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this document is commercially confidential and must no t be disclosed to third parties without prior consent. the information provided herein is believed to be reliable. but production testing may not include testing of all parameters. airoha technology corp. reserves th e right to change information at any time without notification. ( http://www.airoha.com.tw tel:+886-3-6128800 fax:+886-3-6128833 sales@airoha.com.tw ) preliminary specification version 0.20 12-apr-2011 a a a b b b 1 1 1 1 1 1 2 2 2 0 0 0 bluetooth 3.0 single chip for hid applications confidential for leahope free datasheet http:///
page 2 of 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 this document is commercially confidential and must not be disclosed to third parties without prior consent. the information provided herein is believed to be reliable. but production testing may not include testing of all parameters. airoha technology corp. reserves the right to change information at any time without notification. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 3 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 revision history version change summary date author 0.10 created 10-feb-11 kh chen 0.20 updated 12-apr-11 kh chen confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 4 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 index 1 ..................................................................................................... 6 features 2 ................................................................................................ 7 description 2.1 ............................................................................................................................... .............. 7 r adio t ransceiver 2.2 ............................................................................................................................... .......... 8 b aseband p rocessor 2.3 .............................................................................................................. 8 s erial c ommunication i nterface 2.4 ............................................................................................................................... ................................. 8 i/o p orts 2.5 ............................................................................................................................... ............................. 9 p eripherals 3 .......................................................................................... 10 pin definition 4 ....................................................................................... 11 pin description 4.1 ............................................................................................12 s uggestion to pio i nput /o utput u sage 5 ................................................................................... 13 radio transceiver 5.1 ............................................................................................................................... ........................13 rf f ront - end 5.2 ............................................................................................................................... ...................................13 r eceiver 5.3 ............................................................................................................................... ..........................14 t ransmitter 5.4 ............................................................................................................................... ...........................14 s ynthesizer 6 ...................................................................... 15 baseband processing unit 6.1 ..........................................................................................................15 b luetooth f rame d ata p rocessor 6.2 ....................................................................................................................16 m odulator and d emodulator 6.3 .......................................................................................................16 b luetooth t iming p rocessing u nit 7 ...................................................................................... 17 mcu and memory 8 ............... 18 peripheral control and serial communication interfaces 8.1 .......................................................................................................................18 s erial p eripheral i nterface general waveform ....................................................................................... 19 write operation ................................................................................................................. 19 read operation ................................................................................................................. 20 confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 5 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 resync ............................................................................................................................... . 20 9 ........................................................... 