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datasheet product structure silicon monolithic integrated circuit this product is not designed for protection against radioactive rays. 1/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 multifunction lcd segment driver BU97501KV max 204 segments (51seg4com) features key input function for up to 30 keys (a key scan is performed only when a key is pressed.) either 1/4 or 1/3 duty can be selected 1/4 duty drive up to 204 segments 1/3 duty drive up to 156 segments integrated ram for display data (ddram) segment/gpo (max 4port) output mode selectable support standby mode integrated power-on reset circuit integrated oscillator circuit no external component low power consumption design applications telephone fax portable equipment (pos, ecr, pda etc.) dsc dvc car audio home electrical appliance meter equipment key specifications supply voltage range: 2.7v to 6.0v lcd drive power supply range: 4.5v to 6.0v operating temperature range: -40c to +85c max segments: 204 segments display duty: 1/3, 1/4 selectable bias: 1/2, 1/3 selectable interface: 3wire serial interface package vqfp64 w(typ.)d(typ.)h(max.) typical application circuit figure 1. typical application circuit vqfp64 12.00mm x 12.00mm x 1.60mm matrix lcd panel (up to 204 segments) vdd vlcd resb csb scl sd do com1 com2 com3 p1/s1 p2/s2 p4/s4 s5 com4/s41 (p1) (p2) (p4) +5v +5.5v (note1) to controller s40 osc from controller ks1/s42 | ks6/s47 ki1/s48 | ki5/s52 (general purpose ports) (for use control of backlight) (note1) insert capacitors between vdd/vlcd and vss c 0.1uf. key matrix (note1)
datasheet 2/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV block diagram / pin configuration / pin description figure 2. block diagram figure 3. pin configuration (top view) terminal terminal no. i/o handling when unused functions csb 59 i vdd chip select : ?l? active scl 60 i vss serial data transfer clock sd 61 i vss input serial data vdd 63 - - power supply for the logic osc 56 i/o open/vss external clock input: fix to low or open when the internal clock mode setting. do 58 o open output data resb 57 i vdd reset input: resb=?l? : display is disabled. resb=?h? : display is controllable. however, serial data can not be transferred when resb is ?l?. vss 64 - - power supply pin. must be connected to ground. vlcd 62 - - power supply for the lcd driver com1~com3 41 to 43 o open common output for lcd driver com4/s41 44 o open common / segment output for lcd driver. assigned as segment output in 1/3duty mode. s1/p1~s4/p4 1 to 4 o open segment output for lcd driving / general purpose output s1/p1 table 1. pin description ks6/s47 ks5/s46 ks4/s45 ks3/s44 ks2/s43 ks1/s42 s40 s5 s4/p4 s2/p2 s1/p1 resb p.o.r shift register vlcd osc do sd scl csb vdd com1 com2 com3 com4/s41 control register segment driver & latch common driver clock generator lcd voltage generator 3-spi interface + - + - key buffer key scan ki5/s52 ki4/s51 ki3/s50 ki2/s49 ki1/s48 s45 s44 s43 s42 com4/s41 com3 com2 com1 s40 s39 s38 s37 s36 s35 s34 s33 s46 s32 s47 s31 s48 s30 s49 s29 s50 s28 s51 s27 s52 s26 osc s25 resb s24 test s23 csb s22 scl s21 sd s20 vlcd s19 vdd s18 vss s17 49 4949 49 32 3232 32 33 33 33 33 1 6 1 6 1 6 1 6 48 48 48 48 1 1 1 1 64 6464 64 17 1717 17 p1/s1 p2/s2 p3/s3 p4/s4 s5 s6 s7 s8 s9 s10 s11 s12 s13 s14 s15 s16 1 6 1 6 1 6 1 6 1 1 1 1
