draft draft draft draft 1 of 10 optimum technology matching? applied gaas hbt ingap hbt gaas mesfet sige bicmos si bicmos sige hbt gaas phemt si cmos si bjt gan hemt not for new desig n s functional block diagram rf micro devices?, rfmd?, optimum technology matching?, enabling wireless connectivity?, powerstar?, polaris? total radio? and ultimateblue? are trademarks of rfmd, llc. bluetooth is a trade- mark owned by bluetooth sig, inc., u.s.a. and licensed for use by rfmd. all other trade names, trademarks and registered tradem arks are the property of their respective owners. ?2006, rf micro devices, inc. product description 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . ordering information rf in rf out vcc1 nc nc vmode nc vreg nc gnd vcc2 vcc2 vcc2 nc vcc2l nc 16 15 14 13 1 2 3 4 8 7 6 5 9 10 11 12 bias rf6263 3v 900mhz linear power amplifier module the rf6263 is a high-power, high-efficiency linear amplifier module spe- cifically designed for 3v handheld systems. the device is manufactured on an advanced third generation gaas hbt process, and was designed for use as the final rf amplifier in 3v is-95/cdma2000-1x/ amps handheld digital cellular equipm ent, spread-spectrum systems, and other applications in the 824mhz to 849mhz band. the rf6263 has a digital control pin which when enabled will allow the amplifier to operate up to 19dbm output power with reduced current consumption. the low power mode current consumption can be reduced by more than 50% that of a standard power amplifier. the rf6263 is assembled in a 16-pin, 3mmx3mm, qfn package. features ? input internally matched@50 ? ? output internally matched ? 23% linear efficiency @ 19dbm ? 40% linear efficiency @ 28dbm ? -50dbc acpr @ 885khz ? 18ma idle current in lpm applications ? 3v cdma/amps cellular handset ? 3v cdma2000/1xrtt cellu- lar handset ? 3v cdma2000/1x-ev-do us- cellular handset ? spread-spectrum system rf6263 3v 900mhz linear power amplifier module rf6263pcba-41x fully assembled evaluation board ds101122 not for new designs ? rohs compliant & pb-free product package style: qfn, 16-pin, 3x3
draft draft draft draft 2 of 10 rf6263 ds101122 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . not for new desig n s absolute maximum ratings parameter rating unit supply voltage (rf off) +8.0 v supply voltage (p out ? 31 dbm) +5.2 v control voltage (v reg )+3.9v input rf power +10 dbm mode voltage (v mode )+3.9v operating temperature -30 to +110 c storage temperature -40 to +150 c moisture sensitivity level (ipc/jedec j-std-20) msl 2 @ 260c parameter specification unit condition min. typ. max. high power mode - cdma (v mode low) t=25 o c ambient, v cc =3.4v, v reg =2.8v, v mode =0v, and p out =28dbm for all parame- ters (unless otherwise specified). operating frequency range 824 849 mhz linear gain 28 db second harmonics -35 -30 dbc third harmonics -40 -30 dbc maximum linear output 28 linear efficiency 40 % maximum i cc 465 ma acpr @ 885 khz -50 dbc acpr @ 1.98mhz -58 dbc input vswr 2:1 stability in band 6:1 no oscillation>-70dbc stability out of band 10:1 no damage noise power -133 dbm/hz at 45mhz offset. low power mode - cdma (v mode high) t=25 o c ambient, v cc =3.4v, v reg =2.8v, v mode =2.8v, and p out =19dbm for all param- eters (unless otherwise specified). operating frequency range 824 849 mhz linear gain 18 db maximum linear output 19 linear efficiency 23 % maximum i cc 100 ma 70 ma p out =16dbm acpr @885 khz -49 dbc acpr @1.98mhz -62 dbc input vswr 2:1 output vswr stability 6:1 no oscillation>-70dbc 10:1 no damage caution! esd sensitive device. exceeding any one or a combination of the absolute maximum rating conditions may cause permanent damage to the device. extended application of absolute maximum rating conditions to the device may reduce device reliability. specified typical perfor- mance or functional operation of the devi ce under absolute maximum rating condi- tions is not implied. rohs status based on eudirective2002/95/ec (at time of this document revision). the information in this publication is believed to be accurate and reliable. however, no responsibility is assumed by rf micro devices, inc. ("rfmd") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. no license is granted by implication or otherwise under any patent or patent rights of rfmd. rfmd reserves the right to change component circuitry, recommended appli- cation circuitry and specifications at any time without prior notice.
