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product structure silicon monolithic chip this chip is not designed for protection against ratio active ray s. 1/ 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 ? 14 ? 001 power supply ic series for tft-lcd panels 12v input multi-channel system power supply ic BM81004MUV general description BM81004MUV is a system power supply for tft-lcd panels used for liquid crystal tvs. this ic is incorporated with negative and positive charge pump controller and gate pulse modulation (gpm) function. it also features built- in eeprom to contain each setting voltage, soft start time etc. features step - up dc/dc converter (avdd). (synchronous rectification, built - in load switch). step -dow n dc/dc converter 1(vio). (non-synchronous rectification). step - down dc/dc converter 2(vcore). step - down dc/dc converter 3(havdd). (synchronous rectification). p ositive charge pump controller (vgh) . negative charge pump controller (vgl) . gat e pulse modulation (gpm) function. high voltage ldo (50ma) 10 bit dac - controlled gamma amplifier 4ch 8 bit dac - controlled vcom amplifier output voltage control by i2c. built - in eeprom. switching frequency 750khz (avdd, vio). switching frequency 1mhz (vcore , havdd). applications tft - lcd panel typical application circuit 1 top view key specifications ? input voltage range 8.6v to 14.0v ? avdd output voltage range 11.7v to 18.0v ? vio output voltage range 2.2v to 3.7v ? havdd output voltage range 4.8v to 11.1 v ? vgh output voltage range 25v to 40.5v ? vgl output voltage range - 10.2v to - 4.0v ? switching frequency 750khz(typ) 1mhz(typ) ? operating temperature range -40 to + 10 5 package w(typ) x d(typ) x h(max) vqfn48v7070a 7.00mm x 7.00mm x 1.0 mm figure 1 . application circuit 1 datashee t vio amp2 BM81004MUV amp1 vdd1 pg sda scl a0 avin hvldo hvcc vdd2 vinb2 vinb1 vinb1 n.c. swb1 swb1 ampgnd amp4 amp3 en vdd3 pgnd3 swb3 n.c. vinb3 re vghm vgh drvp swo swi sw sw pgnd pgnd vl comp agnd ctrl vcore havdd vin vin vin avdd vgl swb1 avdd sw vgh sw vcom inn pgnd2 swb2 drvn vgl pgate avdds avdd
2 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? v i o a m p 2 b m 8 1 0 0 4 m u v a m p 1 v d d 1 p g s d a s c l a 0 a v i n h v l d o h v c c v d d 2 v i n b 2 v i n b 1 v i n b 1 n . c . s w b 1 s w b 1 a m p g n d a m p 4 a m p 3 e n v d d 3 p g n d 3 s w b 3 n . c . v i n b 3 r e v g h m v g h d r v p s w o s w i s w s w p g n d p g n d v l c o m p a g n d c t r l v c o r e h a v d d v i n v i n v i n a v d d v g l s w b 1 a v d d s w v g h s w v c o m i n n p g n d 2 s w b 2 d r v n v g l p g a t e a v d d s a v d d
3 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? features ................................ ................................ ................................ ................................ ................................ .......................... 1 applications ................................ ................................ ................................ ................................ ................................ .................... 1 typic al application circuit 1 ................................ ................................ ................................ ................................ ............................ 1 key specifications ................................ ................................ ................................ ................................ ................................ ........... 1 package ................................ ................................ ................................ ................................ ................................ .......................... 1 typica l application circuit 2 ................................ ................................ ................................ ................................ ............................ 2 pin configuration ................................ ................................ ................................ ................................ ................................ ............ 4 pin description ................................ ................................ ................................ ................................ ................................ ................ 4 block diagram ................................ ................................ ................................ ................................ ................................ ................ 5 description of each block ................................ ................................ ................................ ................................ ............................... 6 absolute maximum ratings ................................ ................................ ................................ ................................ ............................ 7 recommended operating ranges ................................ ................................ ................................ ................................ ................. 7 electrical characteristics ................................ ................................ ................................ ................................ ................................ . 8 typical performance curves ................................ ................................ ................................ ................................ ......................... 12 timing chart ................................ ................................ ................................ ................................ ................................ ................. 24 example application ................................ ................................ ................................ ................................ ................................ ..... 25 protection function explanation of each block ................................ ................................ ................................ ............................... 26 protection function list ................................ ................................ ................................ ................................ ................................ ... 29 serial transmission ................................ ................................ ................................ ................................ ................................ ....... 30 register map ................................ ................................ ................................ ................................ ................................ ................ 33 command table 1 ................................ ................................ ................................ ................................ ................................ ......... 34 command table 2 ................................ ................................ ................................ ................................ ................................ ......... 35 selecting application componen ts ................................ ................................ ................................ ................................ ............... 36 layout guideline ................................ ................................ ................................ ................................ ................................ ............. 41 power dissipation ................................ ................................ ................................ ................................ ................................ ......... 41 i/o equivalence c ircuit ................................ ................................ ................................ ................................ ................................ . 42 operational notes ................................ ................................ ................................ ................................ ................................ ......... 45 ordering information ................................ ................................ ................................ ................................ ................................ ..... 47 marking d iagram ................................ ................................ ................................ ................................ ................................ .......... 47 physical dimension tape and reel information ................................ ................................ ................................ ............................ 48 revision history ................................ ................................ ................................ ................................ ................................ ............ 49
4 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8 1 0 9 8 7 6 5 4 3 2 1 2 7 2 8 2 9 3 0 3 1 3 2 3 3 3 4 3 5 3 6 a m p 2 a m p 1 v d d 1 p g s d a s c l a 0 a v i n h v l d o h v c c e n v d d 3 p g n d 3 s w b 3 n . c . v i n b 3 r e v g h m v g h d r v p c t r l a g n d c o m p v l p g n d p g n d s w s w s w i s w o a m p 3 a m p 4 s w b 1 s w b 1 n . c . v i n b 1 v i n b 1 v i n b 2 v d d 2 t h e r m a l p a d a m p g n d 2 5 2 6 d r v n v g l 2 4 2 3 a v d d s p g a t e 3 7 3 8 s w b 2 p g n d 2 1 2 1 1 v c o m i n n
5 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? b o o s t c o n v e r t e r b u c k c o n v e r t e r 3 v g h r e g u l a t o r g p m d a c i 2 c i n t e r f a c e e e p r o m i n t e r n a l r e g u l a t o r a v i n b u c k c o n v e r t e r 1 b u c k c o n v e r t e r 2 s e q u e n c e c o n t r o l s w v g l s w b 1 c o m p s w o s w i s w p g n d v i n b 1 s w b 1 v d d 1 v i n b 2 s w b 2 p g n d 2 v d d 2 v i n b 3 s w b 3 p g n d 3 v d d 3 d r v p v g h v g h m r e c t r l d r v n v g l a g n d p g e n a 0 s c l s d a v l v i n h a v d d v c o r e v i o v i n v i n v g l s w a v d d v g h p g a t e a v d d s a v d d v i n h v l d o h v c c h v l d o h v l d o a v d d o p a m p + - v c o m a m p 1 + - a m p 2 + - a m p 4 + - a m p 3 + - h v l d o d a c a m p g n d h v c c h v c c i n n h v c c
6 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ?