datasheet 3/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV absolute maximum ratings (ta=25c, vss=0.0v) parameters symbol ratings unit remarks power supply voltage 1 vdd -0.5 to +7.0 v power supply power supply voltage 2 vlcd -0.5 to +7.0 v lcd drive voltage power dissipation pd 1.00 (note2) w input voltage range vin -0.5 to vdd+0.5 v operating temperature range topr -40 to +85 c storage temperature range tstg -55 to +125 c (note2) when operated higher than ta=25c, subtract 10mw per degree. (using rohm standard board) (board size: 70mm70mm1.6mm material: fr4 board copper foil: land pattern only) caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions ratings parameters symbol min typ max unit remarks power supply voltage 1 vdd 2.7 - 6.0 v power supply power supply voltage 2 vlcd 4.5 - 6.0 v lcd driver voltage (note3) the power supply condition shall be met vlcd vdd. electrical characteristics (unless otherwise specified, ta=-40c to +85c, vdd=2.7 to 6.0v, vlcd=4.5 to 6.0v, vss=0.0v) limits parameters symbol min typ max unit conditions ?h? input voltage vih 0.7vdd - vdd v sd, scl, csb, resb, osc ?l? input voltage vil vss - 0.3vdd v sd, scl, csb, resb, osc ?h? input current iih - - 5.0 a sd, scl, csb, resb, osc, vi=5.5v ?l? input current iil -5.0 - - a sd, scl, csb, resb, osc, vi=0.0v input floating voltage vif - - 0.05vdd v ki1 to ki5 pull-down resistance rpd 50 100 250 k ki1 to ki5, vlcd=5.0v output off leakage current ioffh - - 6.0 a do, vo=5.5v voh1 vlcd-1.0 - - p1 to p4, io=-1ma voh2 vlcd-1.0 - - s1 to s52, io=-20a voh3 vlcd-1.0 - - com1 to com4, io=-100a ?h? level output voltage voh4 vlcd-1.0 - - v ks1 to ks6, io=-500a vol1 - - 1.0 p1 to p4, io=1ma vol2 - - 1.0 s1 to s52, io=20a vol3 - - 1.0 com1 to com4, io=100a vol4 - - 1.0 ks1 to ks6, io=25a ?l? level output voltage vol5 - - 0.5 v do, io=1ma vmid1 1/2vlcd -1.0 - 1/2vlcd +1.0 s1 to s52 1/2 bias, io=20a vmid2 1/2vlcd -1.0 - 1/2vlcd +1.0 com1 to com4 1/2 bias, io=100a vmid3 2/3vlcd -1.0 - 2/3vlcd +1.0 s1 to s52 1/3 bias, io=20a vmid4 1/3vlcd -1.0 - 1/3vlcd +1.0 s1 to s52 1/3 bias, io=20a vmid5 2/3vlcd -1.0 - 2/3vlcd +1.0 com1 to com4 1/3bias, io=100a lcd bias voltage vmid6 1/3vlcd -1.0 - 1/3vlcd +1.0 v com1 to com4 1/3 bias, io=100a istvdd - 1 5 input pin all ?l? display off, disable oscillator istvlcd - 1 5 input pin all ?l? display off, disable oscillator ivdd1 - 2 10 vdd=vlcd=5.0v, output unloaded ffr=80hz ivlcd1 - 40 95 vdd=vlcd=5.0v,output unloaded 1/2 bias, ffr=80hz current consumption ivlcd2 - 65 140 a vdd=vlcd=5.0v, output unloaded 1/3 bias, ffr=80hz
datasheet 4/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV electrical characteristics ? continued oscillation characteristics (ta=-40c to +85c, vdd=2.7 to 6.0v, vlcd=4.5v to 6.0v, vss=0.0v) limits parameters symbol min typ max unit conditions frame frequency1 ffr1 56 80 104 hz vlcd=4.5v to 6.0v, ffr = 80hz setting frame frequency2 ffr2 68 80 92 hz vlcd=5.0v, ffr = 80hz setting external clock frequency ffr3 30 - 600 khz external clock mode (drv ctrl1 setting : p2p1=11) frame frequency is decided