21 power management / regulation 9.1 ............................................................................................................................... .............21 p ower r egulation 9.2 ..............................................................................................................21 p ower m anagement u nit (pmu) 9.3 .............................................................................................................................21 l i - mode b attery c harger 10 ....................................................................................... 22 software stack 10.1 .......................................................................................................22 k ey f eatures of hid d evice s tack 10.2 .............................................................................................23 d evelopment e nvironments and t ools 10.2.1 software development environments ............................................................ 23 10.2.2 test and configuration tools ........................................................................... 23 11 ................................................................... 24 electrical characteristics 11.1 a bsolute m aximum r atings .....................................................................................................................24 11.2 .....................................................................................................24 ecommended o perating c onditions 11.3 d igital t erminals ............................................................................................................................... ..........25 11.4 ...........................................................................................25 pio c urrent s ink /s ource c apabilities 11.5 r eference c lock ............................................................................................................................... .............26 11.6 ............................................................................................................................... .....26 s witching r egulator 11.6.1 ............................................................................................................................... ............26 b uck r egulator 11.6.2 ............................................................................................................................... .........27 b oost r egulator 11.7 ............................................................................................................................... .............27 l i -m ode c harger 11.8 ................................................................................................................28 t ypical c urrent c onsumption 11.9 r adio c haracteristics ............................................................................................................................... 29 11.9.1 t ransmitter (b asic d ata r ate ) ...........................................................................................................29 11.9.2 r eceiver (b asic d ata r ate ) ...................................................................................................................30 11.9.3 t ransmitter (e nhanced d ata r ate ) ..................................................................................................31 11.9.4 r eceiver (e nhanced d ata r ate ) ..........................................................................................................32 12 .............................................................................. 33 package information confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 6 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 1 features ? compliant with bluetooth 3.0 specifications ? hid profile version 1.0 compliant ? supports afh ? supports sniff sub-rating for longer battery life & faster re-connect ? 18 programmable gpios ? supports 3 axis detection ? supports spi interface with 3/4-wire mode to sensor ic ? supports i2c eeprom interface ? supports uart interface for firmware downloading and pe ripheral control ? supports usb interface for host control ? embedded 2 led drivers with fader ? low cost rom based design wi th customer code support ? embedded power management unit ? integrated 1.8v buck and 2.7~ 3.3v boost switching regulator ? embedded charger circuits with li-battery mode ? single rf port for transmitter and receiver ? receiver sensitivity of ?88d bm at basic data rate ? transmit power up to +6dbm with 20 db gain tuning range ? qfn 6mmx6mm 48 pin package confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 7 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 2 description AB1120 is a single-chip ic for hid applications , which supports blue tooth system version 3.0 features including afh function. it support s sniff sub-rating for longer battery life & faster re-connect. bluetooth 3.0 simple-pairi ng mechanism is also implemented. AB1120?s scatternet can join up to 3 piconets. it comp lies with rf transceiver, baseband processor, pmu, switching regulator, boost regulator and li-ion battery charger . several serial communication interfaces including usb , uart, i2c and spi are supported. mcu rom ram usb led driver spi gpio xyz control i2c radio transceiver baseband processing unit pmu swreg & ldo boost AB1120 bouetooth soc for hid uart charger 2.1 radio transceiver a common rf terminal is sh ared by the tx/rx paths of AB1120 with embedded tx/rx switch. only an external balun and 3 matching components are requir ed in the rf port. a low-if architecture is im plemented in the receiver pa rt. the receiver sensitivity is ?88dbm at basic data rate. the rssi valu e which indicates the received signal power level is also measured and pr ovided to the upper layers. