View BD6973FV-LB_7513924.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/17 tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 14? 001 dc brushless fan motor drivers multifunction single-phase full-wave fan motor driver BD6973FV-LB general description this is the product guarantees long time support in industrial market. BD6973FV-LB is a pre-driver that controls the motor drive part composed of the power transistors. moreover, a lot of functions are installed, and the pin is compatible with bd6974fv-lb (lock alarm signal output). features ? long time support product for industrial applications ? pre-driver for external power transistors ? speed controllable by dc / direct pwm input ? pwm soft switching ? soft start ? quick start ? current limit ? lock protection and automatic restart ? rotation speed pulse signal (fg) output package w (typ) x d (typ) x h (max) ssop-b16 5.00mm x 6.40mm x 1.35mm applications ? industrial equipment and fan motors for general consumer equipment of desktop pc, and server, etc. absolute maximum ratings (ta=25c) parameter symbol limit unit supply voltage vcc 20 v power dissipation pd 0.87 (note 1) w operating temperature range topr ?40 to +100 c storage temperature range tstg ?55 to +150 c high side output voltage voh 36 v low side output voltage vol 15 v low side output current iol 10 ma rotation speed pulse signal (fg) output voltage vfg 20 v rotation speed pulse signal (fg) output current ifg 10 ma reference voltage (ref) output current iref 12 ma hall bias (hb) output current ihb 12 ma input voltage (h+, h?, th, min, cs) vin 7 v junction temperature tjmax 150 c (note 1) reduce by 7.0mw/c over ta=25c. (on 70.0mm70.0mm1.6mm glass epoxy board) caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=?40c to +100c) parameter symbol limit unit operating supply voltage range vcc 4.3 to 17.0 v operating input voltage range 1 (h+, h?) (more than vcc=9v) vin1 0 to 7 v operating input voltage range 1 (h+, h?) (less than vcc=9v) 0 to vcc?2 v operating input voltage range 2 (th, min) vin2 0 to vref v ssop-b16
2/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 pin configuration pin description p/no. p/name function 1 fg speed pulse signal output pin 2 osc oscillating capacitor connecting pin 3 min minimum output duty setting pin 4 th output duty controllable input pin 5 ref reference voltage output pin 6 vcc power supply pin 7 a1h high side output 1 pin 8 a1l low side output 1 pin 9 a2l low side output 2 pin 10 a2h high side output 2 pin 11 cs output current detection pin 12 ss soft start capacitor connecting pin 13 h+ hall + input pin 14 hb hall bias pin 15 h? hall ? input pin 16 gnd ground pin block diagram i/o truth table hall input driver output h+ h? a1h a1 l a2h a2l fg h l hi-z h l l hi-z l h l l hi-z h l h; high, l; low, hi-z; high impedance fg output is open-drain type. figure 2. block diagram min ref hb a1h h+ h? fg a2h vcc osc cs gnd th a1l 1 2 3 4 5 6 7 15 a2l ss 16 8 14 13 12 11 9 10 figure 1. pin configuration (top view) th min osc fg signal output ref a1 h vcc vcc h+ a1l gnd cs hall comp hall amp hb control logic pre- driver a2l a2 h ref reg reg osc quick start lock protect tsd h? ss pwm soft switching pwm comp pwm comp hall bias soft start & current limit comp 1 2 3 4 5 6 7 8 10 9 14 13 12 11 16 15 vcl
3/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 electrical characteristics (unless otherwise specified ta=25c, vcc=12v) parameter symbol limit unit conditions ref. data min typ max circuit current icc 3 5 8 ma figure 3 hall input hysteresis voltage vhys 5 10 15 mv figure 4 high side output current ioh 9.0 12.0 16.5 ma voh=12v figure 5 high side output leak current iohl - - 10 a voh=36v figure 6 low side output high voltage volh 9.3 9.5 - v iol=?5ma figure 7, figure 8 low side output low voltage voll - 0.5 0.7 v iol=5ma figure 9, figure 10 lock detection on time ton 0.20 0.30 0.45 s figure 11 lock detection off time toff 4.0 6.0 9.0 s figure 12 fg output low voltage vfgl - - 0.3 v ifg=5ma figure 13, figure 14 fg output leak current ifgl - - 10 a vfg=17v figure 15 osc high voltage vosch 2.3 2.5 2.7 v figure 16 osc low voltage voscl 0.8 1.0 1.2 v figure 16 osc charge current icosc ?55 ?40 ?25 a figure 17 osc discharge current idosc 25 