external frequency and dividing ratio of drv ctrl1 setting. figure 4. typical temperature characteristics mpu interface characteristics (ta=-40 to +85c, vdd=2.7v to 6.0v, vlcd=4.5 to 6.0v, vss=0.0v) limits parameters symbol min typ max unit conditions input rise time tr - - 80 ns input fall time tf - - 80 ns scl cycle time tscyc 400 - - ns ?h? scl pulse width tshw 100 - - ns ?l? scl pulse width tslw 100 - - ns sd setup time tsds 20 - - ns sd hold time tsdh 20 - - ns csb setup time tcss 50 - - ns csb hold time tcsh 50 - - ns ?h? csb pulse width tchw 50 - - ns do output delay time tdc - - 1.5 s do rpu=4.7k , cl=10pf (note4) do rise time tdr - - 1.5 s do rpu=4.7k , cl=10pf (note4) (note4) since do can be an open-drain output; these values depend on the resistance of the pull-up resistor rpu and the load capacitance cl. 60 70 80 90 100 -40 -20 0 20 40 60 80 temperature[ tdc scl csb sd tcss tf tslw tscyc tshw tr tsds tsdh tcsh tchw tdr do vlcd = 5.0v vlcd = 4.5v vlcd = 6.0v figure 5 . 3 - wire ser ial i nterface timing vdd = 4.0v setting
datasheet 5/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV i/o equivalent circuit figure 6. i/o equivalent circuit function descriptions command and data transfer method 3-spi (3-wire serial interface) this device is controlled by a 3-wire signal (csb, scl, and sd). first, interface counter is initialized with csb=?h" setting csb=?l? enables sd and scl inputs. first, interface counter is initialized with csb=?h", and then csb=?l? makes sd and scl input enable. the protocol of 3-spi transfer is shown as follows. each command starts with d7 bit as msb data, followed by d6 to d0 (this is while csb =?l?). (internal data is latched at the rising edge of scl, then the data is converted to an 8-bit parallel data at the falling edge of the 8th clk.) when you rise csb = ?h?, in case command less than 8bit, command and data are canceled. (1) write mode figure 7. 3-spi data transfer format
datasheet 6/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV (2) read mode (key rd command only) the following occurs when key read by key rd command. if key rd command is recognized at the rising edge of 8th clk, it enters read mode after the falling edge of 8th clk and then key data is output through do. setting csb=?h? can exit read mode after or during serial data transfer. figure 8. serial data output format command transfer method after csb=?h?
datasheet 7/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV 1/3 duty mode ddram address/segment outputs 00h 01h 02h ... 27h 28h 29h ... 31h 32h 33h 0 d1 d4 d7 d118 d121 d124 d148 d151 d154 com1 1 d2 d5 d8 d119 d122 d125 d149 d152 d155 com2 bit 2 d3 d6 d9 d120 d123 d126 d150 d153 d156 com3 s1 s2 s3 s40 s41 s42 s50 s51 s52 transferred data is written to the ddram by every 3bits. the write operation is cancelled if it changes csb=?l? ... 27h 28h 29h ... 30h 31h 32h 0 d1 d5 d9 d157 d161 d165 d193 d197 d201 com1 1 d2 d6 d10 d158 d162 d166 d194 d198 d202 com2 2 d3 d7 d11 d159 d163 d167 d195 d199 d203 com3 bit 3 d4 d8 d12 d160 d164 d168 d196 d200 d204 com4 s1 s2 s3 s40 s42 s43 s50 s51 s52 transferred data is written to the ddram by every 4bits. the write operation is cancelled if it changes csb=?l?
