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108-2072 product specification 10 sep 12 rev e multigig rt* signal connectors, tiers 1 and 2, rt2 mezzanine, and rt2 ruggedized ?2012 tyco electronics corporation, a te connectivity ltd. company all rights reserved | indicates change 1 of 11 *trademark. te connectivity, te connectivity (logo), and te (l ogo) are trademarks. other logos , product and/or company names may be trademarks of their respective owners. 1. scope 1.1. content this specification covers performance, tests and quality requirements for the te connectivity (te) multigig rt* signal connector system which uses a modular concept and interconnects two printed circuit boards. both receptacle and plug connectors are connected to the printed circuit boards with plated thru-hole compliant press-fit leads. the connect or system is designed to perform at two different signal transmission performance levels which are id entified by the ?tier? designator. although signal transmission performance levels vary between the ?tiers? of product, the mechanical and environmental requirements contained in this specification apply to all. 1.2. qualification when tests are performed on the subject product line, procedures specified in figure 1 shall be used. all inspections shall be performed using the applicable inspection plan and product drawing. 1.3. qualification test results successful qualification testing on tier 1 product was completed on 14aug02. successful qualification testing on tier 2 product was completed on 31jan0 4. successful qualification testing on rt2 mezzanine product was completed on 11nov07. successful qualification testing on the rt2 ruggedized product was completed 20aug2012. the q ualification test report number for this testing is 501-544. this documentation is on file at and available from engineering practices and standards (eps). 2. applicable documents the following documents form a part of this specif ication to the extent specified herein. unless otherwise specified, the latest edition of the docum ent applies. in the event of conflict between the requirements of this specification and the product dr awing, the product drawing shall take precedence. in the event of conflict between t he requirements of this specificat ion and the referenced documents, this specification shall take precedence. 2.1. tyco electronics documents 109 series: test specifications as indicated in figure 1 109-197: test specification (amp test s pecifications vs eia and iec test methods) 501-544: qualification test report (multigi g rt* signal connectors, tiers 1 and 2, rt2 mezzanine, and rt2 ruggedized.) 2.2. commercial documents bellcore gr-1217: generic requirements for separable electrical connectors used in telecommunications hardware eia-364: electrical connector/socket test proc edures including environmental classifications
108-2072 rev e 2 of 11 3. requirements 3.1. design and construction product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2. materials materials used in the construction of this product shall be as specified on the applicable product drawing. 3.3. ratings operating voltage: 50 volts ac peak or dc current: 1 ampere at <30c (single circuit, free air) temperature: -55 to 105c 3.4. performance and test description product is designed to meet the electrical, mech anical and environmental performance requirements specified in figure 1. unless otherwise specified, all tests shall be performed at ambient environmental conditions. 3.5. test requirements and procedures summary test description requirement procedure initial examination of product. meets requirements of product drawing. eia-364-18. visual and dimensional (c of c) inspection per product drawing. final examination of product. meet s visual requirements. eia-364-18. visual inspection. electrical low level contact resistance, circuit. 80 milliohms maximum initial. 5 milliohms maximum average increase. 10 milliohms maximum individual increase. eia-364-23. subject specimens to 100 milliamperes maximum and 20 millivolts maximum open circuit voltage. see figure 3. low level contact resistance, compliant pin. 1 milliohm maximum initial. 1 milliohm maximum change. eia-364-23. subject specimens to 100 milliamperes maximum and 20 millivolts maximum open circuit voltage. see figure 4. insulation resistance. 1000 megohms minimum. eia-364-21. test between any adjacent pair of signal contacts, or from any signal contact to an adjacent ground pin of mated specimens at 100 volts dc. figure 1 (continued)