7 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ?
8 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? m m m C
9 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? m m m m m
10 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ?
11 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ?
12 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? 0 1 2 3 4 5 6 7 8 5 6 7 8 9 10 11 12 13 14 15 input voltage : v in [v] input current : icc[ma] en=l no switching 500 600 700 800 900 1000 1100 1200 1300 1400 1500 5 6 7 8 9 10 11 12 13 14 15 input voltage : v in [v] internal oscillatior freqency : f osc [khz] avdd,vio frequency vcore,havdd frequency
13 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? vio (100mv/div ac) i out (500ma/div) i out =500ma i out =100ma 50usec/div vio (10mv/div ac) swb1 (10v/div) i swb1 (500ma/div) i out (500ma/div) v 0 10 20 30 40 50 60 70 80 90 100 0 200 400 600 800 1000 1200 1400 efficiency [%] output current [ma] vin=12v vio=3.3v -3 -2 -1 0 1 2 3 0 200 400 600 800 1000 output voltage [%] output current [ma] vin=12v vio=3.3v
14 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? -3 -2 -1 0 1 2 3 0 200 400 600 800 1000 output current [ma] output voltage [%] vin=12v vcore=1.2v 0 10 20 30 40 50 60 70 80 90 100 0 200 400 600 800 1000 1200 1400 output current [ma] efficiency [%] vin=12v vcore=1.2v vcore (100mv/div ac) i out (200ma/div ) i out =300ma i out =10ma 50usec/div vcore (10mv/div ac) swb2 (10v/div ) i swb2 (500ma/div ) i out (500ma/div ) v
15 / 49 ts z02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? -3 -2 -1 0 1 2 3 0 200 400 600 800 1000 output current [ma] output voltage [%] vin=12v avdd=15.6v havdd=7.8v 0 10 20 30 40 50 60 70 80 90 100 0 200 400 600 800 1000 1200 1400 output current [ma] efficiency [%] vin=12v avdd=15.6v havdd=7.8v (source) havdd (100mv/div ac) i out (300ma/div) i out =350ma i out =0ma 200usec/div havdd (10mv/div ac) swb3 (10v/div) i swb3 (500ma/div) i out (500ma/div) v
16 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? -3 -2 -1 0 1 2 3 0 200 400 600 800 1000 output currnet [ma] output voltage [%] vin=12v avdd=15.6v havdd=7.8v 0 10 20 30 40 50 60 70 80 90 100 0 200 400 600 800 1000 1200 1400 output current [ma] efficiency [%] vin=12v avdd=15.6v havdd=7.8v (sink) havdd (100mv/div ac) i out (300ma/div) i out =350ma i out =0ma 200usec/div havdd (10mv/div ac) swb3 (10v/div) i swb3 (500ma/div) i out (500ma/div) v
17 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? avdd (10mv/div ac) sw (10v/div ) i sw (1a/div ) i out (500ma/div ) v avdd (200mv/div ac) i out (500ma/div ) i out =500ma i out =100ma 50usec/div -3 -2 -1 0 1 2 3 0 200 400 600 800 1000 output current [ma] output voltage [%] vin=12v avdd=15.6v 0 10 20 30 40 50 60 70 80 90 100 0 200 400 600 800 1000 1200 1400 output current [ma] efficiency [%] vin=12v avdd=15.6v
18 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? -3 -2 -1 0 1 2 3 10 30 50 70 90 110 130 150 output current [ma] output voltage [%] vin=12v avdd=15.6v vgh=35v 5usec/div i out (50ma/div ) i out =50ma vgh (20mv/div ac) v 200usec/div i out (50ma/div ) i out =50ma i out =10ma vgh (200mv/div ac)
19 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? -3 -2 -1 0 1 2 3 10 30 50 70 90 110 130 150 output current [ma] output voltage [%] vin=12v vgl=-6.0v 5usec/div i out (50ma/div ) i out =50ma v 200usec/div i out (50ma/div ) i out =50ma i out =10ma vgl (100mv/div ac)
20 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? 500usec/div vghm (10v/div ) ctrl (5v/div ) clamp voltage 20v 500nsec/div vghm (5v/div) ctrl (5v/div) delay=255nsec vgh=28v no capacitive load re resister=0 500nsec/div vghm (5v/div) ctrl (5v/div) delay=270nsec vgh=28v no capacitive load re resister=0
21 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? 500nsec/div vghm (5v/div) ctrl (5v/div) delay=255nsec vgh=28v no capacitive load re resister=0 -3 -2 -1 0 1 2 3 -200 -150 -100 -50 0 50 100 150 200 output current [ma] output voltage [%] vin=12v avdd=15.6v hvldo=15.2v vcom=6.1v -3 -2 -1 0 1 2 3 -20 -15 -10 -5 0 5 10 15 20 output current [ma] output voltage [%] vin=12v avdd=15.6v hvldo=15.2v gamma=7.8v -3 -2 -1 0 1 2 3 0 20 40 60 80 100 output current [ma] output voltage [%] vin=12v avdd=15.6v hvldo=15.2v
22 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? -1 -0.5 0 0.5 1 000h 0ffh bit inl [lsb] -1 -0.5 0 0.5 1 000h 0ffh bit dnl [lsb] 100nsec/div vcom (5v/div ) s/r = 43.3v/us 100nsec/div vcom (5v/div ) s/r = 43.6v/us
