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tsop62.., tsop64.. www.vishay.com vishay semiconductors rev. 1.1, 17-sep-13 1 document number: 82463 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 ir receiver modules for remote control systems mechanical data pinning 1 = gnd, 2 = n.c., 3 = v s , 4 = out features ? low supply current ? photo detector and preamplifier in one package ? internal filter for pcm frequency ? improved shielding against emi ? supply voltage: 2.5 v to 5.5 v ? improved immunity against ambient light ? insensitive to supply voltage ripple and noise ? taping available for top view and side view assembly ? material categorization: for definitions of compliance please see www.vishay.com/doc?99912 description these products are miniaturiz ed smd-ir receivers for infrared remote control systems. a pin diode and a preamplifier are assembled on a lead frame, the epoxy package acts as an ir filter. the demodulated output signal can be directly connected to a microprocessor. the tsop62.. is a legacy product for all common ir remote control data formats. the tsop64.. is optimized to suppress almost all spurious pulses from energy saving fluorescent la mps. they may suppress some data signals. this component has not been qualified according to automotive specifications. note (1) we advise try agc4 first if the burst length is unknown block diagram application circuit 16797 1 2 3 4 parts table agc legacy, for long burst remote controls (agc2) recommended for long burst codes (agc4) (1) carrier frequency 30 khz tsop6230 tsop6430 33 khz tsop6233 tsop6433 36 khz tsop6236 tsop6436 (2)(3)(4) 38 khz tsop6238 tsop6438 (5)(6)(9) 40 khz tsop6240 tsop6440 56 khz tsop6256 tsop6456 (7)(8) package pinning 1 = gnd, 2 = n.c., 3 = v s , 4 = out dimensions (m m) 4.0 h x 5.3 w x 7.5 l mounting smd application remote control best remote control code (2) rc-5 (3) rc-6 (4) panasonic (5) nec (6) sharp (7) r-step (8) thomson rca (9) r-map 33 k v s out demo - gnd pass agc input pin band dulator control circuit 3 4 1 16839-1 c 1 ir receiver gnd circuit c r 1 + v s gnd transmitter with tsalxxxx v s v o 17170-10 out the external components r 1 and c 1 are optional to improve the robustness against electrical overstress (typical values are r 1 = 100 , c 1 = 0.1 f).
tsop62.., tsop64.. www.vishay.com vishay semiconductors rev. 1.1, 17-sep-13 2 document number: 82463 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note ? stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress ratin g only and functional operation of the device at these or any other cond itions beyond those indicated in the operational sections of t his specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect the device reliability. typical characteristics (t amb = 25 c, unless otherwise specified) fig. 1 - output active low fig. 2 - puls e length and sensitivity in dark ambient absolute maximum ratings parameter test condition symbol value unit supply voltage v s -0.3 to +6 v supply current i s 5ma output voltage v o -0.3 to (v s + 0.3) v output current i o 5ma junction temperature t j 100 c storage temperature range t stg -25 to +85 c operating temperature range t amb -25 to +85 c power consumption t amb 85 c p tot 10 mw electrical and optical characteristics (t amb = 25 c, unless otherwise specified) parameter test condition symbol min. typ. max. unit supply voltage v s 2.5 5.5 v supply current v s = 5 v, e v = 0 i sd 0.55 0.7 0.9 ma e v = 40 klx, sunlight i sh 0.8 ma transmission distance e v = 0, ir diode tsal6200, i f = 250 ma, test signal see fig. 1 d40m output voltage low i osl = 0.5 ma, e e = 0.7 mw/m 2 , test signal see fig. 1 v osl 100 mv minimum irradiance pulse width tolerance: t pi - 5/f o < t po < t pi + 6/f o, test signal see fig. 1 e e min. 0.2 0.4 mw/m 2 maximum irradiance t pi - 5/f o < t po < t pi + 6/f o , test signal see fig. 1 e e max. 50 w/m 2 directivity angle of half transmission distance ? 1/2 50 deg e e t t pi * t * t pi 10/f 0 is recommended for optimal function v o v oh v ol t 16110 optical test signal (ir diode tsal6200, i f = 0.4 a, 30 pulses, f = f 0 , t = 10 ms) output signal t d 1) t po 2) 1) 7/f 0 < t d < 15/f 0 2) t pi - 5/f 0 < t po < t pi + 6/f 0 1.0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.1 1 10 10 2 10 3 10 4 e e - irradiance (mw/m 2 ) t po - output pulse width (ms) input burst length output pulse width = 950 nm, optical test signal, fig.1 0 0.1
tsop62.., tsop64.. www.vishay.com vishay semiconductors rev. 1.1, 17-sep-13 3 document number: 82463 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 3 - output function fig. 4 - output pulse diagram fig. 5 - frequency dependence of responsivity fig. 6 - sensitivity in bright ambient fig. 7 - sensitivity vs. supply voltage disturbances fig. 8 - max. envelope duty cycle vs. burst length e e t v o v oh v ol t 600 s 600 s t = 60 ms t on t off 94 8134 optical test signal output signal , (see fig. 4) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.1 1 10 100 1000 10 000 t on , t off - output pul s e width (m s ) e e - irradiance (mw/m 2 ) t on t off = 950 nm, optical te s t s ignal, fig. 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.7 0.9 1.1 1.3 f/f 0 - relative frequency 16925 f = f 0 5 % f(3 db) = f 0 /10 e /e - rel. responsivity e min. e 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.01 0.1 1 10 100 e e - ambient dc irradiance (w/m 2 ) e e min. - threshold irradiance (mw/m 2 ) correlation with ambient light sources: 10 w/m 2 = 1.4 klx (std. illum. a, t = 2855 k) 10 w/m 2 = 8.2 klx (daylight, t = 5900 k) wavelength of ambient illumination: = 950 nm 4.5 5.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1 10 100 1000 v s rms - ac voltage on dc supply voltage (mv) e e min. - threshold irradiance (mw/m 2 ) f = f 0 f = 20 khz f = 30 khz f = 100 hz f = 10 khz 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 20 40 60 80 100 120 burst length (number of cycles/burst) max. envelope duty cycle f = 38 khz, e e = 2 mw/m2 tsop62.. tsop64..
