160 0123456 reverse voltage - v r (v) capacitance - c j (pf) f = 1mhz smf05 start . 030 mhz 3 stop 000 . 000 000 mhz ch1 s21 log 6 db / ref 0 db
4 ? 2008 semtech corp. www.semtech.com protection products smf05 and smf12 typical characteristics (continued) smf05 esd clamping (8kv contact per iec 61000-4-2) smf12 esd clamping (8kv contact per iec 61000-4-2)
5 ? 2008 semtech corp. www.semtech.com protection products smf05 and smf12 smf circuit diagram protection of four unidirectional lines device connection for protection of four data lines the smfxx is designed to protect up to four unidirec- tional data lines. the device is connected as follows: 1. unidirectional protection of four i/o lines is achieved by connecting pins 1, 3, 4, and 5 to the data lines. pin 2 is connected to ground. the ground connection should be made directly to the ground plane for best results. the path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. circuit board layout recommendations for suppres- sion of esd. good circuit board layout is critical for the suppression of esd induced transients. the following guidelines are recommended: z place the smfxx near the input terminals or con- nectors to restrict transient coupling. z minimize the path length between the smfxx and the protected line. z minimize all conductive loops including power and ground loops. z the esd transient return path to ground should be kept as short as possible. z never run critical signals near board edges. z use ground planes whenever possible. matte tin lead finish matte tin has become the industry standard lead-free replacement for snpb lead finishes. a matte tin finish is composed of 100% tin solder with large grains. since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the pcb, the reflow profile will be determined by the requirements of the solder paste. therefore, these devices are compatible with both lead-free and snpb assembly techniques. in addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2 1345 applications information
6 ? 2008 semtech corp. www.semtech.com protection products smf05 and smf12 typical applications
7 ? 2008 semtech corp. www.semtech.com protection products smf05 and smf12 outline drawing - sc70 5l land pattern - sc70 5l ccc c 2x n/2 tips 2x e/2 12 n ei seating aaa c bbb c a-b d a bxn a2 a1 d a e1 d b e c plane detail l (l1) 01 0.15 plane gage c h a see detail a side view 3. dimensions "e1" and "d" do not include mold flash, protrusions or gate burrs. -b- controlling dimensions are in millimeters (angles in degrees). datums and to be determined at datum plane notes: 1. 2. -a- -h- reference jedec std mo-203, variation aa. 4. .083 bsc .026 bsc 5 .004 .045 .079 .049 .083 .006 - 5 0.10 1.25 2.10 2.10 bsc 0.65 bsc .053 1.15 2.00 .012 0.15 1.35 0.30 - 1.90 .075 0 .012 - .004 .010 .003 (.017) .014 - .028 .000 - - - .035 0.10 0.30 8 0 - 8 0.90 (0.42) 0.36 .018 .009 0.26 0.08 .043 .039 .004 0.00 0.70 - 0.22 0.46 - 0.10 1.10 1.00 - - 1.30 bsc .051 dim bbb ccc e l1 aaa 01 n e1 l c e1 e d a2 a1 b a millimeters nom inches dimensions min nom max min max e dimensions inches y z dim g p x c millimeters z .033 .106 .039 (.073) .026 .016 1.00 (1.85) 0.65 0.40 0.85 2.70 x dimensions inches y z dim g p x c millimeters this land pattern is for reference purposes only. consult your manufacturing group to ensure your company's manufacturing guidelines are met. notes: 1. c p g y
8 ? 2008 semtech corp. www.semtech.com protection products smf05 and smf12 marking codes ordering information r e b m u n t r a ph s i n i f d a e ll e e r r e p y t qe z i s l e e r c t . 5 0 f m sb p n s0 0 0 , 3h c n i 7 c t . 2 1 f m sb p n s0 0 0 , 3h c n i 7 t c t . 5 0 f m se e r f b p0 0 0 , 3h c n i 7 t c t . 2 1 f m se e r f b p0 0 0 , 3h c n i 7 r e b m u n t r a p g n i k r a m e d o c 5 0 f m s5 0 f 2 1 f m s2 1 f h c n a r b n a w i a t 0 8 3 3 - 8 4 7 2 - 2 - 6 8 8 : l e t fx a0 9 3 3 - 8 4 7 2 - 2 - 6 8 8 : h b m g d n a l r e z t i w s h c e t m e s h c n a r b n a p a j 0 5 9 0 - 8 0 4 6 - 3 - 1 8 : l e t 1 5 9 0 - 8 0 4 6 - 3 - 1 8 : x a f h c n a r b a e r o k tl e7 7 3 4 - 7 2 5 - 2 - 2 8 : f6 7 3 4 - 7 2 5 - 2 - 2 8 : x a ) . k . u ( d e t i m i l h c e t m e s 0 0 6 - 7 2 5 - 4 9 7 1 - 4 4 : l e t 1 0 6 - 7 2 5 - 4 9 7 1 - 4 4 : x a f e c i f f o i a h g n a h s t0 3 8 0 - 1 9 3 6 - 1 2 - 6 8 : l e 1 3 8 0 - 1 9 3 6 - 1 2 - 6 8 : x a f l r a s e c n a r f h c e t m e s 0 0 - 2 2 - 8 2 - 9 6 1 ) 0 ( - 3 3 : l e t 8 9 - 2 1 - 8 2 - 9 6 1 ) 0 ( - 3 3 : x a f f o y r a i d i s b u s d e n w o - y l l o h w a s i g a l a n o i t a n r e t n i h c e t m e s . a . s . u e h t n i s r e t r a u q d a e h s t i s a h h c i h w , n o i t a r o p r o c h c e t m e s h b m g y n a m r e g h c e t m e s 3 2 1 - 0 4 1 - 1 6 1 8 ) 0 ( - 9 4 : l e t 4 2 1 - 0 4 1 - 1 6 1 8 ) 0 ( - 9 4 : x a f contact information for semtech international ag
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