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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays 1/ 20 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 output coupling capacitor-less line amplifier BD8876FV, bd8878fv description BD8876FV, bd8878fv are output coupling capacitor-less line amplifiers. these ic have a negative voltage generator built-in and generate the negative voltage from the supply voltage. it is possible to drive in a ground reference with both voltage of the supply voltage and the negative voltage. therefore , these line amplifiers have wide output range, and they can output 2v rms(5.65v p-p ) with the single-supply 5v. features ? possible to output 2vrms with single-supply 5v ? output coupling capacitor-less ? variable gain +6db / +9db typ. [BD8876FV] ? fixed gain +6.7db typ. [bd8878fv] ? integrated negative power supply ? ground-referenced outputs ? integrated short-circuit and thermal protection applications video game console, projector, set top box, blu-ray player etc. typical application circuit figure 1 . typical application circuit key specifications ? power supply voltage: 3v to 5.5v ? thd+n: 0.003% (typ) (v cc =5 v, r l =10k , vo=2vrms, 20khz lpf) ? maximum output voltage: 2vrms (min) @v cc =5v ? output noise: 10 vrms (typ) ? circuit current (active): 3.2ma (typ) ? operating temperature range: - 40 c to +85c package w(typ) x d(typ) x h(max) ssop-b14 5.00mm x 6.40mm x 1.35 mm BD8876FV bd8878fv amplifier type inverting amplifi er non-inverting amplifier gain +6 .0 db / +9 .0 db (changed by gain pin) +6.7db package ssop-b14 ssop-b14 inl outl inr outr sdb gain (* 1) cp cn pvss svdd pvdd vdd vdd (*1) gain pin : BD8876FV downloaded from: http:///
2/ 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 pin configurations outl svdd sgnd sdb gain pvdd outr inr svsspvss cn pgnd cp bd 8876 fv inl 1 2 13 12 11 10 9 8 7 6 5 4 3 14 outl svdd sgnd sdb nc pvdd outr inr svsspvss cn pgnd cp bd 8878 fv inl 1 2 13 12 11 10 9 8 7 6 5 4 3 14 figure 2. pin configurations pin description/function equivalence circuit pin no. pin name function eq uivalence circuit 1 outl line amplifier (lch) output d 2 inl line amplifier (lch) input c1 (BD8876FV) c2 (bd8878fv) 3 svdd line amplifier supply voltage - 4 sgnd line amplifier g round - 5 sdb shutdown control (h: active, l: shutdown) e 6 gain (BD8876FV) gain control (h: 9 .0 db, l:6 .0 db) e nc (bd8878fv) no connection - 7 pvdd charge pump supply voltage - 8 cp flying capacitor positive terminal a 9 pgnd charge pump g round - 10 cn flying capacitor negative terminal b 11 pvss charge pump output voltage f 12 svss line amplifier negative supply input f 13 inr line amplifier (rch) input c1 (BD8876FV) c2 (bd8878fv) 14 outr line amplifier (rch) output d (top view) pgnd pvdd pad pvdd pgnd a pvss pgnd pad pgnd pvss b b a svss svdd pad c1 c1 svss svdd pad c2 c2 svss svdd pad d d sgnd svdd pad e e pgnd pad pgnd f f downloaded from: http:///
3/ 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 block diagra ms + - + - svdd charge pump outl svdd svss svss inl svdd svdd svss sgnd sdb gain pvdd outr inr svss pvss cn cp pgnd sgnd sgnd sgnd short circuit protection 15k/19.1k pvdd 1 23 4 56 7 8 9 10 11 12 13 14 uvlo / shutdown control svdd sgnd 15k/19.1k 42.3k/38.2k 42.3k/38.2k s v d d c h a r g e p u m p o u t l s v d d i n l s v d d s v d d s v s s s g n d s d b n c p v d d o u t r i n r s v s s p v s s c n c p p g n d s g n d s h o r t c i r c u i t p r o t e c t i o n p v d d 1 23 4 56 7 8 9 1 0 1 1 1 2 1 3 1 4 u v l o / s h u t d o w n c o n t r o l s v d d s g n d o p e n + - s v s s s g n d s g n d 1 5 k 1 5 k + - s v s s s g n d s g n d 6 . 8 k 2 2 . 5 k 2 2 . 5 k 6 . 