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1 / 32 tsz02201 - 0a1a0az 00130 - 1 - 2 15.apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 battery charger ic series boost dc/dc charger with i nput c urrent l imiter bd8664gw BD8665GW bd8668gw g eneral description bd8664gw, BD8665GW and bd8668gw are lithium - ion battery charger ic s , suitable for charging 2s batter ies from a 5v source, such as a usb port with dc/dc boost topology. features ? cp/cv c harging ? charge - on/ off control available with en pin ? integrated i nput d etection (vbusok) ? int egrated p ower g ood ? boost s witching t opology ? low ron integrated mosfet ? output s hort c ircuit p rotection ? 0.4mm pitch chip scale package (ucsp75m2) applications dvc , dsc , mid and other lithium battery - powered portable devices key specifications ? input c urrent a ccuracy 2 % (bd8664gw) 3% (BD8665GW/bd8668gw) ? charging v oltage a ccuracy 0.5% ? selectable i nput c urrent 1 00ma/500ma/900ma/1500ma ( max ) ? charging frequency 1 mhz (typ) ? i nput s tandby c urrent 71a (typ) ? battery leakage current while charging is off 0a (typ) package w(typ) x d(typ) x h(max) ucsp75m2 2.20 mm x 2.20 mm x 0.85 mm line up charge voltage package pin number orderable part number 8.30v uscp75m2 20 bd8664gw 8.40v BD8665GW 25 bd8668 g w t ypical application circuit product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays fig ure 1. typical application circuit b d 8 6 6 4 g w b d 8 6 6 5 g w b d 8 6 6 8 g w v b u s i s n s s w 1 s w 2 v f b i s e t i n 1 g n d p g o o d i c o m p i s e t i n 2 a c l e n v b u s l i m s y s t e m b a t t e r y + v b u s + f s e t h o s t p g n d v c o m p i s e t i n 3 e n f s e t v b u s o k i s e t o u t 1 i s e t o u t 2 o v p b c 1 . 2 d e t e c t o r s d a s c l c o n t r o l e d b y h o s t d + d - datashee t
2 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 contents general description ................................ ................................ ................................ ................................ ................................ ...... 1 features ................................ ................................ ................................ ................................ ................................ ......................... 1 applications ................................ ................................ ................................ ................................ ................................ .................. 1 key specifications ................................ ................................ ................................ ................................ ................................ ........ 1 package w(typ) x d(typ) x h(max) ................................ ................................ ................................ ................................ . 1 line up ................................ ................................ ................................ ................................ ................................ ........................... 1 typical application circuit ................................ ................................ ................................ ................................ ........................... 1 pin configuration (top view) ................................ ................................ ................................ ................................ ..................... 3 pin description ................................ ................................ ................................ ................................ ................................ ............. 3 block diagram ................................ ................................ ................................ ................................ ................................ ............... 5 absolute maximum ratings (ta=25c) ................................ ................................ ................................ ................................ ....... 6 recommended operating conditions (ta= - 30 to +85c) ................................ ................................ ................................ ........... 6 electrical cha racteristics ................................ ................................ ................................ ................................ ............................. 7 typical performance curves ................................ ................................ ................................ ................................ ........................ 9 reference data ................................ ................................ ................................ ................................ ................................ ............ 14 block descriptions ................................ ................................ ................................ ................................ ................................ ..... 16 timing chart/application information ................................ ................................ ................................ ................................ ....... 18 application components selection ................................ ................................ ................................ ................................ ........... 21 example of recommended circuit ................................ ................................ ................................ ................................ ............ 22 input/output pin immediate circuit ................................ ................................ ................................ ................................ ........... 23 thermal reduction char acteristics ................................ ................................ ................................ ................................ .......... 25 operational notes ................................ ................................ ................................ ................................ ................................ ....... 26 ordering information ................................ ................................ ................................ ................................ ................................ .. 28 mark ing diagrams ................................ ................................ ................................ ................................ ................................ ....... 28 physical dimensions, tape and reel information ................................ ................................ ................................ ................... 29 revision history ................................ ................................ ................................ ................................ ................................ ......... 32
3 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 pin co nfiguration (top view) p in d escription bd8664gw / BD8665GW no. name i/o description a1 en i charging on/off a2 vbus i power input a3 isns i current sensing a4 pgood o power good output a5 vbuslim o vbus current limiter output b1 icomp o pin for phase compensation of constant current b2 vbusok o vbusok output b3 - - - b4 isetin1 i current setting pin1 b5 isetin3 i current setting pin3 c1 fset i frequency setting pin c2 - - - c3 - - - c4 - - - c5 sw1 o inductor connection pin1 d1 vcomp o pin for phase compensation of constant current connection d2 isetin2 i current setting pin2 d3 - - - d4 isetout2 o current setting output2 d5 pgnd i power gnd(0.0v) e1 aclen i automatic cur rent on/off selection pin e2 gnd i gnd(0.0v) e3 isetout1 o current setting output 1 e4 vfb i feedback pin of cv charging voltage e5 sw2 o inductor connection pin2 no upper esd protection diodes are connected to isetin1, isetin2, isetin3, and en . bd8668gw bd8664gw / BD8665GW a b c d e 1 2 3 4 5 e n v b u s i s n s p g o o d v b u s l i m i c o m p v b u s o k i s e t i n 1 i s e t i n 3 f s e t s w 1 v c o m p i s e t i n 2 i s e t o u t 2 p g n d a c l e n g n d i s e t o u t 1 v f b s w 2 a b c d e 1 2 3 4 5 v b u s v b u s i s n s p g o o d v b u s l i m i c o m p e n i s e t i n 3 v b u s o k s w 1 f s e t i s e t i n 1 i s e t i n 2 i s e t o u t 2 p g n d g n d g n d v c o m p v f b s w 2 a c l e n g n d g n d v f b i s e t o u t 1
4 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 p in d escription C
5 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 b lock d iagram figure 2. block d iagram i s e t i n 1 i s e t i n 3 ( g n d ) v f b v b u s l i m v b u s f s e t p g n d s w 2 ( v f b ) d r i v e r o s c i l l a t o r 5 0 0 k h z 2 m h z e n v b u s o k p g o o d i c o m p s w 1 a c l e n c v e r r o r a m p l i f i e r c p / c v c o n t r o l i n t e r n a l r e g v c o m p r e f e r e n c e v o l t a g e c o n t r o l c p e r r o r a m p l i f i e r o n / o f f r a m p u p b y v b u s v b u s l i m s o f t - s t a r t e n d s 5 0 m s e c a f t e r c h a r g i n g s t a r t s i s n s ( v b u s ) i s e t i n 2 l e v e l s h i f t e r i s e t o u t 1 i s e t o u t 2 i n t e r n a l r e g 3 v n p o c p l o a d s w p 2 0 0 m a 1 m s e c s c p d e t e c t i o n 2 . 6 v 2 0 ( t y p ) g n d p ( g n d ) ( g n d ) ( ) : n c i n b d 8 6 6 5 .
