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1 zarlink semiconductor inc. zarlink, zl and the zarlink semiconductor logo are trademarks of zarlink semiconductor inc. copyright 2006, zarlink semiconductor inc. all rights reserved. features ? compatible with pop4 msa usage ? 4 transmit channels and 4 receive channels ? data rate up to 3.125 gbps per channel ? 850 nm vcsel array ? data i/o is cml compatible ? link reach with 50/125 m 500 mhz. km fiber, 300-m and 90-m at 2.5 and 3.125-gbps, respectively ? channel ber better than 10 -12 ? industry standard mpo/mtp ? ribbon fiber connector interface ? pluggable megarray ? connector ? laser class 1 m iec 60825-1:2001 compliant ? low power consumption, < 1 w ? power supply 3.3 v january 2006 ordering information zl60304mjda transceiver additional heatsink and emi shield options are available upon request 0 c to +80 c zl60304 parallel fiber optic transceiver (4 + 4) x 3.125 gbps data sheet figure 1 - transceiver block diagram pin array v cc tx v ee tx trans- impedance and limiting amplifier 0 1 2 3 dout0+ dout0- dout3+ dout3- vcsel array 0 1 2 3 din0+ din0- din3+ din3- sq_en rx_en rx_sd v cca rx v ee rx v ccb rx vcsel driver reset tx_en tx_dis vcsel driver controller fault rx0 rx1 rx2 rx3 tx3 tx2 tx1 tx0
zl60304 data sheet 2 zarlink semiconductor inc. applications ? high-speed interconnects within and between switches, routers and transport equipment ? server-server clusters, super-computing interconnections ? infiniband ? 4x-sx compliant ? fibre channel connections ? xaui based interconnections ? proprietary backplanes ? interconnects rack-to-rack, shelf-to-she lf, board-to-board, board-to-optical backplane description the zl60304 is a very high-speed transceiver for parallel fi ber applications. this transce iver performs e/o and o/e conversions for data transmission over multimode fiber ribbon. the zl60304 provides an effective solution for xaui transmissi on of optical fibre, provid ing advantages in terms of power consumption, edge and board density over competing solutions. the transmit section converts parallel electrical input si gnals via a laser driver and a vcsel array into parallel optical output signals at a wavelength of 850 nm. the receive section converts parallel optical input signals via a pin photodiode array and a transimpedance and limiting amplifier, into electrical output signals. the module is fitted with two pluggabl e industry-standard connector s. for the electrical interface, a 100 position fci megarray ? receptacle (fci pn: 84513-101) is used. fo r the optical interfac e, an industry-standard mtp tm (mpo) connector is used, which is compliant with iec 617 54-7. this provides ease of assembly on the host board and enables provisioning of bandwidth on demand.
zl60304 data sheet table of contents 3 zarlink semiconductor inc. features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 transmitter specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 transmitter control and status signal requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 transmitter control and status ti ming diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 receiver specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 receiver status signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 receiver status timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 transceiver module signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 transceiver pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 handling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 cleaning the optical interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 esd handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 link reach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 link model parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 electrical interface - appli cation examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
