?i 1 ?^ 9 ?j 1. scope this specifications shall be applie d to chip inductors kqm 0603t produced b y koa co rp o r at i o n . 2. type designation t y pe designation shall be as the follow i ng form . kqm 0603 t te r12 j term ination surface t y p e c o m ponent si ze m a t e r i a l p a c k a g i n g n o m i nal i nduct a nce t o l e r a n c e wi ndi ng fo r m 1.6 ?~ 1.0 ?~ 0.9 ( m m ) t : s n te : em bos s e d tapi ng n one : bul k 1 n 8 --- 1.8nh 5 6 n --- 56nh r 1 2 --- 120 nh d: ?} 0.5nh j : ?} 5% 3. rating n o i t e m s p e c i f i c a t i o n 1 n o m i nal inductance range 1. 6 nh ?` 390 nh 2 n o m i nal inductance tolerance 3 q (q uality factor) 4 self-resonant frequency (mhz) 5 dc resistance (ohm ) 6 a llow a ble current (m a ) 7 measurem ent frequency (mh z ) t h e rating shall be show n in t h e table-1 8 storage tem p erature range -40 ???` +100 ?? 9 o p erating tem p erature range -40 ???` +125 ?? koa corp orat ion
?i 2 ?^ 9 ?j table-1 orde ring code ?| nominal induct a nce @100m h z induct ance t o l e rance qual it y fa c t or min. q me asuring fr eq. (mhz ) se l f re sonant fr eq. min. (mhz ) dc re sist ance max . ?i???j a llo w a ble dc curre n t max . (m a) kqm0603tte1n6?? 1.6 n h 24 250 12500 0.030 850 kqm0603tte1n8?? 1.8 n h 1 6 2 5 0 1 2 5 0 0 0 . 0 4 5 8 5 0 kqm0603tte3n3?? 3.3 n h 22 250 6900 0.055 850 kqm0603tte3n6?? 3.6 n h 2 5 2 5 0 6 9 0 0 0 . 0 5 9 8 5 0 kqm0603tte3n9?? 3.9 n h 35 250 6900 0.059 850 kqm0603tte4n3?? 4.3 n h 3 5 2 5 0 6 0 0 0 0 . 0 5 9 8 5 0 kqm0603tte4n7?? 4.7 n h 35 250 6000 0.059 850 kqm0603tte5n1?? 5.1 n h 3 5 2 5 0 6 0 0 0 0 . 0 8 2 7 5 0 kqm0603tte6n8?? 6.8 n h 35 250 6000 0.082 750 kqm0603tte7n5?? 7.5 n h 3 5 2 5 0 6 0 0 0 0 . 0 8 2 7 5 0 kqm0603tte8n2?? 8.2 n h 35 250 6000 0.11 700 kqm0603tte8n7?? 8.7 n h 3 5 2 5 0 4 6 0 0 0 . 1 0 9 7 0 0 kqm0603tte9n5?? 9.5 n h c( ?}0 . 2n h ) d( ?}0 . 5n h ) 35 250 6000 0.11 700 kqm0603tte10n?? 10 n h 3 5 2 5 0 6 0 0 0 0 . 1 1 7 0 0 kqm0603tte11n?? 11 n h 35 250 4600 0.086 700 kqm0603tte12n?? 12 n h 3 5 2 5 0 4 5 0 0 0 . 1 3 7 0 0 kqm0603tte15n?? 15 n h 40 250 4200 0.13 700 kqm0603tte16n?? 16 n h 4 0 2 5 0 3 8 0 0 0 . 1 0 4 7 0 0 kqm0603tte18n?? 18 n h 40 250 3600 0.16 700 kqm0603tte22n?? 22 n h 4 0 2 5 0 3 5 0 0 0 . 1 7 7 0 0 kqm0603tte23n?? 23 n h 40 250 3300 0.15 700 kqm0603tte24n?? 24 n h 4 0 2 5 0 3 2 0 0 0 . 1 3 5 7 0 0 kqm0603tte27n?? 27 n h 40 250 3200 0.21 600 kqm0603tte30n?? 30 n h 4 0 2 5 0 3 0 0 0 0 . 1 4 4 6 0 0 kqm0603tte33n?? 33 n h 40 250 2900 0.22 600 kqm0603tte36n?? 36 n h 4 0 2 5 0 2 9 0 0 0 . 2 5 6 0 0 kqm0603tte39n?? 39 n h 40 250 2800 0.25 600 kqm0603tte43n?? 43 n h 4 0 2 0 0 2 7 0 0 0 . 2 8 6 0 0 kqm0603tte47n?? 47 n h 38 200 2600 0.28 600 kqm0603tte51n?? 51 n h 3 8 2 0 0 2 6 0 0 0 . 3 0 6 0 0 kqm0603tte56n?? 56 n h 38 200 2400 0.31 600 kqm0603tte68n?? 68 n h 3 8 2 0 0 2 2 0 0 0 . 