datasheet 8/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV for example, s11 output case bits in a ddram d31 d32 d33 segment output pin (s11) 0 0 0 off-state of the lcd elements corresponding to com1, 2 and 3 0 0 1 on-state of the lcd element corresponding to com3 0 1 0 on-state of the lcd element corresponding to com2 0 1 1 on-state of the lcd elements corresponding to com2 and 3 1 0 0 on-state of the lcd element corresponding to com1 1 0 1 on-state of the lcd elements corresponding to com1 and 3 1 1 0 on-state of the lcd elements corresponding to com1 and 2 1 1 1 on-state of the lcd elements corresponding to com1, 2 and 3
datasheet 9/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV 1/4 duty output terminal com1 com2 com3 com4 address output terminal com1 com2 com3 com4 address s1/p1 d1 d2 d3 d4 00 s27 d105 d106 d107 d108 1a s2/p2 d5 d6 d7 d8 01 s28 d109 d110 d111 d112 1b s3/p3 d9 d10 d11 d12 02 s29 d113 d114 d115 d116 1c s4/p4 d13 d14 d15 d16 03 s30 d117 d118 d119 d120 1d s5 d17 d18 d19 d20 04 s31 d121 d122 d123 d124 1e s6 d21 d22 d23 d24 05 s32 d125 d126 d127 d128 1f s7 d25 d26 d27 d28 06 s33 d129 d130 d131 d132 20 s8 d29 d30 d31 d32 07 s34 d133 d134 d135 d136 21 s9 d33 d34 d35 d36 08 s35 d137 d138 d139 d140 22 s10 d37 d38 d39 d40 09 s36 d141 d142 d143 d144 23 s11 d41 d42 d43 d44 0a s37 d145 d146 d147 d148 24 s12 d45 d46 d47 d48 0b s38 d149 d150 d151 d152 25 s13 d49 d50 d51 d52 0c s39 d153 d154 d155 d156 26 s14 d53 d54 d55 d56 0d s40 d157 d158 d159 d160 27 s15 d57 d58 d59 d60 0e ks1/s42 d161 d162 d163 d164 28 s16 d61 d62 d63 d64 0f ks2/s43 d165 d166 d167 d168 29 s17 d65 d66 d67 d68 10 ks3/s44 d169 d170 d171 d172 2a s18 d69 d70 d71 d72 11 ks4/s45 d173 d174 d175 d176 2b s19 d73 d74 d75 d76 12 ks5/s46 d177 d178 d179 d180 2c s20 d77 d78 d79 d80 13 ks6/s47 d181 d182 d183 d184 2d s21 d81 d82 d83 d84 14 ki1/s48 d185 d186 d187 d188 2e s22 d85 d86 d87 d88 15 ki2/s49 d189 d190 d191 d192 2f s23 d89 d90 d91 d92 16 ki3/s50 d193 d194 d195 d196 30 s24 d93 d94 d95 d96 17 ki4/s51 d197 d198 d199 d200 31 s25 d97 d98 d99 d100 18 ki5/s52 d201 d202 d203 d204 32 s26 d101 d102 d103 d104 19 (note6) in case of s1/p1~s4/p4, ks1/s42~ks6/s47 and ki1/s48~ki5/s52 are selected for segment output. for example, s11 output case bits in the ddram d41 d42 d43 d44 segment output pin (s11) 0 0 0 0 off-state of the lcd elements corresponding to com1,2 ,3 and4 0 0 0 1 on-state of the lcd element corresponding to com4 0 0 1 0 on-state of the lcd element corresponding to com3 0 0 1 1 on-state of the lcd elements corresponding to com3 and 4 0 1 0 0 on-state of the lcd element corresponding to com2 0 1 0 1 on-state of the lcd elements corresponding to com2 and 4 0 1 1 0 on-state of the lcd elements corresponding to com2 and 3 0 1 1 1 on-state of the lcd elements corresponding to com2,3 and 4 1 0 0 0 on-state of the lcd element corresponding to com1 1 0 0 1 on-state of the lcd elements corresponding to com1 and 4 1 0 1 0 on-state of the lcd elements corresponding to com1 and 3 1 0 1 1 on-state of the lcd elements corresponding to com1, 3 and 4 1 1 0 0 on-state of the lcd elements corresponding to com1 and 2 1 1 0 1 on-state of the lcd elements corresponding to com1,2 and 4 1 1 1 0 on-state of the lcd elements corresponding to com1,2 and 3 1 1 1 1 on-state of the lcd elements corresponding to com1,2 3 and 4
datasheet 10/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV serial data output figure 9. serial data output kd1 to kd30: key data sa: sleep acknowledge data key data read command (key rd): 1000_0101 (note7) if a key data operation is executed when do is high, the read key data (kd1 to kd30) and sleep acknowledge data(sa) will be invalid. output data kd1 to kd30: key data when a key matrix of up to 30 keys is formed from the ks1 to ks6 output pins and the ki1 to ki5 input pins and one of those keys is pressed, the key output data corresponding to that key will be set to 1. the table shows the relationship between those pins and the key data bits. ki1 ki2 ki3 ki4 ki5 ks1 kd1 kd2 kd3 kd4 kd5 ks2 kd6 kd7 kd8 kd9 kd10 ks3 kd11 kd12 kd13 kd14 kd15 ks4 kd16 kd17 kd18 kd19 kd20 ks5 kd21 kd22 kd23 kd24 kd25 ks6 kd26 kd27 kd28 kd29 kd30 sa: sleep acknowledge data this output data is used to set the state when the key is pressed. in this case, do will go to the low level. if serial data is input during this period and the mode is set (normal mode or sleep mode), the ic will be set to that mode. sa is set to 0 in the sleep mode and to 1 in the normal mode.
