applications ? buck or boost inductor ? pdas ? desktop computer ? dvd players ? portable power devices ? output filter chokes ? test equipment instrumentation environmental data ? storage temperature range: -40c to +125c ? operating temperature range: -40c to +125c (with derated current) ? solder reflow temperature: j-std-020d compliant packaging ? supplied in tape and reel packaging, 600 parts per reel, 13? diameter reel halogen hf free description ? halogen free ? 125c maximum total temperature operation ? 9.5 x 12.7 x 5.21mm drum core ? ferrite core material ? inductance range from 1.0 h to 1000 h ? current range from 0.30 to 9.0 amps ? rohs compliant high power, drum inductors uni-pac? up2uc series 0609 bu09493 page 1 of 4 data sheet: 4369 smd device 1 open circuit inductance (ocl) test parameters: 100khz, 0.25v rms , 0.0adc 2i rms : dc current for an approximate t rise of 40c without core loss. derating is necessary for ac currents. pcb layout, trace thickness and width, air-flow and proximity of other heat generat- ing components will affect the temperature rise. it is recommended the part temperature not exceed 125c under worst case operating conditions verified in the end application. 3i sat : peak current for approximately 7.5% rolloff at 25c. 4 k-factor: used to determine b p-p for core loss (see graph). b p-p = k * l * i , b p-p : (gauss), k: (k-factor from table), l: (inductance in h), i (peak-to-peak ripple current in amps). 6 part number definition: up2cu-xxx-r ? up2cu = product code and size ? xxx= inductance value in h, r = decimal point. if no r is present, then third digit equals the number of zeros. ? ?-r? suffix = rohs compliant product specifications ocl 1 i rms 2 i sat 3 srf mhz dcr m @20c dcr m @20c part number 5 h 20% amps amps@25c typical typical maximum k-factor 4 up2uc-1r0-r 1.0 6.8 9.0 100 4.0 9.0 216 up2uc-1r5-r 1.5 6.4 8.0 90.0 4.4 10.0 177 up2uc-2r2-r 2.2 6.1 7.0 80.0 5.8 12.0 130 up2uc-3r3-r 3.3 5.4 6.4 65.0 9.9 15.0 114 up2uc-4r7-r 4.7 4.8 5.4 45.0 12.0 18.0 92.52 up2uc-6r8-r 6.8 4.4 4.6 38.0 25.8 27.0 77.72 up2uc-100-r 10.0 3.9 3.8 30.0 25.9 38.0 62.68 up2uc-150-r 15.0 3.1 3.0 27.0 35.4 46.0 49.82 up2uc-220-r 22.0 2.7 2.6 19.0 55.9 85.0 41.34 up2uc-330-r 33.0 2.1 2.0 15.0 81.6 100 34.09 up2uc-470-r 47.0 1.8 1.6 12.0 120 140 29.00 up2uc-680-r 68.0 1.5 1.4 10.0 145 200 24.59 up2uc-101-r 100 1.3 1.2 9.0 211 280 20.89 up2uc-151-r 150 1.0 1.0 6.0 347 400 15.80 up2uc-221-r 220 0.80 0.80 5.0 491 610 13.04 up2uc-331-r 330 0.60 0.60 4.5 750 1020 10.85 up2uc-471-r 470 0.50 0.50 3.5 1188 1270 9.39 UP2UC-681-R 680 0.40 0.40 2.5 1811 2020 7.56 up2uc-102-r 1000 0.30 0.30 2.0 2757 3000 6.13
user direction of feed section a-a up2uc- xxx wwllyy r 16 24 0.30 up2uc- xxx wwllyy r up2uc- xxx wwllyy r 13.4 9.70 4.40 4.0 2.0 1.5 dia. 1.75 11.5 5.5 top view side view bottom view recommended pad layout schematic 1 2 9.3 0 .2 8.4 0 .1 5 5.21 max 2.54 0 .2 7.62 typ 2.54 0 .2 2.92 ref 7.62 ref 2.79 ref 1 2 12.7 0 .2 5 up2uc- xxx wwllyy r dimensions - mm tolerances are 0.0254mm unless otherwise specified. 0 10 20 30 40 50 60 0 0.1 0.2 0.3 0.4 0.5 0.6 total loss (w ) temperature rise (c) part marking: up2uc xxx = inductance value in h (r = decimal point). if no ?r? is present, then the third digit equals the number of zeros. wwllyy = date code r = revision level supplied in tape-and-reel packaging, 600 parts per reel, 13? diameter reel. packaging information - mm 0609 bu09493 page 2 of 4 data sheet: 4369 temperature rise vs. total loss
0609 bu09493 page 3 of 4 data sheet: 4369 core loss core loss vs. b 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 10000 b (g a u s s ) core loss (w) 500khz 400khz 300khz 200khz 100khz p-p p-p % of ocl vs i sat 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0% 20% 40% 60% 80% 100% 120% 140% 160% 180% % of i sat % of ocl +25c -40c +85c inductance characteristics
