2DB1697 document number: ds31618 rev. 3 - 2 1 of 5 www.diodes.com april 2012 ? diodes incorporated 2DB1697 new product 12v low v ce(sat) pnp surface mount transistor features ? epitaxial planar die construction ? ideally suited for automated assembly processes ? ideal for medium power switching or amplification applications ? complementary npn type available (2dd2661) ? totally lead-free & fully rohs compliant (note 1) ? halogen and antimony free. ?green? device (note 2) mechanical data ? case: sot89 ? case material: molded plasti c, "green? molding compound. ul flammability classification rating 94v-0 ? moisture sensitivity: level 1 per j-std-020d ? terminals: finish ? matte tin annealed over copper leadframe (lead free plating). solderable per mil-std-202, method 208 ? weight: 0.052 grams (approximate) ordering information (note 3) part number marking reel size (inches) tape width (mm) quantity per reel 2DB1697-13 1697 13 12 2500 notes: 1. no purposely added lead. fully eu directiv e 2002/95/ec (rohs) & 2011/6 5/eu (rohs 2) compliant. 2. halogen and antimony free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm to tal br + cl) and <1000ppm antimony compounds. 3. for packaging details, go to our website at http://www.diodes.com. marking information top view device schematic top view pin out configuration 1697 = product type marking code yww = date code marking y = last digit of year (ex: 8 = 2008) ww = week code (01 ? 53) 1697 yww sot89 4 3 2 1 c c b e collector emitte r base 2, 4 3 1
2DB1697 document number: ds31618 rev. 3 - 2 2 of 5 www.diodes.com april 2012 ? diodes incorporated 2DB1697 new product maximum ratings @t a = 25c unless otherwise specified characteristic symbol value unit collector-base voltage v cbo -15 v collector-emitter voltage v ceo -12 v emitter-base voltage v ebo -6 v peak pulse current i cm -4 a continuous collector current i c -2 a thermal characteristics @t a = 25c unless otherwise specified characteristic symbol value unit power dissipation (note 4) p d 0.9 w thermal resistance, junction to ambient air (note 4) r ja 139 c/w power dissipation (note 5) p d 2 w thermal resistance, junction to ambient air (note 5) r ja 62.5 c/w operating and storage temperature range t j , t stg -55 to +150 c electrical characteristics @t a = 25c unless otherwise specified characteristic symbol min typ max unit conditions off characteristics collector-base breakdown voltage v ( br ) cbo -15 ? ? v i c = -100 a, i e = 0 collector-emitter breakdown voltage (note 6) v ( br ) ceo -12 ? ? v i c = -10ma, i b = 0 emitter-base breakdown voltage v ( br ) ebo -6 ? ? v i e = -100 a, i c = 0 collector cut-off current i cbo ? ? -0.1 a v cb = -15v, i e = 0 emitter cut-off current i ebo ? ? -0.1 a v eb = -6v, i c = 0 on characteristics (note 6) collector-emitter saturation voltage v ce ( sat ) ? -65 -180 mv i c = -1a, i b = -50ma dc current gain h fe 270 ? 680 ? v ce = -2v, i c = -200ma small signal characteristics output capacitance c obo ? 40 ? pf v cb = -10v, i e = 0, f = 1mhz current gain-bandwidth product f t ? 140 ? mhz v ce = -2v, i c = -100ma, f = 100mhz notes: 4. device mounted on fr-4 pcb with minimum recommended pad layout. 5. device mounted on fr-4 pcb with 1 inch 2 copper pad layout. 6. measured under pulsed conditions. pulse width = 300 s. duty cycle 2%.
