1 gaas mmic power amplifier 2.0 - 6.5 ghz rev. v7 MAAM26100 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. m/a - com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a - com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a - com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. features ? saturated power: 30.5 dbm typical ? gain: 19 db typical ? power added efficiency: 30% ? on - chip bias network ? dc decoupled rf input and output ? rohs* compliant description the MAAM26100 is a gaas mmic two stage high efficiency power amplifier. the MAAM26100 is a fully monolithic design which eliminates the need for external circuitry in 50 - ohm systems. the MAAM26100 is ideally suited for driver amplifiers and transmitter outputs in umts applications, test equipment, electronic warfare jammers, missile subsystems and phased array radars. the MAAM26100 is fabricated using a mature 0.5 - micron gate length gaas process. the process features full passivation for increased performance reliability. ordering information part number package MAAM26100 die die absolute maximum ratings 1,2 parameter absolute maximum v dd +9 v v g1 , v g2 - 2.5 v to - 0.8 v v gg 3 - 6 v to - 3 v rf input power +17 dbm channel temperature 150c storage temperature - 65c to +150c 1. exceeding any one or combination of these limits may cause permanent damage to this device and will void product warranty. 2. m/a - com does not recommend sustained operation near these survivability limits. 3. v gg rating applies when using the optional on - chip resistor network.
2 gaas mmic power amplifier 2.0 - 6.5 ghz rev. v7 MAAM26100 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. m/a - com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a - com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a - com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. electrical specifications: t a = 25c, z 0 = 50 , v dd = +8 v, v gg = - 1.3 v nominal parameter test conditions units min. typ. max. small signal gain 2 - 6 ghz db 15 19 input vswr 2 - 6 ghz ratio - 2.0:1 output vswr 2 - 6 ghz ratio 2.2:1 saturated output power input power +14 dbm, 2 - 6 ghz dbm 29 30.5 output power at 1 db gain compression 2 - 6 ghz dbm 28 power added efficiency % 30 third order intercept 2 - 6 ghz dbm 39 reverse isolation 2 - 6 ghz db 30 bias current no rf p in = +14 dbm ma ma 390 475 650 thermal resistance 4 c/w 14 4. attachment method not included. schematic v d 1 v g g v g 2 g n d v d 2 r f o u t a 2 b 2 c 2 d 2 e 2 g n d v g 2 a 1 b 1 c 1 d 1 e 1 v g 1 r f i n
3 gaas mmic power amplifier 2.0 - 6.5 ghz rev. v7 MAAM26100 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. m/a - com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a - com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a - com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. typical performance curves input return loss gain power added efficiency @ p in = +14 dbm output power @ p in = +14 dbm 0 5 10 15 20 25 1.5 2.5 3.5 4.5 5.5 6.5 7.5 frequency (ghz) -25 -20 -15 -10 -5 0 1.5 2.5 3.5 4.5 5.5 6.5 7.5 frequency (ghz) 0 10 20 30 40 50 1.5 2.5 3.5 4.5 5.5 6.5 7.5 frequency (ghz) 24 26 28 30 32 34 1.5 2.5 3.5 4.5 5.5 6.5 7.5 frequency (ghz)
4 gaas mmic power amplifier 2.0 - 6.5 ghz rev. v7 MAAM26100 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. m/a - com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a - com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a - com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. bonding table 7 bin # bond pads 1 e1 to v g1 , e2 to v g2 2 d1 to v g1 , d2 to v g2 3 c1 to v g1 , c2 to v g2 4 b1 to v g1 , b2 to v g2 7. optional on - chip resistor networks are used by connecting a nominal - 5 volts to the pad v gg then connecting pads per the bonding table. each gel pack is labeled with a cd # which corresponds to a bin # in the bonding table. for example, cd1 on the gel pack corresponds to bin 1, which means that pad e1 must be connected to pad v g1 and pad e2 must be connected to pad v g2 . typical bias configuration 5,6 5. nominal bias is obtained by first connecting - 1.3 volts to pads v g1 and v g2 followed by connecting +8 volts to pads v d1 and v d2 (note sequence). 6. the recommended v dd range is +6 to +9 volts. handling procedures permanent damage to the MAAM26100 may occur if the following precautions are not adhered to: a. cleanliness - the MAAM26100 should be han- dled in a clean environment. do not attempt to clean assembly after the MAAM26100 is installed. b. static sensitivity - all die handling equipment and personnel should comply with dod - std - 1686 class i. c. transients - avoid instrument and power sup- ply transients while bias is connected to the MAAM26100. use shielded signal and bias cables to minimize inductive pick - up. d. general handling - do not touch the surface of the die. it is recommended that the MAAM26100 die be handled along the long side with a sharp pair of tweezers. mounting the MAAM26100 is back - metallized with pd/ni/au (100/1,000/30,000?) metallization. it is recom- mended that the die be mounted with au/sn eutec- tic preforms. the attachment surface should be clean and flat. a. an 80/20 preform is recommended with a work surface temperature of approximately 255c and a tool temperature of 265c. when hot 90/5 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290c. b. do not expose the MAAM26100 to a tem- perature greater than 320c for more than 20 seconds. no more than 3 seconds of scrub- bing should be required for attachment. bonding a. ball or wedge bond with 1.0 mil diameter gold wire of 3.0 mil x 0.5 mil ribbon. thermosonic bonding with a nominal stage temperature of 150c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. ultrasonic energy and time should be adjusted to the minimum levels necessary to achieve reliable bonds. b. bonds should be started on the die and termi- nated on the package. c. bonding pads are 4.0 x 4.0 mils minimum. v g g ( v g 1 , v g 2 ) 1 0 0 0 p f m i n i m u m r f o u t r f i n v d d ( v d 1 , v d 2 )
5 gaas mmic power amplifier 2.0 - 6.5 ghz rev. v7 MAAM26100 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for additional data sheets and product information. m/a - com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a - com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a - com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. pad configuration 8 die size: 2.342 x 1.802 x 0.102 mm (nominal) 8. all x,y locations are at pad center. pad no. x (mm) nominal y (mm) nominal pad size (mm) description 3 0 0 .10 x .10 vd1 4 0.6435 0 .10 x .10 vgg 5 0.9235 0 .10 x .10 vg2 6 1.0885 0 .15 x .10 gnd 7 1.954 0 .15 x .10 vd2 9 1.979 0.640 .10 x .10 gnd 10 1.979 0.840 .10 x .20 rf out 11 1.564 1.420 .10 x .10 b2 12 1.413 1.380 .10 x .10 c2 13 1.263 1.420 .10 x .10 d2 14 1.213 1.580 .15 x .10 e2 15 1.413 1.580 .15 x .10 vg2 pad no. x (mm) nominal y (mm) nominal pad size (mm) description 16 1.613 1.580 .10 x .10 a2 17 1.942 1.580 .10 x .10 gnd 19 0.5525 1.580 .10 x .10 a1 20 0.5025 1.420 .10 x .10 b1 21 0.3525 1.380 .10 x .10 c1 22 0.2025 1.420 .10 x .10 d1 23 0.1525 1.580 .10 x .10 e1 24 0.0025 1.580 .10 x .10 gnd 26 0.3525 1.580 .10 x .10 vg1 27 - 0.141 0.840 .10 x .20 rf in 28 - 0.141 0.640 .10 x .10 gnd outline drawing 3 10 9 7 6 5 4 13 12 11 17 16 15 22 14 21 20 24 23 26 19 28 27
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