zl60304 data sheet 4 zarlink semiconductor inc. absolute maximum ratings not necessarily applied together. exceeding these valu es may cause permanent damage. functional operation under these conditions is not implied. recommended operating conditions figure 2 - recommended power supply filter parameter symbol min. max. unit supply voltage v cc -0.3 4.0 v differential input voltage amplitude 1 1. differential input voltage amplitude are peak to peak values . ? v2.4v voltage on any pin v pin -0.3 v cc + 0.3 v relative humidity (non-condensing) m os 595% storage temperature t stg -40 100 c esd resistance v esd 1 kv parameter symbol min. max. unit power supply voltage v cc 3.135 3.465 v operating case temperature t case 080 c signalling rate (per channel) 1 1. data patterns are to have maximum run lengths and dc balance shifts no worse than that of a pseudo random bit sequence of length 2 23 -1 (prbs-23). information on lower bit rates and longer run lengths are available on request. f d 1.0 3.125 gbps link distance 2 2. for maximum distance, see table 4. ld 2 m data i/o dc blocking capacitors 3 3. for ac-coupling, dc blocking capacitors external to the module with a minimum value of 100 nf is recommended. c blk 100 nf power supply noise 4 4. power supply noise is defined at the supply side of the recommended filter for all v cc supplies over the frequency range of 500 hz to 3200 mhz with the recommended power supply filter in place. v nps 200 mv p-p module vcc 0.1 f 1 h 10 f host vcc
zl60304 data sheet 5 zarlink semiconductor inc. transmitter specifications all parameters apply over ?recommended operating conditions? on page 4, unless otherwise stated. parameter symbol min. max. unit optical parameters launch power (50/125 mm mmf) 1 1. the average output optical power is compliant with iec 60825-1 amendment 2, class 1m accessible emission limits. p out -8 -2 dbm extinguished output power p off -30 dbm extinction ratio er 6 db optical modulation amplitude 2 2. informative. corresponds to p out = -8 dbm and er = 6 db. oma 0.19 mw center wavelength c 830 860 nm spectral width 3 3. spectral width is measured as defined in eia/tia-455-127 spectral characterization of multimode laser diodes . ? 0.85 nm rms relative intensity noise oma rin 12 oma -120 db/hz optical output rise time (20 - 80%) t ro 150 ps optical output fall time (20 - 80%) t fo 150 ps total jitter contributed (peak to peak) 4 4. total jitter is tp2 - tp1 as defined in ieee 802.3 clause 38.6 (gigabit ethernet). tj 0.30 ui deterministic jitter contributed (peak to peak) 4, 5 5. deterministic jitter is informative. comb ined random and deterministic jitter should be no higher than stated total jitter. dj 0.125 ui channel to channel skew 6 6. channel skew is defined for the condition of equal amplitude, zero ps skew signals applied to the transmitter inputs. t sk 150 ps electrical parameters power dissipation p d 500 mw supply current i cc 150 ma differential input voltage amplitude (peak to peak) 7 7. differential input voltage is defined as the peak to peak value of the differential voltage between din+ and din-. data inpu ts are cml compatible. ? v in 200 1600 mv p-p differential input impedance 8 8. differential input impedance is measured between din+ and din-. z in 80 120 ? electrical input ri se time (20 - 80%) t re 140 ps electrical input fall time (20 - 80%) t fe 140 ps
zl60304 data sheet 6 zarlink semiconductor inc. classified in accordance with ie c 60825-1/a2:2001, iec 60825-2: 2000 class 1m laser product emitted wavelength: 840 nm
zl60304 data sheet 7 zarlink semiconductor inc. transmitter control and status signal requirements the following table shows the timing re lationships of the status and contro l signals of the transmit section. parameter symbol min. typ. max. unit control input voltage high 1 1. applies to cont rol signals reset , tx_dis and tx_en. v ih 0.6v cc v cc +0.5 v control input voltage low v il -0.5 0.2v cc v control pull-up resistor 2 2. applies to cont rol signals reset and tx_en. internal pull-up resistor. r pu 20 50 k ? control pull-down resistor 3 3. applies to control signal tx_dis. internal pull-down resistor. r pd1 10 k ? status output voltage low 4, 5 4. applies to status signal fault . internal pull-down to v ee . 5. with status output sink current max. 2 ma. v ol 0.5 v status pull-down resistor 4 r pd2 10 k ? fault assert time t fa 100 s fault lasers off t fd 100 s reset duration t tdd 10 s reset assert time t off 510 s reset de-assert time t on 100 ms tx_en assert time t ten 1ms tx_en de-assert time t td 510 s tx_dis assert time t td 510 s tx_dis de-assert time t ten 1ms
zl60304 data sheet 8 zarlink semiconductor inc. transmitter control and status timing diagrams the following figures show the timing relationships of the status and control sign als of the transmit section. figure 3 - transmitter power-up sequence figure 4 - transmitter fault signal timing diagram reset: floating or high transmitter not ready normal operation v cc t ten tx output [0:3] data [0:3] no fault fault fault t fa t fd tx output [0:3] data [0:3]