108-2072 rev e 3 of 11 test description requirement procedure withstanding voltage. 1 minute hold with no breakdown or flashover. eia-364-20, condition i. 500 volts ac peak or dc at sea level. test between any adjacent pair of signal contacts, or from any signal contact to an adjacent ground pin of mated specimens. temperature rise vs current. 30c maximum temperature rise at 1 ampere load, single circuit in free air using thermography. eia-364-70, method 1. stabilize at a single current level until 3 readings at 5 minute intervals are within 1c. mechanical vibration, sinusoidal. no discontinuities of 1 microsecond or longer duration. see note. eia-364-28, test condition ii. subject mated specimens to 10- 500-10 hz traversed in 15 minutes with 1.5 mm [.06 in] maximum total excursion. two hours in each of 3 mutually perpendicular planes. mechanical shock. no discont inuities of 1 microsecond or longer duration. see note. eia-364-27, method h. subject mated specimens to 30 g's half-sine shock pulses of 11 milliseconds duratio n. three shocks in each direction applied along 3 mutually perpendicular planes, 18 total shocks. durability. see note. eia-364-9. mate and unmate specimens for 200 cycles at a maximum rate of 500 cycles per hour. mating force. 0.75 n [2.7 ozf] maximum per contact. average for entire connector. eia-364-13. measure force necessary to mate specimens at a maximum rate of 12.7 mm [.5 in] per minute. unmating force. 0.15 n [.54 ozf] minimum per contact. average for entire connector. eia-364-13. measure force necessary to unmate specimens at a maximum rate of 12.7 mm [.5 in] per minute. compliant pin insertion. 31 n [7 lbf] maximum per pin average. amp spec 109-41. measure force necessary to correctly apply a connector assembly to a printed circuit board at a maximum rate of 12.7 mm [.5 in] per minute. compliant pin retention. 13.35 n [3 lbf] minimum. amp spec 109-30. measure force neces sary to unseat a single pin in a correctly applied connector assembly from its printed circuit board hole at a maximum rate of 12.7 mm [.5 in] per minute. figure 1 (continued)
108-2072 rev e 4 of 11 test description requirement procedure minute disturbance. see note. unmate and mate specimens a distance of approximately 0.1 mm [.004 in]. environmental thermal shock. see note. ei a-364-32, test condition vii. subject mated specimens to 5 cycles between -55 and 105c. humidity/temperature cycling. see note. eia-364-31, method iii. subject mated specimens to 10 cycles (10 days) between 25 and 65c at 80 to 100% rh. temperature life. see note. eia-364-17, method a, test condition 4, test time condition c. subject mated specimens to 105c for 500 hours. mixed flowing gas. see note. eia-364-65, class iia (4 gas). subject mated and unmated specimens to environmental class iia for 20 days. dust contamination. see note. eia-364-91. subject unmated specimens to dust contamination for 1 hour. note shall meet visual requirements, show no physi cal damage, and meet requirements of additional tests as specified in the product qualification and r equalification test sequence shown in figure 2. figure 1 (end)
108-2072 rev e 5 of 11 3.6. product qualification and requalification test sequence a. tier 1 product test group (a) 1 2 3 4 5 test or examination test sequence (b) initial examination of product 1 1 1 1 1 low level contact resistance, circuit 3,7,10,15 3,7,9,12 2,5,7,10 2,5,7,9,12,14,16,19 low level contact resistance, compliant pin (c) 4,16 4,13 3,11 3,10,17 insulation resistance 5,13 14 withstanding voltage 6,14 15 temperature rise vs current 2 vibration 8 mechanical shock 9 durability 6 4 4,18(d) mating force 2,12 2,17 13 unmating force 8,11 5,16 12 compliant pin insertion 3 compliant pin retention 18 18 14 20 4 minute disturbance 15 thermal shock 10 humidity-temperature cycling 11 temperature life 9 mixed flowing gas 6(e),8(e),11(f),13(f) dust contamination 8 6 final examination of product 17 19 15 21 note (a) see paragraph 4.1.a. (b) numbers indicate sequence in which tests are performed. (c) compliant pin design requires special test printed circuit board for low level contact resistance data collection. s eparate, parallel test groups to be supplied where this data is required. (d) perform 100 cycles of durability before, and 100 cycles after mixed flowing gas testing. (e) exposure interval of 5 days with specimens unmated. (f) exposure interval of 5 days with specimens mated. figure 2a
108-2072 rev e 6 of 11 b. tier 2 product test group (a) 1 2 3 4 5 test or examination test sequence (b) initial examination of product 1 1 1 1 1 low level contact resistance, circuit 3,9,13 3,9,11,14 2,5,7,10 2,5,7,9,12,14,16,18 low level contact resistance, compliant pin (c) 4,10 4,17 3,11 3,10,19 insulation resistance 5,14 5,18 withstanding voltage 6,15 6,19 temperature rise vs current 2 vibration 8 mechanical shock 9 durability 8 4 4,17(d) mating force 2,12 2,16 13 unmating force 7,11 7,15 12 compliant pin insertion 3 compliant pin retention 16 20 14 20 4 minute disturbance 15 thermal shock 12 humidity-temperature cycling 13 temperature life 8 mixed flowing gas 6(e),8(e),11(f),13(f) dust contamination 10 6 final examination of product 17 21 15 21 5 note (a) see paragraph 4.1.a. (b) numbers indicate sequence in which tests are performed. (c) compliant pin design requires special test printed circuit board for low level contact resistance data collection. s eparate, parallel test groups to be supplied where this data is required. (d) perform 100 cycles of durability before, and 100 cycles after mixed flowing gas testing. (e) exposure interval of 5 days with specimens unmated. (f) exposure interval of 5 days with specimens mated. figure 2b