23 / 49 tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.co .jp tsz22111 ? ? -2 -1 0 1 2 000h 3ffh bit inl [lsb] -2 -1 0 1 2 000h 3ffh bit dnl [lsb]
24 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 timing chart on and off sequence of this ic are shown below. figure 47 . timing chart vl activates with uvlo release of vin. it reads eeprom data by a uto read operation after vl finish its activati o n. (t ear =2msec) after auto read completion, vcore activates. the soft start time of vcore is 3msec. after vcore soft - start completion, vio activates. the soft start time of vio is 3.3msec if the setting is 3.3v. after vio soft - start completion, pg become s high and vgl activates. ( if swb1 is used) the soft start time of vgl depends on output voltage setting, external capacitor etc. 2.5msec after vio soft - start completion, load sw turns on (10msec) because of en=high and avdd activates. the soft start time of avdd can be changed by register setting. (10msec or 20msec) after avdd started, vgh activates. the soft start time of vgh is 7msec if the setting is 35v. after vgh started, ctrl rising or falling will be a trigger to activate gpm operation. w hen vghm voltage at ctrl =l reaches the gpm clamp voltage, vghm output is high impedance . gpm, vgh, avdd, havdd shuts down when en=low. gpm output (vghm) will be the same potential with re. all output shuts down when uvlo of vin is detected. vghm will be the same potential with vgh. hvldo, havdd and vcom starts up follow ed by avdd output voltage. amp 1 to 4 startup follow ed by hvldo output voltage. when en=low, avdd and havdd output become high impedance. hvldo, vcom and amp1 to 4 output shut down follow e d by avdd till avdd is below a certain level. figure 48 . timing chart 2 v i n v l v i o v g l e n a v d d h a v d d v g h c t r l v g h m v i n _ u v l o e e p r o m a u t o r e a d v l _ u v l o v c o r e v g l d e l a y ( i n t e r n a l ) v g h m = r e v g h m = v g h t s s _ v c o r e / 3 . 0 m s t s s _ l s w / 1 0 m s t s s _ a v d d t s s _ v g h / 7 m s l o a d s w i t h o n t e a r t s s _ v i o / 3 . 3 m s t d l y _ v g l / 2 . 5 m s v i n _ u v l o avdd en hvldo havdd vcom amp 1 - 4
25 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 example application >& top view >' figure 49 . example application application circuit components list parts name value company parts number parts name value company parts number c3 4x 10 [uf] murata grm21bb31a106ke18 c40 10 [uf] murata grm31cb31e106ka75 c8 1 [uf] murata grm188b31e105ka75 c41 2x 10 [uf] murata grm31cb31e106ka75 c9 10 [uf] murata grm31cb31e106 ka75 c51 - 54 0.1 [uf] murata grm188b31h104ka92 c10 10 [uf] murata grm31cb31e106ka75 r15 2.7 [k ] rohm mcr03 c11 10 [uf] murata grm31cb31e106ka75 r30 300 [ ] rohm mcr25 c15 6.8 [nf] murata grm188b11e682ka01 r39_1 330 [ ] rohm mcr03 c16 1 [uf] murata grm188cb31e105ka75 r39_2 120 [ ] rohm mcr03 c19 2x 10 [uf] murata grm31cb31e106ka75 rfn1 2.2 [ ] rohm mcr25 c22 4x 10 [uf] murata grm31cb31e106ka75 rfp1 - 2 2.2 [ ] rohm mcr25 c25 4.7 [uf] murata grm219b31c475ke15 rqn 100 [k ] rohm mcr03 cfn1 0.1 [uf] murata grm188b31h104ka92 rqp 100 [k ] rohm mcr03 cfn2 470 [pf] murata grm188b11h471ka01 l19 6.8 [uh ] taiyo yuden ns10165t6r8n cfp1 0.1 [uf] murata grm188b31h104ka92 l3 6.8 [uh] taiyo yuden nrs8040t6r8m cpf2 0.1 [uf] murata grm188b31h104ka92 l35 6.8 [uh] taiyo yuden nrs8040t6r8m cpf3 1 [uf] murata grm21bb31h105ka12 l39 6.8 [uh] taiyo yuden nrs8040t6r8 m cfp4 2.2 [nf] murata grm188b11h222ka01 d45 - rohm rsx301l - 30 c28 10 [uf] murata grm31cb31h106ka12 dfn1 - rohm rb558w c31 10 [uf] murata grm31cb31e106ka75 dfp1 - rohm rb558w c35 2x 10 [uf] murata grm31cb31e106ka75 dfp2 - rohm rb558w c39 4x 10 [uf] mu rata grm21bb31a106ke18 qn pnp rohm 2scr513p c39_0 22 [nf] murata grm188b31h104ka92 qp npn rohm 2sar513p v i o a m p 2 b m 8 1 0 0 4 m u v a m p 1 v d d 1 p g s d a s c l a 0 a v i n h v l d o h v c c v d d 2 v i n b 2 v i n b 1 v i n b 1 n . c . s w b 1 s w b 1 a m p g n d a m p 4 a m p 3 e n v d d 3 p g n d 3 s w b 3 n . c . v i n b 3 r e v g h m v g h d r v p s w o s w i s w s w p g n d p g n d v l c o m p a g n d c t r l v c o r e h a v d d v i n v i n v i n a v d d v g l s w b 1 a v d d s w v g h c 8 c 1 5 r 1 5 c 1 9 l 1 9 c 2 2 c 2 5 d f n 1 c f n 1 r f n 1 c f n 2 q n r q n r q p q p d f p 2 c 2 8 r 3 0 c 3 1 l 3 5 c 3 5 l 3 9 c 3 9 c 3 l 3 s w d f p 1 c f p 3 c f p 4 c f p 1 r f p 1 r f p 2 c f p 2 v c o m i n n p g n d 2 s w b 2 d r v n v g l p g a t e a v d d s c 1 6 d 4 5 c 5 2 c 5 1 c 5 4 c 5 3 c 9 c 1 1 c 1 0 a v d d c 4 1 c 4 0 c 3 9 _ 0 r 3 9 _ 1 r 3 9 _ 2