8 k 1 5 k 1 5 k figure 3 . block diagra ms absolute maximum ratings (ta = 25c) parameter symbol rating unit svdd-pvdd voltage v dd 0 v sgnd-pgnd voltage v gg 0 v svss -pvss voltage v ss 0 v svdd, pvdd-sgnd or pgnd voltage v dg -0.3 6.0 v svss, pvss-sgnd or pgnd voltage v sg -6.0 0.3 v in_-sgnd voltage v in (svss -0.3) (svdd+0.3) v out_-sgnd voltage v out (svss -0.3) (svdd+0.3) v cp -pgnd voltage v cp (pgnd-0.3) (pvdd+0.3) v cn -pgnd voltage v cn (pvss -0.3) (pgnd+0.3) v sdb-sgnd voltage v sh (sgnd-0.3) (svdd+0.3) v gain-sgnd voltage v ga (sgnd-0.3) (svdd+0.3) v input current i in - 10 10 ma power dissipation (note 1) p d 0.87 w storage temperature range t stg - 55 +150 c (note 1) derate by 6.96mw/c when operating above 25c whe n mounted on 70mm x 70mm x 1.6mm, fr4.1-layer glass epoxy board. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. th erefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the abso lute maximum ratings. recommended operating conditions parameter symbol limit unit min typ max supply voltage range v svdd , v pvdd 3.0 - 5.5 v operating temperature range t opr - 40 - +85 c minimum load impedance z l 550 - - BD8876FV bd8878fv downloaded from: http:///
4/ 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 electrical characteristics (unless otherwise specified , ta=25c , svdd=pvdd=5v , sgnd=pgnd=0v , sdb=h, gain=l [BD8876FV] , c 1 =c 2 =1f , r l =10k , input coupling capacitor=1f) parameter symbol limit unit remarks BD8876FV bd8878 fv min typ m ax m in typ m ax circuit current circuit current (shutdown) i st - 0.1 2 - 0.1 2 a sdb=l circuit current (active) i dd - 3.2 8.2 - 3.2 10.5 ma sdb=h, no sign al , rl=no load sdb pin/gain pin h level input voltage v ih 0.7 x svdd - - 0.7 x svdd - - v l level input voltage v il - - 0.3 x svdd - - 0.3 x svdd v input leak current i leak - - 1 - - 1 a line amplifier start up time t son - 470 - - 470 - sec sdb=l h offset voltage v is - 0.5 5 - 1 10 mv maximum output voltage v out 2.5 3.5 - 2.05 3.0 - vrms f=1khz , thd+n Q -40db, 20khz lpf thd+n thd+n - 0.003 0.032 - 0.003 0.032 % f=1khz, vout=2vrms, 20khz lpf input impedance z in1 *1 12 19 26 20 30 40 k *1 gain=l (6db mode) *2 gain=h (9db mode) z in2 *2 10 15 20 gain a v1 *1 5.0 6.0 7.0 5.7 6.7 7.7 db *1 gain=l (6db mode) *2 gain=h (9db mode) a v2 *2 8.0 9.0 10.0 gain mismatch a v - 1 - - 1 - % output noise v n - 8 - - 10 - vrms 20khz lpf+a-weight filter, rg=0ohm slew rate sr - 3.0 - - 3.0 - v/ sec maximum capacitive load c l - - 250 - - 250 pf crosstalk ct - - 80 - - - 65 - db f=1khz, vout=200mv p-p , 1khz bpf power supply rejection ratio psrr - - 65 - - - 65 - db f=1khz, v ripple =100mv p-p , 1khz bpf charge-pump oscillator frequency f osc 150 300 450 150 300 450 khz downloaded from: http:///
5/ 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 (unless otherwise specified , ta=25c , svdd=pvdd=5v , sgnd=pgnd=0v , sdb=h, gain=l [BD8876FV] , c 1 =c 2 =1f , r l =10k , input coupling capacitor=1f) * svdd, pvdd shows as vdd in the following graphs. 0.1u 1u 10u 100u 1m 10m 10 100 1k 10k 100k noise [vrms] frequency [hz] 0.1u 1u 10u 100u 1m 10m 10 100 1k 10k 100k noise [vrms] frequency [hz] figure 6. noise level (BD8876FV) BD8876FV bd8878fv vdd=5v r l =10k gain=6db 22khz lpf+a-weight filter v n =7.8vrms figure 7. noise level (bdd8878fv) vdd=5v r l =10k 22khz lpf+a-weight filter v n =10.6vrms 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 circuit current (shutdown) [ a] supply voltage [v] 0 1 2 3 4 5 6 7 8 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 circuit current (active) [ma] supply voltage [v] figure 4. circuit current (shutdown) vs . supply voltage figure 5. circuit current (active) vs . supply voltage BD8876FV bd8878fv BD8876FV bd8878fv downloaded from: http:///
