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  ? 2014 littelfuse, inc. 55 revised: february 21, 2014 auml varistor series rohs description the auml series of multilayer transient surge suppressors was specifcally designed to suppress the destructive transient voltages found in an automobile. the most common transient condition results from large inductive energy discharges. the electronic systems in the automobile, e.g. antilock brake systems, direct ignition systems, engine control, airbag control systems, wiper motor controls, etc., are susceptible to damage from these voltage transients and thus require protection. the auml transient suppressors have temperature independent suppression characteristics affording protection from -55oc to 125oc. the auml suppressor is manufactured from semiconducting ceramics which offer rugged protection and excellent transient energy absorption in a small package. the devices are available in ceramic leadless chip form, eliminating lead inductance and assuring fast speed of response to transient surges. these suppressors require signifcantly smaller space and land pads than silicon tvs diodes, offering greater circuit board layout fexibility for the designer. also see the littelfuse ml, mln and mle series of multilayer suppressors. features ? aec - q200 compliant ? rohs compliant ? load dump energy rated per sae specifcation j1113 ? leadless, surface mount chip form ? zero lead inductance ? variety of energy ratings available ? no temperature derating up to 125oc ambient ? high peak surge current capability ? low profle, compact industry standard chip size; (1206, 1210, 1812 and 2220 sizes) ? inherent bidirectional clamping ? no plastic or epoxy packaging assures better than 94v-0 fammability rating ? iso 7637-2 (test pulse 5a) compliance size table metric eia 3216 1206 3225 1210 4532 1812 5650 2220 absolute maximum ratings ? for ratings of individual members of a series, see device ratings and specifcations chart. continuous auml series units steady state applied voltage: dc voltage range (v m(dc) ) 18, 24, 48 v transient: load dump energy, (w ld ) 1.5 to 25 j jump start capability (5 minutes), (v jump ) 24.5 v operating ambient temperature range (t a ) -55 to +125 o c storage temperature range (t stg ) -55 to +150 o c temperature coefficient ( v) of clamping voltage (v c ) at specified test current <0.01 %/ o c caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. applications ? suppression of inductive switching or other transient events such as eft and surge voltage at the circuit board level ? esd protection for components sensitive to iec 61000-4-2 (level 4), mil-std- 883c, method 3015.7, and other industry specifcations (see also the mle or mln series) ? provides on-board transient voltage protection for ics and transistors ? used to help achieve electromagnetic compliance of end products ? replace larger surface mount tvs zeners in many applications varistor products auml varistor series surface mount multilayer varistors (mlvs) > auml series specifcations are subject to change without notice. please refer to www.littelfuse.com/series/auml.html for current information. auml s eries