26 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 protection function explanation of each block 1. buck converter block 1 (vio) 1 - 1. over voltage protection (ovp) ovp function is incorporated to prevent ic or other components from malfunctioning due to rising vio voltage. voltage inputted to vdd1 pin is monitored and if vio voltage reaches vio>110% (t yp ), it is considered as unusual condition thus, ovp function is operated. if ovp is detected, switching is stopped until ovp release voltage (100%, t yp) falls to vio voltage. after ovp is released, switching is re - started. 1 - 2. over current protection (ocp) if excessive load current (swb1 peak current>3.5a, t yp) is present, it limits current to flow to built C C
27 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 4. boost converter block (avdd) 4 - 1. over voltage protection (ovp) ovp function is built in to prevent ic or other components from malfunction ing du e to excessive rise in avdd voltage. t he voltage inputted to swo pin is being monitored . if the swo pin voltage becomes 19.5v ( t yp), ovp is detected. once ovp is detected, switching is stopped. after avdd voltage falls below ovp detection release voltage 18v ( t yp), switching is restarted. 4 - 2. over current protection (ocp) if excessive load current over 5a ( t yp) of sw peak current is present, ocp limits current to rush to built - in power mos by controlling its output switching. 4 - 3. under voltage protec tion (uvp) timer - latch type output uvp function is built in. when an unusual condition is detected (avdd<80%) , uvp time r starts . if the unusual condition continues upto 1 0ms ec (typ), all output is latched in shutdown condition . power reset is needed to rem ove the latch state and to re - start. 4 - 4. load switch over current protection (lsw_ocp) if excessive load current (7a, t yp) is present, it controls current of load switch. 5. buck converter block 3 (havdd) 5 - 1. over voltage protection (ovp) ovp function i s incorporated for preventing ic or other components from malfunctioning due to rising havdd voltage. voltage inputted to vdd3 pin is being monitored and if havdd voltage reaches havdd>110% (t yp ), it is considered as unusual condition thus, ovp function i s operated. if ovp is detected, switching is stopped until ovp release voltage (100%, t yp) falls to havdd voltage. after ovp release, switching is re - started. 5 - 2. over current protection (ocp) if excessive load current is demanded (swb3 peak current>1.5a, t yp ) , it limits current to flow to built C
28 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 8. general 8 - 1. thermal shutdown all outputs will shut down when the ic temperature exceeds 175 ( t yp). after the temperature falls below 150 ( t yp), the operation re - starts . 8 - 2. vin under voltage lock out vin under voltage lock out prevents the circuit malfunction below the uvlo voltage. if vin voltage is below the uvlo voltage ( 8.3v / 7.55v ) , it enters the standby state .
29 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 protection function list block protective function working condition action protective removal buck converter 1 ovp vio>110% stops switching. vio<100% ocp i_swb1>3.5a control switching pulse duty to not over current limit . i_swb1<3.5a uvp vio<80% frequency becomes 1/4 vio>80% ic shutdown if uvp status maintains du ring 10m sec . ic restart buck converter 2 ovp vcore>110% stops switching. vcore<100% ocp i_swb2>3.0a control switching pulse duty to not over current limit . i_swb2<3.0a uvp vcore<80% frequency becomes 1/4 vcore>80% ic shutdown if uvp status maintai ns during 10m sec . ic restart vgl regulator ocp i_drvn>5ma l imit drvn current. i_drvn<5ma uvp vgl<80% ic shutdown if uvp status maintains during 1 0msec . ic restart boost converter ovp avdd>19.5v stops switching avdd<18v ocp i_sw>5a control switching p ulse duty to not over current limit . i_sw<5a uvp avdd<80% ic shutdown if uvp status maintains during 1 0msec . ic restart load sw ocp i_swo>7.0a control switching pulse duty to not over current limit . ic restart buck converter 3 ovp havdd>110% stops swit ching. havdd<100% ocp i_swb3>1.5a control switching pulse duty to not over current limit . i_swb3<1.5a uvp havdd<80% frequency becomes 1/4 havdd>80% ic shutdown if uvp status maintains during 10m sec . ic restart high voltage ldo ocp i_hvldo>100ma l i mit hvldo current. i_hvldo<100ma uvp hvldo<80% ic shutdown if uvp status maintains during 1 0msec . ic restart vgh regulator ovp vgh>45v drvp current limit to 0ma vgh<42v ocp i_drvp>5 ma l imit drvp current. i_drvp<5ma uvp vgh<80% ic shutdown if uvp st atus maintains during 1 0msec . ic restart general tsd tj>175 ic shutdown tj<150 uvlo vin<7.55v ic shutdown vin>8.3v