6 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 absolute m aximum ratings ( t a = 25c ) item symbol range unit vbus v oltage v vbu s - 0.3 to + 7.0 v vbuslim v oltage v v buslim - 0.3 to vbus+0.3 (note 3) v vfb v oltage v v fb - 0.3 to + 13.0 v sw1 v oltage v s w1 - 0.3 to vbuslim+0.3 (note 4) v sw2 v oltage v s w2 - 0.3 to vfb+0.3 v terminal v oltage 1 (note 1) v in out1 - 0.3 to vbus+0.3 (note 3) v terminal v oltage 2 (note 2) v in out2 - 0.3 to + 6.0 v voltage b etween t erminals (note 5) v in out3 - 0.3 to +0.3 v maximum power dissipation (note 6) pd 1.00 w operating t emperature topr - 30 to + 85 c storage t emperature tstg - 55 to + 150 c junction t emperature tjmax + 150 c (note 1) isns, fset, vbusok, pgood, vcomp, icomp, isetout1, isetout2 (note 2) aclen, en, ise tin1, isetin2, isetin3 (note 3) 7.0v against gnd (note 4) 7.0v against pgnd (note 5) gnd - pgnd , vbus - isns (note 6) when mounted on 54mm x 62 mm pcb. pd decreases by 8mw per 1 c when t a is 25c or higher . caution : operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as addin g a fuse, in case the ic is operated over the absolute maximum ratings . recommended operating conditions ( t a = - 30 to +85 c ) item symbol value unit part no. m in typ max v bus v oltage v vbu s 4.1 5.0 5.5 v - vfb v oltage v v fb 0.0 8.4 10.0 v BD8665GW/bd8668gw 8.3 bd8664gw
7 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 electrical characteristics (unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd= pgnd= 0v t a =25 r c) item symbol value unit conditions min typ max vbus s tand - by c urrent i vbus1 - 71 142 $ v en = 0.0v, o nly vbusok is on vbus o perational c urrent i vbus2 - 2 5 ma no switching batte ry s tand - by c urrent i batt1 - 1 0 + 1 $ v en = 0.0v battery o perational c urrent i batt2 - 60 120 $ no switching frequency 1 f osc1 0.9 1.0 1.1 mhz r fset = 47 k frequency 2 f osc2 (1.8) 2.0 (2.2) mhz r fset = 22 k fset o utput v oltage v fset - 0.6 - v < constant voltage control block> constant voltage c harging a ccuracy v cv2 8.258 8.300 8.342 v 0.5% , bd8664gw v cv2 8.358 8.400 8.442 v 0.5% , BD8665GW/bd8668gw < vbuslim current control block> vbuslim c urrent a ccuracy (vbus - isns v oltage) i vbuslim1 6.0 8.0 10.0 mv v isetin1 = 0.0v , v isetin2 = 0.0v i vbuslim2 47.0 48.5 50.0 mv v isetin1 = 0.0v , v isetin2 = 3.3v i vbuslim3 8 5 . 2 87.0 88 . 8 mv v isetin1 = 3.3v , v isetin2 = 0.0v bd8664gw, 2 % 84.0 90.0 mv v isetin1 = 3.3v , v isetin2 = 0.0v BD8665GW/bd8668gw, 3 % i vbuslim4 14 2 . 1 145.0 1 47 . 9 mv v isetin1 = 3.3v , v isetin2 = 3.3v bd8664gw, 2 % 140.0 150.0 mv v isetin1 = 3.3v , v isetin2 = 3.3v BD8665GW/bd8668gw, 3 % vbuslim c urrent l imiter l evel (vbus - isns v oltage) i vbusocp ( +1 5) +20 ( + 3 0 ) mv against the current set by v buslim < pgood block> pgood h v oltage v pgoodh 2.94 3.00 3.06 v 2% pgood l v oltage v pgoodl - 0.0 - v vbus t hreshold 1 v vbusokth1 3.9 4.0 4.1 v v bus = l to h vbus t hreshold 2 v vbusokth2 3.8 3.9 4.0 v v bus = h to l vbusok l - >h d elay t ime v vbusokdelay 20 40 - ms vbusok h v oltage v vbusokh 2.94 3.00 3.06 v 2% vbusok l v oltage v vbusokl - 0.0 - v vbus uvlo t hreshold v vbusuvloon 3.40 3.60 3.80 v vbus uvlo u nlock t hreshold v oltage v vbusuvloff 3 .50 3.70 3.90 v vfb l ow v oltage d etection1 v vfblv1 - 2.4 - v vfb = h to l vfb l ow v oltage d etection2 v vfblv2 - 2.6 - v vfb = l to h vfb o ver v oltage d etection1 v vfbov1 8.5 9.0 9.5 v vfb = h to l vfb o ver v oltage d etection2 v vfbov2 9.2 9.7 10.2 v vfb = l to h vbus c urrent a utomatic s elect ion v oltage 1 v vbusautoth 3.9 4.0 4.1 v vbus = h to l vbus c urrent a utomatic s election v oltage 1 v vbusautoth 4.0 4.1 4.2 v vbus = l to h vbuslim - sw1 pmos ron r sw1a - 70 - p i sw1 - 10m a vbuslim - sw1small pmos ron r sw1b - 20 - i sw1 - 10m a sw2 - pgnd nmos ron r sw2 - 60 - p i sw2 10m a sw2 m ax duty w idth t sw2maxduty - 80 - ns r fset = 47 k sw2 m in duty ratio t sw2minduty - 0 - r fset = 47 k
8 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 electrical characteristics - continued en/isetin1,2,3/aclen l v oltage v inl - - 0.4 v en/isetin1,2,3/aclen h v oltage v inh 2.5 - 5.5 v isetin1,2 i nput c urrent i inh - 0 - $ no pull - down, open is not allowed. en/aclen/isetin3 p ull - d ow n r esistor r in2 300 500 700 n i setout1,2 l v oltage v outl - 0.0 - v isetout1,2 h v oltage v outh 2.94 3.00 3.06 v this product has no designed protection against radioactive rays . pd is the maximum power. please keep the current to meet power lower than t he pd.
9 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 typical performance curves ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd= pgnd= 0v t a =25 r c ) figure 5 . s tart - up w aveform (vfb is s horten to g round) v v fb 2 .0v/div. i vbus 0.2a /div. v ic omp 0.5v/ div. 10ms/div. figure 6 . charging m ode s tart - up ( 1 00 ma mode) 10ms/div. v vfb 2 .0v/div. i vbus 0.1a /div. v ic omp 0 .5v/ div. figure 4 . feeding m ode r amp - up l oad) 10ms/div. v v fb 2 .0v/div. i vbus 0.5a /div. v ic omp 0.5v/ div. figure 3 . feeding m ode r amp - up ( n o l oad) 10ms/div. i vbus 0.5a /d iv. v ic omp 0.5v/ div. v v fb 2 .0v/div.
