cha2441 - qag ref. : dscha2441 - qag3149 - 29 may 13 1 / 10 specifications subject to change without notice united monolithic semiconductors s.a.s. bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 22 - 26ghz low noise amplifier gaas monolithic microwave ic in smd leadless package description the cha2441 - qag is a k - band low noise amplifier providing 25.5db gain from a single bias supply +3.3v with a noise figure of 2.5db. all the active devices are self biased o n chip. the circuit is manufactured with a phemt process 0.25 main features s21 versus frequency and temperature main electrical characteristics tamb.= +25c; vd=+3.3v symbol parameter min typ max unit freq frequency range 22 26 ghz gain linear gain 25.5 db nf noise figure 2.5 db pin - 1db input power @1db comp. - 14 dbm ums a2441 yyww ? ? - 40c +25c +105c ums a3667a yywwg ums a3667a yywwg ums a3688a yywwg ums a3667a yywwg ums a3667a yywwg ums a3688a yywwg
cha2441 - qag 22 - 26ghz low noise amplifier ref. : dscha2441 - qag3149 - 29 may 13 2 / 10 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 electrical characteristics full operating temperature range; vd=+3.3v symbol parameter min typ max unit freq frequency range 22 26 ghz gain small signal gain 25.5 db ? - 1db input power at 1 db gain compression - 14 dbm iip3 input ip3 - 4 dbm psat saturated output power @ 24.5 ghz 15 dbm id supply current 50 ma top operating temperature range - 40 25 105 c these values are representative of onboard measurements as defined on the drawing in paragraph "evaluation mother board". absolute maximum ratings (1) symbol parameter values unit +vd maximum positive supply voltage 4.0 v +i maximum positive supply current 70 ma rfin maximum peak input power overdrive - 5.0 dbm top operating temperature range - 40 to 105 c tstg storage temperature range - 55 to 150 c tjmax maximum junction temperature 175 c (1) operation of this device above anyone of these parameters may cause permanent damage.
22 - 26ghz low noise amplifier cha2441 - qag ref. : dscha2441 - qag3149 - 29 may 13 3 / 10 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 device thermal performances all the figures given in this section are obtained assuming that the qfn device is cooled down only by conduction through the package thermal pad (no convection mode considered). the temperature is monitored at the package back - side interface (tcase) as shown below. the system maximum temperature must be adjusted in order to guarantee that tcase remains bel ow the maximum value specified in the next table. so, the system pcb must be designed to comply with this requirement. a derating must be applied on the dissipated power if the tcase temperature can not be maintained below the maximum temperature specifie d (see the curve pdiss. max) in order to guarantee the nominal device life time (mttf). recommended max. junction temperature (tj max) : 146 c junction temperature absolute maximum rating : 175 c max. continuous dissipated power (pdiss. max.) : 0.1 w => pdiss. max. derating above tcase (1) = 105 c : 4 mw/c junction-case thermal resistance (rth j-c) (2) : <278 c/w minimum tcase operating temperature (3) : -40 c maximum tcase operating temperature (3) : 105 c minimum storage temperature : -55 c maximum storage temperature : 150 c (1) derating at junctio n temperature co nstant = tj max. (2) rth j-c is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n o f the m m ic and all the devices biased. (3) tcase=p ackage back side temperature measured under the die-attach-pad (see the drawing belo w). 6.4 device thermal specification : cha2441-qag 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 - 50 - 25 0 25 50 75 100 125 150 175 pdiss. max. @tj cha2441 - qag 22 - 26ghz low noise amplifier ref. : dscha2441 - qag3149 - 29 may 13 4 / 10 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 typical board measurements vd = +3.3v linear gain versus temperature s11 versus temperature s22 versus temperature - 40c +25c +105c - 40c +25c +105c - 40c +25c +105c
22 - 26ghz low noise amplifier cha2441 - qag ref. : dscha2441 - qag3149 - 29 may 13 5 / 10 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 typical board measurements vd = +3.3v input power at 1db compression versus temperature input ip3 versus temperature - 40c +25c +105c - 40c +25c +105c - 8 - 7 - 6 - 5 - 4 - 3 - 2 - 1 0 1 2 22 23 24 25 26 27 input ip3 (dbm) frequency (ghz)
cha2441 - qag 22 - 26ghz low noise amplifier ref. : dscha2441 - qag3149 - 29 may 13 6 / 10 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 package outline matt tin, lead free (green) 1 - gnd (1) 7 - nc 13 - nc units : mm 2 - gnd (1) 8 - gnd (1) 14 - vd from the standard : jedec mo - 220 3 - rf in 9 - gnd (1) 15 - nc (veed) 4 - gnd (1) 10 - rf out 16 - nc 17 - gnd 5 - gnd (1) 11 - gnd (1) 6 - nc 12 - gnd (1) (1) it is strongly recommended to ground all pins marked gnd through the pcb board.
22 - 26ghz low noise amplifier cha2441 - qag ref. : dscha2441 - qag3149 - 29 may 13 7 / 10 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 esd sensitivity standard value mil - std - 1686c hbm class 1 (<1000v) esd stm5.1 - 1998 hbm class 0 (<250v) package information parameter value package body material rohs - compliant low stress injection molded plastic lead finish 100% matte sn msl rating msl1
cha2441 - qag 22 - 26ghz low noise amplifier ref. : dscha2441 - qag3149 - 29 may 13 8 / 10 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 evaluation mother board
22 - 26ghz low noise amplifier cha2441 - qag ref. : dscha2441 - qag3149 - 29 may 13 9 / 10 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 notes the dc connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external dc decoupling (100pf + 10nf) on the pc board, as close as possible to the package.
cha2441 - qag 22 - 26ghz low noise amplifier ref. : dscha2441 - qag3149 - 29 may 13 10 / 10 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 recommended package footprint refer to the application note an0017 available at http://www.ums - gaas.com for package foot print recommendations. smd mounting procedure for the mounting process standard techniques involving solder paste and a suitable reflow process can be used. for further details, see application note an0017. recommended environmental management ums products are compliant with the regulation in particular with the directives rohs n2011/65 and reach n1907/2006. more environmental data are available in the application note an0019 also available at http://www.ums - gaas.com . recommended esd management refer to the application note an0020 available at http://www.ums - gaas.com for esd sensitivity and handling recommendations for the ums package products. ordering information qfn 3x3 package: cha2441 - qag /xy stick: xy = 20 tape & reel: xy = 21 information furnished is believed to be accurate and reliable. however united monolithic semiconductors s.a.s. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of united monolithic semiconductors s.a.s. . specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. united monolithic semicondu ctors s.a.s. products are not authorised for use as critical components in life support devices or systems without express written approval from united monolithic semiconductors s.a.s.
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