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| USPQ-4B03 unit: mm package information / reference pattern layout dimensions
USPQ-4B03 reel taping specifications taping specifications unit: mm 5000pcs/reel direction of feed r type :[device orientation : right] standard feed USPQ-4B03 power dissipation power dissipation data for the USPQ-4B03 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. measurement condit ion (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board dimensions: 40 x 40 mm (1600mm2) board structure: 4 copper layers each layer is connected to the package heat-sink and terminal pin no.1. each layer has approximat ely 800mm2 copper area. material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter 2. power dissipation vs. ambient temperature (85 ) board mount (tjmax=125 ) 3. power dissipation vs. ambient temperature (105 ) board mount (tjmax=125 ) ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 550 181.82 85 220 ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 550 181.82 85 110 evaluation board (unit: mm) pd vs. ta pd vs. ta power dissipation pd (mw) ambient temperature ta( ) power dissipation pd (mw) ambient temperature ta( ) USPQ-4B03 USPQ-4B03 perspective rohs ? rohs com p liance ? ? item material note ?? ?? y?` /flammability rating resin epoxy resin ul94v-0 `??? lead pad ?I au ? ?? outer pad plating gold plating except the side of the terminals. ? ? die attach epoxy ???? au bonding wire ?? si silicon chip ?? `` marking laser marking ?? nickel ver.00 |
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