30 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 serial transmission use i 2 c bus control for command interface with host. writing or reading by specifying 1 byte register address besides slave address. i 2 c bus slave mode format is show n below. s tart : start condition slave address : send 7 bit data in all with bit of read mode (h) or write mode (l) . ( msb first ) a0 are select able (1/0) with the slave address select pin. a ck : acknowledge sending or receiving data includes ack nowledge bit per byte. if the data is sent and received properly, s c l s d a _ i n d e v i c e _ o u t s t a r t s l a v e a d d r e s s w r i t e a c k n r e s i s t e r a d d r e s s a c k n a 6 a 5 a 4 a 3 a 2 a 1 a 0 r / w a c k n r 7 r 6 r 5 r 4 r 3 r 2 r 1 r 0 a c k n d a t a a c k n a c k n s t o p a 6 a 5 a 4 a 3 a 2 a 1 a 0 r / w a c k n r 7 r 6 r 5 r 4 r 3 r 2 r 1 r 0 a c k n d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 a c k n d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 a c k n r/w a a a 0 1 0 0 0 0 a0 0 0 0 0 r/w a a a 0 1 0 0 0 0 a0 1 0 0 0 select register address (8bit) register address data register address data select register address (8bit) stop stop 8bit data 8bit data write operation read operation start start slave address slave address a 5 scl sda _ in device _ out start slave address write ackn resister address ( ex . 01 h ) ackn a 6 a 4 a 3 a 2 a 1 a 0 r / w ackn r 7 r 6 r 5 r 4 r 3 r 2 r 1 r 0 ackn d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 ackn data ( to resister 01 h ) ackn data ( to resister 02 h ) ackn a 6 a 5 a 4 a 3 a 2 a 1 a 0 r / w ackn r 7 r 6 r 5 r 4 r 3 r 2 r 1 r 0 ackn d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 ackn ??? ??? ??? d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 ackn dac ( 3 ) msbyte . d 15 - d 10 have no meaning ackn dac ( 3 ) lsbyte . ackn d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 ackn stop ??? ??? ??? d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 ackn d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 ackn data ( to resister 06 h ) data ( to resister 05 h ) d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 ackn d 7 d 6 d 5 d 4 d 3 d 2 d 1 d 0 ackn
31 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 i2ctiming diagram figure 50 . i2c timing diagram timing standard values parameter symbol norma l mode fast mode unit min typ max min typ max scl frequency >d scl - - 100 - - 400 khz scl high time thigh 4.0 - - 0.6 - - us scl low time tlow 4.7 - - 1.2 - - us rise time tr - - 1.0 - - 0.3 us fall time tf - - 0.3 - - 0.3 us start condition hold time thd >9 sta 4.0 - - 0.6 - - us start condition setup time tsu >9 sta 4.7 - - 0.6 - - us sda hold time thd >9 dat 200 - - 100 - - ns sda setu p time tsu >9 dat 200 - - 100 - - ns acknowledge delay time tpd - - 0.9 - - 0.9 us acknowledge hold time tdh - 0.1 - - 0.1 - us stop condition setup time tsu >9 sto 4.7 - - 0.6 - - us bus release time tbuf 4.7 - - 1.2 - - us noise spike width tl - 0.1 - - 0 .1 - us tbuf thd : sta tsu ; dat tr tlow thigh thd ; dat tdh tpd tf scl sda ( in ) sda ( out ) tsu ; sta thd ; sta tl tsu ; sto scl sda s p s start bit p stop bit 7 0 % 3 0 % 7 0 % 7 0 % 3 0 % 7 0 % 3 0 % 7 0 % 3 0 %