3 4 6 0 0 kqm0603tte72n?? 72 n h 34 150 2100 0.49 400 kqm0603tte82n?? 82 n h 3 4 1 5 0 2 0 0 0 0 . 5 4 4 0 0 kqm0603tter10?? 100 n h 34 150 1800 0.58 400 kqm0603tter11?? 110 n h 3 2 1 5 0 1 8 0 0 0 . 6 1 3 0 0 kqm0603tter12?? 120 n h 32 150 1600 0.65 300 kqm0603tter15?? 150 n h 3 2 1 5 0 1 4 0 0 1 . 4 1 6 0 kqm0603tter18?? 180 n h 25 100 1300 2.2 140 kqm0603tter20?? 200 n h 2 5 1 0 0 1 2 5 0 2 . 3 1 3 0 kqm0603tter21?? 210 n h 25 100 1200 2.3 130 kqm0603tter22?? 220 n h 2 5 1 0 0 1 2 0 0 2 . 5 1 2 0 kqm0603tter25?? 250 n h 25 100 1000 2.4 120 kqm0603tter27?? 270 n h 3 0 1 0 0 1 0 0 0 2 . 3 1 7 0 kqm0603tter33?? 330 n h 30 100 800 3.0 100 kqm0603tter39?? 390 n h g( ?} 2% ) j( ?} 5% ) k( ?} 10% ) 3 0 1 0 0 8 0 0 3 . 7 8 0 ?| te : em b o ssed plastic ?? : tolerance character ( c, d, g, j , k , ) koa corp orat ion
?i 3 ?^ 9 ?j 4. dimensions l p h ht w wt di m e n s i o n l w h w t ht p mm 1. 6 ?} 0. 1 1 . 0 ?} 0. 1 0 . 9 ?} 0. 1 0 . 8 5 ?} 0. 1 0 . 2 5 ?} 0. 1 5 0 . 35 ?} 0. 1 5. construction ma g n e t w i r e ce r a m i c c o r e inne r c o a t fl a t t o p f il m e l e c t r o d e ( a g / p d+ n i + s n s o l de r i n g ) koa corp orat ion
?i 4 ?^ 9 ?j 6. marking of inductance t h e m a rking of nom inal inductance consists of only one-figure num ber as detailed below : val u e n u m b e r val u e n u m b e r val ue number val u e n u m b e r 1.6 nh c 9.5nh b 33 nh 9 120 nh 8 1.8 nh 0 10 nh 3 36 nh p 150 nh 9 3.3 nh x 11 nh k 39 nh 0 180 nh 0 3.6 nh e 12 nh 4 43 nh q 200 nh u 3.9 nh 1 15 nh 5 47 nh 1 210 nh v 4.3 nh f 16 nh l 51 nh t 220 nh 1 4.7 nh g 18 nh 6 56 nh 2 250 nh w 5.1 nh y 22 nh 7 68 nh 3 270 nh 2 6.8 nh 2 23 nh s 72 nh 4 330 nh 3 7.5 nh h 24 nh m 82 nh 5 390 nh 4 8.2 nh a 27 nh 8 100 nh 6 8.7 nh j 30 nh n 110 nh 7 n o tolerance of inductance shall be indicated. 7. measurement method n o m i nal inductance range t e st e quipm ent fixture s e t u p measuring frequency 1. 6nh to 390nh 4291a rf im pedance analy zer (h.p) 16193a t e st fixture e.l=1 . 4 c m o s c=500m v l i s t e d table-1 8. test conditions unless otherwise specified, the test shall be perform ed at the tem p erature of 20 ?} 15 ?? and at a relative hum idity of 65 ?} 20% . revers for the test conditions shall be perform ed at the tem p erature of 20 ?} 2 ?? and at a relative hum idity of 65 ?} 5% . koa corp orat ion
?i 5 ?^ 9 ?j 9. reliability tests 9 - 1 el ect ri ca l ch a r a c t eri s t i c s i t e m r e q u i r e m e n t test m e t h o d s dielectric w ithstanding v o ltage no evidence of flam ing, fum i ng, or breakdow n 5 seconds at a c 500v applied betw een both term inals and film . insulation resistance 1000m ?? and over 1 m i nute at d c 100v m easured betw een both term inals and film . flam m a bility i e c 695-2-2 w ithstands needle-flam e test. 9-2 me c h anic al c h ar ac te r i stic s i t e m r e q u i r e m e n t test m e t h o d s term i n al pull strength no evidence of dam a ge t e rm inals shall be w ithstand a pull of 5n in a horizontal direction. t e rm inal bending strength no evidence of breakdow n specim e n shall be soldered on bend test board and force applied to the opposite side to cause a 3 m m deflection v i bration ? l / l w ithin ?