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pc1231xnsz0f series features dip 4pin reinforced insulation type, high cmr, low input current photocoupler 1. 4pin dip package 2. double transfer mold package (ideal for flow solder- ing) 3. low input current type (i f =0.5ma) 4. high resistance to noise due to high common rejec- tion voltage (cmr : min. 10kv/ s) 5. reinforced insulation type (isolation distance : min. 0.4mm) 6. long creepage distance type (wide lead-form type only : min. 8mm) 7. high isolation voltage between input and output (v iso(rms) : 5.0kv) 8. rohs directive compliant description pc1231xnsz0f series contains an ired optically coupled to a phototransistor. it is packaged in a 4-pin dip, available in wide-lead spacing option and smt gullwing lead-form option. input-output isolation voltage(rms) is 5.0kv. ctr is 50% to 400% at input current of 0.5ma. 1 sheet no.: d2-a02903fen date jun. 30. 2005 ? sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc1231xnsz0f series 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc1231) 2. approved by bsi, bs-en60065, file no. 7087, bs- en60950, file no. 7409, (as model no. pc1231) 3. approved by semco, en60065, en60950, file no. 9933036 (as model no. pc1231) 4. approved by demco, en60065, en60950, file no. 99-03814 (as model no. pc1231) 5. approved by nemko, en60065, en60950, file no. p99102251 (as model no. pc1231) 6. approved by fimko, en60065, en60950, file no. 13986 (as model no. pc1231) 7. recognized by csa file no. ca095323 (as model no. pc1231) 8. approved by vde, din en60747-5-2 ( ) (as an op- tion), file no. 40008087(as model no. pc1231) 9. package resin : ul flammability grade (94v-0) () din en60747-5-2 : successor standard of din vde0884 agency approvals/compliance 1. primary to secondary isolation in switch mode power supply 2. noise suppression in switching circuit 3. signal transmission between circuits of different po- tentials and impedances 4. over voltage detection applications
internal connection diagram anode cathode emitter collector 1 1 2 3 4 2 4 3 2 sheet no.: d2-a02903fen outline dimensions pc1231xnsz0f series (unit : mm) 1. through-hole [ex. pc1231xnsz0f ] 2. through-hole (vde option) [ex. pc1231xysz0f] 3. wide through-hole lead-form [ex. pc1231xnfz0f] 4. wide through-hole lead-form (vde option) [ex. pc1231xyfz0f] 1231 4.58 0.3 0.6 0.2 1.2 0.3 2.54 0.25 6.5 0.3 7.62 0.3 4.58 0.3 3.5 0.5 3.4 0.5 2.7 0.5 0.5 typ. anode mark 0.5 0.1 : 0 to 13? epoxy resin 1 2 4 3 rank mark factory identification mark date code 0.26 0.1 1231 4.58 0.3 0.6 0.2 1.2 0.3 2.54 0.25 6.5 0.3 7.62 0.3 4.58 0.3 3.5 0.5 3.4 0.5 2.7 0.5 0.5 typ. anode mark 0.5 0.1 : 0 to 13? epoxy resin 1 2 4 3 rank mark factory identification mark date code 4 sharp mark "s" vde indenfication mark 0.26 0.1 1.2 0.3 0.6 0.2 2.54 0.25 4.58 0.3 3.5 0.5 1.0 0.1 6.5 0.3 7.62 0.3 epoxy resin 4.58 0.3 0.26 0.1 10.16 0.5 2.7 min. anode mark 1 2 3 4 0.5 0.1 rank mark factory identification mark date code 1231 1.2 0.3 0.6 0.2 2.54 0.25 4.58 0.3 3.5 0.5 1.0 0.1 6.5 0.3 7.62 0.3 epoxy resin 4.58 0.3 0.26 0.1 10.16 0.5 2.7 min. anode mark 1 2 3 4 0.5 0.1 rank mark factory identification mark sharp mark "s" date code vde indenfication mark 4 1231 product mass : approx. 0.23g product mass : approx. 0.23g product mass : approx. 0.23g product mass : approx. 0.23g
3 sheet no.: d2-a02903fen (unit : mm) 5. smt gullwing lead-form [ex. pc1231xnip0f ] 6. smt gullwing lead-form (vde option) [ex. pc1231xyip0f] 7. wide smt gullwing lead-form [ex. pc1231xnup0f] 8. wide smt gullwing lead-form (vde option) [ex. pc1231xyup0f] 0.6 0.2 1.2 0.3 6.5 0.3 7.62 0.3 0.26 0.1 4.58 0.3 2.54 0.25 epoxy resin 3.5 0.5 4.58 0.3 2.54 0.25 4 3 anode mark rank mark factory identification mark date code 1.0 +0.4 ? 0 1.0 +0.4 ? 0 10.0 +0 ? 0.5 1 2 0.35 0.25 1231 0.6 0.2 1.2 0.3 6.5 0.3 7.62 0.3 0.26 0.1 4.58 0.3 2.54 0.25 epoxy resin 3.5 0.5 4.58 0.3 2.54 0.25 4 3 anode mark rank mark factory identification mark date code 1.0 +0.4 ? 0 1.0 +0.4 ? 0 10.0 +0 ? 0.5 1 2 4 0.35 0.25 sharp mark "s" vde indenfication mark 1231 1231 0.6 0.2 1.2 0.3 1.0 0.1 6.5 0.3 10.16 0.5 0.75 0.25 0.75 0.25 4.58 0.3 2.54 0.25 anode mark rank mark factory identification mark date code 4 3 7.62 0.3 12.0 max 4.58 0.3 epoxy resin 3.5 0.5 0.26 0.1 0.5 0.1 0.25 0.25 1 2 0.6 0.2 1.2 0.3 1.0 0.1 6.5 0.3 10.16 0.5 0.75 0.25 0.75 0.25 4.58 0.3 2.54 0.25 anode mark rank mark factory identification mark date code 4 3 7.62 0.3 12.0 max 4.58 0.3 epoxy resin 3.5 0.5 0.26 0.1 0.5 0.1 0.25 0.25 1 2 4 sharp mark "s" vde indenfication mark 1231 pc1231xnsz0f series product mass : approx. 0.22g product mass : approx. 0.22g product mass : approx. 0.22g product mass : approx. 0.22g plating material : sncu (cu : typ. 2%)
