Part Number Hot Search : 
130PF TA8272H M101AI IDT7202 SA9102F K8A60DA PAXCDS60 014014
Product Description
Full Text Search
 

To Download HT666 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  hi-sincerity microelectronics corp. spec. no. : he6464-b issued date : 1993.09.07 revised date : 2000.10.01 page no. : 1/3 hsmc product specification HT666 npn epitaxial planar transistor description the HT666 is designed for general purpose amplifier and high- speed,medium-power switching applications. features ? high frequency current gain ? high speed switching transistor absolute maximum ratings ? maximum temperatures storage temperatur e ............................................................................................ -55 ~ +150 c junction temperature .................................................................................... +150 c maximum ? maximum power dissipation total power dissipation (ta=25 c) ................................................................................ 625 mw ? maximum voltages and currents (ta=25 c) bvcbo collector to base voltage....................................................................................... 75 v bvceo collector to emitter voltage.................................................................................... 40 v bvebo emitter to base voltage............................................................................................ 6 v ic collector current........................................................................................................ 60 0 ma characteristics (ta=25 c) symbol min. typ. max. unit test conditions bvcbo 75 - - v ic=10ua *bvceo 40 - - v ic=100ma bvebo 6 - - v ie=10ua icbo - - 10 na vcb=60v icex - - 10 na vcb=60v, veb(off)=3v iebo - - 50 na veb=3v *vce(sat)1 - - 300 mv ic=150ma, ib=15ma *vce(sat)2 - - 1 v ic=500ma, ib=50ma *vbe(sat)1 - - 1.2 v ic=150ma, ib=15ma *vbe(sat)2 - - 2 v ic=500ma, ib=50ma *hfe1 35 - - - vce=10v, ic=100ua *hfe2 50 - - - vce=10v, ic=1ma *hfe3 75 - - - vce=10v, ic=10ma *hfe4 100 300 - vce=10v, ic=150ma *hfe5 40 - - - vce=10v, ic=500ma *hfe6 50 - - - vce=1v, ic=150ma ft 300 - - mhz ic=20ma vce=20v, f=100mhz *pulse test: pulse width 380us, duty cycle 2% to-92
hi-sincerity microelectronics corp. spec. no. : he6464-b issued date : 1993.09.07 revised date : 2000.10.01 page no. : 2/3 hsmc product specification characteristics curve dc current gain 1 10 100 1000 1 10 100 1000 collector current (ma) hfe gain bandwidth product & collector current 10 100 1000 10000 110100 collector current (ma) gain bandwidth product (mhz) collector-emitter saturation voltage 0.0 0.1 1.0 10.0 1 10 100 1000 collector current (ma) saturation voltage (v) total power dissipation & ambient temperature 0 200 400 600 800 0 25 50 75 100 125 150 175 200 ta-ambient temperature total power dissipation (mw) base-emitter saturation voltage 0.1 1 10 1 10 100 1000 collector current (ma) v(be) saturation voltage
hi-sincerity microelectronics corp. spec. no. : he6464-b issued date : 1993.09.07 revised date : 2000.10.01 page no. : 3/3 hsmc product specification to-92 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1704 0.1902 4.33 4.83 g 0.0142 0.0220 0.36 0.56 b 0.1704 0.1902 4.33 4.83 h - *0.1000 - *2.54 c 0.5000 - 12.70 - i - *0.0500 - *1.27 d 0.0142 0.0220 0.36 0.56 1 - *5 - *5 e - *0.0500 - *1.27 2 - *2 - *2 f 0.1323 0.1480 3.36 3.76 3 - *2 - *2 notes: 1.dimension and tolerance based on our spec. dated apr. 25,1996. 2.controlling dimension: millimeters. 3.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is any question with packing specification or packing method, please contact your local hsmc sales office. material: ? lead: 42 alloy; solder plating ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of hsmc. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be su itable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. head office and factory: ? head office (hi-sincerity microelectronics corp.): 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel: 886-2-25212056 fax: 886-2-25632712, 25368454 ? factory 1: no. 38, kuang fu s. rd., fu-kou hsin-chu industrial park hsin-chu taiwan. r.o.c tel: 886-3-5983621~5 fax: 886-3-5982931 3 1 a d b c i 1 e f 2 3 g h 2 style: pin 1. emitter 2.collector 3.base 3-lead to-92 plastic package hsmc packa g e code: a marking: ht 6 66 date code control code


▲Up To Search▲   

 
Price & Availability of HT666

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X