2DB1697 document number: ds31618 rev. 3 - 2 3 of 5 www.diodes.com april 2012 ? diodes incorporated 2DB1697 new product 0 0 p , power dissipation (w) d t , ambient temperature ( c) a note 4 fig. 1 power dissipation vs. ambient temperature 0.4 0.8 1.2 1.6 2.0 25 50 75 100 125 150 note 5 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 01 2 3 4 -v , collector-emitter voltage (v) ce fig. 2 typical collector current vs. collector-emitter voltage -i , c o lle c t o r c u r r en t (a) c i = -1ma b i = -2ma b i = -3ma b i = -4ma b i = -5ma b 1 10 100 1,000 10,000 -i , collector current (ma) c fig. 3 typical dc current gain vs. collector current 100 10,000 h, d c c u r r e n t g ai n fe 1,000 t = 150c a t = 25c a t = -55c a t = 85c a v = -4v ce 1 10 100 1,000 10,000 -i , collector current (ma) c fig. 4 typical collector-emitter saturation voltage vs. collector current 0.001 0.01 0.1 1 -v , c o lle c t o r -emi t t e r saturation ce(sat) voltage (v) i/i = 20 cb t = 85c a t = 25c a t = -55c a t = 150c a 1 10 100 1,000 10,000 -i , collector current (ma) c fig. 5 typical base-emitter turn-on voltage vs. collector current 0 0.2 0.4 0.6 0.8 1.0 1. 2 -v , base-emi t t e r t u r n- o n v o l t a g e (v) be(on) t = 150c a t = 25c a t = -55c a t = 85c a v = -4v ce 1 10 100 1,000 10,000 -i , collector current (ma) c fig. 6 typical base-emitter saturation voltage vs. collector current 0.2 0.4 0.6 0.8 1.0 1. 2 -v , base-emi t t e r sa t u r a t i o n v o l t a g e (v) be(sat) 0 t = 150c a t = 25c a t = -55c a t = 85c a i = 20 cb /i
2DB1697 document number: ds31618 rev. 3 - 2 4 of 5 www.diodes.com april 2012 ? diodes incorporated 2DB1697 new product 0.1 1 10 100 v , reverse voltage (v) r fig. 7 typical capacitance characteristics 10 100 1,000 c a p a c i t an c e (p f ) c ibo c obo f = 1mhz v = -2v f = 100mhz ce 0 102030405060708090100 -i , collector current (ma) c fig. 8 typical gain-bandwidth product vs. collector current 1 10 100 1,000 f, g ai n -ba n dwid t h p r o d u c t (m h z) t v = -2v f = 100mhz ce package outline dimensions suggested pad layout sot89 dim min max a 1.40 1.60 b 0.44 0.62 b1 0.35 0.54 c 0.35 0.43 d 4.40 4.60 d1 1.52 1.83 e 2.29 2.60 e 1.50 typ e1 3.00 typ h 3.94 4.25 l 0.89 1.20 all dimensions in mm dimensions value (in mm) x 0.900 x1 1.733 x2 0.416 y 1.300 y1 4.600 y2 1.475 y3 0.950 y4 1.125 c 1.500 e d h l a c e 8 ( 4 x ) b1 b d1 r 0 . 2 0 0 e1 y1 x1 y2 y c x (3x) y3 y4 x2 (2x)
2DB1697 document number: ds31618 rev. 3 - 2 5 of 5 www.diodes.com april 2012 ? diodes incorporated 2DB1697 new product important notice diodes incorporated makes no warranty of any kind, expr ess or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries reserve the right to ma ke modifications, enhancements, improvements, corrections or ot her changes without further notice to this document and any product described herein. diodes incorporated does not assume any liabi lity arising out of the application or use of this document or an y product described herein; neither does diodes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or user of this document or products described he rein in such applications shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated w ebsite, harmless against all damages. diodes incorporated does not warrant or accept any liability what soever in respect of any pr oducts purchased through unauthoriz ed sales channel. should customers purchase or use diodes incorporated pr oducts for any unintended or unauthorized application, customer s shall indemnify and hold diodes incorporated and its representatives harmless against all claims, damages , expenses, and attorney fee s arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized applicati on. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or mo re united states, international or foreign trademarks. life support diodes incorporated products are specifica lly not authorized for use as critical components in life support devices or systems without the express written approval of the chief executive officer of diodes incorporated. as used herein: a. life support devices or system s are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to resu lt in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsi ble for all legal, regulatory and safety-related requirements c oncerning their products and any use of diodes incor porated products in such safety-critical, life support devices or systems, notwithsta nding any devices- or systems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporated and its representatives against any damages aris ing out of the use of diodes incorporated products in such safety- critical, life support devices or systems. copyright ? 2012, diodes incorporated www.diodes.com
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