10 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 typical performance curves - continue ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd= pgnd= 0v t a =25 r c ) v v fb 2 .0v/div. i vbus 0.5a /div. v ic omp 0.5v/ div. v v fb 2.0 v/div. i vbus 0.5a /div. v i comp 0.5v/ div. 10ms/div. 1 ms/div. figure 9 . charging m ode s tart - up (1 5 00 ma m ode) figure 1 0 . changing c urrent (100 ma to 500ma ) fi gure 8 . charging m ode s tart - up ( 900ma m ode) 10ms/div. v v fb 2 .0v/div. i vbus 0.5a /div. v ic omp 0.5v/ div. figure 7 . charging m ode s tart - up ( 5 00 ma m ode) 10ms/div. v v fb 2 .0v/div. i vbus 0.5a /div. v ic omp 0.5v/ div.
11 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 typical performance curves - continue ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd= pgnd= 0v t a =25 r c ) v v fb 2.0 v/div. i vbus 0.5a /div. v i comp 0.5v/ div. 1 ms/div. figure 13 . changing c urrent ( 100ma to 1500ma ) v v fb 2.0 v/div. i vbus 0.5a /div. v i comp 0.5v/ div. 1 ms/div. figure 14 . changing c urrent ( 1500ma to 500ma ) 1 ms/div. figure 11 . changing c urrent ( 500ma to 900ma ) v v fb 2.0 v/div. i vbus 0.5a /div. v i comp 0.5v/ div. 1 ms/div. figure 12 . c hanging c urrent ( 900ma to 1500ma ) v v fb 2.0 v/div. i vbus 0. 5a /div. v i comp 0.5v/ div.
12 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 typical performance curves - continue ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin 1,2,3 =0v gnd= pgnd= 0v t a =25 r c ) v vfb 2.0 v/div. i vbus 0.5a /div. v i comp 0.5v/ div. 5 ms/div. figure 15 . changing c urrent (1500 ma to 1 00ma ) 20 ms/div. figure 16 . automatically c hanging c urrent (15 00ma to 9 00ma ) v i setout2 5.0v/ div. v v bus 2.0v /div. v i setout1 5.0v/ div. i vbus 0.5a / div. v en 10 v /div. 20 ms/div. figure 17 . automatically c hanging c urrent ( 900ma to 500ma ) v i setout2 5.0v/ div. v vbus 2.0v /div. v i se tout1 5.0v/ div. i vbus 0.5a / div. v en 10 v /div. 20 ms/div. figure 18 . automatically c hanging c urrent ( 500ma to 100ma ) v i setout2 5.0v/ div. v vbus 2.0v /div. v i setout1 5.0v/ div. i vbus 0.5a / div. v en 10 v /div.
13 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 typical performance curves - continue ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd= pgnd= 0v t a =25 r c ) v v bus 2 .0v/div. v v busok 1.0v/ div. 1 0 ms/div. figure 1 9 . vbusok ( l to h d elay t ime )
14 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 r eference d ata ( unless oth erwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd= pgnd= 0v t a =25 r c ) figure 20 . cv v oltage vs t emperature figure 2 3 . 500ma m ode cp c urrent t emperature c haracteristic figure 2 2 . cv v oltage vbus v oltage d ependency (BD8665GW/bd8668gw) figure 21 . cv v oltage vbus v oltage d ependency (bd8664gw) 47.0 47.5 48.0 48.5 49.0 49.5 50.0 -30 -15 0 15 30 45 60 75 90 7hpshudwxuh> @ vbus-isns voltage [mv] 4.1v 5.0v 5.5v 47.0 47.5 48.0 48.5 49.0 49.5 50.0 -30 -15 0 15 30 45 60 75 90 7hpshudwxuh> @ vbus-isns voltage[mv] 8.36 8.38 8.40 8.42 8.44 -30 -15 0 15 30 45 60 75 90 7hpshudwxuh> @ 9)%?9rowdjh>9@ 4.1v 5.0v 5.5v 8.26 8.28 8.30 8.32 8.34 -30 -15 0 15 30 45 60 75 90 7hpshudwxuh> @ vfb voltage[v] 4.1v 5.0v 5.5v