32 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 command i nterface eeprom t ransmission format for data sent and received is shown below. i2c write format it can enter further register from 3 byte by entering data continuou sly. data after 0dh is invalid. i nputted data reflect to the reg ister at the ack output timing. i2c read format 1. read data from dac register eeprom write f ormat eeprom (dac register) t ransmission format for w rite is shown below. eeprom write format d 6 to d0 : don c t care automatic eeprom read f unction at s tart - up upon b m81110 m uw start - up, a reset signal is generated and each r egister is initialized . after vl activation is finish ed , data which is stored in the eeprom is copied to the r egister s . the automatic eeprom read function at start - up is furthe r explained by the flow chart below. figure 51 . automatic eeprom read f unction at s tart - up r/w a a a 0 1 0 0 0 0 a0 0 0 1 1 1 1 1 1 1 1 0 1 x x x x x x x 0 start slave address register address data stop vl active eeprom read transfer data register start operation r/w a a a 0 1 0 0 0 0 a0 0 0 0 0 data stop 00h to 0ch n-bytes data start slave address register address r/w a a 0 1 0 0 0 0 a0 0 0 0 r/w a a 0 1 0 0 0 0 a0 1 0 0 data stop 00h to 0ch n-bytes data start slave address register address repeated start slave address
33 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 content of eeprom setting register address bits function default(*1) resolution 00h 6 channel disable register 00h - 01h 6 avdd output voltage setting[5:0] 15.6v [27h] 0.1v [11.7v to 18.0v] 02h 3 avdd o cp offset setting[2:0] 1.6a [04h] 0.4a [0a to 2.8a ] 03h 1 avdd soft start time setting [0] 10msec [00h] 10msec [10msec or 20msec] 04h 4 vio output voltage setting[3:0] 3.3v [0bh] 0.1v [2.2v to 3.7v] 05h 6 havdd output voltage setting[5:0] 7.8v [1eh] 0.1v [4.8v to 11.1 v] 06h 5 vgh output voltage setting[4:0] 35v [14h] 0.5v [25v to 40.5 v] 07h 2 gpm clamp voltage setting[1:0] 20v [01h] 5v [15v to 30 v] 08h 5 vgl output voltage setting[4:0] - 6.0v [0ah] 0.2v [ - 10.2v to - 4.0v] 09h 6 hvldo output voltage sett ing [5:0] 15.2v [23h] 0.1v [11.7v to 18.0v] 0ah 8 vcom output voltage setting[7:0] 6.103v[c5h] hvldox0.18/256 [hvldox0.36 to hvldox0.54] 0bh[7:6], 0ch 10 amp1 output voltage setting[9:0] 7.808v[1f2h] hvldo/1024[0v to hvldo] 0bh[5:4], 0dh 10 amp2 output v oltage setting[9:0] 7.808v[1f2h] hvldo/1024[0v to hvldo] 0bh[3:2], 0eh 10 amp3 output voltage setting[9:0] 7.808v[1f2h] hvldo/1024[0v to hvldo] 0bh[1:0], 0fh 10 amp4 output voltage setting[9:0] 7.808v[1f2h] hvldo/1024[0v to hvldo] ffh 8 control register [7:0] *1 factory value. *2 value of default voltage setting. the soft start time of each output changes depending on a set ting voltage . channel disable register register address = 00h [7] [6] [5] [4] [3] [2] [1] [0] - - vcore havdd vgh vgl gpm av dd_ext 0 >8 enable 1 >8 disable avdd_ext 1 >8 avdd external mode control register register address data [bin ] function ffh 1xxx_xxxx write to eeprom from dac register data. x >8 dont care bit
34 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 command table 1 01 02 03 04 05 06 07 08 09 [5:0] [2:0] [0] [3:0] [5:0] [4:0] [1:0] [4:0] [5:0] data (hex) avdd [v] avdd ocp offset [a] avdd soft start [msec] vio [v] havdd [v] vgh [v] gpm clamp [v] vgl [v] hvldo [v] 00 11.7 0.0 10 2.2 4.8 25.0 15 -4.0 11.7 01 11.8 0.4 20 2.3 4.9 25.5 20 -4.2 11.8 02 11.9 0.8 2.4 5.0 26.0 25 -4.4 11.9 03 12.0 1.2 2.5 5.1 26.5 30 -4.6 12.0 04 12.1 1.6 2.6 5.2 27.0 -4.8 12.1 05 12.2 2.0 2.7 5.3 27.5 -5.0 12.2 06 12.3 2.4 2.8 5.4 28.0 -5.2 12.3 07 12.4 2.8 2.9 5.5 28.5 -5.4 12.4 08 12.5 3.0 5.6 29.0 -5.6 12.5 09 12.6 3.1 5.7 29.5 -5.8 12.6 0a 12.7 3.2 5.8 30.0 -6.0 12.7 0b 12.8 3.3 5.9 30.5 -6.2 12.8 0c 12.9 3.4 6.0 31.0 -6.4 12.9 0d 13.0 3.5 6.1 31.5 -6.6 13.0 0e 13.1 3.6 6.2 32.0 -6.8 13.1 0f 13.2 3.7 6.3 32.5 -7.0 13.2 10 13.3 6.4 33.0 -7.2 13.3 11 13.4 6.5 33.5 -7.4 13.4 12 13.5 6.6 34.0 -7.6 13.5 13 13.6 6.7 34.5 -7.8 13.6 14 13.7 6.8 35.0 -8.0 13.7 15 13.8 6.9 35.5 -8.2 13.8 16 13.9 7.0 36.0 -8.4 13.9 17 14.0 7.1 36.5 -8.6 14.0 18 14.1 7.2 37.0 -8.8 14.1 19 14.2 7.3 37.5 -9.0 14.2 1a 14.3 7.4 38.0 -9.2 14.3 1b 14.4 7.5 38.5 -9.4 14.4 1c 14.5 7.6 39.0 -9.6 14.5 1d 14.6 7.7 39.5 -9.8 14.6 1e 14.7 7.8 40.0 -10.0 14.7 1f 14.8 7.9 40.5 -10.2 14.8 20 14.9 8.0 14.9 21 15.0 8.1 15.0 22 15.1 8.2 15.1 23 15.2 8.3 15.2 24 15.3 8.4 15.3 25 15.4 8.5 15.4 26 15.5 8.6 15.5 27 15.6 8.7 15.6 28 15.7 8.8 15.7 29 15.8 8.9 15.8 2a 15.9 9.0 15.9 2b 16.0 9.1 16.0 2c 16.1 9.2 16.1 2d 16.2 9.3 16.2 2e 16.3 9.4 16.3 2f 16.4 9.5 16.4 30 16.5 9.6 16.5 31 16.6 9.7 16.6 32 16.7 9.8 16.7 33 16.8 9.9 16.8 34 16.9 10.0 16.9 35 17.0 10.1 17.0 36 17.1 10.2 17.1 37 17.2 10.3 17.2 38 17.3 10.4 17.3 39 17.4 10.5 17.4 3a 17.5 10.6 17.5 3b 17.6 10.7 17.6 3c 17.7 10.8 17.7 3d 17.8 10.9 17.8 3e 17.9 11.0 17.9 3f 18.0 11.1 18.0 : default value register address