? 2014 littelfuse, inc. 56 revised: february 21, 2014 device ratings and specifcations part number maximum ratings (125 oc ) specifcations (25 oc ) maximum continuous dc voltage jump start voltage (5 min) load dump energy (10 pulses) nominal varistor voltage at 10ma dc test current maximum standby leakage (at 13v dc) maximum clamping voltage (v c ) at test current (8/20 s) v m(dc) v jump w ld v n(dc) min v n(dc) max i l v c i p (v) (v) (j) (v) (v) ( a) (v) (a) v18aumla1206 18 24.5 1. 5 23 32 50 40 1. 5 v18aumla1210 18 24.5 3.0 23 32 50 40 1. 5 v18aumla1812 18 24.5 6.0 23 32 100 40 5.0 v18aumla2220 18 24.5 25 23 32 200 40 10.0 v24aumla2220 24 24.5 25 32 39 200 60 10.0 v48aumla2220 48 24.5 25 54.5 66.5 200 105 10.0 notes: 1. average power dissipation of transients not to exceed 0.1w, 0.15w, 0.3w and 1w for model sizes 1206, 1210, 1812 and 2220 respectively. 2. load dump energy rating (into the suppressor) of a voltage transient with a resultant time constant of 115ms to 230ms. 3. thermal shock capability per mil-std-750, method 1051: -55oc to 125oc, 5 minutes at 25oc, 25 cycles: 15 minutes at each extreme. 4. for application specifc requirements, please contact littelfuse. current, energy and power derating curve when transients occur in rapid succession, the average power dissipation is the energy (watt-seconds) per pulse times the number of pulses per second. the power so developed must be within the specifcations shown on the device ratings and characteristics table for the specifc device. certain parameter ratings must be derated at high temperatures as shown below. figure 1. current , energy and po wer der a ting cur ve 10 0 90 80 70 60 50 40 30 20 10 0 -55 50 60 70 80 90 10 01 10 12 01 30 14 01 50 percent of ra ted v alue ambient temper a ture ( o c) t 1 t 2 10 0 50 0 o 1 time percent of peak v alue o 1 = vir tu al origin of wa ve t 1 = vir tu al fr ont time = 1 .25 x t (impulse dur a tion) t = time fr om 1 0% to 90% of peak t 2 = vir tu al time to half v alue example: for an 8/20 s current wa veform 8s = t 1 = vir tu al fr ont time 20 s = t 2 = vir tu al time to half v alue figure 2. peak pulse current tes t wa veform for clamping vo lta ge t peak pulse current test waveform for clamping voltage typical v-i characteristics of the v18aumla2220 at -40oc, 25oc, 85oc and 125oc maximum leakage current/clamping voltage curve for auml series at 25oc figure 2. maximum leak a ge current/clamping vo lta ge cur ve for a uml series at 25 o c figure 3. typic al v -i char a cteris tics of the v1 8a umla2220 at -40 o c, 25 o c, 85 o c and 12 5 o c vo lta ge 10 0 1 1ma 1 0ma 10 0ma 1a 10 a 10 0a current 10 0a 1 0a 10 12 1 0/1 206 18 12 2220 maximum leak ag e maximum clamping vo lt ag e 12 1 0/1 206 18 12 2220 10 0 10 1 1a 1 0a 10 0a 1ma -40 o c 25 o c 85 o c 1 0ma 10 0ma 1a 10 a1 00 a1 000 a current 12 5 o c vo lta ge figure 2. maximum leak a ge current/clamping vo lta ge cur ve for a uml series at 25 o c figure 3. typic al v -i char a cteris tics of the v1 8a umla2220 at -40 o c, 25 o c, 85 o c and 12 5 o c vo lta ge 10 0 1 1ma 1 0ma 10 0ma 1a 10 a 10 0a current 10 0a 1 0a 10 12 1 0/1 206 18 12 2220 maximum leak ag e maximum clamping vo lt ag e 12 1 0/1 206 18 12 2220 10 0 10 1 1a 1 0a 10 0a 1ma -40 o c 25 o c 85 o c 1 0ma 10 0ma 1a 10 a1 00 a1 000 a current 12 5 o c vo lta ge 0 1 = virtual origin of wave t = time from 10% to 90% of peak t 1 = rise time = 1.25 x t t 2 = decay time example - for an 8/20 s current waveform: 8 s = t 1 = rise time 20 s = t 2 = decay time figure 1 figure 2 figure 3 figure 4 varistor products auml varistor series surface mount multilayer varistors (mlvs) > auml series specifcations are subject to change without notice. please refer to www.littelfuse.com/series/auml.html for current information.
