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  design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. choke coils ? 196 ? e 12 q 3 pb h 456789 product code inductance classification 10 11 12 suffix packaging core winding size t explanation of part numbers recommended applications dc-dc converter for cpu in pcs thin on-board power supply modules for serv ers features high power, high inductance (no saturation per for mance limitation due to its metal dust core) (27 a to 36 a/0.80 ? to 0.45 ?) low loss due to low r dc (using ? at wire) low buzz noise due to its gap-less structure surface mount, low pro? le (h)6.0 mm  (l)13.0 mm  (w)12.9 mm standard packing quantity 500 pcs./reel low pro le, high power, low loss power ch oke coil series: pcc-d126h (nx3) standard parts part no. inductance (at 20 ?) ? 1 rated current (a) ? 2 dc resistance (at 20 c) (m  ) max. l1 l 2 ( reference) (h) tolerance (%) measurement current (a) (h) measurement current (a) ETQP1H0R6BFA 0.60 25 26 0.45 36 26 0.90 etqp1h 1r0bfa 1.00 20 19 0.80 27 19 1.56 ( ? 1) inductance is measured at 100 khz. ( ? 2) rated current de? nes actual value of dc current, when temperature rise of coil becomes 40 k. sep. 2010 00
design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. choke coils ? 197 ? 02 4 6 810121 41618202 2242628303234363840 (a) ( h) 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 i dc (a) 1r0bfa 0r6bfa  t(k) 0510 15 20 i dc (a) 25 30 35 40 45 50 200 150 100 50 0 etqp1h1r0bfa ETQP1H0R6BFA date code 13.0 0.3 6.0 max. (1.6) ( 4.0) (2.1) (1.2) (5.3) (5.15) (1.2) 7.2 9.0 nc p1 p2 nc 12.9 0.5 0.01 min. marking t ype no.1 clearance between the terminal face and the core face : reference value () p2 nc nc p1 4.1 3.1 10.2 2.5 2.2 6.4 2.6 dimensions in mm (not to scale) connection recommended land pattern in mm (not to scale) case temperature vs dc current inductance vs dc current performance characteristics (reference)  packaging methods please see pages 202 to 203  soldering conditions please see page 204  safety precautions please see page 205 sep. 2010 00


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