35 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 command table 2 in ca se of hvldo=15.2[v] register address 0a 0b[7:6], 0c 0b[5:4], 0d 0b[3:2], 0e 0b[1:0], 0f [7:0] [9:0] [9:0] [9:0] [9:0] data (hex) vcom [v] data (hex) amp1 [v] amp2 [v] amp3 [v] amp4 [v] 00 hvldox0.18x(3 - 0/256) 000 hvldox(1 - 0/1024) hvldox(1 - 0/1024) hvldox(1 - 0/1024) hvldox(1 - 0/1024) 01 hvldox0.18x(3 - 1/256) 001 hvldox(1 - 1/1024) hvldox(1 - 1/1024) hvldox(1 - 1/1024) hvldox(1 - 1/1024) 02 hvldox0.18x(3 - 2/256) 002 hvldox(1 - 2/1024) hvldox(1 - 2/1024) hvldox(1 - 2/1024) hvldox(1 - 2/1024) fd hvldox0.18x(3 - 253/256) 3fd hvldox(1 - 1021/1024) hvldox(1 - 1021/1024) hvldox(1 - 1021/1024) hvldox(1 - 1021/1024) fe hvldox0.18x(3 - 254/256) 3fe hvldox(1 - 1022/1024) hvldox(1 - 1022/1024) hvldox(1 - 1022/1024) hvldox(1 - 1022/1024) ff hvldox0.18x(3 - 255/256) 3ff hvldox(1 - 1023/1024) hvldox(1 - 1023/1024) hvldox(1 - 1023/1024) hvldox(1 - 1023/1024) register address register address 0a 0b[7:6], 0c 0b[5:4], 0d 0b[3:2], 0e 0b[1:0], 0f [7:0] [9:0] [9:0] [9:0] [9:0] data (hex) vcom [v] data (hex) amp1 [v] amp2 [v] amp3 [v] amp4 [v] 00 8.208 000 15.200 15.200 15.200 15.200 01 8.197 001 15.185 15.185 15.185 15.185 02 8.187 002 15.170 15.170 15.170 15.170 c5 6.103 1f2 7.808 7.808 7.808 7.808 fd 5.504 3fd 0.045 0.045 0.045 0.045 fe 5.493 3fe 0.030 0.030 0.030 0.030 ff 5.483 3ff 0.015 0.015 0.015 0.015 step
36 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 selecting application components 1. buck converter 1 - 1. selecting the o utput lc c onstant figure 52 . inductor current waveform (buck converter). the output inductance (l) is decided by the rated c urrent (i lr ) and maximum input current (i omax ) of the inductance. adjust so that i omax + i i set with sufficient margin because the inductan ce value may have a dispersion of 30%. if the coil current exceeds the rated current ( i lr ) , the ic may be damaged. 1 - 2. selecting the input/ o utput capacitor the output capacitor (c o ) smoothens the ripple voltage at the output. select a capacitor that wi ll regulate the output ripple voltage within the specifications. output ripple voltage can be obtained by the following equation. vpp = i i however, since the aforementioned co nditions are based on a lot of factors, verify the results using the actual product. since the peak current flows between the input and output at the dc/dc converter, a capacitor is required to install at the input side. for the reason, the low esr capac itor is recommended as an input capacitor which has the value more than 10f and less than 100m esr. if an out of range capacitor is selected, the excessive ripple voltage is superimposed on however these conditions may vary according to the load current, input voltage, output voltage, inductance and switching frequency. be sure to perform margin check using the actual product. il t ilr i omax mean current i omax + should not exceed the rated value level . S
37 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 1 - 3. selecting the o utput rectifier diode a schottky bar rier is recommended as rectifier diode to be used at the output stage of the dc/dc converter. select carefully in consideration of the maximum inductor current, maximum output voltage and power supply voltage. maximum inductor current i o max >) figure 53 . inductor current waveform (boost converter). the output inductance (l) is decided by the rated current (i lr ) and maximum input current (i inmax ) of the inductance. adjust so that i in max + i i 2 - 2. selecting the o utput capacitor the output capacitor (c o ) smoothens the ripple voltage at the output. select a capacitor that will regulate the output ripple voltage within the specificatio ns. output ripple voltage can be obtained by the following equation. v ? ? ? ? i however, since the aforementioned conditions are based on a lot of factors, verify the results using the actual product. since the peak current flows between the input and output at the dc/dc converter, a capacitor is required to install at the input side. for the reason, the low esr capacitor is recommended as an i nput capacitor which has the value more than 10f and less than 100m esr. if an out of range capacitor is selected, the excessive ripple voltage is superimposed on however these conditions may vary according to the load current, input voltage, output voltage, inductance and switching frequency. be sure to perform the margin check using the actual product. il t ilr i omax mean current i omax + should not exceed the rated value level . S f vo vin vo vin l i l 1 1 ? ? ? ?