tsop62.., tsop64.. www.vishay.com vishay semiconductors rev. 1.1, 17-sep-13 4 document number: 82463 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 9 - sensitivity vs. ambient temperature fig. 10 - relative spectral sensitivity vs. wavelength fig. 11 - horizontal directivity fig. 12 - sensitivity vs. supply voltage t amb - ambient temperature (c) e e min. - sensitivity (mw/m 2 ) 0 0.05 0.10 0.15 0.20 0.40 -30 -10 10 30 50 70 90 0.30 0.25 0.35 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 750 800 850 900 950 1000 1050 1100 1150 21425 - wavelength (nm) s ( ) rel - relative spectral sensitivity 16801 0.4 0.2 0 0.2 0.4 0.6 0.6 0.9 0 30 10 20 40 50 60 70 80 1.0 0.8 0.7 d rel - relative transmission distance 0 0.1 0.2 0.3 0.4 0.5 0.8 1.5 2.5 3.5 4.5 5.5 2.0 3.0 4.0 5.0 v s - supply voltage (v) e e min. - sensitivity (mw/m 2 ) 0.6 0.7
tsop62.., tsop64.. www.vishay.com vishay semiconductors rev. 1.1, 17-sep-13 5 document number: 82463 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 suitable data format this series is designed to suppress spurious output pulses due to noise or disturbance signals. the devices can distinguish data signals from noise due to differences in frequency, burst length, and en velope duty cycle. the data signal should be close to the devices band-pass center frequency (e.g. 38 khz) and fulfill the conditions in the table below. when a data signal is applied to the product in the presence of a disturbance, the sensit ivity of the receiver is automatically reduced by the agc to insure that no spurious pulses are present at the receivers output. some examples which are suppressed are: ? dc light (e.g. from tungsten bulbs sunlight) ? continuous signals at any frequency ? strongly or weakly modula ted noise from fluorescent lamps with electronic ballasts (see figure 13 or figure 14) fig. 13 - ir disturbanc e from fluorescent lamp with low modulation fig. 14 - ir disturbanc e from fluorescent lamp with high modulation notes ? for data formats with short bursts please see the datasheet of tsop61.., tsop63.., tsop65.. ? example of compatible products for ir-codes: - tsop6436: rc-5, rc-6, panasonic - tsop6438: nec, sharp, r-map - tsop6456: r-step, thomson rca ? for sircs 15 and 20 bit, sony 12 bit ir-codes, please see the datasheet for tsop4s40, tsop2s40 0101520 time (ms) 16920 ir signal 5 0101520 time (ms) 16921 ir signal 5 tsop62.. tsop64.. minimum burst length 10 cy cles/burst 10 cycles/burst after each burst of length a minimum gap time is required of 10 to 70 cycles 12 cycles 10 to 35 cycles 12 cycles for bursts greater than a minimum gap time in the data stream is needed of 70 cycles > 4 x burst length 35 cycles > 10 x burst length maximum number of continuous short bursts/second 800 1300 recommended for nec code yes yes recommended for rc5/rc6 code yes yes recommended for sony code yes no recommended for thom son 56 khz code yes yes recommended for mitsubishi code (38 khz, preburst 8 ms, 16 bit) yes yes recommended for sharp code yes yes suppression of interference from fluorescent lamps most common disturbance patterns are suppressed even extreme disturbance patterns are suppressed
tsop62.., tsop64.. www.vishay.com vishay semiconductors rev. 1.1, 17-sep-13 6 document number: 82463 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 package dimensions in millimeters assembly instructions reflow soldering ? reflow soldering must be done within 72 h while stored under a max. tempe rature of 30 c, 60 % rh after opening the dry pack envelope ? set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. excercise extreme care to keep the maximum temperature below 260 c. the temperature shown in the profile means th e temperature at the device surface. since there is a temperature difference between the component and the circuit bo ard, it should be verified that the temperature of the device is accurately being measured ? handling after reflow should be done only after the work surface has been cooled off manual soldering ? use a soldering iron of 25 w or less. adjust the temperature of the so ldering iron below 300 c ? finish soldering within 3 s ? handle products only after the temperature has cooled off 2.35 r 1.7 5.51 0.5 0.15 3 x 1.27 = 3.81 2.6 7.5 7.2 4x 1.27 5.3 2.9 4 2.2 pick and place area. tr taping 2.2 3 x 1.27 = 3.81 1.27 0.9 2.8 specifications according to din technical drawings not indicated tolerances 0.3 pick and place area. tt taping footprint (1.5) (1.4) issue: 8; 02.09.09 16776 drawing-no.: 6.544-5341.01-4 a a 0.1 0.1 0.3 0.4 14