40 55 a figure 17 output on duty 1 poh1 75 80 85 % vth=vref x 0.26 pull up resistance 1k ? , osc=470pf - output on duty 2 poh2 45 50 55 % vth=vref x 0.35 pull up resistance 1k ? , osc=470pf - output on duty 3 poh3 15 20 25 % vth=vref x 0.44 pull up resistance 1k ? , osc=470pf - reference voltage vref 4.8 5.0 5.2 v iref=?2ma figure 18, figure 19 hall bias voltage vhb 1.10 1.26 1.50 v ihb=?2ma figure 20, figure 21 current limit setting voltage vcl 120 150 180 mv figure 22 ss charge current iss ?300 ?120 ?50 na vss=0v figure 23 th input bias current ith - - ?0.2 a vth=0v figure 24 min input bias current imin - - ?0.2 a vmin=0v figure 25 cs input bias current ics - - ?0.2 a vcs=0v figure 26 about a current item, define the inflow cu rrent to ic as a positive notation, and t he outflow current from ic as a negative not ation.
4/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 typical performance curves (reference data) 2 5 8 11 14 17 0 5 10 15 20 supply voltage: vcc[v] high side output current: ioh[ma] figure 5. high side output current vs supply voltage ope r ating range 100c 25c ? 40c 0 2 4 6 8 10 0 5 10 15 20 supply voltage: vcc[v] circuit current: icc[ma] figure 3. circuit current vs supply voltage operating range 100c 25c ? 40c -20 -10 0 10 20 0 5 10 15 20 supply voltage: vcc[v] hall input hysteresis voltage: vhys[mv] figure 4. hall input hysteresis voltage vs supply voltage operating range 100c 25c ? 40c 100c 25c ? 40c -2 0 2 4 6 8 0 10203040 output voltage: voh[v] high side output leak current: iohl[ua] operating range figure 6. high side output leak current vs output voltage 100c 25c ? 40c
5/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 typical performance curves (reference data) 0 2 4 6 8 10 12 0246810 output source current: io[ma] low side output high voltage: volh[v] figure 7. low side output high voltage vs output source current (vcc=12v) 100c 25c ? 40c 0.0 0.4 0.8 1.2 1.6 0246810 output sink current: io[ma] low side output low voltage: voll[v] figure 9. low side output low voltage vs output sink current (vcc=12v) 100c 25c ? 40c 0 2 4 6 8 10 12 0246810 output source current: io[ma] low side output high voltage: volh[v] figure 8. low side output high voltage vs output source current (ta=25c) 17v 12v 4.3v 0.0 0.4 0.8 1.2 1.6 0246810 output sink current: io[ma] low side output low voltage: voll[v] figure 10. low side output low voltage vs output sink current (ta=25c) 17v 12v 4.3v
6/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 typical performance curves (reference data) 4.0 5.0 6.0 7.0 8.0 0 5 10 15 20 supply voltage: vcc[v] lock detection off time: toff[s] operating range figure 12. lock detection off time vs supply voltage 100c 25c ? 40c 0.0 0.2 0.4 0.6 0.8 0246810 output sink current: ifg[ma] fg output low voltage: vfgl[v] figure 13. fg output low voltage vs output sink current (vcc=12v) 100c 25c ? 40c 0.0 0.2 0.4 0.6 0.8 0246810 output sink current: ifg[ma] fg output low voltage: vfgl[v] figure 14. fg output low voltage vs output sink current (ta=25c) 17v 12v 4.3v 0.20 0.25 0.30 0.35 0.40 0 5 10 15 20 supply voltage: vcc[v] lock detection on time: ton[s] figure 11. lock detection on time vs supply voltage 100c 25c ? 40c operating range
7/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 typical performance curves (reference data) 2 3 4 5 6 0 5 10 15 20 supply voltage: vcc[v] reference voltage: vref[v] operating range figure 18. reference voltage vs supply voltage 100c 25c ? 40c -60 -40 -20 0 20 40 60 0 5 10 15 20 supply voltage: vcc[v] osc charge/discharge current: icosc/idosc [ua] operating range figure 17. osc charge/discharge current vs supply voltage 100c 25c ? 40c 100c 25c ? 40c -2 0 2 4 6 8 0 5 10 15 20 output voltage: vfg[v] fg output leak current: ifgl[ua] operating range figure 15. fg output leak current vs output voltage 100c 25c ? 40c 0.5 1.0 1.5 2.0 2.5 3.0 0 5 10 15 20 supply voltage: vcc[v] osc high/low voltage: vosch/voscl [v] operating range figure 16. osc high/low voltage vs supply voltage 100c 25c ? 40c 100c 25c ? 40c