6/ 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 (unless otherwise specified , ta=25c , svdd=pvdd=5v , sgnd=pgnd=0v , sdb=h, gain=l [BD8876FV], c 1 =c 2 =1f , r l =10k , input coupling capacitor=1f) * svdd, pvdd shows as vdd in the following graphs. figure 8. output voltage vs . input voltage (BD8876FV, 6db) figure 9. output voltage vs . input voltage (BD8876FV, 9db) 0 1 2 3 4 5 6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [vrms] input voltage [vrms] vdd=3v vdd=5v vdd=5.5v BD8876FV f=1khz r l =10k gain =9 db 0 1 2 3 4 5 6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [vrms] input voltage [vrms] BD8876FV vdd=3v vdd=5v vdd=5.5v f=1khz r l =10k gain=6db 0 1 2 3 4 5 6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [vrms] input voltage [vrms] bd8878fv vdd=3v vdd=5v vdd=5.5v f= 1khz r l =10k figure 10. output voltage vs . input voltage (bd8878fv) figure 11. gain vs . frequency (BD8876FV, 6db) 2 3 4 5 6 7 8 9 10 11 12 100 1k 10k 100k gain [db] frequency [hz] 200k BD8876FV vdd=3v vdd=5v vdd=5.5v vout=2vrms r l =10k gain=6db downloaded from: http:///
7/ 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 (unless otherwise specified , ta=25c , svdd=pvdd=5v , sgnd=pgnd=0v , sdb=h , gain=l [BD8876FV], c 1 =c 2 =1f , r l =10k , input coupling capacitor=1f) * svdd, pvdd shows as vdd in the following graphs. figure 13. gain vs . frequency (bd8878fv) figure 12. gain vs . frequency (BD8876FV, 9db) 2 3 4 5 6 7 8 9 10 11 12 100 1k 10k 100k gain [db] frequency [hz] 200k BD8876FV vout=2vrms r l =10k gain=9db vdd=3v vdd=5v vdd=5.5v 2 3 4 5 6 7 8 9 10 11 12 100 1k 10k 100k gain [db] frequency [hz] 200k bd8878fv vout=2vrms r l =10k vdd=3v vdd=5v vdd=5.5v figure 14. thd+n vs. output voltage (BD8876FV, 3v) figure 15. thd+n vs . output voltage (BD8876FV, 5v) 0.001 0.01 0.1 1 10 0.01 0.1 1 10 thd+n [%] output voltage [vrms] BD8876FV vdd=3v gain=6db r l =10k 20khz lpf 0.001 0.01 0.1 1 10 0.01 0.1 1 10 thd+n [%] output voltage [vrms] BD8876FV vdd=5v gain=6db r l =10k 20khz lpf downloaded from: http:///
8/ 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 (unless otherwise specified , ta=25c , svdd=pvdd=5v , sgnd=pgnd=0v , sdb=h, gain=l [BD8876FV], c 1 =c 2 =1f , r l =10k , input coupling capacitor=1f) * svdd, pvdd shows as vdd in the following graphs. figure 16. thd+n vs. output voltage (BD8876FV, 5.5v) figure 17. thd+n vs. output voltage (bd8878fv, 3v) 0.001 0.01 0.1 1 10 0.01 0.1 1 10 thd +n[%] output voltage [vrms] BD8876FV vdd=5.5v gain=6db r l =10k 20khz lpf 0.001 0.01 0.1 1 10 0.01 0.1 1 10 thd+n [%] output voltage [vrms] bd8878fv vdd=3v r l =10k 20khz lpf figure 18. thd+n vs. output voltage (bd8878fv, 5v) 0.001 0.01 0.1 1 10 0.01 0.1 1 10 thd+n [%] output voltage [vrms] bd8878fv v dd =5v r l =10k 20khz lpf figure 19. thd+n vs. output voltage (bd8878fv, 5.5v) 0.001 0.01 0.1 1 10 0.01 0.1 1 10 thd +n[%] output voltage [vrms] bd8878fv vdd=5.5v r l =10k 20khz lpf downloaded from: http:///
9/ 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 (unless otherwise specified , ta=25c , svdd=pvdd=5v , sgnd=pgnd=0v , sdb=h, gain=l [BD8876FV], c 1 =c 2 =1f , r l =10k , input coupling capacitor=1f) * svdd, pvdd shows as vdd in the following graphs. 0.0001 0.001 0.01 0.1 1 10 100 1k 10k thd+n [%] frequency [hz] 20k BD8876FV vdd=5v gain=6db vo=2vrms r l =10k 20khz lpf figure 20. thd+n vs. frequency (BD8876FV) 0.0001 0.001 0.01 0.1 1 10 100 1k 10k thd+n [%] frequency [hz] 20k bd8878fv vdd=5v vo=2vrms r l =10k 20khz lpf figure 21. thd+n vs. frequency (bd8878fv) figure 22. psrr vs. frequency (BD8876FV) - 80 - 70 - 60 - 50 - 40 - 30 - 20 - 10 0 10 100 1k 10k 100k psrr [db] frequency [hz] 20k vdd=5v gain=6db vripple=100mv p-p r l =10k band pass filter BD8876FV figure 23. psrr vs. frequency (bd8878fv) - 80 - 70 - 60 - 50 - 40 - 30 - 20 - 10 0 10 100 1k 10k 100k psrr [db] frequency [hz] 20k bd8878fv vdd=5v vripple=100mv p-p r l =10k band pass filter downloaded from: http:///