tsop62.., tsop64.. www.vishay.com vishay semiconductors rev. 1.1, 17-sep-13 7 document number: 82463 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 vishay lead (pb)-free reflow solder profile taping version tsop..tt dimensions in millimeters 0 50 100 150 200 250 300 0 50 100 150 200 250 300 t (s) t (c) 255 c 240 c 245 c max. 260 c max. 120 s max. 100 s 217 c max. 20 s max. ramp up 3 c/s max. ramp down 6 c/s max. 2 cycles allowed 19800 16584
tsop62.., tsop64.. www.vishay.com vishay semiconductors rev. 1.1, 17-sep-13 8 document number: 82463 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 taping version tsop..tr dimensions in millimeters 16585
tsop62.., tsop64.. www.vishay.com vishay semiconductors rev. 1.1, 17-sep-13 9 document number: 82463 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 reel dimensions in millimeters leader and trailer dimensions in millimeters cover tape peel strength according to din en 60286-3 0.1 n to 1.3 n 300 mm/min. 10 mm/min. 165 to 180 peel angle label standard bar code labels for finished goods the standard bar code labels are product labels and used for identification of goods. th e finished goods are packed in final packing area. the standard packing units are labeled with standard bar code labels be fore transported as finished goods to warehouses. the labels are on each packing unit and contain vishay semicond uctor gmbh specific data. 16734 trailer leader no devices min. 200 min. 400 start end devices 96 11818 no devices
tsop62.., tsop64.. www.vishay.com vishay semiconductors rev. 1.1, 17-sep-13 10 document number: 82463 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 dry packing the reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. final packing the sealed reel is packed in to a cardboard box. a secondary cardboard box is used for shipping purposes. recommended meth od of storage dry box storage is recommended as soon as the aluminum bag has been opened to preve nt moisture absorption. the following conditions should be observed, if dry boxes are not available: ? storage temperature 10 c to 30 c ? storage humidity 60 % rh max. after more than 72 h under these conditions moisture content will be too high for reflow soldering. in case of moisture absorptio n, the devices will recover to the former condition by drying under the following condition: 192 h at 40 c + 5 c / - 0 c and < 5 % rh (dry air/nitrogen) or 96 h at 60 c + 5 c and < 5 % rh for all device containers or 24 h at 125 c + 5 c not suitable for reel or tubes. an eia jedec ? standard j-std-020 level 4 label is included on all dry bags. eia jedec standard j-std-020 level 4 label is included on all dry bags vishay semiconductor gmbh standard bar code product label (finished goods) plain writing abbreviation length item-description - 18 item-number ino 8 selection-code sel 3 lot-/serial- number batch 10 data-code cod 3 (yww) plant-code ptc 2 quantity qty 8 accepted by acc - packed by pck - mixed code indica tor mixed code - origin xxxxxxx+ company logo long bar code top type length item-number n 8 plant-code n 2 sequence-number x 3 quantity n 8 total length - 21 short bar code bottom type length selection-code x 3 data-code n 3 batch-number x 10 filter - 1 total length - 17 aluminum bag label reel 15973 caution this bag contains moisture-sensitive devices 1. shelf life in sealed bag: 12 months at < 40 c and < 90 % relative humidity (rh) 2. after this bag is opened, devices that will be subjected to soldering reflow or equivalent processing (peak package body temp. 260 c) must be 2a. mounted within 72 hours at factory condition of < 30 c/60 % rh or 2b. stored at < 5 % rh 3. devices require baking befor mounting if: humidity indicator card is > 10 % when read at 23 c 5 c or 2a. or 2b. are not met. 4. if baking is required, devices may be baked for: 192 hours at 40 c + 5 c/- 0 c and < 5 % rh (dry air/nitrogen) or 96 hours at 60 c 5 c and < 5 % rh for all device containers or 24 hours at 125 c 5 c not suitable for reels or tubes bag seal date: (if blank, see barcode label) note: level and body temperature defined by eia jedec standard j-std-020 4 level 22522
tsop62.., tsop64.. www.vishay.com vishay semiconductors rev. 1.1, 17-sep-13 11 document number: 82463 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 esd precaution proper storage and handling pro cedures should be followed to prevent esd damage to the devices especially when they are removed from the antistatic shielding bag. electro-static sensitive devices warning la bels are on the packaging. vishay semiconductors standard bar code labels the vishay semiconductors st andard bar code labels are printed at final packing areas. the labels are on each packing unit and contain vishay semiconductors specific data. 22645
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