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 8 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 a direct-up conversion architect ure is used in the transmitter part. the output power level at tx part is +6dbm for the basic data rate, with 20db vga gain tuning range. a fractional-n synthesizer is im plemented in AB1120 with internal loop filters such that no external componen ts are required. an internal crystal oscillator is integrated such that only an exte rnal 26mhz crystal is required. an internal 32.768khz slow clock is also gene rated. external clock signal can also be fed into AB1120 instead of the 26mhz crystal clock signal. 2.2 baseband processor the baseband processor of AB1120 supports bl uetooth 3.0 specificati ons including afh. a digital data processing unit is in charge of the gfsk, dqpsk and d8psk modulation / demodulation, channel filtering, error detection/correction, and burst framing. a mcu-based link controller is implemented for the whole baseband control functions. a firmware is in charge of the link management protocols, profiles and mmi. several hardware accelerators are implemented to su pport the baseband processing such as encryption, scatter-net operation, etc. 2.3 serial communication interface several serial communication interfaces including usb, uart and spi are supported in AB1120. an i2c interface is im plemented for eeprom access. 2.4 i/o ports the total number of i/o pins of AB1120 is 18 pins, includin g 6 pins dedicated for input and 1 pin (pio29) dedicated for eeprom wr ite protection. othe r 11 i/o pins are programmable and support both input and outp ut. a 3-axis detection is supported for external button control (i .e. pio4/pio5 are dedicated to za/zb control in mouse application). two led drivers with faders for blue/red leds are also included. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 9 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 2.5 peripherals an on-chip switching regulator or a linear regu lator is used to prov ide 1.8v vcc to the whole chip from battery supply. a 2.7~3.3v (selectable) boost switching regulator is also included for the power supply of pmu, led an d external sensor ic of the hid device. a pmu is embedded in AB1120 for th e power management affairs. a li-ion battery charger circuits is also supported in AB1120. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 10 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 3 pin definition 15 16 17 18 19 20 21 22 23 24 1 2 3 4 5 6 7 8 9 10 11 12 28 27 26 25 36 35 34 33 32 31 30 29 48 47 46 45 44 43 airoha vreg_in pio23 rf_p pio24 vccrf rf_n pio0 pio1 rst_n pio2 pio3 vccana usb_dp vccled led1 wp uart_rx pio4 uart_tx vccio usb_dn boost_vbat pio5 lx2 xtal_out vccxo pio26 pio8 pio6 vccdig v_chg lx bat_n vb_out xtal_in AB1120 bluetooth soc vccdiv pio10 li_mode pio11 pio14 pio15 pio17 sda scl pio29 led0 pio16 bat_p 13 14 42 41 40 39 38 37 for hid applications confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 11 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 4 pin description pin siganl type description alternative 1 pio23 input/output, digital programmable io 2 pio24 input, digital input pin 3 vccana supply, 1.8v vcc for analog 4 vccrf supply, 1.8v vcc for rf 5 rf_p input/output, differential rf rf input/output p 6 rf_n input/output, differential rf rf input/output n 7 rst_n input, digital global reset 8 pio0 input, digital input pin 9 pio1 input, digital input pin 10 pio2 input, digital input pin 11 pio3 input, digital input pin motion wake up 12 vreg_in supply, 1.8v vco regulator input 13 vccdiv supply, 1.8v vcc for divider 14 pio10 input/output, digital programmable io 15 li_mode input, digital battery mode indicator 16 pio11 input/output, digital programmable io 17 pio14 input/output, digital programmable io spi_csb (ncs) 18 pio15 input/output, digital programmable io spi_mosi 19 pio16 input/output, digital programmable io spi_miso 20 pio17 input/output, digital programmable io spi_clk (sclk) 21 sda input/output, digital i2c data line 22 scl input/output, digital i2c clock line 23 pio29 output, digital output pin (dedicated for eeprom wp ) 24 led0 open drain led 0 for red light 25 led1 open drain led 1 for blue light 26 wp output, digital write protect control for eeprom 27 pio4 input/output, digital programmable io zb 28 pio5 input/output, digital programmable io za confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 12 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 29 uart_rx input, digital uart rx 30 uart_tx output, digital uart tx 31 vccio supply, 1.8v ~ 3. 