} 5% ? q/ q wi t h i n ?} 10% 2 hours in each direction of x , y , z on pcb at a frequency range of 10-55-10h z w ith 1. 5 m m am plitude d r opping n o evidence of dam a ge ? l / l w ithin ?} 5% ? q/ q wi t h i n ?} 10% d r opping 1 m on the ground of concrete 1 tim e resistance to soldering heat no evidence of outer dam a ge ? l / l w ithin ?} 5% ? q/ q wi t h i n ?} 10% im m e rse in the solder at 260 ?} 5 ?? for 10 ?} 1 seconds solderability 95% of the term inal should be covered w ith new solder im m e rse in the solder at 230 ?} 5 ?? for 3 ?} 0. 5 seconds resistance to solvent n o dam a ge and ma r k i n g mu s t rem a in legible a ccordance w ith mil - st d - 202f method 215 koa corp orat ion
?i 6 ?^ 9 ?j 9-3 e n vir o nm e n tal c h ar ac te r i stic s i t e m r e q u i r e m e n t test m e t h o d s low tem p erature storage no evidence of dam a ge ? l / l w ithin ?} 5% ? q/ q wi t h i n ?} 10% store at -40 ?} 2 ?? , for 1000 hours high tem p erature storage no evidence of dam a ge ? l / l w ithin ?} 5% ? q/ q wi t h i n ?} 10% store at +125 ?} 2 ?? , for 1000 hours moisture e ndurance no evidence of dam a ge ? l/ l w ithin ?} 5% ? q/ q wi t h i n ?} 10% store at +40 ?} 2 ?? , 90 ?` 95%rh for 1000 hours lo ad li fe no evidence of dam a ge ? l / l w ithin ?} 5% ? q/ q wi t h i n ?} 10% biased to full rated current at +125 ?? for 1000 hours high tem p erature hi g h hu m i d i t y no evidence of dam a ge ? l/ l w ithin ?} 5% ? q/ q wi t h i n ?} 10% biased to 10% rated current at +85 ?? , 85% rh for 1000 hours therm a l shock no evidence of dam a ge ? l / l w ithin ?} 5% ? q/ q wi t h i n ?} 10% 100cy c les betw een -40 ?? /0. 5hour and +125 ?? /0. 5hour tem p erature characteristics ? l / l w ithin ?} 5% ? l/l to be m easured at the tem p erature of between -40 ?? and +125 ?? as based on the inductance at 20 ?? ?| u n less otherw ise specified, m easurem ents sh all be perform ed w ithin 2 hours after leaving test sam p les for m o re than one hour at the norm a l tem p erature and at the norm a l hum idity . koa corp orat ion
?i 7 ?^ 9 ?j 10. packaging 10-1 bulk pack aging (1) 200pcs chip induc tors are packed in a poly bag. (2) inner box shall be indicated t y pe ( k q m 0603t ), n o m i nal inductance, t o lerance, q u antity , production lot num ber, m a n u f a c t u r e ' s n a m e o r t r a d e m a r k . . 1 0 - 2 t a p i n g t h e t a p e s f o r t a p i n g s h all be em bossed carrier tapes of 8 m m w i dth and 4 m m pitches. t h e standard quantity per reel be 2, 000 pcs. (1) d i m e nsions of carrier t a pe 1 t ?d 1 1 p 2 p 0 p ?d 2 t e f w ?