15 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 r eference d ata - continue ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd= pgnd= 0v t a =25 r c ) figure 2 5 . pgood p in h v oltage t emperature c haracteristic figure 2 7 . efficiency 500ma m ode figure 2 4 . 5 00ma m ode cp c urrent vbus d ependency figure 2 6 . frequency t emperature c haracteristic 2.94 2.96 2.98 3.00 3.02 3.04 3.06 -30 -15 0 15 30 45 60 75 90 7hpshudwxuh> @ pgood voltage[v] 0 10 20 30 40 50 60 70 80 90 100 0.001 0.01 0.1 1 load[a] efficiency[%] 47.0 47.5 48.0 48.5 49.0 49.5 50.0 -30 -15 0 15 30 45 60 75 90 7hpshudwxuh> @ vbus-isns voltage[mv] 4.1v 5.0v 5.5v 0.90 0.95 1.00 1.05 1.10 -30 -15 0 15 30 45 60 75 90 temperature[] frequency[mh]
16 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 b lock d escriptions 1. vb u s i nput d etection c omparator o utput (vbus ok) vbus voltage can set vbus ok . 40ms after detecting that vbus is higher than 4.0v (typ), vbusok turns h ( 3.0v [ typ ] ) . in case vbus ramps down, a nd reaches 3.9v (typ), vbusok turns l without any delay. the function works independently from the condit ion of en and thermal shut down. vbus vbusok < 3.9v (typ) l 0.0v (typ) >= 4.0v (typ) h 3.0v (typ) 2. charging on/off (en) on/off is controlled with the en pin. when en is l, the ic enters shutdown mode ( or usb suspend mode), the battery leakage current is set to w$ , and all other functions but vbusok turns off. en pin is connected to a n (typ) pull - down resistor. 3. usb c urrent s etting (isetin1,2,3) iset1 iset2 iset3 vbus i nput c urrent s ettings l l l 100ma (max) l l h 500ma (max) l h l 500ma (m ax) l h h 500ma (max) h l l 900ma (max) h l h 900ma (max) h h l 1500ma (max) h h h 1500ma (max) note: open is not allowed for isetin1,2 pins. no pull - down resistor is connected to isetin1, slqvn (typ) pull - down resistor is internally connecte d to isetin3. 4. vbus c urrent s etting (isetout1,2) isetout1 isetout2 vbus c urrent s ettings l l 100ma (max) l h 500ma (max) h l 900ma (max) h h 1500ma (max) 1rwhn w\slvfrqqhfwhglqwhuqdoo\wr,6(7287(yhqlqwkhfdvh9%86 9wkhrxwsxwv tays stable. 5. frequency s etting (fset) the pwm switching frequency can be set. fset pwm 100k ? 500khz (typ) n 1mhz (typ) 33k ? 1.5mhz (typ) n 2mhz (typ) 6. cv c ontrol s oft - s tart if the system boots up with no battery, cv control method s uppress es the 8.3v (typ) in case of using bd8664gw and 8.4v (typ) in case of using BD8665GW/bd8668gw, on vfb pin , and enters 3ihhglqjprgh . in this mode , it will take 40ms (typ) for the vfb to reach 8.4v (typ ). 7. load s witch f unction a pmos load switch is integrated between vbuslim and sw1. when en=l , the load switch turns off. if a low battery is connected, charging can be stopped. the integrated load resistors are w\sdqgp (typ) . t he higher resistance is connected d uring start - u p . after 10m s (typ) , t he lower resistance is connected i f no short circuit is detected by vfb pin . 8. ocp for l oad s witch through a sense resistor between vbus and isns , over - current can be detected while the load switch is on . if the over - current is constantly detected for more than 1ms , the load switch turns off and latc hes . to unlatch, the ic must be rebooted by switching e n to low , then back to high; or set vbus to a voltage lower than uvlo , then b ack to the operating vbus voltage .