10 / 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 (unless otherwise specified , ta=25c , svdd=pvdd=5v , sgnd=pgnd=0v , sdb=h, gain=l [BD8876FV], c 1 =c 2 =1f , r l =10k , input coupling capacitor=1f) * svdd, pvdd shows as vdd in the following graphs. - 100 - 90 - 80 - 70 - 60 - 50 - 40 - 30 - 20 - 10 0 10 100 1k 10k 100k crosstalk [db] frequency [hz] 20k BD8876FV vdd=5v lch to rch, rch to lch gain=6db vo=200mv p-p r l =10k 20khz l pf figure 24. crosstalk vs. frequency (BD8876FV, 200mv p-p ) - 120 - 110 - 100 - 90 - 80 - 70 - 60 - 50 - 40 - 30 - 20 - 10 0 10 100 1k 10k 100k crosstalk [db] frequency [hz] 20k BD8876FV vdd=5v lch to rch, rch to lch gain=6db vo=2vrms r l =10k 20khz lpf figure 25. crosstalk vs. frequency (BD8876FV, 2vrms) figure 26. crosstalk vs. frequency (bd8878fv, 200mv p-p ) figure 27. crosstalk vs. frequency (bd8878fv, 2vrms) - 100 - 90 - 80 - 70 - 60 - 50 - 40 - 30 - 20 - 10 0 10 100 1k 10k 100k crosstalk [db] frequency [hz] 20k bd8878fv vdd=5v lch to rch, rch to lch vo=20mv p-p r l =10k 20khz lpf - 100 - 90 - 80 - 70 - 60 - 50 - 40 - 30 - 20 - 10 0 10 100 1k 10k 100k crosstalk [db] frequency [hz] 20k bd8878fv vdd=5v lch to rch, rch to lch vo=2vrms r l =10k 20khz lpf downloaded from: http:///
11 / 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 application examples rch input c 2 =1.0f c 1 =1.0f svdd sgnd sdb gain pvdd outr inr pgnd shutdown control gain control lch input c bpp =1.0f c bps =1.0f r l >550 ? c cl =1.0f 5.0v 5.0v c cr =1.0f r r >550 ? + - + - svdd charge pump outl svdd svss svss inl svdd svss svss pvss cn cp sgnd sgnd sgnd short circuit protection 15k/19.1k pvdd 1 23 4 56 7 8 9 10 11 12 13 14 uvlo / shutdown control svdd sgnd 15k/19.1k 42.3k/38.2k 42.3k/38.2k figure 28. BD8876FV application circuit example c 1 =1.0f cp rch input c 2 =1.0f c cr =1.0f r r >550 ? svdd charge pump outl svdd inl svdd svdd svss sgnd sdb nc pvdd outr inr svsspvss cn pgnd sgnd short circuit protection pvdd 1 23 4 56 7 8 9 10 11 12 13 14 uvlo / shutdown control svdd sgnd open + - svss sgnd sgnd 15k 15k + - svss sgn d sgnd 15k 15k shutdown control lch input c bpp =1.0f c bps =1.0f r l >550 ? 5.0v 5.0v 6.8k 22.5k 22.5k 6.8k c cl =1.0f figure 29. bd8878fv application circuit example * pvss and svss are connected each other inside ic. but, please connect pvss and svss outside ic , also. downloaded from: http:///
12 / 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 timing chart < sequence of start-up / power-down> pvdd , svdd sdb pvss , svss inl , inr outl outr shutdown setup (charge pump start- up ) active (line amp enable) active - > shutdown shutdown on - > off vdd off - > on signal input available the term from pvdd, svdd : on to shutdown on ->off when power supply (pvdd, svdd) is applied, it is started that charging inpu t coupling capacitors. therefore , the input terminal voltage vin is changed as following figure 31. time constant ? of charging input coupling capacitor is decided by input coupling capacitor cin and internal input impedance rin (se e formula (1)). internal impedance rin in term of shutdown is 7.5k (typ) for making time constant shorten. if sdb is changed l to h (shutdown on -> off) during input dc voltage (vin) is changing, pop noise may occur. it is recommended that shutdown on -> off ( sdb : l -> h) after 5 ~ 6 . audio source + - vdd vout time [s] vs [v] bias 0 vss vs vin time [s] vin [v] bias 0 cin rin =7.5k 7.5k 42 .3k figure 31. fluctuation of input terminal voltage when charging in put coupling capacitor figure 30. sequence of start- up / power-down 0 10 20 30 40 50 60 70 80 90 100 0 1 2 3 4 5 6 7 8 wait time [s] convergence [%] (e.g.) in case of cin =1.0 f, = rin x cin =7.5k x 1.0f = 7.5 msec(typ) 6 = 6 x 7.5msec = 45 msec (typ) figure 32. wait time vs. convergence = rin x cin (1) downloaded from: http:///