? 2014 littelfuse, inc. 57 revised: february 21, 2014 speed of response the clamping action of the auml suppressor depends on a conduction mechanism similar to that of other semiconductor devices (i.e. p-n junctions). the apparent slow response time often associated with transient voltage suppressors (zeners, movs) is often due to parasitic inductance in the package and leads of the device and less dependent of the basic material (silicon, z n o). thus, the single most critical element affecting the response time of any suppressor is its lead induc-tance. the auml suppressor is a surface mount device, with no leads or external packaging, and thus, it has virtually zero inductance. the actual response time of a auml surge suppressor is in the 1 to 5 ns range, more than suffcient for the transients which are likely to be encountered in an automotive environment. multilayer internal construction temperature effects in the leakage region of the auml suppressor, the device characteristics approaches a linear (ohmic) relationship and shows a temperature dependent affect. in this region the suppressor is in a high resistance mode (approaching 10 6 ?) and appears as a near open-circuit. leakage currents at maximum rated voltage are in the microamp range. when clamping transients at higher currents (at and above the 10ma range), the auml suppressor approaches a 1-10 characteristic. in this region the characteristics of the auml are virtually temperature independent. figure 3 shows the typical effect of temperature on the v-i characteristics of the auml suppressor. load dump energy capability a load dump transient occurs when the alternator load in the automobile is abruptly reduced. the worst case scenario of this transient occurs when the battery is disconnected while operating at full rated load. there are a number of different load dump specifcations in existence in the automotive industry, with the most common one being that recommended by the society of automotive engineers, specifcation #sae j1113. because of the diversity of these load dump specifcations littelfuse defnes the load dump energy capability of the auml suppressor range as that energy dissipated by the device itself, independent of the test circuit setup. the resultant load dump energy handling capability serves as an excellent fgure of merit for the auml suppressor. standard load dump specifcations require a device capability of 10 pulses at rated energy, across a temperature range of -40oc to +125oc. this capability requirement is well within the ratings of all of the auml series (figure 6 on next page). further testing on the auml series has concentrated on extending the number of load dump pulses, at rated energy, which are applied to the devices. the reliability information thus generated gives an indication of the inherent capability of these devices. as an example of device durability the 1210 size has been subjected to over 2000 pulses at its rated energy of 3 joules (j); the 1812 size has been pulsed over 1000 times at 6j and 2220 size has been pulsed at its rated energy of 25j over 300 times. in all cases there has been little or no change in the device characteristics (figure 7 on next page). the very high energy absorption capability of the auml suppressor is achieved by means of a highly controlled manufacturing process. this technology ensures that a large volume of suppressor material, with an interdigitated layer construction, is available for energy absorption in an extremely small package. unlike equivalent rated silicon tvs diodes, the entire auml device volume is available to dissipate the load dump energy. hence, the peak temperatures generated by the load dump transient are signifcantly lower and evenly dissipated throughout the complete device (figure 5 below). this even energy dissipation ensures that there are lower peak temperatures generated at the p-n grain boundaries of the auml suppressor. there are a number of different size devices available in the auml series, each one with a load dump energy rating, which is size dependent. experience has shown that while the effects of a load dump tranient is of real concern, its frequency of occurrence is much less than thoe of low energy inductive spikes. such low energy inductive spikes may be generated as a result of motors switching on and off, from esd occurrances, fuse blowing, etc. it is essential that the suppression technology selected also has the capability to suppress such transients. testing on the v18aumla2220 has shown that after being subjected to a repetitive energy pulse of 2j, over 6000 times, no characteristic changes have occurred (figure 8 on next page). figure 5 varistor products auml varistor series surface mount multilayer varistors (mlvs) > auml series specifcations are subject to change without notice. please refer to www.littelfuse.com/series/auml.html for current information. auml s eries