8/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 typical performance curves (reference data) 1.1 1.2 1.3 1.4 1.5 036912 output source current: ihb[ma] hall bias voltage: vhb[v] figure 21. hall bias voltage vs output source current (vcc=12v) 100c 25c ? 40c 4.8 4.9 5.0 5.1 5.2 036912 output source current: iref[ma] reference voltage: vref[v] figure 19. reference voltage vs output source current (vcc=12v) 100c 25c ? 40c 1.1 1.2 1.3 1.4 1.5 0 5 10 15 20 supply voltage: vcc[v] hall bias voltage: vhb[v] operating range figure 20. hall bias voltage vs supply voltage 100c 25c ? 40c 120 135 150 165 180 0 5 10 15 20 supply voltage: vcc[v] current limit setting voltage: vcl[mv] operating range figure 22. current limit setting voltage vs supply voltage 100c 25c ? 40c
9/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 typical performance curves (reference data) -0.20 -0.15 -0.10 -0.05 0.00 0.05 0 5 10 15 20 supply voltage: vcc[v] cs bias current: ics[ua] operating range figure 26. cs bias current vs supply voltage 100c 25c ? 40c -300 -250 -200 -150 -100 -50 0 5 10 15 20 supply voltage: vcc[v] ss charge current: iss[na] operating range figure 23. ss charge current vs supply voltage 100c 25c ? 40c -0.20 -0.15 -0.10 -0.05 0.00 0.05 0 5 10 15 20 supply voltage: vcc[v] min bias current: imin[ua] operating range figure 25. min bias current vs supply voltage 100c 25c ? 40c -0.20 -0.15 -0.10 -0.05 0.00 0.05 0 5 10 15 20 supply voltage: vcc[v] th bias current: ith[ua] operating range figure 24. th bias current vs supply voltage 100c 25c ? 40c
10/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 application example (constant values are for reference) substrate design note (a) motor power and ground lines are made as fat as possible. (b) ic power line is made as fat as possible. (c) ic ground line is common with the application ground except motor ground (i.e. hall ground etc.), and arranged near to (?) land. (d) the bypass capacitors (vcc side and vm side) are arrangement near to vcc pin and fets, respectively. (e) h+ and h? lines are arranged side by side and made from the hall element to ic as shorter as possible, because it is easy for the noise to influence the hall lines. figure 27. pwm controllable 4 wires type motor application protection of fg open-drain low-pass filter for rnf voltage smoothing noise measures of substrate so bypass capacitor, arrangement near to fets as much as p ossible so bypass capacitor, arrangement near to vcc pin as much as p ossible reverse-connected prevention of the fan connector reverse-connected prevention of the fan connector circuit that converts pwm duty into dc voltage stabilization of ref voltage soft start time setting minimum output duty setting output pwm frequency setting to limit motor current, the current is detected. note the power consumption of detection resistance. drive the pmos fet gate by constant current flowing to ic adjustment the pmos fet slew rate adjustment the nmos fet slew rate stabilization of nmos fet gate drive hall bias is set according to the amplitude of hall element output and hall input voltage range. pwm m 470 ? to 1k ? 0 ? to 2k ? 0 ? to 2 k ? 2k ? to 20k ? 1 f to 1 f to th min osc fg signal output ref a1 h vcc vcc h+ a1l gnd cs hall comp hall amp hb control logic pre- driver a2l a2 h ref reg reg osc quick start lock protect tsd h? ss pwm soft switching pwm comp pwm comp hall bias soft start & current limit comp 1 2 3 4 5 6 7 8 10 9 14 13 12 11 16 15 vcl sig 0 ? to 100pf to 1000pf 0.1 f to h 0 ? to 0.01 f to 4.7 f 200 ? to 20k ? 100pf to 0.01 f
11/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 safety measure 1. measures against reverse-connection of power supply because the current flows in the reverse-connection of the power supply in different pathways when it is normal, it causes ic destruction or deterioration. when reverse-connec tion is possible, reverse connection protection diode must be added between power supply and vcc. 2. measure against vcc voltage rise by induction (back) electromotive force induction electromotive force (and/or back electromotive force) generates regenerative current to power supply. however, when reverse connection protection diode is conn ected, or power supply doesn't have the current inflow ability with enough, vcc and motor driving outputs voltage rise at regenerative braking. when the absolute maximum rated voltage may be exceeded due to voltage rise by induction electromotive force, place capacitor or zenner diode between vcc and gnd. if necessary, add both. 3. problem of gnd line pwm switching do not perform pwm switching of gnd line because gnd pin potential cannot be kept to a minimum. 