datasheet 11/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV key scan operation key scan timing the key scan period is 288t(s). to reliably determine the on/off state of the keys, the BU97501KV scans the keys twice and determines that a key has been pressed when the key data agrees. it outputs a key data read request (a low level on do) 615t(s) after starting a key scan. if the key data does not agree and a key is pressed at that point, it scans the keys again. thus, BU97501KV cannot detect a key press shorter than 615t(s). figure 10. key scan timing normal mode ks1/s42 - ks6/s47 pins are set high. when a key is pressed, a key scan is started and the keys are scanned until all keys are released. multiple key presses are recognized by determining whether multiple key data bits are set. if a key is pressed for longer than 615 t(s) (where t=1/fosc (when external clock input, fosc is a quarter of external clock)), the BU97501KV outputs a key data read request (a low level on do) to the controller. the controller acknowledges this request and reads the key data. however, if csb is ?l? during a serial data transfer, do will be set high. after the controller reads the key data, the key data read request is cleared (do is set high) and BU97501KV performs another key scan. also note that do can be controlled to be an open-drain output or a cmos output. if set to be an open-drain output, a pull-up resistor (between 1 and 10k ? figure 11. key scan operation in normal mode ks1 ks2 ks3 ks4 ks5 ks6 9216t[s] 1 2 3 4 5 6 1 2 3 4 5 6 * * * * * * * * * * t= 1 fosc
datasheet 12/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV sleep mode ks1/s42 - ks6/s47 pins are set high or low by slp ctrl p3,p2 data. (refer to the slp ctrl description). if a key on one of the lines corresponding to a ks1 to ks6 pin which is set high is pressed, the oscillator on the osc pin is started and a key scan is performed. keys are scanned until all keys are released. multiple key presses are recognized by determining whether multiple key data bits are set. if a key is pressed for longer than 615t(s)(where t=1/fosc (when external clock input, fosc is a quarter of external clock)) the BU97501KV outputs a key data read request (a low level on do) to the controller. the controller acknowledges this request and reads the key data. however, if csb is ?l? during a serial data transfer, do will be set high. after the controller reads the key data, the key data read request is cleared (do is set high) and the BU97501KV performs another key scan. however, this does not clear sleep mode. also note that do can be controlled to be an open-drain output or a cmos output. during open-drain output selection, do is an open-drain output so a pull-up resistor (between 1 k ? ? figure 12. key scan operation in sleep mode
datasheet 13/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV multiple key presses although the BU97501KV is capable of key scanning without inserting diodes for dual key presses, triple key presses on the ki1 to ki5 input pin lines, or multiple key presses on the ks1 to ks6 output pin lines, multiple presses other than these cases may result in keys that were not pressed recognized as having been pressed. therefore, a diode must be inserted in series with each key. applications that do not recognize multiple key presses of three or more keys should check the key data for three or more 1 bit and ignore such data. oscillator several kinds of clock for logic and analog circuits are generated from internal oscillation circuit or external clock. figure 13. internal clock mode figure 14. external clock mode osc BU97501KV vss osc BU97501KV clock input open