3v vcc for io ports 32 usb_dp input/output, analog usb data i/o 33 usb_dn input/output, analog usb data i/o 34 vccled output vcc output, supply to led 35 boost_vbat input, analog boost enable signal 36 lx2 supply boost regulator input 37 vb_out output, 2.7 ~ 3.3v boost regulator output 38 bat_n gnd battery input n, connected to gnd 39 lx analog switching regulator output 40 bat_p supply battery input p, as switching/linear regulator input 41 v_chg supply vcc for li-ion battery charger 42 vccdig supply, 1.8v vcc for digital circuits 43 pio6 input/output, digital programmable io 44 pio8 input/output, digital programmable io 45 pio26 input, digital input pin 46 vccxo supply, 1.8v vcc for xo 47 xtal_out analog crystal output 48 xtal_in analog crystal input 4.1 suggestion to pio input/output usage pio suggestion 0, 1, 2, 3, 24, 26 used as input pins only 4, 5, 6, 8, 10, 11, 14, 15, 16, 17, 23 could be used as input or output. note: pio4, pio5 are dedicated for za/zb usage of mouse application pio14, pio15, pio16, pio17 ar e also used as spi interface 29 ouput, pio29 is dedicated to eeprom write protection confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 13 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 5 r adio transceiver the AB1120 rf transceiver is a 2.4ghz-band transceiver fo r the bluetooth applications. there are three main functions ? transmitter, receiver, and synthesize r. the enable control signals of these functions are given by the baseband processing unit. tx vga lna rx vga synthesizer vco & pll xo rxiq txiq t/r sw rf i/o ports baseband processing unit 26mhz crystal enable control 5.1 rf front-end the rx input ports and tx ou tput ports share the same rf terminals such that no external t/r switch is requir ed. only a balun and some matc hing components are placed outside the rf terminals. 5.2 receiver the AB1120 rf receiver implements a low-if architecture, wh ich is composed with two parts: rf front-end and low-if part. the rf front-end part comprises a lna and a quadrature mixer. the lif part comprises a lo w-pass filter (lpf) for out-band filtering and a variable gain amplifier (vga). confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 14 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 the lna input shares the same rf ports with tx output. the rx front-end gain could be adjusted, and thus reduce the probability of bit er rors caused by poor signal-to-noise ratio. after the lna is followed by a quadrature mi xer that down-converts the rf signal to low-if band. at the lif part, the down-convert ed signal is first low-pass f iltered by the lpf, amplified by the vga, and then sent to the adc for demodulation. the 3db bandwidth of the lpf could be adjusted through rf registers. th e lna and vga provide more than 80db gain control range. 5.3 transmitter the AB1120 rf transmitter implements a di rect-up-conversion architecture, which comprises a lpf, a modulator and a vga stage. the tx baseband signals are fed from baseband dac, generated by the baseband modulators. a lpf is implemented to attenuate the second sidelobe of signal spectrum and unwa nted oversampling clock or spurious signals. the 3db bandwidth of the lp f could be adjusted through rf registers. the vga provides variable ga in with more than 28db dynamic range, and could be controlled through rf register interface. 5.4 synthesizer the AB1120 implements a fractional-n synthe sizer with embedded vco and loop filter without the need of external components. AB1120 also integr ates an internal crystal oscillator that only an external 26mhz crystal is required. external clock signal can also be fed into AB1120 instead of the 26mhz crystal clock signal. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 15 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 6 baseband processing unit the baseband processing unit (bpu) compri ses a digital-to-analog convert (dac), an analog-to-digital converter (adc), a digital modulator, a digital demodulator, a bluetooth frame data processor, and a ti ming processing unit (tpu). adc dac modulator demodulator bluetooth frame data processor bluetooth timing processing unit radio transceiver baseband processing unit mcu ram 6.1 bluetooth frame data processor AB1120 baseband processing unit supports all packet types of bluetooth 1mbps, 2mbps and 3mbps modes. on transmit ter side, the frame data pro cessor can construct bluetooth data packet according to the pa cket type given by mcu. the constructed data packet then will be converted to analog modulated si gnal format by the modulator and dac. on the receiver side, the analog received signal will be firs t converted to digitized data format by the adc and demodulator, and then the frame data processo r will de-construct the received data to several parts and identify if the received signal is a valid bluetooth packet and if the packet is for the device it self. the received header data and psdu data will be stored into memory if it is a valid bl uetooth data packet and is for the device itself. access code check, header error check (hec) and psdu crc checking functions are performed by the frame data proc essor, too, to see if this r eceived signal is valid and error free or not. a data whitening circuit and an encryption engi ne are also in cluded in the frame data processor for both transmitter and receiver paths. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 16 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 6.2 modulator and demodulator the modulator can generate gfsk, dqpsk an d d8psk signals according to which data rate is adopted in the frame data. the demodulator can convert the received data signal to digitized data bit format according to the modulation ty pe indicated in the header region. 6.3 bluetooth timing processing unit a bluetooth timing processing unit (tpu) is embedded in the baseband processing unit. tpu is in charge of generating rf timing control signals to the rf radio part, such as tx enabling signals and rx enabling signals. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 17 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 7 mcu and memory mcu rom ram bpu led driver spi gpio xyz control i2c uart usb the micro-control unit (mcu) executes the bluetooth protocol software stack, controls the bluetooth baseband processing unit (b pu) and serial communication interfaces. 2mbits rom is embedded in AB1120 to store the software stack, and 24kbytes ram is provided to support the mcu and baseband data processing. data are transferred between mcu, rom, ram and bpu with a sh ared memory bus. another peripheral bus is connected with mcu for the pe ripherals access. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 18 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 8 peripheral control and serial communication interfaces the total number of i/o pins of AB1120 is 18, including 6 pins dedica ted for input, 1 pin for eeprom write protection(pio29). other 11 i/o pins are programmable and support both input and output directio ns. the rom firmware provides a possibility that developers could select different pios for input with out re-compile their customer code. an easy-to-use configuration utility program can mo dify the pio selections and up to 16 pins could be programmed as input simultaneously, for example a device with 16 buttons, and thus can fulfill the hid mmi requirements in most applications. there are one set of 3-axis de tection io ports, 2 led driver s, one spi interface, and one i2c interface connected to mcu with a peripheral bus. an uart and an usb for firmware downloading and peripheral co ntrol are also supported. the led drivers integrate fader function and can drive red and blue leds for hid device indication purposes. the i2c interface is used to connect to a serial eeprom, whic h supports 100khz / 400khz / 800khz bus clock rate at 1.8 or 3.3v voltage supply. the uart interface supports up to 3m baud rate. the usb inte rface supports usb 2.0 full speed. both of them are connected to the peripheral interface. 8.1 serial peripheral interface a spi interface allows AB1120 to communicate with external hid device controller to exchange the mmi information su ch as button, axis control, etc. both 3-wire and 4-wire mode spi interfaces are supported in ab11 20. when 3-wire mode is selected, pin 18 (spi_mosi) would be data i/o pi n of the spi interface. only master mode is supported in AB1120. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 19 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 general waveform spi_sclk_ncs_sel spi_sclk_pha = 0 sck (spi_sclk_pol = 0) sck (spi_sclk_pol = 1) mosi pin miso pin ncs msb first (spi_lsb_fe = 0) : msb bit14 bit13 bi t12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit 1 lsb transfer lsb first (spi_lsb_fe = 1) : lsb bit1 bit2 bit3 bit4 bit5 bit6 bit7 bit8 bit9 bit10 bit11 bit12 bit13 bit14 msb msb first (spi_lsb_fe = 0) : msb bit14 bit13 bi t12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bi t1 lsb lsb first (spi_lsb_fe = 1) : lsb bit1 bit2 bit3 bit4 bit5 bit6 bit7 bit8 bit9 bit10 bit11 bit12 bit13 bit14 msb spi_sclk_ncs_sel sck (spi_sclk_pol = 0) sck (spi_sclk_pol = 1) mosi pin miso pin ncs transfer spi_sclk_pha = 1 write operation sclk 12345678910111213141516 d0d1d2 d3 d4d5d6d7 a6 a5 a4 a0a1a2a3 1 mosi confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 20 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 read operation sclk 12345678910111213141516 0 a6 a5a4a3a2a1a0 d7d6d5d4d3d2d1d0 hi-z hi-z mosi a b part a thold a1 a0 d7 789 hi-z sclk mosi thold mosi read hold time part b d0 hi-z 1 16 sclk mosi resync hi-z address data sclk mosi tresync tsiwtt tsiwtt serial interface watchdog timer timeout tresync serial interface resync confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 21 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 9 power management / regulation AB1120 integrates a power management unit (p mu), two internal sw itching regulators: one bulk regulator from vbat to 1.8v vcc, and one boost re gulator from vbat to higher voltage (2.7~3.3v, selectable), an d a 1.5v ldo regulator for vco. a li-ion battery charger is also embedded. 9.1 power regulation a switching regulator is embedded to convert vb at to 1.8v voltage supply for the core of AB1120. there is another boost regulator to up convert th e vbat supply voltage to a higher level (2.7~3.3v, selectable) for the po wer supply of pmu, led driver, and external sensor ic. all these regulators are integrated within AB1120. 