17 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 9. battery l ow v oltage d etection ( o utput scp) if d uring start - up, wkhedwwhu\?vyro tage is lower than vfb voltage or the output is shorted to ground, the low - side load switch will never be turned on , and t he high - side load switch will be on for 80ms (typ) . but , if the high - side load switch is kept on for more than 80ms, the load switch is turned off. this function is off after the pgood is turned h. 10. power good (pgood) the ic is enabled by en pin. after cv, cp, and soft start, pgood condition chang es its state from l to h. inversely , d uring thermal shutdown and over voltage battery , pgood is l . 11. battery o ver v oltage d etection d ue to the vbus current limiter , o vervoltage can occur at vfb terminal d uring cp charging . this can cause damage to devices that are connected to the ic . t o prevent this, o ver voltage protection is integrated . once over voltage is detected, sw2 becomes h i - z , the error amp output and soft start are reset to default, and pgood is set l. once vfb voltage is at a safe level , the ic automatically restart s with soft start. 12. auto vbus c urrent s etting once vbus voltage exceeds 4.1v (typ), the vbus current set to iset1 to 3 pins are automatically change d from 1500ma (max) to 900ma (max), from 900ma (max) to 500ma (max), and from 500ma (max) to 100ma (max) , while vbus is continuously monitored . i f iset1 to 3 are changed after the auto change is don e, the initial current that has been set to iset1 to 3 will be employed again . n otes : (1) i f vbus v oltage remains lower than 4.1v and current is chan ged from 1500ma to 900ma , the current will not be change d to 500ma. (2) aclen has a pull - up resistor . t he pin is l if it is open and auto setting becomes active. (3) it can be turned off by setting aclen to h. (4) it starts to work after the lower resistance load is turned on. until pgood is changed to h, the bus current value is determined only by isetin1 to 3 and will not to be changed by vfb low volt age function. 13. feeding m ode and c harging m ode feeding mode: if the system boots up with no battery to the ic , cv control method suppress es 8.3v (typ) for bd8664gw and 8.4v (typ) for BD8665GW/bd8668gw on vfb pin . during the feeding mode, the constant voltage is done by the vfb pin. charging mode: i f the system boots up with a battery to t he ic , cp/cv c ontrol method is employed . during charging mode, the cv/cp function is applied to the battery. t he two modes , however , are not internally controll able by the ic . an application that applies constant output voltage with cv fkdujlqjlvfdoohg3ihhglqjprghdqgdqrwkhudssolfdwlrqwkdw charges with cv/ cp charging is calle g3fkdujlqjprghlqwklvwhfkqlfdoqrwh
18 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 t iming chart / a pplication i nformation 1. vbusok/vbus threshold at automatic change current setting figure 2 8. vbusok/vbus threshold at automatic change current setting waveform 1. start - up w aveform at f eeding m ode (no b attery, light l oad) figure 2 9. start - up waveform at feeding mode 4.1v (threshold for auto current limit) 4.0v (threshold for auto current limit, curre nt decreases at rising of vbus) 3.9v (vbusok falling) 3.7v (vbusuvlo rising) 3.6v (vbusuvlo falling) vbusok set usb current automatic change on usb current vbus 3 . 6 v ( v b u s u v l o ) 3 . 7 v ( v b u s u v l o ) 3 . 9 v ( v b u s o k ) 4 . 0 v ( a u t o c u r r e n t l i m i t = v b u s o k ) 4 . 1 v ( a u t o c u r r e n t l i m i t ) v b u s o k u s b Q u s b O v b u s R v b u s o k v f b v b u s p g o o d b o o s t m o d e 8 . 4 v e n i s e t o u t 4 0 m s e c ( t y p ) 4 0 m s e c ( t y p ) 7 0 m s e c ( t y p ) 2 0 o h m l o a d s w i t c h g a t e s i g n a l l o w e r r e s i s t a n c e l o a d s w i t c h g a t e s i g n a l 1 0 m s e c ( t y p ) o n o f f o n o f f a u t o m a t i c c h a n g e o n u s b c u r r e n t
19 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 2. start - up w aveform at f eeding m ode (no b attery, 50 attery, 50 a v f b 8 . 4 v v b u s o k v b u s p g o o d e n i s e t o u t 4 0 m s e c ( t y p ) 4 0 m s e c ( t y p ) 7 0 m s e c ( t y p ) 1 0 m s e c ( t y p ) o n o f f o n o f f a u t o m a t i c c h a n g e o n u s b c u r r e n t 2 0 o h m l o a d s w i t c h g a t e s i g n a l l o w e r r e s i s t a n c e l o a d s w i t c h g a t e s i g n a l b o o s t m o d e v o u t v b u s o k v b u s p g o o d e n i s e t o u t 4 0 m s e c ( t y p ) 8 0 m s e c ( t y p ) o f f o f f o n o f f 2 0 o h m l o a d s w i t c h g a t e s i g n a l l o w e r r e s i s t a n c e l o a d s w i t c h g a t e s i g n a l