38 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 2 - 3. setting phase compensation phase setting procedure. stable negative feedback co ndition is achieved as follows : ? ? ? - + a r 3 c 1 r 1 r 2 c o m p r c p c c p v o v o a c o m p r 1 r 2 r 3 c 1 r c p c c p a f p h a s e m a r g i n 0 - 9 0 - 1 8 0 0 - 2 0 d b / d e c a d e f - 9 0 - 1 8 0 p h a s e [ d e g ] g a i n [ d b ] ( a ) g b w ( b )
39 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 3. positive charge pump : vgh 3 - 1. selecting the o utput rectifier diode select carefully in consideration of the maximum load current, maximum output voltage and power supply voltage. maximum output cur rent i o max >: diode maximum absolute c urrent maximum output voltage avdd >: diode maximum absolute v oltage provide sufficient design margins for a tolerance of 30%~40 for each parameter. 3 - 2. selecting the o utput pnp transistor sel ect carefully in consideration of the maximum load current, maximum output voltage and power supply voltage. boost converter duty d = avdd >+ vin avdd maximum output current i o max d >: transistor maximum absolute current powe r supply voltage avdd x 2 >: transistor maximum absolute voltage dc gain iomax / ibase >: transistor hfe power dissipation (doubler mode) ( 2 x avdd C C C C
40 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 4. negative charge pump : vgl 4 - 1. selecting the o utput rectifier diode select carefully in consideration of the maximum load current, maximum output voltage and power s upply voltage. maximum output current i o max >: diode maximum absolute c urrent maximum switching voltage vin >: diode maximum absolute v oltage provide sufficient design margins for a tolerance of 30%~40 for each parameter. 4 - 2. selecting t he o utput npn transistor select carefully in consideration of the maximum load current, maximum output voltage and power supply voltage. converter duty d = vin >+ vio vin maximum output current i o max d >: transistor maximum absolute current power supply voltage vin >: transistor maximum absolute voltage dc gain iomax / ibase >: transistor hfe power dissipation (doubler mode) ( vin - ? vgl ? C base - emitter resistor used to ensure proper operation. 4 - 4. selecting the flying capacitor and the switch node resistor a 0.1uf t o 0.47uf flying capacitor and 1
41 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 l ayout g uideline dc/dc converter switching line must be as short and thick as possible to reduce line impedance . if the wiring is long, ringing caused by switching would increase and this may exceed the absolute maximum voltage ratings . if the parts are located far apart, consider inserting a snubber circuit . the thermal pad on the back side of ic has the great ther mal conduction to the chip. so using the gnd plain as broad and wide as possible can help thermal dissipation. and a lot of thermal via for helping the spread of heat to the different layer is also effective. when there is unused area on pcb, please arrang e the copper foil plain of dc nodes, such as gnd, vin and vout for helping heat dissipation of ic or circumference parts. power dissipation vqfn48 v707 0a package on 4 - layer 114.3mm ? 74.2mm ? 1.6mm glass epoxy pcb ( 1 ) 2 - layer board (backside copper foil area 74.2 mm ? 74.2 mm) (2 ) 4 - layer board ( the 2nd, 3rd layers and b ackside copper foil area 74.2 mm ? 74.2 mm) 0 1 2 3 4 5 6 0 25 50 75 100 125 150 ambient temperature : ta [
42 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 i/o equivalence circuit 1, 2, 47, 48. amp1~4 3. vdd1 4.pg 5.sda 6.scl 7.a0 8. avin 9.hvldo 10. hvcc 11.vcom 12. inn 13. ctrl v d d 1 v i n b 1 i n t e r n a l r e g . s d a i n t e r n a l r e g . s c l i n t e r n a l r e g . c t r l i n t e r n a l r e g . a 0 a v i n h v c c v c o m i n n h v c c h v c c a m p x h v c c p g h v c c h v l d o h v c c a v i n
43 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 i/o e quivalence c ircuit - continued 15.comp 16.vl 19, 20.sw 21.swi 22.swo 23.avdds 24.pgate 25.vgl 26.drvn 27.drvp 28.vgh 29.vghm d r v p v l v l d r v n s w i p g a t e s w i a v d d s s w o s w o s w o s w i s w i n t e r n a l r e g . c o m p v g l v l i n t e r n a l r e g . v g h v g h v g h v g h v g h m r e a v i n v l
44 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 i/o e quivalence c ircuit - continued 30.re 31.vinb3 33. swb3 35. vdd3 36. en 38. swb2 39. vdd2 40. vinb2 41, 42.vinb1 44, 45. swb1 ? ? ? ? v g h v g h v g h v g h m r e v d d 3 v i n b 3 v i n b 3 s w b 3 s w b 2 v i n b 1 s w b 1 v i n b 2 v d d 2 i n t e r n a l r e g . v i n b 1 v i n b 2 v i n b 3
45 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 operational no tes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic o stress. always discharge capacitors completely after each process or step. the ics power supply
46 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 operational notes C be within the ics p n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
47 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 ordering informatio n b m 8 1 0 0 4 m u v ze2 part number package muv : vqfn48v7070a packaging and forming specification z e2: embossed tape and reel marking diagram vqfn48v7070a (top view) 8 1 0 0 4 part number marking lot number 1pin mark
48 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 physical dimension tape and reel information package name vqfn48v7070a ze2
49 / 49 b m81004muv tsz02201 - 0313aaf00420 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 4.dec.2014 rev.002 www.rohm.com tsz22111 15 001 revision history date revision contents 2014. 09.16 001 new release 2014.12.04 002 page 8/4 9 tsd: min, max added p age 9/49 vovp_vio, vovp_vcore and vovp_havdd : min, max added
notice - ge rev.00 3 ? 20 13 rohm c o., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car a ccessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical e quipment c lassifica tion of the s pecific applications japan usa eu china class 2 . rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3 . our p roducts are de signed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arisi ng from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electr icity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning res idue of flux (even if you use no - clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew cond ensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short pe riod of time, such as pulse . is applied, confirmation of performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may neg atively affect product performance and reliability. 7 . de - rate power dissipation (pd) depending on ambient temperature (ta). when used in sealed area, confirm the actual ambient temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under deviant condition from what is defined in this document . precaution for mounting / circuit board design 1 . when a highly activ e halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2 . in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be us ed on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the rohm representative in advance. for details , please refer to rohm mounting specification
notice - ge rev.00 3 ? 20 13 rohm c o., ltd. all rights reserved. precautions regarding application examples and external circuits 1 . if change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2 . you agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for products use . therefore, in case you use such information, you are solel y responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction preve ntion and temperature / humidity control). precaution for storage / transportation 1 . product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases , including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2 . even under rohm recommended sto rage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3 . store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4 . use p roducts within the specified time after opening a humidity barrie r bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel qr code printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when d isposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since our products might fall under controlled goods prescribed by the applicable f oreign exchange and f oreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1 . all i nformation and data including but not limited to application example contained in this document is for reference only. rohm do es not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intel lectual property rights or other damages arising from use of such information or data. : 2 . no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the informat ion contained in this document. other precaution 1 . this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise chang ed without prior written consent of rohm. 3 . i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the develop ment of mass - destruction weapons . 4 . the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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