13 / 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 the term from shutdown off to line amplifier start- up when shutdown is on -> off, charge pump starts up. line ampli fier is stopped during t son (start-up time of charge pump , 470 sec typ.) for preventing irregular output. please input audio signal af ter t son . vdd 0 [v] [time] sdb 0 [v] [time] pvsssvss line amplifier active shutdown wait (= t son ) 470 sec(typ .) figure 33. wait time for line amplifier from shutdown on -> off functional descriptions / application information the composition of conventional line amplifier is shown in figure 34 . output signal swings in reference to middle dc bias (e.g. vdd/2) . t herefore, output dynamic range of line amplifier limits until vdd . + - vdd gnd vout input time [s] vout [v] vdd /2 middle dc bias ( ex . vdd /2) vdd 0 figure 34 . the composition of conventional line amplifier the composition of BD8876FV/bd8878fv is shown to figure 35 . output signal swings in reference to ground level. line amplifier can output between from vss (-vdd) to vdd. therefore, output dynam ic range of line amplifier expands 2 x vdd . and, it is possible to drive 2vrms (5.65v p-p ) with single supply voltage 5v. + - vdd vout input time [s] vout [v] vdd charge pump vss 0 c 1 : flying capacitor c 2 : hold capacitor bd 8876 fv vss + - vdd vout input charge pump bd 8878 fv vss figure 35 . the composition of BD8876FV/bd8878fv output range vdd output range 2 x vdd downloaded from: http:///
14 / 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 ? ch arge pump the negative power supply circuit is composed of the regulate d charge-pump. this circuit outputs the negative voltage (pvss) from positive power-supply voltage (pvdd). the negative power supply circuit starts when sdb=h , and power is downed when sdb=l (see table 1). table 1. control of the charge pump circuit sdb control l power down h power on the flying capacitor and the hold capacitor the flying capacitor (figure 35 . c1) and the hold capacitor (figure 35 . c2) have great influences on the characteristic of the charge pump. please select capacitors that have low esr c haracteristic and low volt age co efficient, low temperature co ef ficient for c1, c2. and, please connect the se capacitors as near as possible to ic. over-current protection t he charge pump has the over-current protection function. if th e terminals of charge pump (cp, cn, pvss, svss) are under the abnormal connecting conditions (e.g. shorting to grou nd), this function shutdown ic and protect it from the damage. ? line amplifier the line amplifier is driven by power-supply voltage (svdd) and n egative voltage (svss) based on ground (sgnd). therefore, the amplifier can output 2vrms for rl=10kohm with the sing le supply voltage 5v. and BD8876FV can change the gain 6db and 9db. the gain of bd8878fv is 6.7db (fixed). the both of lch and rch of the line amplifier are simultaneously c ontrolled by sdb logic (see table 2). in addition, the over-current protection circuit is built in. t he amplifier is shutdown, when the over-current occurs because of the output short-circuit etc., and ic is protected from be ing destroyed. table 2. control of the line amplifier circuit sdb lch/rch amplifier control l power down h power on input coupling capacitor input dc voltage level of BD8876FV/bd8878fv is 0v (sgnd) . therefore, input coupling capacitor is needed. gain is decreased in low frequency because of composing the high-pass filter by input coupling capacitor cin and internal input impedance rin of BD8876FV/bd8878fv. input impedance r in of BD8876FV is 15k (typ, gain=+ 9db), and r in of bd8878fv is 30k (typ). c ut -off frequency of the high-pass filter is shown to the followin g formula (2). -21.0 -18.0 -15.0 -12.0 -9.0 -6.0 -3.0 0.0 3.0 6.0 9.0 1 10 100 frequency [hz] gain [db] rin=15k cin=1.0 f cin=2.2 f cin=4.7 f cin=10.0 f figure 36 . frequency response by the input coupling capacitor (reference dat a: calculated value) the degradation of thd happens because of the input coupling capacitor. therefore, please consider the appl ied voltage dependence and the temperature characteristic of the ca pacitor when selecting parts. )2( 2 1 in in c c r f ? ? downloaded from: http:///