9.2 power management unit (pmu) a pmu is designed in AB1120 for the powe r management affairs. during general operations, mcu may get into sleep mode for power saving . at this moment the pmu watches the keys and wake up mcu if one of the keys is pressed. pmu also monitors the battery voltage and reports to mcu. 9.3 li-mode battery charger the li-mode battery charge r of AB1120 provides several operation modes including trickle mode, constant curren t mode (cc mode), constant voltage mode (cv mode), and standby mode. when an external power supp ly is connected to AB1120, pmu will first detect if the voltage is corr ect and enable the ch arger circuit. when charger circuit is enabled, it will detect the ba ttery voltage and enters the a ssociated mode to charge the battery, i.e. trickle, cc or cv mode. when the battery volt age reaches a high threshold, the charger will enter standby mode and keep watching the ba ttery voltage. if the battery voltage drops to a lower threshold, charger circuit will re-charge the battery again. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 22 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 10 s oftware stack 10.1 key features of hid device stack the airoha AB1120 hid software stack provides total solution of bluetooth hid profile (device role), including all protocol stacks an d profiles defined in hi d v1.0. in additional, it has some extra features as shown below: ? configurable mmi: customers can modify user interface behavior by setting registers in eeprom. in additional, ab 1120 provides a set of function interface in arioha hid customer code environment. customers can re-write these functions to configure their own mmi. ? support mainstream optical/la ser sensors by default, and can be chosen by eeprom settings. customers can re-write the mmi using arioha hid customer code environment for other sensor. ? good report rate for hi d mouse. (up to 125hz) ? low-power operation based on various hardware-wakeup mechanisms. hardware lc lm hci middleware l2cap gap host controller sdp mmi profile manager hid data center connection center sdap airoha defined interface component bluetooth defind component customer defind component figure 10.1: hid software stack confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 23 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 10.2 development environments and tools 10.2.1 s oftware development environments AB1120 provides a set of function interface in arioha hid customer code environment . customers can rewrite these func tions to control their hardware components, such as keypad, led, spi , optical sensor and etc.. 10.2.2 t est and configuration tools various tools are provided for testin g and configuration as shown below: ? AB1120 labtest AB1120 labtest provides the capability for rf testing and can be used as hid module testing during mass-production. ? AB1120 hid configuration tool AB1120 hid configuration tool provides to customers the capability to configure the various settings, such as button i/o, led behavior, battery parameters, and sensor settings stor ed in eeprom. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 24 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 11 electrical characteristics 11.1 absolute maximum ratings AB1120 could be damaged by any stress in excess of the absolute maximum ratings listed below. 11.2 recommended operating conditions item min. max. i/o supply voltage (vccio) -0.3v 5.5v boost supply voltage (vb_in) -0.3v 5.5v charger supply voltage (v_chg) -0.3v 6.5v switching regulator supply voltage (bat_p) -0.3v 5.5v operating temperature -40 ? c +85 ? c storage temperature -65 ? c +150 ? c lna input level - +10 dbm pa output load mismatch - 10:1 item min. typ. max. unit core supply voltage (vccana, vccrf, vccdiv, vreg_in, vccdig, vccxo) 1.8 v i/o supply voltage (vccio) 1.8 3.6 v boost supply voltage (vb_in) 1.6 3.3 v charger supply voltage (v_chg) 4.5 5 6.5 v switching regulator supply voltage (bat_p) 2 4.2 v confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 25 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 11.3 digital terminals item min. typ. max. unit input voltage levels input logic level low (v il ) 0 0.3*vccio v input logic level high (v ih ) 0.7*vccio vccio+0.4 v output voltage levels ( 1.7v Q vccio Q 1.9v ) output logic level low (v ol ), i o =4.0ma 0.4 v output logic level high (v oh ), i o =-4.0ma vccio-0.4 v output voltage levels ( 2.7v Q vccio Q 3.0v ) output logic level low (v ol ), i o =4.0ma 0.2 v output logic level high (v oh ), i o =-4.0ma vccio-0.2 v 11.4 pio current sink/source capabilities item output criteria capability note vccio = 3.3 v max. input current low vout Q 0.3vccio 10 ma max. output current high vout 0.7vccio R 10 ma vccio = 2.7 v max. input current low vout Q 0.3vccio 10 ma max. output current high vout 0.7vccio R 10 ma z this table is applied to pio # 4, 5, 6, 8, 10, 11, 14, 15, 16, 17, 23 confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 26 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 11.5 reference clock item min. typ. max. unit crystal requirement nominal frequency 26 mhz operating temperature range -30 25 85 frequency stability over operating temperature range -10 +10 ppm crystal oscillator characteristics tunning range ( with 128 steps ) 95 ppm negative resistance (@ c0 = 0.89pf, cl = 10pf ) 140 external reference clock requirement input frequency 26 mhz clock input level ( ac-coupled, sinusoidal