| 0 a ch ip induc t o r t a p i n g ru nn in g d i r ec t i o n b feed in g h o l e [ u n i t : m m ] a b w e f t 1 1. 15 ?} 0. 05 1. 86 ?} 0. 05 8. 0 ?} 0. 1 1. 75 ?} 0. 10 3. 50 ?} 0. 05 0. 98 ?} 0. 05 t 2 p 0 p 1 p 2 ? d 0 ? d 1 0. 25 ?} 0. 05 4. 0 ?} 0. 1 4. 0 ?} 0. 1 2. 00 ?} 0. 05 1 . 5 ?} 0. 60 ?} 0. 05 0.1 0 ?| 20 pitches accum u lation of f eeding holes shall be 80 ?} 0. 15m m . t op tape peeling strength : 0. 1 n ?` 0. 7 n koa corp orat ion
?i 8 ?^ 9 ?j (2) t a ped configuration conform i ng to e i a - 481 standard ?e?e?e?e ?e ?e?e?e?e?e ?e ?e?e?e?e ?e?e?e?e ?e empty space c hip m oun ti ng sp ace empty space leader space dr aw in g o u t di re ct io n 16 0m m m i n . 23 0m m m i n . 17 0m m m i n . beg i nning end (3) reel d i m e nsions and indication ?d ??a ??` ? c ?v ?v1 ?d ? a ? b ? c ? d e w w 1 180 ?} 3 0 6 0 ?} 1. 0 1 3 ?} 0. 2 2 1 . 0 ?} 0. 8 2 . 0 ?} 0. 5 9 . 0 ?} 0. 3 1 1 . 4 ?} 1. 0 the follow i ng item s shall be indicated on the reel. ( ?t ) type(kqm 0603tte) ( ?u ) nom i nal inductan ce and tolerance ( ?v ) quantity ( ?w ) production lot num ber ( ?x ) manufacturer?s nam e or trade m a rk koa corp orat ion
?i 9 ?^ 9 ?j 11 general information (1) storage chip inductors shall not be stor ed under high tem p erature and high hum idity conditions. e s pecially , do not store t a pin g w h ere they are exposed to heat or direct sun light. o t herw ise, the packing m a terial m a y be deform ed, causing problem s during m ounting. (2) mounting placem ent force should not be excessive. (3) soldering ?e reflow soldering should done at 240 ?? for less than 30 s econds w ith e ute c tic solder, and peak 250 ?? m o re than 230 ?? for 30-40 seconds w ith lead free solder. ?e w h en using a soldering iron, tem p erature shall not exceed 350 ?? and w ithin 3 seconds. soldering iron tim e of each electrode shall be allow e d only one t i m e. aft e r s o l d eri n g , chip inductors s h al l n o t b e s t res s e d ex ces s i v e l y . (4) cleaning it is no problem to use organic solvents. si n ce t h i s chip inductor i s a co i l o f u l t r a-fi n e wi re, i t i s s u s cep t i b l e t o vibration. if an ultrasonic cl eaning unit is used for cleaning, check for any possibility of problem generati on before practical use since such cleaning u n i t s c o n s i d e r a b l y differ in vibration level and m ode. a lthough the conditions differ depending on the printed board size, ultrasonic cleaning is generally used in the conditions described below as e x a m p l e s . p o w e r : w i t h i n 2 0 w / l c l e a n i n g t i m e s : w i t h i n 5 m i n u t e s (5) pattern design t h e land pattern is recom m e nded as follow s . ind u ctor position s o lder r e sist c b d a land [ unit : m m ] a b c d 0. 6 4 1 . 9 2 1 . 0 2 0. 1 6 koa corp orat ion
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