20 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 4. voltage w av eform to pgood at c harging m ode ( w ith b attery) figure 3 2. v oltage waveform to pgood at charging mode (with battery) 5. operation f rom f eeding m ode t o c harging m ode during feeding mode, after the output sta rted up with 8.3v(typ) for bd8664gw and 8.4v(typ ) for BD8665GW/bd8668gw , if the battery has to be connected and the mode has to change to charging mode, set en to l then h to enable cp charging. th is turns pgood pin to l then h. n ote that vbus current may exceed the set value unless the en is set l once. 6. operation f rom c harging m ode t o f eeding m ode during charging mode , if the mode has to change to feeding mode, set the en to l , detach the battery , then set en to h again. this turns pgood pin to l, ramp s up v fb to 8.3v (typ) for bd8664gw and 8.4v (typ) for BD8665GW/bd8668gw by feeding mode , and turns pgood to h , afterwards . n ote that the o ver c urrent p rotection may occur unless the en is set l like af ore mentioned vfb over voltage detection waveform. 7. battery o ver v oltage d etection w aveform during charging, if the battery is detached by a user , v out will g o higher as the mode changes to feeding mode. in this scenario, to prevent damage to devices connected to this ic, ovp is integrated. pgood has to be tur ned off to l when ovp is detected. s oft - start is again implemented when v out g o es low due to its output load . i n the application circuit example , note that the vfb node goe s down to vbus - 1vf , as determined by an external schottky diode. figure 3 3. battery overvoltage detection waveform v f b v b u s o k v b u s p g o o d e n i s e t o u t 4 0 m s e c ( t y p ) 4 0 m s e c ( t y p ) 7 0 m s e c ( t y p ) 1 0 m s e c ( t y p ) o n o f f o n o f f v b u s c u r r e n t 8 . 4 v 2 0 o h m l o a d s w i t c h g a t e s i g n a l l o w e r r e s i s t a n c e l o a d s w i t c h g a t e s i g n a l a u t o m a t i c c h a n g e o n u s b c u r r e n t c h a r g i n g b a t t e r y i s d e t a c h e d o v p s w 2 = h i z v o u t o v p u n l a t c h e d s o f t - s t a r t r e s t a r t 8 . 4 v ( b d 8 6 6 5 g w / b d 8 6 6 8 g w ) p g o o d 3 . 0 v 8 . 3 v ( b d 8 6 6 4 g w )
21 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 8. precaution on v oltage a ppli cation b etween c onstant - v oltage c harging v oltage and ovp when the voltage between constant - voltage charging voltage and ovp is applied to the vfb node , ( e.g. , an ac adapter is unplugged when the ac adapter voltage is applied to the vfb pin ) , the vfb terminal drops drastically , so avoid the abov e mentioned condition. a pplication c omponents s election 1. frequency s etting ( fset ) r esistor figure 3 3 frequency setting (f set ) resistor 2. inductor selection inductance for t he boost switching affects its ripple current and ripple current at feeding mode. the ripple voltage is inversely proportional to the inductance and switching frequency so that the inductance must be higher if the frequency is lower. in other word s, the inductance can be smaller if the frequency is higher. however, if the inductance changes, since the lc cutoff frequency changes, the phase compensation of icomp and vcomp may have to be changed. pwm i nductance output c apacitance icomp t ime c onstant vcomp c oefficient 1mhz(typ) w+ w) w) serial n w) serial if the external coefficient is changed from the designated value above , c heck the open - loop gain phase carefully. f set r esistor [k ? ] figure 3 4. . f requency setting (f set ) resisto r f set r esistor vs frequency fset??vsk? 100 1000 10000 10 100 1000 fset??[k ] k?[khz]
22 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 example of recommended circuit figure 3 5. example of recommended circuit b a t t e r y u s b ( v b u s ) b a t t + i n p u t c u r r e n t c o n t r o l 1 0 0 m a / 5 0 0 m a / 9 0 0 m a / 1 5 0 0 m a b a t t - 4 . 7 h 4 7 k 4 . 7 f 0 . 1 f c h a r g e 1 0 f 3 . 0 v a t s t a r t - u p d u r i n g c h a r g i n g v b u s o k 3 . 0 v o u t p u t 0 . 0 v b e f o r e s t a r t - u p c h a r g i n g 0 . 1 f v b u s o k 3 . 0 v o u t p u t v b u s n g 0 . 0 v o u t p u t 1 0 0 m i s e t i n 1 i s e t i n 3 g n d v f b v b u s l i m v b u s f s e t p g n d s w 2 v f b d r i v e r o s c i l l a t o r 5 0 0 k h z 2 m h z e n v b u s o k p g o o d i c o m p s w 1 a c l e n c v e r r o r a m p l i f i e r c p / c v c o n t r o l i n t e r n a l r e g v c o m p r e f e r e n c e v o l t a g e c o n t r o l c p e r r o r a m p l i f i e r o n / o f f r a m p u p b y v b u s v b u s l i m s o f t - s t a r t e n d s 5 0 m s e c a f t e r c h a r g i n g s t a r t s i s n s v b u s i s e t i n 2 l e v e l s h i f t e r i s e t o u t 1 i s e t o u t 2 0 . 1 f 4 7 k 2 0 0 i n t e r n a l r e g 3 v v b u s l i m s y s t e m 0 . 1 f 0 . 1 f n p o c p l o a d s w p 2 0 0 m a 1 m s e c s c p d e t e c t i o n 2 . 6 v 2 0 ( t y p ) g n d g n d g n d 4 7 r b 0 7 0 m - 3 0 p 3 0 f h o s t
23 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 i nput / o utput pin immediate c ircuit pin n o . (bd8668gw) pin name pin immediate c ircuit function a1/a2 vbus usb power input a5 vbu slim usb current limiter d1/d2 /e2/e3 gnd g round c5 pgnd power g round a3 isns current detection amp input a4 b4 c4 e5 pgood vbusok isetout2 isetout1 logic output ( with pull - down resistor) b1 d3 icomp vcomp error amp output b2 e1 b3 en aclen isetin3 logic input ( with pull - down resistor) g n d ( s u b ) p g n d v b u s v b u s l i m v b u s i s n s g n d g n d v b u s v b u s l i m g n d v b u s l i m 5 0 0 k t y p . 3 v r e f v b u s l i m g n d 5 0 0 k t y p .
