cystech electronics corp. spec. no. : c330sb issued date : 2003.04.09 revised date :2011.01.28 page no. : 1/6 sk32sb thru sk3bsb cystek product specification 3.0amp. surface mount schottky barrier diodes sk32sb thru sk3bsb features ? for surface mounted applications. ? for use in low voltage, high frequency inverters, fr ee wheeling, and polarity protection applications. ? plastic material used carries underwriters laboratory flammability classification 94v-0. ? low leakage current. ? high surge capability. ? high temperature soldering: 250 c/10 seconds at terminals. ? exceeds environmental standards of mil-s-19500/228. mechanical data ? case: molded plastic, jedec do-214aa/smb. ? terminals: solder plated, solderable per mil-std-750 method 2026. ? polarity: indicated by cathode band. ? mounting position: any. ? weight: 0.093 gram. maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise specified. ) parameter conditions symbols sk32 sb sk33 sb sk34 sb sk36 sb sk3b sb units repetitive peak reverse voltage v rrm 20 30 40 60 100 v maximum rms voltage v rms 14 21 28 42 70 v maximum dc blocking voltage v r 20 30 40 60 100 v maximum instantaneous forward voltage i f =3a (note 1) v f 0.475 0.5 0.5 0.7 0.85 v maximum average forward rectified current i o 3 a peak forward surge current 8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 100 a v r =v rrm ,t a =25 (note 1) 0.5 ma m aximum dc reverse curren t v r =v rrm ,t a =125 (note 1) i r 20 ma maximum thermal resistance, junction to ambient (note 2) r th,ja 40 (typ) /w diode junction capacitance f=1mhz and applied 4v reverse voltage c j 50 (typ) pf storage temperature tstg -65~+150 operating temperature t j -55~+125 -55~+150 notes : 1.pulse test, pulse width=300 sec, 2% duty cycle 2.mounted on pcb with 0.2? 0.2?mm2 (0.5mm 0.5mm) copper pad area.
cystech electronics corp. spec. no. : c330sb issued date : 2003.04.09 revised date :2011.01.28 page no. : 2/6 sk32sb thru sk3bsb cystek product specification characteristic curves forward current derating curve 0 0.5 1 1.5 2 2.5 3 3.5 0 50 100 150 200 ambient temperature---ta() average forward current---io(a) sk36-3b sk32-34 maximum non-repetitive forward surge current 0 20 40 60 80 100 120 11 0 numbers of cycles at 60hz peak forward surge current--- i fsm (a) 1 0 0 tj=25, 8.3ms single half sine wave, jedec method forward current vs forward voltage 0.01 0.1 1 10 100 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 forward voltage---vf(v) forward current---if(a) tj=25, pulse width=300s, 1% duty cycle sk32-34 sk36 sk3b junction capacitance vs reverse voltage 0 20 40 60 80 100 120 140 0.01 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 percentage of rated peak reverse voltage---(%) reverse leakage current---ir(ma) tj=75 tj=25
cystech electronics corp. spec. no. : c330sb issued date : 2003.04.09 revised date :2011.01.28 page no. : 3/6 sk32sb thru sk3bsb cystek product specification taping reel dimension
cystech electronics corp. spec. no. : c330sb issued date : 2003.04.09 revised date :2011.01.28 page no. : 4/6 sk32sb thru sk3bsb cystek product specification recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c330sb issued date : 2003.04.09 revised date :2011.01.28 page no. : 5/6 sk32sb thru sk3bsb cystek product specification recommended footprint inches millimeters dim typ typ a 0.142 3.60 b 0.059 1.50 c 0.118 3.00 ordering information device package shipping marking sk32sb smb 3000 pcs / tape & reel sk32 sk33sb smb 3000 pcs / tape & reel sk33 sk34sb smb 3000 pcs / tape & reel sk34 sk36sb smb 3000 pcs / tape & reel sk36 sk3bsb smb 3000 pcs / tape & reel sk3b
cystech electronics corp. spec. no. : c330sb issued date : 2003.04.09 revised date :2011.01.28 page no. : 6/6 sk32sb thru sk3bsb cystek product specification smb/do-214aa dimension marking code : sk32sb sk33sb sk34sb sk32 sk33 sk34 sk36sb sk3bsb sk36 sk3b smb/do-214aa plastic surface mounted package cystek package code : sb *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.075 0.083 1.91 2.11 e 0.006 0.012 0.152 0.305 b 0.130 0.155 3.30 3.94 f 0.002 0.008 0.051 0.203 c 0.160 0.185 4.06 4.70 g 0.030 0.060 0.76 1.52 d 0.083 0.096 2.13 2.44 h 0.200 0.220 5.08 5.59 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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