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| SOT-89-5 packaging information reference pattern layout dimension unit: mm packaging information / reference pattern layout dimensions 2.0 1.5 1.5 1.0 0.7 2.50.1 0.8 min 4.35 max (0.1) 1.50.1 0.8 min 0.3) 0.4) 1.8) 0.4)
SOT-89-5 ` /reel ?`?? /taping specifications ?`?? / ta p in g s p ecifications unit: mm 1,000pcs/reel direction of feed r type :[device orientation : right] standard feed 15.41.0 13.00.5 (1.5) 130.2 2 0 . 5 SOT-89-5 power dissipation power dissipation data for the SOT-89-5 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. measurement condition (reference data) condition : mount on a board ambient : natural convection soldering : lead (pb) free board : dimensions 4040mm 1600mm 2 in one side copper (cu) traces occupy 50% of the board area in top and back faces package heat-sink is tied to the copper traces material : glass epoxy fr-4 thickness : 1.6mm through-hole : 5 x 0.8 diameter evaluation board (unit: mm) 2. power dissipation vs. ambient temperature85 board mount ( tjmax=125 ) 3. power dissipation vs. amb ient temperature105 board mount ( tjmax=125 ) ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 1300 85 520 76.92 ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 1300 105 260 76.92 28.9 40.0 2.5 pd vs ta 0 200 400 600 800 1000 1200 1400 25 45 65 85 105 125 ambient temperature ta power dissipation pdmw pd vs ta 0 200 400 600 800 1000 1200 1400 25 45 65 85 105 125 ambient temperature ta power dissipation pdmw rohs ? rohs com p liance ? ? item material note ?? ?? y?` /flammability rating resin epoxy resin ul94v-0 `??` ~? lead frame copper alloy ?I U?`?? lead plating lead(pb) free solder plating ? ? die attach epoxy ???? au bonding wire ?? si silicon chip ?? `` marking laser marking SOT-89-5 SOT-89-5 perspective ver.09 |
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