24 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 input/ output pin immediate c ircuit - continued pin n o . ( b d8668gw) pin name pin immediate c ircuit function c2 isetin1 logic input ( without pull - down resistor) c3 isetin2 b5 sw1 load switch output inductor connection1 c1 fset frequency setting resistor terminal d4 e4 vfb vfb cv charging voltage feed - back terminal d5 sw2 boost switching terminal inductor connection 2 g n d v b u s l i m v b u s l i m s w 1 g n d s w 2 g n d v f b g n d v f b v b u s l i m f s e t g n d
25 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 thermal reduction characteristics fig ure 3 6. . power dissipation ( mounted on a 4 - layer substrate board ) 0 2 5 7 5 5 0 1 0 0 1 2 5 1 5 0 0 . 5 1 . 0 1 . 0 w t e m p e r a t u r e t a [ ] p o w e r d i s s i p a t i o n p d [ w ]
26 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 operational notes 1. rever se - connection of power supply connecter connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when frqqhfwlqjwkhsrzhuvxsso\vxfkdvprxqwlqjdqh[whuqdoglrghehwzhhqwkhsrzhuvxsso\dqgwkh,&?v power supply terminals. 2. power supply line design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the di gital and analog blocks to prevent noise in the ground and supply lines of the digital block f rom affecting the analog block. furt hermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitan ce valu e when using electrolytic capacitors. 3. ground p otential ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoi d fluctuations in the small - signal ground caused by large current. also ensure that the ground traces of external components do not cause variation on the ground voltage. t he ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding t he pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inr ush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. th erefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or ste s 7kh ,&?v srzhu vxsso\ vkrxog always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during tr ansport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to grou nd , power supply and output pin. inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extr emely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so, unless otherwise specified, unused input terminals should be connected to the power supply of ground line.
27 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 operational notes C te er at rat eer te rat eeee r a te er, te t teeratre 0 n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
28 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 8664 ordering information b d 8 6 6 4 g w - e 2 part number package gw: ucsp75m2 pac kaging and forming specification e2: embossed tape and reel b d 8 6 6 5 g w - e 2 part number package gw: ucsp75m2 packaging and forming specification e2: embossed tape and reel b d 8 6 6 8 g w - e 2 part number package gw: ucsp75m2 packaging and forming specification e2: embossed tape and reel marking diagr am s part number marking package orderable part number bd866 4 gw ucsp75m2 bd 866 4 gw - e2 BD8665GW ucsp75m2 bd 8665gw - e2 bd8668 gw ucsp75m2 bd 8668gw - e2 top view side view 866 8
29 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 physical dimension s, tape and reel information package name ucsp75m2 ( bd866 4 gw ) < ta pe and reel information > tape embossed carrier tape quantity 3000 p cs direction of feed e2 the direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand
30 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 physical dimension s, tape and reel information package name ucsp75m2 ( BD8665GW ) < tape and reel information > tape embossed carrier tape quantity 3000 p cs direction of feed e2 the direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the r ight hand
31 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 physical dimension s, tape and reel information package name ucsp75m2 ( bd8668gw ) < tape and reel information > tape embossed carrier tape quantity 3000 p cs direction of feed e2 the direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand
32 / 32 bd8664gw BD8665GW b d8668gw tsz02201 - 0a1a0az 0013 0 - 1 - 2 1 5 . apr .201 5 rev.0 0 1 ? 20 1 5 rohm co., ltd. all rights reserved. tsz22111 1 5 001 revision history date revision changes 1 7.dec.2014 00 1 new release
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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