4. protection of rotation speed pulse (fg) and/or lock alarm (al) open-drain output it is possible to protect it so as not to become destruction by putting the protection resistor in the motor unit when the connector is mistaken and it is connected directly with the power supply exceeding the absolute maximum rating. i/o vcc gnd in normal energization internal circuit impedance is high ? am p era g e small circuit block i/o gnd reverse power connection large current flows ? thermal destruction circuit block vcc i/o gnd after reverse connection destruction prevention no destruction circuit block vcc figure 28. flow of current when power supply is connected reversely on phase switching on on on figure 29. vcc and motor driving outputs voltage rise by induction (back) electromotive force o n on o n on o n on (a) capacitor (b) zenner diode (c) capacitor & zenner diode figure 31. gnd line pwm switching prohibited figure 32. protection of fg/al pin figure 30. measure against vcc and motor driving outputs voltage rise at regenerative braking vcc gnd prohibit motor driver controller pwm input m fg driver al protection resistor motor unit pull-up resistor sig connecto r
12/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 power dissipation 1. power dissipation power dissipation (total loss) indicates the power that can be consumed by ic at ta=25c (normal temperature). ic is heated when it consumes power, and the temperature of ic chip becomes higher than ambient temperature. the temperature that can be accepted by ic chip into the package, that is junction temperature of the absolute maximum rating, depends on circuit configuration, manufacturing process, etc. power dissipation is determined by this maximum joint temperature, the thermal resistance in the state of the substrate mounting, and the ambient temperature. therefore, when a power dissipation that provides by the absolute maximum rating is exceeded, the operating temperature range is not a guarantee. the maximum junction temperature is in general equal to the maximum value in the storage temperature range. 2. thermal resistance heat generated by consumed power of ic is radiated from the mold resin or lead frame of package. the parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. in the state of the substrate mounting, thermal resistances from the chip junction to the ambience and to the package surface are shown respectively with ja[c/w] and jc[c/w]. thermal resistance is classified into the package part and the substrate part, and thermal resistance in the package part depends on the composition materials such as the mold resins and the lead frames. on the other hand, thermal re sistance in the substrate part depends on the substrate heat dissipation capability of the material, the size, and the copper foil area etc. therefore, thermal resistance can be decreased by the heat radiation measures to install the heat sink etc. in the mounting substrate. the thermal resistance model and calculations are shown in figure 33, and equation 1 and 2, respectively. where: ja is the thermal resistance from the chip junction to the ambience jc is the thermal resistance from the chip junction to the package surface tj is the junction temperature ta is the ambient temperature tc is the package surface temperature p is the power consumption even if it uses the same package, thermal resistance ja and jc are changed depending on the chip size, power consumption, and the measurement environments of the am bient temperature, the mounting condition, and the wind velocity, etc. thermal resistance under a certain regulated condition is shown in table 1 as a reference data when the fr4 glass epoxy substrate (70mm x 70mm x 1.6mm and 3% or less in the area of the copper foil) is mounted. rohm standard (note 1) one-layer unit ja 142.9 c/w jc 36 c/w (note 1) 70.0mm x 70.0mm x 1. 