? 2014 littelfuse, inc. 58 revised: february 21, 2014 auml load dump pulsing over a temperature range of -55oc to +125oc repetitive energy testing of v18aumla2220 at an energy level of 2 joules v(1 0ma) 35 30 25 20 15 10 5 0 01234 56 78 91 01 11 2 vo lta ge # of load dumps # of load dumps 2220 = 25j 18 12 = 6j 12 10 = 3j figure 5. a uml load dump pulsing o ver a temper a ture r ange of -55?c to 1 25?c figure 6. repetitive load dump pulsing at ra ted energy figure 7. repetitive energy tes ting of the v1 8a umla2220 at an energy level of 2 joules v(1 0ma) v at 1 0ma 35 10 0 10 1 000 2000 3000 4000 5000 6000 7000 v1 8a umla2220 30 25 20 15 10 5 0 05 01 00 15 02 00 250 30 0 350 1,000 2,000 vo lta ge vo lta ge 2220 = 25j 18 12 = 6j 12 10 = 3j number of pulses v(1 0ma) 35 30 25 20 15 10 5 0 01234 56 78 91 01 11 2 vo lta ge # of load dumps # of load dumps 2220 = 25j 18 12 = 6j 12 10 = 3j figure 5. a uml load dump pulsing o ver a temper a ture r ange of -55?c to 1 25?c figure 6. repetitive load dump pulsing at ra ted energy figure 7. repetitive energy tes ting of the v1 8a umla2220 at an energy level of 2 joules v(1 0ma) v at 1 0ma 35 10 0 10 1 000 2000 3000 4000 5000 6000 7000 v1 8a umla2220 30 25 20 15 10 5 0 05 01 00 15 02 00 250 30 0 350 1,000 2, 000 vo lta ge vo lta ge 2220 = 25j 18 12 = 6j 12 10 = 3j number of pulses v(1 0ma) 35 30 25 20 15 10 5 0 01234 56 78 91 01 11 2 vo lta ge # of load dumps # of load dumps 2220 = 25j 18 12 = 6j 12 10 = 3j figure 5. a uml load dump pulsing o ver a temper a ture r ange of -55?c to 1 25?c figure 6. repetitive load dump pulsing at ra ted energy figure 7. repetitive energy tes ting of the v1 8a umla2220 at an energy level of 2 joules v(1 0ma) v at 1 0ma 35 10 0 10 1 000 2000 3000 4000 5000 6000 7000 v1 8a umla2220 30 25 20 15 10 5 0 05 01 00 15 02 00 250 30 0 350 1,000 2,000 vo lta ge vo lta ge 2220 = 25j 18 12 = 6j 12 10 = 3j number of pulses repetitive load dump pulsing at rated energy figure 6 figure 7 figure 8 explanation of terms maximum continuous dc working voltage (*v m*(dc)+ + ) this is the maximum continuous dc voltage which may be applied, up to the maximum operating temperature (125oc), to the ml suppressor. this voltage is used as the reference test point for leakage current and is always less than the breakdown voltage of the device. load dump energy rating *w ld + this is the actual energy the part is rated to dissipate under load dump conditions (not to be confused with the "source energy" of a load dump test specifcation). maximum clamping voltage *v c + this is the peak voltage appearing across the suppressor when measured at conditions of specifed pulse current and specifed waveform (8/20 s). it is important to note that the peak current and peak voltage may not necessarily be coincidental in time. leakage current *i l + in the nonconducting mode, the device is at a very high impedance (approaching 10 6 ? at its rated working voltage) and appears as an almost open circuit in the system. the leakage current drawn at this level is very low (<25 a at ambient temperature) and, unlike the zener diode, the multilayer tvs has the added advantage that, when operated up to its maximum temperature, its leakage current will not increase above 500 a. nominal voltage *v n*dc+ + this is the voltage at which the auml enters its conduction state and begins to suppress transients. in the automotive environment this voltage is defned at the 10ma point and has a minimum (v n(dc) min ) and maximum (v n(dc) max ) voltage specifed. varistor products auml varistor series surface mount multilayer varistors (mlvs) > auml series specifcations are subject to change without notice. please refer to www.littelfuse.com/series/auml.html for current information.