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production factory identification mark factory identification mark no mark country of origin japan indonesia china * this factory marking is for identification purpose only. please contact the local sharp sales representative to see the actual status of the production. 4 repeats in a 20 year cycle sheet no.: d2-a02903fen pc1231xnsz0f series rank mark refer to the model line-up table
sheet no.: d2-a02903fen electro-optical characteristics parameter conditions forward voltage reverse current terminal capacitance collector dark current collector-emitter breakdown voltage transfer charac- teristics emitter-collector breakdown voltage collector current collector-emitter saturation voltage isolation resistance floating capacitance min. ? ? ? ? ? 10 10 ? ? ? ? ? ? ? ? 10 11 0.6 4 3 max. 1.4 10 250 ? ? ? a pf na ? ? s s 10 ?? s symbol v f i r c t i ceo bv ceo bv eco i c v ce (sat) c f t r t f r iso cmr response time common mode rejection voltage rise time fall time input output i f =10ma v r =4v v=0, f=1khz v ce =50v, i f =0 i c =0.1ma, i f =0 i e =10a, i f =0 i f =0.5ma, v ce =5v i f =10ma, i c =1ma v=0, f=1mhz v ce =2v, i c =2ma, r l =100? =1.5kv(peak), i f =0 r l =470? =9v, v np =100mv dc500v, 40 to 60%rh (t a =25?c) absolute maximum ratings (t a =25?c) parameter symbol unit input forward current ma *1 peak forward current ma power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1 minute, f=60hz *3 for 10s rating 10 200 15 reverse voltage v v r 6 70 6 50 150 170 ? +100 ? +125 260 5.0 kv 5 pc1231xnsz0f series
sheet no.: d2-a02903fen model line-up 6 please contact a local sharp sales representative to inquire about production status. i c [ma] (i f =0.5ma, v ce =5v, t a =25?c) rank mark lead form package din en60747-5-2 model no. sleeve 100pcs/sleeve ? pc12310nsz0f pc12311nsz0f PC12310YSZ0F pc12311ysz0f ? pc12310nfz0f pc12311nfz0f pc12310yfz0f pc12311yfz0f ? =0.5ma, v ce =5v, t a =25?c) rank mark lead form package din en60747-5-2 model no. taping 2 000pcs/reel wide smt gullwing smt gullwing 0.25 to 2.0 0.5 to 1.25 ? pc12310nip0f pc12311nip0f pc12310yip0f pc12311yip0f ? pc12310nup0f pc12311nup0f ? pc12310yup0f pc12311yup0f pc1231xnsz0f series
sheet no.: d2-a02903fen total power dissipation p tot (mw) ambient temperature t a (?c) 0 250 200 150 170 100 50 ? 30 0 25 50 75 100 125 fig.5 total power dissipation vs. ambient temperature forward current i f (ma) ambient temperature t a (?c) 0 15 10 5 ? 30 0 25 50 75 100 125 fig.2 forward current vs. ambient temperature diode power dissipation p (mw) ambient temperature t a (?c) 0 15 10 5 ? 30 0 25 50 75 100 125 fig.3 diode power dissipation vs. ambient temperature collector power dissipation p c (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125 fig.4 collector power dissipation vs. ambient temperature 7 fig.1 test circuit for common mode rejection voltage v cm v cp v np v o (dv/d t ) 1) r l v np v cc v cm v cm : high wave pulse r l =470? v cc =9v ? ? ? ? ? 1) v cp : voltage which is generated by displacement current in floating capacitance between primary and secondary side. (v cp nearly = dv/d t c f r l ) pc1231xnsz0f series