108-2072 rev e 7 of 11 c. rt2 mezzanine product test group (a) 1 2 test or examination test sequence (b) initial examination of product 1 1 low level contact resistance, ci rcuit 2,4,6,9 2,4,6,8,10,12,14,16 vibration 7 mechanical shock 8 durability 3 3,15(c) mating force 10 unmating force 11 minute disturbance 13 mixed flowing gas 5(d),7(d),9(e),11(e) dust contamination 5 final examination of product 12 17 note (a) see paragraph 4.1.a. (b) numbers indicate sequence in which tests are performed. (c) perform 100 cycles of durability before, and 100 cycles after mixed flowing gas testing. (d) exposure interval of 5 days with specimens unmated. (e) exposure interval of 5 days with specimens mated. figure 2c
108-2072 rev e 8 of 11 d. rt2 ruggedized product test groups (a) 1 2 3 test or examination test sequence (b) initial examination of product 1 1 1 low level contact resistance, circuit 3,6 2,4,6,9 2,4,6,8,10,12,14,16 vibration 7 mechanical shock 8 durability 3 3,15(c) mating force 2,8 11 unmating force 4,7 10 minute disturbance 13 temperature life 5 mixed flowing gas 5(d),7(d),9(e),11(e) dust contamination 5 final examination of product 9 12 17 note (a) see paragraph 4.1.a. (b) numbers indicate sequence in which tests are performed. (c) perform 100 cycles of durability before, and 100 cycles after mixed flowing gas testing. (d) exposure interval of 5 days with specimens unmated. (e) exposure interval of 5 days with specimens mated. figure 2d
108-2072 rev e 9 of 11 4. quality assurance provisions 4.1. qualification testing a. specimen selection 1. tier 1 product specimens shall be prepared in accordance with applicable instruction sheets and shall be selected at random from current production. each test group shall consist of 8 male and 8 female connector assemblies. low level contact resistance circuit data, where tested, shall be collected and evaluated from a minimum of 100 circuits chosen at random from those assemblies. low level contact resistance compli ant pin data, where tested, shall be collected and evaluated from a minimum of 50 pins chosen at random from those assemblies. 2. tier 2 product specimens shall be prepared in accordance with applicable instruction sheets and shall be selected at random from current production. te st groups 1 and 2 shall each consist of 12 male and 12 female connector assemblies. test groups 3 and 4 shall each consist of 8 male and 8 female connector assemblies. test group 5 shall consist of 7 male and 7 female connector assemblies. low level contact resi stance circuit data, where tested, shall be collected and evaluated from a minimum of 96 circuits chosen at random from those assemblies. low level contact resistance compli ant pin data, where tested, shall be collected and evaluated from a minimum of 100 pins chosen at random from those assemblies. 3. rt2 mezzanine product specimens shall be prepared in accordance with applicable instruction sheets and shall be selected at random from current production. each test group shall consist of 4, 42 mm stack height mezzanine connectors and 8, 20.3 mm mu ltigig rt2 vertical receptacle assembly backplane connectors. low level contact resist ance circuit data, where tested, shall be collected and evaluated from a minimum of 100 circuits chosen at random from those assemblies. 4. rt2 ruggedized specimens shall be prepared in accordance with applicable instruction sheets and shall be selected at random from current production. each test group shall consist of 5 male and 5 female connector assemblies. low level contact resistance circuit data, where tested, shall be collected and evaluated from a minimum of 100 circuits chosen at random from those assemblies. b. test sequence qualification inspection shall be verified by test ing specimens as specified in figures 2a, 2b, 2c, and 2d. 4.2. requalification testing if changes significantly affecting form, fit or function are made to the product or manufacturing process, product assurance shall coordinate requalification testi ng, consisting of all or part of the original testing sequence as determined by development/product, quality and reliability engineering.
108-2072 rev e 10 of 11 4.3. acceptance acceptance is based on verification that the pr oduct meets the requirement s of figure 1. failures attributed to equipment, test setup or operator de ficiencies shall not disqualify the product. if product failure occurs, corrective action shall be taken and sp ecimens resubmitted for qualification. testing to confirm corrective action is required before resubmittal. 4.4. quality conformance inspection the applicable quality inspection plan shall specify the sampling acceptable quality level to be used. dimensional and functional requirements shall be in accordance with the applicable product drawing and this specification. figure 3 low level contact resistance measurement points (circuit) termination resistance measurement points power supply a
108-2072 rev e 11 of 11 figure 4 low level contact resistance measurement points (compliant pin) power supply power supply termination resistance measurement points termination resistance measurement points

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