? 2014 littelfuse, inc. 59 revised: february 21, 2014 lead (pb) soldering recommendations the principal techniques used for the soldering of components in surface mount technology are ir re-fow and wave soldering. typical profles are shown on the right. the termination option available for each solder technique is: refow wave 1. nickel barrier (preferred) 1. nickel barrier (preferred) 2. silver/platinum the recommended solder for the auml suppressor is a 62/36/2 (sn/pb/ag), 60/40 (sn/pb) or 63/37 (sn/pb). littelfuse also recommends an rma solder fux. wave soldering is the most strenuous of the processes. to avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. when using a refow process, care should be taken to ensure that the auml chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. during the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. one possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. the boards must be allowed to cool gradually to less than 50oc before cleaning. figure 8. refl ow solder pr ofile figure 9. wa ve solder pr ofile figure 10 . lead-free re-flow solder pr ofile temper a ture ( o c) time (minutes) 30 0 250 20 0 15 0 10 0 50 0 0.0 0.5 1. 01 .5 2.0 2.5 3.0 3.5 4.0 4.5 maximum wa ve 260 o c second prehea t firs t prehea t 5.0 6.0 7. 0 maximum temper at ure 260?c 20 - 40 seconds within 5?c prehea t zone r amp ra te <3?c/s 60 - 15 0 sec > 21 7?c 230 figure 8. refl ow solder pr ofile figure 9. wa ve solder pr ofile figure 10 . lead-free re-flow solder pr ofile temper a ture ( o c) time (minutes) 30 0 250 20 0 15 0 10 0 50 0 0.0 0.5 1. 01 .5 2.0 2.5 3.0 3.5 4.0 4.5 maximum wa ve 260 o c second prehea t firs t prehea t 5.0 6.0 7. 0 maximum temper at ure 260?c 20 - 40 seconds within 5?c prehea t zone r amp ra te <3?c/s 60 - 15 0 sec > 21 7?c 230 figure 8. refl ow solder pr ofile figure 9. wa ve solder pr ofile figure 10 . lead-free re-flow solder pr ofile temper a ture ( o c) time (minutes) 30 0 250 20 0 15 0 10 0 50 0 0.0 0.5 1. 01 .5 2.0 2.5 3.0 3.5 4.0 4.5 maximum wa ve 260 o c second prehea t firs t prehea t 5.0 6.0 7. 0 maximum temper at ure 260?c 20 - 40 seconds within 5?c prehea t zone r amp ra te <3?c/s 60 - 15 0 sec > 21 7?c 230 leadCfree (pb-free) soldering recommendations littelfuse offers the nickel barrier termination fnish for the optimum leadCfree solder performance. the preferred solder is 96.5/3.0/0.5 (snagcu) with an rma fux, but there is a wide selection of pastes and fuxes available with which the nickel barrier parts should be compatible. the refow profle must be constrained by the maximums in the leadCfree refow profle. for leadCfree wave soldering, the wave solder profle still applies. note: the leadCfree paste, fux and profle were used for evaluation purposes by littelfuse, based upon industry standards and practices. there are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. refow solder profle wave solder profle leadCfree re-fow solder profle figure 9 figure 10 figure 11 varistor products auml varistor series surface mount multilayer varistors (mlvs) > auml series specifcations are subject to change without notice. please refer to www.littelfuse.com/series/auml.html for current information. auml s eries