sheet no.: d2-a02903fen relative current transfer ratio (%) ambient temperature t a (?c) ? 30 100908070605040302010 0 ? 10 ? 20 v ce =5v i f =0.5ma 0 150 100 50 fig.10 relative current transfer ratio vs. ambient temperature collector-emitter saturation voltage v ce (sat) (v) ambient temperature t a (?c) 0 0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 i f =10ma i c =1ma ? 30 100908070605040302010 0 ? 10 ? 20 fig.11 collector - emitter saturation voltage vs. ambient temperature 8 collector current i c (ma) collector-emitter voltage v ce (v) 0 40 0246810 t a =25?c 30 20 10 p c (max.) i f =7ma i f =5ma i f =3ma i f =2ma i f =1ma i f =0.5ma fig.9 collector current vs. collector-emitter voltage current transfer ratio ctr (%) forward current i f (ma) 0.1 1 10 0 500 400 300 200 100 v ce =5v t a =25?c fig.8 current transfer ratio vs. forward current forward current i f (ma) 0.1 1 10 100 0 0.5 1 1.5 2 forward voltage v f (v) t a =25?c t a =75?c t a =100?c t a =50?c t a =0?c t a =? 25?c fig.7 forward current vs. forward voltage peak forward current i fm (ma) duty ratio 10 1 000 100 10 ? 2 10 ? 3 10 ? 1 1 pulse width 100s t a =25?c fig.6 peak forward current vs. duty ratio pc1231xnsz0f series
sheet no.: d2-a02903fen 9 ambient temperature t a (?c) ? 30 100908070605040302010 0 ? 10 ? 20 v ce =50v 10 ? 11 10 ? 5 10 ? 6 10 ? 7 10 ? 8 10 ? 9 10 ? 10 collector dark current i ceo (a) fig.12 collector dark current vs. ambient temperature fig.13 response time vs. load resistance remarks : please be aware that all data in the graph are just for reference and not for guarantee. pc1231xnsz0f series 10% input output input output 90% t s t d v cc r d r l t f t r please refer to the conditions in fig.13. v ce fig.14 test circuit for response time voltage gain a v (db) ? 25 5 0.1 1 10 100 1 000 frequency f (khz) v ce =2v i c =2ma t a =25?c 0 ? 5 ? 10 ? 15 ? 20 r l =10k? 1k? 100? fig.15 frequency response collector-emitter saturation voltage v ce (sat) (v) forward current i f (ma) 0 5 0246810 t a =25?c 4 3 2 1 i c =7ma i c =5ma i c =3ma i c =2ma i c =1ma i c =0.5ma fig.16 collector-emitter saturation voltage vs. forward current load resistance r l (k?) 0.1 1 10 100 v ce =2v, i c =2ma 1 tf ts tr td 10 responce time (s)
sheet no.: d2-a02903fen design considerations while operating at i f <0.5ma, ctr variation may increase. please make design considering this fact. in case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through ired or current may change. if the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of ired. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 10 8.2 2.54 1.7 2.2 (unit : mm) design guide pc1231xnsz0f series 10.2 2.54 1.7 2.2 smt gullwing lead-form wide smt gullwing lead-form
sheet no.: d2-a02903fen manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 11 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc1231xnsz0f series
sheet no.: d2-a02903fen solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated di- phenyl ethers (pbde). presence of odc 12 pc1231xnsz0f series
sheet no.: d2-a02903fen sleeve package 1. through-hole package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 100pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions package specification 13 (unit : mm) 12.0 6.7 5.8 10.8 520 2 (unit : mm) 2. wide through-hole package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 100pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions 520 2 pc1231xnsz0f series 15.0 6.35 5.9 10.8
sheet no.: d2-a02903fen 14 tape and reel package 1. smt gullwing package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g b h h a c 5? max. dimensions list (unit : mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.4 0.05 j 4.2 0.1 k 5.1 0.1 f 4.0 0.1 g +0.1 ? a c e g f b d dimensions list (unit : mm) a 330 b 17.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 2 000pcs/reel] reel structure and dimensions direction of product insertion pc1231xnsz0f series
sheet no.: d2-a02903fen 2. wide smt gullwing package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions 15 dimensions list a 24.0 0.3 b 11.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 12.4 0.1 i 0.4 0.05 j 4.1 0.1 k 5.1 0.1 f 4.0 0.1 g 1.5 +0.1 ? 0 (unit : mm) j g i e c b a h h 5? max. f d k a c e g f b d dimensions list (unit : mm) a 330 b 22.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 2 000pcs/reel] reel structure and dimensions direction of product insertion pc1231xnsz0f series
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this publication. 16 sheet no.: d2-a02903fen important notices pc1231xnsz0f series [e223]

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