march 2003 / b page 1 semiconductor tak cheon g ? 1.3 watt do-41 hermetically sealed glass zener voltage regulators absolute maximum ratings t a = 25c unless otherwise noted parameter value units power dissipation 1.3 w storage temperature range -65 to +200 c operating junction temperature +200 c lead temperature (1/16? from case for 10 seconds) +230 c these ratings are limiting values above which the serviceability of the diode may be impaired. specification features: zener voltage range 3.3 to 56 volts do-41 package (jedec) through-hole device type mounting hermetically sealed glass compression bonded construction all external surfaces are corrosion resistant and leads are readily solderable cathode indicated by polarity band electrical characteristics t a = 25c unless otherwise noted v z @ i zt (volts) device type v z min v z max i zt (ma) z zt @ i zt ( ? ) max i zk (ma) z zk @ i zk ( ? ) max i r @ v r ( a) max v r (volts) tcbzx85c 3v3 3.1 3.5 80 20 1 400 40 1 tcbzx85c 3v6 3.4 3.8 60 20 1 500 20 1 tcbzx85c 3v9 3.7 4.1 60 15 1 500 20 1 tcbzx85c 4v3 4 4.6 50 13 1 500 3 1 tcbzx85c 4v7 4.4 5 45 13 1 500 3 1 tcbzx85c 5v1 4.8 5.4 45 10 1 500 1 1.5 tcbzx85c 5v6 5.2 6 45 7 1 400 1 2 tcbzx85c 6v2 5.8 6.6 35 4 1 300 1 3 tcbzx85c 6v8 6.4 7.2 35 3.5 1 300 1 4 tcbzx85c 7v5 7 7.9 35 3 0.5 200 1 4.5 tcbzx85c 8v2 7.7 8.7 25 5 0.5 200 1 6.2 tcbzx85c 9v1 8.5 9.6 25 5 0.5 200 1 6.9 tcbzx85c 10 9.4 10.6 25 7 0.5 200 0.5 7.5 tcbzx85c 11 10.4 11.6 20 8 0.5 300 0.5 8.2 tcbzx85c 12 11.4 12.7 20 9 0.5 350 0.5 9.1 tcbzx85c 13 12.4 14.1 20 10 0.5 400 0.5 10 tcbzx85c 15 13.8 15.6 15 15 0.5 500 0.5 11 tcbzx85c 16 15.3 17.1 15 15 0.5 500 0.5 12 tcbzx85c 18 16.8 19.1 15 20 0.5 500 0.5 13 tcbzx85c 20 18.8 21.2 10 24 0.5 600 0.5 15 tcbzx85c 22 20.8 23.3 10 25 0.5 600 0.5 16 tcbzx85c3v3 through tcbzx85c56 series cathode anode electrical symbol axial lead do41 l 85c xxx device marking diagram l : lo g o device code : tcbzx85c3v3
march 2003 / b page 2 semiconductor tak cheon g ? electrical characteristics t a = 25c unless otherwise noted v z @ i zt (volts) device type v z min v z max i zt (ma) z zt @ i zt ( ? ) max i zk (ma) z zk @ i zk ( ? ) max i r @ v r ( a) max v r (volts) tcbzx85c 24 22.8 25.6 10 25 0.5 600 0.5 18 tcbzx85c 27 25.1 28.9 8 30 0.25 750 0.5 20 tcbzx85c 30 28 32 8 30 0.25 1000 0.5 22 tcbzx85c 33 31 35 8 35 0.25 1000 0.5 24 tcbzx85c 36 34 38 8 40 0.25 1000 0.5 25 tcbzx85c 39 37 41 6 45 0.25 1000 0.5 27 tcbzx85c 43 40 46 6 50 0.25 1000 0.5 30 tcbzx85c 47 44 50 4 90 0.25 1500 0.5 33 tcbzx85c 51 48 54 4 115 0.25 1500 0.5 36 tcbzx85c 56 52 60 4 120 0.25 2000 0.5 39 v f forward voltage = 1.2 v maximum @ i f = 200 ma for all types notes: 1. the type numbers listed have zener voltage min/max limits as shown and have a standard tolerance on the nominal zener voltage. 2. for detailed information on price, availability and delivery of nominal zener voltages between the voltages shown and tighte r voltage tolerances, contact your nearest tak cheong electronics representative. 3. the zener impedance is derived from the 60-cycle ac voltage, which results when an ac current having an rms value equal to 10% of the dc zener current ( i zt or i zk ) is superimposed to i zt or i zk. electrical symbol definition typical characteristics symbol parameter v z reverse zener voltage @ i zt i zt reverse current z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i zk i r reverse leakage current @ v r v r breakdown voltage i f forward current v f forward voltage @ i f ordering information device package quantity tcbzx85cxxx bulk 5, 000 tcbzx85cxxx.tb t ape and ammo 3,000 tcbzx85cxxx.tr t ape and reel 5,000 tcbzx85cxxx others (?contact tak c heong sales representatives) axial-lead tape packaging standards this axial-lead component?s packaging requirements use in automatic testing and assembly equipment. and this standard practices for lead-tape packaging of axial-lead components meets the requirements of eia standard rs-296-d ?lead-taping of components on axia l lead configuration for automatic insertion?. v i ( mv ) ( v ) ( ma ) ( ma ) v f i f v r i r v z i zt ( na )
march 2003 / b page 3 semiconductor tak cheon g ? tape & reel packaging information tape & reel outline reel dimensions dim millimeters d1 356 d2 30 d3 84 w1 77.5 quantity per reel pkg type quantity per reel do-41 5,000
march 2003 / b page 4 semiconductor tak cheon g ? tape & ammo packaging information tape & ammo outline quantity per ammo box pkg type quantity per box do-41 3,000 taping dimensions description millimeters standard width 52 26 tape spacing (b) 52 0.69 26 +0.5 / -0 component pitch (c) 5.08 0.4 5.08 0.4 untaped lead (l1 ? l2) 0.69 0.69 glass offset (f) 0.69 0.69 bent (d) 1.2 max 1.2 max tape width (g) 6.138 0.576 6.138 0.576 tape mismatch (e) 0.55 max 0.55 max taped lead (g) 3.2 min 3.2 min lead beyond tape (h) 0 0 250mm x 80mm x 80mm
march 2003 / b page 5 semiconductor tak cheon g ? bulk packaging information bulk outline quantity per box pkg type quantity per box do-41 5,000 plastic bag do-41 500 x 10 plastic bag quantity per plastic bag 190mm x 150mm x 65mm
march 2003 / b page 6 semiconductor tak cheon g ? package outline package case outline do-41 d0-41 millimeters inches dim min max min max a 0.72 0.86 0.028 0.034 b 4.07 5.20 0.160 0.205 c 25.40 --- 1.000 --- d 2.04 2.71 0.080 0.107 notes: 1. all dimensions are within jedec standard. 2. do41 polarity denoted by cathode band.
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