zl60304 data sheet 9 zarlink semiconductor inc. figure 5 - transmitter reset signal timing diagram figure 6 - transmitter enable and disable timing diagram tx_dis high tx_dis low tx_en high transmitter disabled normal operation tx_en low transmitter disabled transmitter disabled table 1 - truthtable for transmitter operation (pre-condition: reset floating or high) transmitter not ready normal operation fault t on tx output [0:3] data [0:3] reset t tdd tx_en data [0:3] lasers off t td normal operation tx off tx_dis lasers off data [0:3] t td normal operation tx off data [0:3] tx_en t ten normal operation transmitter not ready
zl60304 data sheet 10 zarlink semiconductor inc. receiver specifications all parameters apply over ?recommended operating conditions? on page 4, unless otherwise stated. . parameter symbol min. max. unit optical parameters unstressed receiver sensitivity 1 1. receiver sensitivity is measured using a source that does not degrade the sensitivity measurement, i.e. an ideal source. rec eive sensitivity for a channel is measured for a ber of 10 -12 and worst case extinction ratio. p in (min) is measured using a fast rise/fall time source with low rin and adjacent channel(s) operating with incident power of 6 db above p in (min). p in -14 -2 dbm center wavelength c 830 860 nm return loss 2 2. return loss is measured as defined in tia/eia-455-107a determination of component reflectance or link/system return loss us- ing a loss test set. rl 12 db stressed receiver sensitivity 3 3. based on specified unstressed receiver sensitivity and gigabit ethernet link model,?link model parameters? on page 15. p ss -10.9 dbm total link jitter contribution 4 4. total jitter is tp4-tp1 values. tj l 0.50 ui deterministic link jitter contribution 5 5. deterministic jitter is informative. comb ined random and deterministic jitter should be no higher than stated total jitter. dj l 0.20 ui channel to channel skew 6 6. channel skew is defined for the condition of equal amplitude, zero ps skew signals applied to the receiver inputs. t sk 150 ps signal detect assert p sa -16 dbm signal detect de-assert p sd -31 dbm electrical parameters power dissipation p d 500 mw supply current i cc 150 ma differential output voltage amplitude (peak to peak) 7 7. differential output voltage is defined as the peak to peak value of the differential voltage between dout+ and dout- and mea sured with a 100 w differential load connected between dout+ and dout-. data outputs are cml compatible. ? v out 400 800 mv p-p output differential load impedance 8 8. see figure 10. z l 80 120 ? electrical output rise time (20 - 80%) t re 150 ps electrical output fall time (20 - 80%) t fe 150 ps
zl60304 data sheet 11 zarlink semiconductor inc. receiver status signal the following table shows the timing re lationships of the status and control signals of the receive section. receiver status timing diagrams the following figures show the timing relationships of the status and control sign als of the receive section. figure 7 - receiver enable signal timing diagram parameter symbol min. typ. max. unit control input voltage high 1 1. applies to control signals rx_en, sq_en. v ih 2.0 v control input voltage low 1 v il 0.9 v control input pull-up current 1 ? i in ? 10 100 a status output voltage low 2, 3 2. applies to status signal rx_sd. internal pull-up to v cc . 3. with status output sink current max 2 ma. v ol 0.4 v status output pull-up resistor 2 r pu 3.25 k ? receiver signal detect assert time t sd 50 200 s receiver signal detect de-assert time t los 50 200 s receiver enable assert time t rxen 33 ms receiver enable de-assert time t rxd 5 s normal operation rx off rx_en t rxd i cc
