1. 2. 3. material content data sheet sales product name tle6208-3g issued 28. august 2013 ma# MA000982028 package pg-dso-14-35 weight* 144.83 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 8.287 5.72 5.72 57219 57219 leadframe inorganic material phosphorus 7723-14-0 0.015 0.01 104 non noble metal zinc 7440-66-6 0.060 0.04 417 non noble metal iron 7439-89-6 1.207 0.83 8333 non noble metal copper 7440-50-8 49.007 33.84 34.72 338365 347219 wire noble metal gold 7440-57-5 0.814 0.56 0.56 5618 5618 encapsulation organic material carbon black 1333-86-4 0.161 0.11 1112 plastics epoxy resin - 7.411 5.12 51169 inorganic material silicondioxide 60676-86-0 72.982 50.39 55.62 503900 556181 leadfinish non noble metal tin 7440-31-5 1.226 0.85 0.85 8466 8466 plating noble metal silver 7440-22-4 1.030 0.71 0.71 7110 7110 glue plastics acrylic resin - 0.580 0.40 4001 noble metal silver 7440-22-4 2.055 1.42 1.82 14186 18187 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