datasheet 14/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV lcd driver bias/duty circuit this lsi generates lcd driving voltage with on-chip buffer amp. and it can drive lcd at low power consumption. * 1/3 or 1/2bias and line or frame inversion mode can be selected by drv ctrl2. * 1/4 or 1/3duty can be selected by drv ctrl1 command. refer to ?lcd waveform? about each lcd waveform. lcd waveform 1/4duty, 1/3bias line inversion figure 15. lcd waveform in line inversion figure 16. lcd waveform in frame inversion
datasheet 15/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV 1/4duty, 1/2bias line inversion figure 17. lcd waveform in line inversion figure 18. lcd waveform in frame inversion
datasheet 16/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV 1/3duty, 1/3bias line inversion figure 19. lcd waveform in line inversion figure 20. lcd waveform in frame inversion
datasheet 17/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV 1/3duty, 1/2bias line inversion figure 21. lcd waveform in line inversion figure 22. lcd waveform in frame inversion
datasheet 18/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV command table bin command. d7 d6 d5 d4 d3 d2 d1 d0 descriptions slp ctrl 1 0 0 1 p3 p2 * * sleep control seg ctrl 1 0 1 1 p3 p2 p1 * segment control drv ctrl1 1 1 0 0 p3 p2 p1 0 drive control1
datasheet 19/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV detailed command description sleep control (slp ctrl) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 0 0 1 p3 p2 * * (* : don?t care) p3, p2: normal mode/sleep mode switching control data these control data bits select key scan output pins ks1 to ks6 states of during key scan standby. control bits output pin states during key scan standby reset conditions p3 p2 mode internal osc segment outputs/common outputs ks1 ks2 ks3 ks4 ks5 ks6 0 0 normal enabled operating h h h h h h 0 1 sleep l l l l l h
datasheet 20/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV drive control1 (drv ctrl1) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 1 0 0 p3 p2 p1 0 p3: 1/3 duty drive or 1/4 duty drive switching control data this control data bit selects either 1/3 duty drive or 1/4 duty drive. p3 duty mode status of (com4/ s41) reset conditions 0 1/4 com4
datasheet 21/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV drive control3 (drv ctrl3) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 0 1 0 p3 p2 * p0 (* : don?t care) p3 to p2: key scan output port/segment output port switching control data these control data bits select key scan outputs or segment outputs. when (p3,p2)=(1,1), keyscan doesn't function. key scan pins are all segment outputs. thus, maximum segment display number and ram last address change based on this value. control bits status of pins maximum segment display number last address p3 p2 ks1/ s42 ks2/ s43 ks3/ s44 ks4/ s45 ks5/ s46 ks6/ s47 1/3 duty 1/4 duty 1/3 duty 1/4 duty 0 0 ks1 ks2 ks3 ks4 ks5 ks6 123 160 28h 27h 0 1 s42 ks2 ks3 ks4 ks5 ks6 126 164 29h 28h 1 0 s42 s43 ks3 ks4 ks5 ks6 129 168 2ah 29h 1 1 s42 s43 s44 s45 s46 s47 156 204 33h 32h p0: output setting for do this control data bit selects either open drain output or cmos output. p0 setting reset conditions 0 open drain output ? ? display control (disctrl) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 1 1 1 1 0 p1 * (* : don?t care) p1: segment on/off control data this control data bit controls the on/off state of the segments. p1 display status reset conditions 1 on 0 off
datasheet 22/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV software reset (swrst) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 1 1 1 1 0 0 0 1 this is the software reset command. after sending this command, each register, ddram data and ddram address are initialized. address set (adset) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 0 1 p5 p4 p3 p2 p1 p0 address which could be set starts from 00(hex) until ram last address. setting of values other than the above is not allowed. (otherwise, address is set to 0.) refer to ?display data transfer method? for ram last address. data write (datawr) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 0 0 0 0 1 0 1 0 data transfer can be started by this command. set the csb pin to high to terminate the data transfer. refer to ?command and data transfer method?.