0609 bu09493 page 4 of 4 data sheet: 4369 the only controlled copy of this data sheet is the electronic read-only version located on the cooper bussmann network drive. a ll other copies of this document are by definition uncon- trolled. this bulletin is intended to clearly present comprehensive product data and provide technical information that will he lp the end user with design applications. cooper bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution o f any products. cooper bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. once a product has been selected, it sh ould be tested by the user in all possible applications. life support policy: cooper bussmann does not authorize the use of any of its products for use in life support devices or syste ms without the express written approval of an officer of the company. life support systems are devices which support or sustain life, and whose failure to perform, when properly used in ac cordance with instructions for use provided in the label- ing, can be reasonably expected to result in significant injury to the user. north america cooper electronic technologies 1225 broken sound parkway nw suite f boca raton, fl 33487-3533 tel: 1-561-998-4100 fax: 1-561-241-6640 toll free: 1-888-414-2645 cooper bussmann p.o. box 14460 st. louis, mo 63178-4460 tel: 1-636-394-2877 fax: 1-636-527-1607 europe cooper electronic technologies cooper (uk) limited burton-on-the-wolds leicestershire ? le12 5th uk tel: +44 (0) 1509 882 737 fax: +44 (0) 1509 882 786 cooper electronic technologies avda. santa eulalia, 290 08223 terrassa, (barcelona), spain tel: +34 937 362 812 +34 937 362 813 fax: +34 937 362 719 asia pacific cooper electronic technologies 1 jalan kilang timor #06-01 pacific tech centre singapore 159303 tel: +65 278 6151 fax: +65 270 4160 solder reflow profile temperature t t p t s t c -5c time 25c to peak time 25c t smin t smax t l t p preheat a max. ramp up rate = 3c/s max. ramp down rate = 6c/s t t a a b b l l e e 1 1 - - s s t t a a n n d d a a r r d d s s n n p p b b s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me packa g emm 3 mm 3 thickne ss <350 > _ 350 <2.5mm 235 c 220 c > _ 2.5mm 220 c 220 c t t a a b b l l e e 2 2 - - l l e e a a d d ( ( p p b b ) ) f f r r e e e e s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me vol u me packa g emm 3 mm 3 mm 3 thickne ss <350 350 - 2000 >2000 <1. 6 mm 2 6 0 c 2 6 0 c 2 6 0 c 1. 6 ? 2.5mm 2 6 0 c 250 c 245 c >2.5mm 250 c 245 c 245 c reference jdec j-std-020d profile feat u re s tan d ar d s npb s ol d er lea d (pb) free s ol d er pr e h ea t a n d s o a k? t e mp e r a tur e min. (t smin ) 100 c 150 c ? t e mp e r a tur e m a x. (t sm a x ) 150 c 200 c ? tim e (t smin to t sm a x ) (t s ) 6 0-120 se con d s 6 0-120 se con d s a v e r a g e r a mp up r a t e t sm a x to t p 3 c / se con d m a x. 3 c / se con d m a x. liqui d ous t e mp e r a tur e (t l ) 183 c 217 c tim e a t liqui d ous (t l ) 6 0-150 se con d s 6 0-150 se con d s p ea k p a ck a g e b o d y t e mp e r a tur e (t p ) * t ab l e 1t ab l e 2 tim e (t p ) ** within 5 c of th e sp e cifi ed cl a ssific a tion t e mp e r a tur e (t c ) 20 se con d s ** 30 se con d s ** a v e r a g e r a mp- d own r a t e (t p to t sm a x ) 6 c / se con d m a x. 6 c / se con d m a x. tim e 25 c to p ea k t e mp e r a tur e6 minut e s m a x. 8 minut e s m a x. * tol e r a nc e for p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum. ** tol e r a nc e for tim e a t p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum. ? 2009 cooper bussmann st. louis, mo 63178 www.cooperbussmann.com
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