? 2014 littelfuse, inc. 60 revised: february 21, 2014 product dimensions (mm) note: avoid metal runs in this area, parts are not recommended for use in applications using silver (ag) epoxy paste. not e: av oid metal r uns in this ar ea, par ts ar e not r ecommended f or use in applications using sil v er (a g) e xpo xy past e. d e w l symbol 1206 size 1210 size 1812 size 2220 size in mm in mm in mm in mm a 0.203 5.150 0.219 5.510 0.272 6.910 0.315 8.000 b 0.103 2.620 0.147 3.730 0.172 4.360 0.240 6.190 c 0.065 1.650 0.073 1.850 0.073 1.850 0.073 1.850 d (max.) 0.071 1.80 0.070 1.80 0.07 1.80 0.118 3.00 e 0.020 -/+ 0.010 0.50 -/+0.25 0.020 -/+ 0.010 0.50 -/+ 0.25 0.020 -/+ 0.010 0.50 -/+ 0.25 0.030 -/+ 0.010 0.75 -/+ 0.25 l 0.125 -/+ 0.012 3.20 -/+ 0.03 0.125 -/+ 0.012 3.20 -/+ 0.30 0.180 -/+ 0.014 4.50 -/+ 0.35 0.225 -/+ 0.016 5.70 -/+ 0.40 w 0.060 -/+ 0.011 1.60 -/+ 0.28 0.100 -/+ 0.012 2.54 -/+ 0.30 0.125 -/+ 0.012 3.20 -/+ 0.30 0.197 -/+ 0.016 5.00 -/+ 0.40 pad layout dimensions chip layout dimensions v 18 a uml a 2220 xx pa cking options end termina tion option device size load dump energy ra ting indic at or au t omo tive mul tila yer designa to r maximum dc w orking vo lta ge device f amil y a: bulk pa c k, 2500 pieces h: 7in (1 78mm) diamet er r eel* t: 1 3in (330mm) diamet er r eel* * see quant tities in pa ckaging tab le belo w n or no let te r: nickel barr ier i.e ., 220 mil x 200 mil tvss de vice part numbering system packaging* device size quantity 13 inch reel ('t' option) 7 inch reel ('h' option) bulk pack ('a' option) 1206 10,000 2,500 2,500 1210 8,000 2,000 2,000 1812 4,000 1,000 1,000 2220 4,000 1,000 1,000 *(packaging) it is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags. varistor products auml varistor series surface mount multilayer varistors (mlvs) > auml series specifcations are subject to change without notice. please refer to www.littelfuse.com/series/auml.html for current information.
? 2014 littelfuse, inc. 61 revised: february 21, 2014 symbol description dimensions in millimeters a 0 width of cavity dependent on chip size to minimize rotation. b 0 length of cavity dependent on chip size to minimize rotation. k 0 depth of cavity dependent on chip size to minimize rotation. w width of tape 8 -/+ 0.2 12 -/+ 0.2 f distance between drive hole centers and cavity centers 3.5 -/+ 0.5 5.4 -/+ 0.5 e distance between drive hole centers and tape edge 1.75 -/+ 0.1 1.75 -/+ 0.1 p 1 distance between cavity center 4 -/+ 0.1 8-/+ 0.1 p 2 axial distance between drive hole centers and cavity centers 2 -/+ 0.1 2 -/+ 0.1 p 0 axial distance between drive hole centers 8 -/+ 0.1 8 -/+ 0.1 d 0 drive hole diameter 1.55 -/+ 0.05 1.55 -/+ 0.05 d 1 diameter of cavity piercing 1.05 -/+ 0.05 1.55 -/+ 0.05 t 1 embossed tape thickness 0.3 max 0.4 max t 2 top tape thickness 0.1 max 0.1 max ? conforms to eia-481-1, revision a ? can be supplied to iec publication 286-3 note: dimensions in millimeters. tape 8mm wide tape 12mm wide tape chip size 1206 1210 1812 2220 standard packaging tape and reel is the standard packaging method of the auml series. the standard 300 millimeter (13Cinch) reel utilized contains 4000 pieces for the 2200 and 1812 chips, 8000 pieces for the 1210 chip and 10,000 pieces for the 1206 size. to order: add ' t ' to the standard part number, e.g.v18aumla222ot. special packaging option1: 178 millimeter (7Cinch) reels containing 1000 (2220, 1812), 2000 (1210), 2500 (1206), pieces are available. to order add 'h' to the standard part number, e.g. v18aumla2220h. option 2 for small sample quantities (less than 100 pieces) the units are shipped bulk pack. to order add 'a' to the standard part number, e.g. v18aumla222 0a. tape and reel specifcations varistor products auml varistor series surface mount multilayer varistors (mlvs) > auml series specifcations are subject to change without notice. please refer to www.littelfuse.com/series/auml.html for current information. auml s eries


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