page 1 rev :b mechanical data -case: sot -563 standard package, molded plastic. -mounting position: any . -w eight: 0.0034 gram (approx.). circuit diagram CPDH6-5V0U-HF qw -jp005 comchip t echnology co., l td. 1 2 3 6 5 4 -iec61000-4-2 level 4 esd protection -surface mount package. -high component density . features t yp parameter min max unit junction capacitance diode breakdown voltage v esd capability clamping voltage 80 pf v kv 6.1 8 peak pulse power w 80 leakage current ua 1.0 60 operation temperature 125 c forward voltage v 1.2 0.1 conditions i r = 1ma v r = 0v ,f = 1mhz i pp = 1a,t p =8/20us v r = 3v i f =10ma i pp = 8a,t p =8/20us 10 symbol v bd c t v c esd p pp i l t j v f storage temperature t stg c 150 -55 maximum rating and electrical characteristics (at t a=25c unless otherwise noted) -t erminals: solderable per mil-std-750, method 2026. rohs device halogen free smd esd protection diode 1 5 8 iec 61000-4-2(air) iec 61000-4-2(contact) -marking code: e5u sot -563 dimensions in inches and (millimeters) 0.067(1.70) 0.059(1.50) 0.051(1.30) 0.043(1.10) 0.022(0.55) 0.018(0.45) 0.024(0.60) 0.021(0.52) 0.01 1(0.27) 0.007(0.17) 0.002(0.05) 0.012(0.30) 0.004(0.10) 0.067(1.70) 0.059(1.50) 0.006(0.16) 0.004(0.09) 0.000(0.00) c o m p a n y r e s e r v e s t h e r i g h t t o i m p r o v e p r o d u c t d e s i g n , f u n c t i o n s a n d r e l i a b i l i t y w i t h o u t n o t i c e .
ra ting and characteristic cur ves ( ) CPDH6-5V0U-HF page 2 comchip t echnology co., l td. rev :b qw -jp005 smd esd protection diode p o w e r r a t i n g ( % ) ambient temperature, ( c ) m o u n t i n g o n g l a s s e p o x y p c b s 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 c l a m p i n g v o l t a g e , v c ( v ) f i g . 3 - c l a m p in g v o l t a g e v s . p e a k p u ls e c u r r e n t peak pulse current,ipp (a) 8 2 0 8 10 12 4 6 6 4 2 0 8/20us waveform 2 5 5 0 7 5 1 0 0 1 5 0 0 1 2 5 f=1mhz t a=25c 0 20 40 60 80 0 1 2 3 5 4 100 c a p a c i t a n c e b e t w e e n t e r m i n a l s ( p f ) reverse voltage (v) f i g . 4 - c a p a c i t a n c e b e t w e e n t e r m i n a l s c h a r a c t e r is t i c s f ig .2 - p o w e r r a ti n g d e r a ti n g c u r v e 14 f o r m a c c . i e c 6 1 0 0 0 - 4 - 5 w a v e f i g . 1 - 8 / 2 0 u s p e a k p u l s e c u r r e n t t i m e , ( u s ) 0 % 2 0 % 4 0 % 6 0 % 8 0 % 1 0 0 % 0 5 1 5 2 5 3 0 1 0 2 0 1 2 0 % p e r c e n t a g e o f i p p t a = 2 5 c p e a k v a l u r i p p t e s t w a v e f o r m p a r a m e t e r s t f = 8 u s t d = 2 0 u s e - t t d = t i p p / 2 c o m p a n y r e s e r v e s t h e r i g h t t o i m p r o v e p r o d u c t d e s i g n , f u n c t i o n s a n d r e l i a b i l i t y w i t h o u t n o t i c e .
page 3 comchip t echnology co., l td. rev :b qw -jp005 smd esd protection diode reel t aping specification b c d d d 2 d 1 s o t - 5 6 3 s y m b o l a ( m m ) ( i n c h ) 2 . 1 4 2 0 . 0 4 0 1 . 7 8 0 . 1 0 1 . 7 8 0 . 1 0 4 . 0 0 0 . 1 0 1 . 5 0 0 . 1 0 3 . 5 0 0 . 0 5 1 . 7 5 0 . 1 0 5 4 . 4 1 . 0 0 1 3 . 0 1 . 0 0 0 . 6 9 0 . 1 0 4 . 0 0 0 . 1 0 2 . 0 0 0 . 1 0 8 . 0 0 0 . 1 0 1 2 . 3 0 1 . 0 0 1 7 8 2 . 0 0 0 . 0 7 0 0 . 0 0 4 0 . 0 7 0 0 . 0 0 4 0 . 0 2 7 0 . 0 0 4 0 . 0 5 9 0 . 0 0 4 7 . 0 0 8 0 . 0 7 9 0 . 5 1 2 0 . 0 4 0 s o t - 5 6 3 s y m b o l ( m m ) ( i n c h ) 0 . 1 3 8 0 . 0 0 2 0 . 0 6 9 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 2 0 . 5 6 7 0 . 0 4 0 e f p p 0 p 1 w w 1 0 . 3 1 5 0 . 0 0 4 xxx . d f e b p 1 p 0 o 1 2 0 d 1 d 2 w 1 p d a w t c c o m p a n y r e s e r v e s t h e r i g h t t o i m p r o v e p r o d u c t d e s i g n , f u n c t i o n s a n d r e l i a b i l i t y w i t h o u t n o t i c e .
page 4 comchip t echnology co., l td. rev :b e5u . 1 2 3 6 5 4 marking code part number CPDH6-5V0U-HF marking code e5u qw -jp005 smd esd protection diode standard packaging c a s e t y p e 3 , 0 0 0 r e e l ( p c s ) reel size (inch) 7 r e e l p a c k s o t - 5 6 3 suggested p ad layout a d c b e size (inch) 0.012 (mm) 0.30 0.30 1.00 0.012 0.039 sot -563 1.40 0.055 e 1.70 0.067 b c d a c o m p a n y r e s e r v e s t h e r i g h t t o i m p r o v e p r o d u c t d e s i g n , f u n c t i o n s a n d r e l i a b i l i t y w i t h o u t n o t i c e .
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