draft draft draft draft 3 of 10 not for new desig n s rf6263 ds101122 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . parameter specification unit condition min. typ. max. fm mode t=25 o c ambient, v cc =3.4v, v reg =2.8v, v mode =0v, and p out =30.5dbm for all param- eters (unless otherwise specified). operating frequency range 824 849 mhz amps maximum output power 30.5 dbm amps efficiency 50 % amps gain 28 amps second harmonics -35 -30 dbc amps third harmonics -40 -30 dbc power supply supply voltage 3.2 3.4 4.2 v high gain idle current 55 ma v mode =low and v reg =2.8v low gain idle current 18 ma v mode =high and v reg =2.8v v reg current 2.5 ma v mode =high v mode current 500 ua rf turn on/off time 6 us dc turn on/off time 40 us total current (power down) 0.2 2.0 ua v reg low voltage 0 0.5 v v reg high voltage (recommended) 2.75 2.85 2.95 v v reg high voltage (operational) 2.7 3.0 v v mode voltage 0 0.5 v high gain mode 2.0 3.0 v low gain mode
draft draft draft draft 4 of 10 rf6263 ds101122 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . not for new desig n s package drawing pin function description interface schematic 1nc no connection. do not connect this pin to any external circuit. 2vreg regulated voltage supply for amplifier bias circuit. in power down mode, both v reg and v mode need to be low (<0.5v). 3vmode for nominal operation (high power mode), v mode is set low. when set high, devices are biased lower to improve efficiency. 4rf in rf input internally matched to 50 ? . this input is internally ac-coupled. 5vcc1 first stage collector supply. a 2200pf and 4.7 ? f decoupling capacitor are required. 6nc no connection. do not connect this pin to any external circuit. 7nc no connection. do not connect this pin to any external circuit. 8nc no connection. do not connect this pin to any external circuit. 9vcc2 high power output stage collector supply. refer to schematic for required external components. 10 vcc2 same as pin 9. 11 vcc2 same as pin 9. 12 rf out rf output. internally ac-coupled. 13 nc no connection. do not connect this pin to any external circuit. 14 vcc2l low power output stage collector supply. refer to schematic for required external components. 15 nc no connection. do not connect this pin to any external circuit. 16 nc no connection. do not connect this pin to any external circuit. pkg base gnd ground connection. the backside of the package should be soldered to a top side ground pad which is connected to the ground plane with multiple vias. the pad should have a short thermal path to the ground plane. b 3.00 a 3.00 pin 1 id 2 plcs 0.15 c 2 plcs 0.15 c 0.203 ref 0.102 ref 0.08 c c 0.08 c 0.925 0.775 1.45 0.05 0.28 0.18 typ pin 1 id 0.50 typ 0.40 0.20 typ 0.10 c ab m 1.45 shaded areas represent pin 1. dimensions in mm.