zl60304 data sheet 12 zarlink semiconductor inc. figure 8 - receiver signa l detect timing diagram transceiver module signals the pluggable parallel optical transceiver uses a 100 position fci megarray electrical connector (fci pn: 84513-101), and an industry standard mtp ?( mpo) optical receptacle compliant with iec 61754-7. kjhgfedcba 1 dout00- v ee rx dout03+ v ee rx v ee rx v ee tx v ee tx din03- v ee tx din00+ 2 dout00+ v ee rx dout03- v ee rx v ee rx v ee tx v ee tx din03+ v ee tx din00- 3 v ee rx v ee rx v ee rx v ee rx v ee rx v ee tx v ee tx v ee tx v ee tx v ee tx 4 dout01+ v ee rx dout02- nic nic nic nic din02+ v ee tx din01- 5 dout01- v ee rx dout02+ nic nic nic nic din02- v ee tx din01+ 6 v ee rx v ee rx v ee rx nic nic nic nic v ee tx v ee tx v ee tx 7 v ccb rx v ccb rx v ccb rx nic nic nic nic v cc tx v cc tx v cc tx 8 nic dnc dnc dnc rx_en tx_dis tx_en dnc dnc dnc 9 nic dnc dnc sd sq_en reset fault dnc dnc dnc 10 v cca rx v cca rx v ee rx nic nic nic nic v ee tx v cc tx v cc tx table 2 - transceiver pinout assignments (top view, toward mpo/mtp ? connector end) (10x10 array, 1.27 mm pitch) module front view - mtp key up tx0 tx1 tx2 tx3 ???? rx3 rx2 rx1 rx0 host printed circuit board table 3 - transceiver optical channel assignment signal no signal rx_sd t los
zl60304 data sheet 13 zarlink semiconductor inc. transceiver pin description the transceiver module case is electrically isolated fr om transmitter signal common and receiver signal common. connection through mounting screw holes or frontplate wh ichever is applicable. make the appropriate electrical connection for emi shield integrity. signal name type description comments din[0:3] +/- data input transmitter data in, channel 0 to 3 internal differential termination at 100 ?. v cc tx transmitter power supply rail v ee tx transmitter signal common. all transmitter voltages are referenced to this potential unless otherwise stated. directly connect these pads to the pc board transmitter signal ground plane. tx_en control input transmitter enable. high: normal operation low: disable transmitter active high, internal pull-up. see table 1. tx_dis control input transmitter disable. high: disable transmitter low: normal operation active high, internal pull- down. see table 1. fault status output transmitter fault. high: normal operation low: laser fault detected on at least one channel when active, all channels are disabled. clear by reset signal. internal pull-up. reset control input transmitter reset. high: normal operation low:reset to clear fault signal internal pull-up. dout[0:3] +/- data output receiver data out, channel 0 to 3. v cca rx pin preamplifier power supply rail. v ccb rx receiver quantizer power supply rail. v ee rx receiver signal common. all receiver voltages are referenced to this potential unless otherwise stated. directly connect these pads to the pc board receiver signal ground plane. rx_en control input receiver enable. high: normal operation low: disable receiver internal pull-up. rx_sd status output receiver signal detect. high: valid optical input on all channels low: loss of signal on at least one channel internal pull-up. sq_en control input squelch enable. high: squelch function enabled. data out is squelched on any channels that have loss of signal low: squelch function disabled internal pull-up. dnc do not connect to any potential, including ground. nic no internal connection.
zl60304 data sheet 14 zarlink semiconductor inc. v cca and v ccb rx can be connected to the same power supply. however, to insure maximum receiver sensitivity and minimize the impact of noise fr om the power supply, it is recommended to keep the power supplies separate and to use the recommended power supply filtering network on v cca rx, see figure 2. handling instructions cleaning the optical interface a protective connector plug is supplied with each module . this plug should remain in place whenever a fiber cable is not inserted. this will keep the op tical port free from dust or other cont aminants, which may potentially degrade the optical signal. before re attaching the connector plug to the module, visually inspect the plug and remove any contamination. if the module?s optic al port becomes contaminated, it can be cleaned with high-pressure nitrogen (the use of fluids, or physical contact, is not advised due to potential for damage). before a fiber cable connector is attached to the module, it is recommended to clean the fiber cable connector using an optical connector cleaner, or according to the c able manufacturer's instructions. it is also recommended to clean the optical port of the m odule with high-pressure nitrogen. connectors for optimum performance, it is reco mmended that the number of insertions is limited to 50 for the electrical megarray connector and 200 for the optical mpo/mtp connector. esd handling when handling the modules, precautions for esd sensitiv e devices should be taken. these include use of esd protected work areas with wrist stra ps, controlled work-benches, floors etc.