or square wave ) 0.2 1.8 v pk-pk xtal_in input impedance 10 k xtal_in input capacitance 10 pf 11.6 switching regulator 11.6.1 buck regulator external inductor = 33uh, external capacitor = 4.7uf item min. typ. max. unit input voltage 2 3.6 v output voltage bat_p > 2.2v 1.7 1.8 1.9 v rated output current (iout) bat_p > 3.6v 60 ma switching frequency 1 mhz power efficiency @iout max 80 % confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 27 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 11.6.2 boost regulator external inductor = 4.7uh, external capacitor = 10uf item min. typ. max. unit input voltage 1.6 3.6 v output voltage at vb_out = 3v setting 2.7 3 3.3 v rated output current (iout) vb _in = 2.4v, vb_out=3v 100 ma switching frequency 566 khz power efficiency @iout max 80 % 11.7 li-mode charger item min. typ. max. unit input voltage 4.5 5 6.5 v charge current (cc mode) 40 100 ma trickle charge current 5 5.5 6 ma trickle charge threshold voltage 2.8 v regulated output (float) voltage 4.16 4.2 4.24 v battery charger termination current 10 % recharge battery hysteresis voltage 100 mv confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 28 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 11.8 typical current consumption core supply voltage = 1.8v @ 25 item min. typ. max. unit transmit (peak current) 53 ma receive (peak current) 48 ma dm1(tx mode) 53 ma dm1(rx mode) 48 ma sniff mode, 10ms 5.1 ma sniff mode, 100ms ma sniff mode, 1.28s ma deep sleep (disconnected, link loss state, wake on interrupt) 27 a the current consumption was measured di rectly on the buck and boost output. confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 29 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 11.9 radio characteristics 11.9.1 transmitter (basic data rate) core supply voltage = 1.8v @ 25 item min. typ. max. unit maximum rf transmit power *1 1 dbm rf power control range 20 db 20db bandwidth for modulated carrier 950 khz +2mhz -21 dbm -2mhz -34 dbm +3mhz -47 dbm adjacent channel transmit power -3mhz -43 dbm average deviation in payload 140 khz frequency deviation maximum deviation in payload 160 khz initial carrier frequency tolerance 10 khz dh1 packet 15 khz dh3 packet 15 khz drift dh5 packet 15 khz drift rate 5 khz/50us 2 nd harmonic content -30 dbm 3 rd harmonic content -30 dbm *1 the maximum rf transmit power could reach to 6dbm with appropriate settings confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 30 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 11.9.2 receiver (basic data rate) core supply voltage = 1.8v @ 25 item min. typ. max. unit 2.402ghz -88 dbm 2.441ghz -88 dbm sensitivity at 0.1% ber 2.480ghz -88 dbm maximum input power at 0.1% ber 0 dbm co-channel interference 7 db f = f 0 +1mhz -5 db f = f 0 -1mhz -5 db f = f 0 +2mhz -35 db f = f 0 -2mhz -28 db f = f 0 +3mhz -43 db ad j acent channel selectivity c/i f = f image -18 db maximum level of intermodulation interference -32 dbm 30-2000 mhz -3 dbm 2000-2400 mhz -10 dbm 2500-3000 mhz -10 dbm blocking @pin=-67dbm with 0.1%ber 3000-12750 mhz 0 dbm confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 31 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 11.9.3 transmitter (enhanced data rate) core supply voltage = 1.8v @ 25 item min. typ. max. unit relative transmit power -3 db /4 dqpsk max carrier frequency stability | o | 1 khz /4 dqpsk max carrier frequency stability | i | 3 khz /4 dqpsk max carrier frequency stability | o + i | 4 khz 8dpsk max carrier frequency stability | o | 1 khz 8dpsk max carrier frequency stability | i | 3 khz 8dpsk max carrier frequency stability | o + i | 4 khz rms devm 7 % 99% devm % /4 dqpsk modulation accuracy peak devm 19 % rms devm 7 % 99% devm % 8dpsk modulation accuracy peak devm 19 % f > f0 + 3mhz dbm f < f0 - 3mhz dbm f = f0 + 3mhz -34 dbm f = f0 - 3mhz -40 dbm f = f0 + 2mhz -23 dbm f = f0 - 2mhz -33 dbm f = f0 + 1mhz -30 dbm in-band spurious emissions f = f0 - 1mhz -30 dbm edr differential phase encoding 0 % confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 32 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 11.9.4 receiver (enhanced data rate) core supply voltage = 1.8v @ 25 item min. typ. max. unit /4 dqpsk -89 dbm sensitivity at 0.01% edr 8dpsk -81 dbm /4 dqpsk 0 dbm maximum input power at 0.1% ber 8dpsk 0 dbm /4 dqpsk 10 db co-channel interference 8dpsk 17 db /4 dqpsk -11 db f = f 0 +1mhz 8dpsk -5 db /4 dqpsk -11 db f = f 0 -1mhz 8dpsk -5 db /4 dqpsk -34 db f = f 0 +2mhz 8dpsk -28 db /4 dqpsk -30 db f = f 0 -2mhz 8dpsk -23 db /4 dqpsk -41 db f = f 0 +3mhz 8dpsk -34 db /4 dqpsk -15 db ad j acent channel selectivity c/i f = f image 8dpsk -8 db confidential for leahope free datasheet http:///
AB1120 bluetooth 3.0 single chip for hid applications page 33 o f 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 12 package information saw qfn 48ld, 6x6x0.85 pkg 0.40 pitch pod confidential for leahope free datasheet http:///
page 34 of 34 confidential copyright ? 2010, airoha technology corp. AB1120 bluetooth 3.0 single chip for hid applications AB1120 bluetooth 3.0 single chip for hid applications preliminary specification version 0.20 12-apr-2011 confidential for leahope free datasheet http:///

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