draft draft draft draft 5 of 10 not for new desig n s rf6263 ds101122 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . evaluation board schematic - cdma 16 15 14 13 1 2 3 4 8 7 6 5 9 10 11 12 bias c3 2200 pf c30 4.7 ? f vreg vmode c40 4.7 ? f j1 rf in vcc1 c2 100 pf c6 dni l1 2.2 nh c1 2200 pf j2 rf out gnd p1-3 vre g p1-5 vmode gnd gnd p1 1 2 3 4 5 con5 p2 1 2 3 4 5 con5 gnd p2-3 vcc1 gnd gnd p2-5 vcc2 r1 dni c20 4.7 ? f vcc2 c4 2200 pf c10 22 ? f
draft draft draft draft 6 of 10 rf6263 ds101122 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . not for new desig n s pcb design requirements pcb surface finish the pcb surface finish used for rfmd?s qualification process is electroless nickel, immersion gold. typical thickness is 3 ? inch to 8 ? inch gold over 180 ? inch nickel. pcb land pattern recommendation pcb land patterns for pfmd components are based on ipc-73 51 standards and rfmd empirical data. the pad pattern shown has been developed and tested for optimized assembly at rf md. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes va ry from company to company, careful process development is recommended. pcb metal land pattern a = 0.64 x 0.28 (mm) typ. b = 0.28 x 0.64 (mm) typ. c = 0.64 x 1.28 (mm) d = 1.50 (mm) sq. dimensions in mm. a d a a a b b b b c a b b b b pin 8 pin 12 pin 1 pin 16 1.50 typ. 0.50 typ. 0.50 typ. 0.55 typ. 0.75 typ. 0.55 typ. 1.00 typ. 0.75 typ. figure 1. pcb metal land pattern (top view)
draft draft draft draft 7 of 10 not for new desig n s rf6263 ds101122 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . pcb solder mask pattern liquid photo-imageable (lpi) so lder mask is recommended. the solder mask fo otprint will match what is shown for the pcb metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. the center-grounding pad shall also have a solder mask clearance. expansion of the pads to create solder mask clearance can be provided in the master data or reques ted from the pcb fabrication supplier. thermal pad and via design the pcb land pattern has been designed with a thermal pad th at matches the die paddle size on the bottom of the device. thermal vias are required in the pcb layout to effectively conduct heat away from the package. the via pattern has been designed to address thermal, power dissipa tion and electrical requirements of the device as well as accommodating routing strategies. the via pattern used for the rfmd qualification is based on th ru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm pl ating on via walls. if micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. pin 8 pin 12 pin 1 pin 16 a c a a a b b b b a a a a b b b b 1.50 typ. 0.50 typ. 0.50 typ. 0.55 typ. 0.75 0.55 typ. 0.75 1.50 typ. a = 0.74 x 0.38 (mm) typ. b = 0.38 x 0.74 (mm) typ. c = 1.60 (mm) sq. dimensions in mm. figure 2. pcb solder mask pattern (top view)
draft draft draft draft 8 of 10 rf6263 ds101122 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . not for new desig n s tape and reel information carrier tape basic dimensions are based on eia481. the pocket is designed to hold the part for shipping and loading onto smt manufacturing equipment, while protecting the body and the solder terminals from damaging stresses. th e individual pocket design can vary from vendor to vendor, but width and pitch will be consistent. carrier tape is wound or placed onto a shipping reel either 330 mm (13 inches) in diameter or 178 mm (7 inches) in diameter. the center hub design is large enough to ensure the radius formed by the carrier tape around it does not put unnecessary stress on the parts. prior to shipping, moisture sensitive parts (msl level 2a-5a) ar e baked and placed into the pockets of the carrier tape. a cove r tape is sealed over the top of the entire length of the carrier tape. the reel is sealed in a moisture barrier, esd bag, which is placed in a cardboard shipping box. it is important to note th at unused moisture sensitive parts need to be resealed in the moisture barrier bag. if the reels exceed the exposure limit and need to be rebaked, most carr ier tape and shipping reels are not rated as bakeable at 125c. if baking is required, device s may be baked according to section 4, table 4-1, column 8 of joint industry standard ipc/jedec j-std-033a. the following table provides useful information for carrier tape and reels used for shipping the devices described in this docu - ment. qfn (carrier tape drawing with part orientation) rfmd part number reel diameter inch (mm) hub diameter inch (mm) width (mm) pocket pitch (mm) feed units per reel rf6263tr7 7 (178) 2.4 (61) 12 4 single 2500 notes: 1. all dimensions are in millimeters (mm). 2. unless otherwise specified, all dimension tolerances per eia-481. ao = 3.18 0.10 bo = 3.18 0.10 f = 5.50 0.05 ko = 1.02 0.10 p = 4.00 0.10 w = 12.00 +0.30/-0.10 ?1.50.10 15 inch trailer top view 15 inch leader sprocket holes toward rear of reel pin 1 location rf part number trace code rf part number trace code rf part number trace code rf part number trace code rf part number trace code rf part number trace code rf part number trace code 2.00 0.05 4.00 0.10 f w 1.750.10 bo ko p ao 0.279 .020 direction of feed
draft draft draft draft 9 of 10 not for new desig n s rf6263 ds101122 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com .
draft draft draft draft 10 of 10 rf6263 ds101122 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . not for new desig n s
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