zl60304 data sheet 15 zarlink semiconductor inc. link reach the following table lists the minimum reach distance of t he pluggable parallel fiber op tic transceiver for different multi-mode fiber (mmf) types and bandwidths based on the gigabit ethernet link model version 2.3.5. each case allows for a maximum of 2 db per channel connection lo ss for patch cables and other connectors and assumes worst case on all input parameters. link model parameters the link reaches above have been calculated using the following link model paramete rs and gigabit ethernet link model version 2.3.5 (filename: 5pmd047.xls). fiber type [core / cladding m] modal bandwidth @ 850 nm [mhz*km] reach distance @ 2.5 gbps [m] reach distance @ 2.7 gbps [m] reach distance @ 3.125 gbps [m] 50/125 mmf 400 260 230 80 50/125 mmf 500 300 270 90 table 4 - link reach for different fiber types and data rates longer operating distance than the r ange specified here can be achieved using transmitters, receivers and / or cables meeting specification but per forming better than worst case. parameter symbol value unit mode partition noise k-factor k 0.3 modal noise mn 0.3 db dispersion slope parameter s o 0.11 ps/nm 2 *km wavelength of zero dispersion u o 1320 nm attenuation coefficient at 850 nm db 3.5 db/km conversion factor c1 480 ns.mhz q-factor [ber 10 -12 ] q 7.04 tp4 eye opening 0.3 ui dcd allocation at tp3 dcd dj 0.08 ui rms baseline wander s.d. blw 0.025 rin coefficient k rin 0.70 conversion factor c_rx 329 ns.mhz
zl60304 data sheet 16 zarlink semiconductor inc. electrical interface - application examples figure 9 - recommended differential cml input interface figure 10 - recommended differ ential cml output interface trademarks infiniband is a registered trademark of the infiniband trade association. mtp is a registered trademark of us conec ltd. the megarray is a registered trademark of fci. z out =100 ? differential recommended cml output z 0 =100 ? differential z in =100 ? differential transmitter cml input 100nf 100nf host pcb receiver cml output z 0 =100 ? differential z term =100 ? differential recommended cml input 100nf 100nf host pcb z l
front view ( 2 : 1 ) ? zarlink semiconductor 2002. all rights reserved. issue acn date apprd. previous package codes title drawing type package code projection method js004296 mj 27,64 36,87 4 , 3 7 , 5 5 3 , 2 6 31,75 7,48 18,16 1 , 1 4 5 1 3 , 7 2 1 7 , 5 a c b a10 a1 0,58 n ` 0,05 j n 0,05 a b-c n 3,63 j n 0,15 m a 2-56 unc-2b 3,50 deep min j n 0,15 m a b-c j n 0,15 m a b-c 14,4 j n 0,15 m a b-c notes:- 1. all dimensions in mm. 2. tolerancing per asme y14.5m-1994. 1 js004296r1a 12-jun-03 td/be md/ma 24-jan-04 js004296 rev.2 2 3 js004296 rev.3 24-jan-05 md/ma package drawing - module layout 1 2 , 2 3 1 2 , 5 2-56 unc-2b n 1,3 n 2,5 0 , 9 8 0 , 7 6 30,23
? zarlink semiconductor 2002. all rights reserved. issue acn date apprd. previous package codes title drawing type package code projection method js004296 mj a1 a10 k1 k10 14,4 17,5 1,145 13,72 5 , 1 5 ` 0 , 2 5 1 8 , 1 6 3 0 , 2 3 3 1 , 7 5 3 5 , 3 1 ` 0 , 7 5 a b c j n 0,1 a b-c j n 0,1 a b-c j n 0,1 a b-c j n 0,05 a b-c j n 0,1 a j n 0,1 a b-c ( n 2,69 ` 0,12 hole) n 1,70 ` 0,12 holes n 3,00 min pads, keep out n 0,58 ` 0,05 pads n 2,69 ` 0,12 hole n 4,30 min pads (3x), keep out notes:- 1. all dimensions in mm. 2. tolerancing per asme y14.5m-1994. max product outline component keep-out area. 1 js004296r1a 12-jun-03 td/be md/ma 24-jan-05 js004296 rev.2 2 package drawing, host circuit board footprint layout 3 js004296 rev.3 14-feb-05 md/ma
www.zarlink.com information relating to products and services furnished herein by zarlink semiconductor inc. or its subsidiaries (collectively ?zarlink?) is believed to be reliable. however, zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from t he application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. neither the supply of such information or purchase of product or service conveys any license, either express or implied, u nder patents or other intellectual property rights owned by zarlink or licensed from third parties by zarlink, whatsoever. purchasers of products are also hereby notified that the use of product in certain ways or in combination with zarlink, or non-zarlink furnished goods or services may infringe patents or other intellect ual property rights owned by zarlink. this publication is issued to provide information only and (unless agreed by zarlink in writing) may not be used, applied or re produced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. the products, t heir specifications, services and other information appearing in this publication are subject to change by zarlink without notice. no warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. it is the user?s responsibility t o fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not b een superseded. manufacturing does not necessarily include testing of all functions or parameters. these products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. all products and materials are sold and services provided subject to zarlink?s conditi ons of sale which are available on request. purchase of zarlink?s i 2 c components conveys a licence under the philips i 2 c patent rights to use these components in and i 2 c system, provided that the system conforms to the i 2 c standard specification as defined by philips. zarlink, zl and the zarlink semiconductor logo are trademarks of zarlink semiconductor inc. copyright zarlink semiconductor inc. all rights reserved. technical documentation - not for resale for more information about all zarlink products visit our web site at

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