datasheet 23/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV initialize sequence recommended sequence after power-on to set this device to initial condition. software reset sequence hardware reset sequence power on power on
datasheet 24/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV t1 t1 cautions in power-on sequence power-on reset (por) circuit this lsi has ?p.o.r? (power-on reset) circuit and software reset function. when the power is on, ic internal circuit and reset pass through unstable low-voltage region. internal ic is not totally reset because vdd rises and this may result to malfunction. thus, por circuit and function of software reset are installed in order to prevent this. please follow the following recommended power-on sequences to allow the reset action to complete. set the power up conditions to meet the recommended tr, tf, toff, and vbot spec below in order to ensure p.o.r operation. tr, tf, toff, vbot recommended conditions tr tf toff vbot less than 5ms less than 5ms more than 150ms less than 0.1v figure 23. power on/off waveform if it is difficult to meet above conditions, execute the following sequence after power-on. (1) figure 24. swrst command sequence power up sequence and power down sequence to prevent the malfunction, in power up sequence, vdd shall be turned on before vlcd. in power down sequence, vdd shall be turned off after vlcd. please satisfies vlcd R figure 25. power on/off sequence vdd tf tr toff vbot
datasheet 25/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV display ddram data example if lcd layout pattern is shown as in figure 26 and 27 and ddram data is shown as in table2, display pattern will be shown as in figure 28. figure 26. example com line pattern figure 27. example of seg line pattern figure 28. example of display pattern s 1 s 2 s 3 s 4 s 5 s 6 s 7 s 8 s 9 s 10 s 11 s 12 s 13 s 14 s 15 s 16 s 17 s 18 s 19 s 20 com1 d0 1 1 0 1 1 1 1 0 1 1 0 0 0 0 0 0 0 0 0 0 com2 d1 0 1 1 1 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 com3 d2 0 0 1 0 1 0 0 1 1 1 0 0 0 0 0 0 0 0 0 0 com4 d3 0 1 1 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0ah 0bh 0ch 0dh 0eh 0fh 10h 11h 12h 13h table 2. ddram data map com1 com2 com3 com4 s1 s3 s2 s4 s5 s6 s8 s7 s9 s10
datasheet 26/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor (cmos?). the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line.
datasheet 27/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input terminals have voltages within the values specified in the electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit.
datasheet 28/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV ordering information b u 9 7 5 0 1 k v - e 2 package part number kv : vqfp64 packaging and forming specification e2: embossed tape and reel (vqfp64) marking diagram(s)(top view) vqfp64 (top view) part number marking lot number 1pin mark b u 9 7 5 0 1 k v
datasheet 29/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV physical dimension, tape and reel information package name vqfp64 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tape quantit y direction of feed th e direction is th e 1p in of p rodu ct i s a t th e upper l eft wh en you hol d reel on th e l eft hand a nd you pull ou t th e tape on th e ri gh t hand 1000pcs e2 ( ) 1pin
datasheet 30/30 tsz02201-0p4p0d300390-1-2 11.apr.2014 rev.004 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? ? BU97501KV version / revision history version date description 001 07. aug. 2013 1 st ver 002 07. nov. 2013 page.4 add electrical characteristics of external clock frequency 003 31. jan. 2014 page.2 modify pin description osc, do, resb, vss and s1/p1
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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