1 / 4 ww w.asb.co.kr november 2008 p lerow tm aln0450wt internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm , pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simp le and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 400 500 gain db 18 19 gain flatness db ? 0.4 ? 0.5 noise figure db 1.1 1.2 output ip3 (1) dbm 26 29 s11 / s22 (2) db - 16 / - 14 output p1db dbm 20 22 switching time ? sec - supply current ma 35 50 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 0 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc other s ground ou t line draw ing (unit: mm) feature s s 21 = 19.5 db @ 400 mhz = 18.5 db @ 500 mhz nf of 1.1 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description (recommended footprint) aln0450wt asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 1 - stage single type typ. @ t = 25 ? c, v s = 5 v, freq. = 450 mhz, z o.sys =50 ohm solder stencil area specifications (in pr o duction)
2 / 4 ww w.asb.co.kr november 2008 p lerow tm aln0450wt internally matched lna module s - param e ters noise figure oip3 p1db 400~500 mhz +5 v typical performance (measured) s - pa rameters & k fa c tor
3 / 4 ww w.asb.co.kr november 2008 p lerow tm aln0450wt internally matched lna module item voltage s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) curren t (ma) 4.5 - 22.78 - 19.53 18.92 0.67 1.099 21.49 25.28 24 4.6 - 21.23 - 18.26 19.07 0.68 1.077 21.68 26.35 27 4.7 - 19.88 - 17.13 19.23 0.70 1.050 21.91 27.54 30 4.8 - 18.79 - 16.21 19.38 0.70 1.045 22.08 28.48 34 4.9 - 18.04 - 15.60 19.48 0.71 1.038 22.27 29. 64 37 5.0 - 17.28 - 15.00 19.60 0.72 1.025 22.44 30.61 42 5.1 - 16.75 - 14.57 19.70 0.72 1.030 22.65 31.43 46 5.2 - 16.40 - 14.30 19.76 0.74 1.031 22.82 32.16 50 5.3 - 15.97 - 13.98 19.85 0.74 1.035 23.04 32.81 55 5.4 - 15.59 - 13.71 19.93 0.76 1.041 23.26 33.3 5 60 5.5 - 15.13 - 13.44 20.05 0.76 1.049 23.47 33.88 66 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 ? c - 17.63 - 14.98 19.66 0.71 0.849 22.84 27.49 33 - 20 ? c - 17.84 - 15.11 19.70 0.72 0.884 22.78 28.4 5 35 0 ? c - 18.32 - 15.42 19.66 0.73 0.978 22.64 29.32 37 25 ? c - 18.37 - 15.44 19.82 0.74 1.038 22.21 30.32 40 40 ? c - 18.87 - 15.74 19.82 0.74 1.098 22.05 30.73 42 60 ? c - 19.22 - 15.98 19.83 0.77 1.158 21.53 31.39 45 80 ? c - 19.52 16.23 19.93 0.78 1.230 20.64 32 .01 50 100 ? c - 19.94 - 16.64 19.92 0.79 1.310 19.92 33.06 53 rf performance with voltage change rf performance with operating temperature
4 / 4 ww w.asb.co.kr november 2008 p lerow tm aln0450wt internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc sup ply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. ther efore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e quency. application circuit rec ommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln - at, bt, t series C 10x10mm)
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