15 / 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 ? uvlo / shutdown control BD8876FV/bd8878fv has low voltage protection function (uvlo: under volta ge lock out). uvlo function protects from abnormal operation under low er power supply voltage than the recommended supply voltage range. the detection voltage is 2.8v (typ) . it does not influence the recommended operation voltage (3 .0v (min)). the power control by uvlo works for the whole of ic, and power down the b oth of the negative power supply charge pump and the l ine amplifier. if power supply voltage recovers over recommended range (3.0v), all function also recover automatically. power dissipation 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 25 50 75 100 125 150 power dissipation pd (mw) ta ( ) figure 37. power dissipation curve measurement condition : mounted on rohm standard board, glass-epoxy board size : 74.2mm74.2mm1.6mm (1 -layer) material : fr4 ssop-b14 0.87w downloaded from: http:///
16 / 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage th e ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external dio de between the p ower supply and the ics power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the gro und and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capac itors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground tra ces, the two ground traces should be routed separately but connected to a single ground at the reference point of th e application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxim um rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board . in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditi ons of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal log ic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, espe cially if the ic has more than one power supply. therefore, give special consideration to power coupl ing capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capa citor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or remo ving it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during a ssembly and use similar precautions during transport and storag e. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a m os transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the e lectric field from the outside can easily charge it. the sm all charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. downloaded from: http:///
17 / 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. pa rasitic diodes inevitably occur in the structure of the ic. th e operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 38. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bia s and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating i s exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below th e tsd threshold, the circuits are automatically restored to normal operati on. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or fo r any purpose other than protecting the ic from heat damage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
18 / 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 ordering information b d 8 8 7 6 f v - e 2 b d 8 8 7 8 f v - e 2 part number package fv: ssop-b14 packaging and forming specification e2: embossed tape and reel line- up BD8876FV bd8878fv amplifier type inverting amplifi er non-inverting amplifier gain +6db / +9 db (changed by gain pin) +6.7db package ssop-b14 marking diagram ssop-b14 (top view) d8876 part number marking lot number 1pin mark ssop-b14 (top view) d8878 part number marking lot number 1pin mark downloaded from: http:///
19 / 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 physical dimension, tape and reel information package name ssop-b14 downloaded from: http:///
20 / 20 BD8876FV, bd8878fv ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0c1c0ez00280-1-2 2015.10.30 rev.001 revision history date revision changes 2015/10 / 30 001 first version downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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