6mm fr4 glass epoxy substrate 3. thermal de-rating curve thermal de-rating curve indicates power that can be consumed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambient temperature (25c), and becomes 0w the maximum joint temperature (150c). the inclination is reduced by the reciprocal of thermal resistance ja. the thermal de-rating curve under a certain regulated condition is shown in figure 34. j c [c/w] junction temperature tj[c] package surface temperature tc[c] ambient temperature ta[c] j a [c/w] mounting substrate figure 33. thermal resistance model of surface mount 2) (equation c/w][ 1) (equation c/w][ ? ? ? ? ? ? p tctj jc p t a t j ja ? ? table 1. thermal resistance (reference data) 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 125 150 ambient temperrature: ta[c] power dissipation: pd[w] operating range figure 34. power dissipation vs ambient temperature (70.0mm x 70.0mm x 1.6mm glass epoxy substrate) ?1/ ja=?7.0mw/c
13/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 i/o equivalence circuit (resistance values are typical) 1. power supply pin, and 2. hall input pins, 3. minimum output duty setting 4. soft start capacitor ground pin output duty cont rollable input pin connecting pin pin, and output current detection pin 5. high side output 1, 2 pins, 6. low side output 1, 2 pins 7. reference volt age output pin, 8. oscillating capacitor and speed pulse signal output and hall bias pin connecting pin pin osc vcc 1k ? vcc 1k ? th 1k ? h+ h? cs vcc vcc gnd min 1 k ? vcc 30 ? ss 1 k ? vcc 30 ? vcc vcc 20? a1l a2l reg 20? a1h a2h fg ref 36k ? vcc hb 31k ? vcc
14/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 operational notes 0. datasheet datasheet may simplify the block chart, the schematic diagr am, the timing chart, and the sequence, etc. to describe the function of ic and the application to explain conveniently. 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. however, pins that drive inductive loads (e.g. motor driver outpu ts, dc-dc converter outputs) may inevitably go below ground due to back emf or electromotive force. in such cases, the user should make sure that such voltages going below ground will not cause the ic and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and pcb wiring to name a few. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the power dissipation stated in this datasheet is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to raise heat dissipation capability. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, width of power and ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. to prevent damage from static discharge, ground the ic during assembly and use si milar precautions during transport and storage. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. 10. mounting errors and inter-pin short ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. especially, if it is not expressed on the datasheet, unused input pins should be connected to the power supply or ground line.
15/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 operational notes - continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown (tsd) circuit this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature will rise which will activate the tsd circui t that will turn off all output pins. when the junction temperature falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. figure 35. example of monolithic ic structure
16/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 ordering information physical dimension marking diagram tape and reel information ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin d6973 ssop-b16 (top view) part number lot number 1pin mark b d 6 9 3 f vb e part number package type ? fv; ssop-b1 6 D product class ? e2; e mbossed tape and reel packaging and formi ng specific ation l 7 2 ? lb ; industrial a pp lications
17/17 datasheet datasheet BD6973FV-LB tsz02201-0h1h0b100820-1-2 ? 2013 rohm co., ltd. all rights reserved. 27.feb.2014 rev.002 www.rohm.com tsz22111 ? 15? 001 revision history date revision comments 11.sep.2013 001 new release 27.feb.2014 002 delete sentence ?and log life cycle? in general description and futures. applied new style (change of the size of the title).
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

▲Up To Search▲

Price & Availability of BD6973FV-LB

	To Download BD6973FV-LB Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .