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datashee t product structure: silicon monolithic integrated circuit this product has no protecti on against radioactive rays. 1/19 tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 14 ? 001 4.5v to 18v input, 3.0a integrated mosfet single synchronous buck dc/dc converter bd9c301fj-lb general description this is the product guarantees long time support in industrial market. bd9c301fj-lb is a synchronous buck switching regulator with built-in low on-resistance power mosfets. with wide input volt age range, it is capable of providing current of up to 3 a. it is a current mode control dc/dc converter and features high-speed transient response. phase compensation can also be set easily. features long time support product for industrial applications. synchronous single dc/dc converter over current protection thermal shutdown protection under voltage lockout protection short circuit protection fixed soft start function applications industrial equipment lcd tvs set-top boxes dvd/blu-ray disc players/recorders broadband network and communication interface entertainment devices key specifications ? input voltage range: 4.5v to 18.0v ? reference voltage: 0.8v 1% ? maximum output current: 3a(max) ? switching frequency: 500khz(typ) ? pch mosfet on resistance: 80m ? (typ) ? nch mosfet on resistance: 45m ? (typ) ? standby current: 1 a (typ) ? operating temperature range: -40c to +85c package w(typ) x d(typ) x h(max) sop-j8 4.90mm x 6.00mm x 1.65mm typical application circuit figure 1. application circuit sop-j8 downloaded from: http:///
datasheet d a t a s h e e t 2/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 sw sw comp p g nd vin agnd fb en pin configuration pin descriptions pin no. pin name function ground pins for the output stage of the switching regulator. this pins supply power to the control circuit and the output stage of the switching regulator. connecting a 10 f and a 0.1f ceramic capacitor is recommended. ground pin for the control circuit. an inverting input node for the gm error amplifier. see page 13 for how to calculate the resistance of the output voltage setting. an input pin for the switch current comparator and an output pin for the gm error amplifier. connect a frequency phase compensation component to this pin. see page 13 for how to calculate the resistance and capacitance for phase compensation. turning this pin signal low (0.8 v or lower) forces the device to enter the shutdown mode. turning this pin signal high (2.0 v or higher) enables the device. this pin must be terminated. switch nodes. these pins are connected to the dr ain of pch mosfet and t he drain of nch mosfet. figure 2. pin assignment 7 8 6 5 3 4 2 1 (top view) downloaded from: http:///
datasheet d a t a s h e e t 3/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 block diagram a absolute maximum ratings (ta = 25 ? c) parameter symbol rating unit conditions supply voltage v in 20 v sw pin voltage v sw 20 v en pin voltage v en 20 v power dissipation (note 1) pd 0.68 w when mounted on a 70 mm x 70 mm x 1.6 mm 1-layer glass epoxy board storage temperature range tstg -55 to +150 c maximum junction temperature tjmax 150 c fb, comp pin voltage v lvpins 7 v (note1) derate by 5.45 mw when operating above 25 ? c. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. figure 3. block diagram downloaded from: http:///
datasheet d a t a s h e e t 4/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 recommended operating conditions parameter symbol rating unit min typ max supply voltage v in 4.5 - 18.0 v output current i out - - 3.0 a output voltage setting range v range v in 0.125 (note 1) - v in 0.7 v operating junction temperature range tj -40 - +125 c (note1) v in 0.125 0.8 [v] electrical characteristics (ta = 25 ? c, v in = 12 v, v en = 5 v unless otherwise specified) parameter symbol limits unit conditions min typ max circuit current in active i q_active - 1.5 2.5 ma v fb = 0.75v, v en = 5v circuit current in standby i q_stby - 1.0 10.0 a v en = 0v fb pin voltage v fb 0.792 0.800 0.808 v fb-comp short (voltage follower) fb input current i fb - 0 2 a switching frequency f osc 450 500 550 khz high side fet on resistance r onh - 80 - m ? v in = 12v , i sw = -1a low side fet on resistance r onl - 45 - m ? v in = 12v , i sw = -1a power mos leakage current i lsw - 0 5 a v in = 18v , v sw = 18v current limit i limit 3.5 - - a minimum duty ratio min_duty - - 12.5 % uvlo threshold v uvlo 3.75 4.0 4.25 v wake up v in voltage uvlo hysteresis voltage v uvlohys - 0.2 - v en high-level input voltage v enh 2.0 - - v en low-level input voltage v enl - - 0.8 v soft start time t ss 0.5 1.0 2.0 msec (note 1) v fb :fb pin voltage, v en :en pin voltage, i sw :sw pin current (note 2) current capability should not exceed pd. downloaded from: http:///
datasheet d a t a s h e e t 5/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves 0 10 20 30 40 50 60 70 80 90 100 0123 i load [a] y [%] figure 4. efficiency (v in =12v, l=4.7h (v out =3.3/5.0v), cout=44f) figure 5. t c vs i load (v in =12v, v out =3.3v, l=4.7h, cout=44f) t - time - 1sec/div v out (ac) [20mv/div] sw [5v/div] t - time - 1sec/div figure 7. output ripple voltage (v in =12v, v out =3.3v, l=4.7h, cout=44f, iout=3a) figure 6. output ripple voltage (v in =12v, v out =3.3v, l=4.7h, cout=44f, iout=0a) v out (ac) [20mv/div] sw [5v/div] v in =12v l=4.7h cout=44f v out = 5.0v v out = 3.3v 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 i load [a] tc[ ] downloaded from: http:///
datasheet d a t a s h e e t 6/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (continued) figure 8. v out load regulation (v in =12v, v out =3.3v, l=4.7h, cout=44f) figure 9. v out line regulation (v out =3.3v, l=4.7h, cout=44f, iout=0a) figure 11. v out vs temperature (v in =12v, v out =3.3v, l=4.7h, cout=44f, iout=0a) figure 10. switching frequency (v out =3.3v, l=4.7h, cout=44f, iout=0a) 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 i load [a] vout [v] 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 4 6 8 1 01 21 41 61 8 vin [v] vout [v] 440 460 480 500 520 540 560 4 6 8 1 01 21 41 61 8 vin [v] frequency : f os c [khz] 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 -40 -20 0 20 40 60 80 100 ta [ ] vout [v] downloaded from: http:///
datasheet d a t a s h e e t 7/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (continued) figure 13. shutdown wave form (v in =12v, v out =3.3v, l=4.7h, cout=44f, iout=0a) figure 12. start-up with en (v in =12v, v out =3.3v, l=4.7h, cout=44f, iout=0a) en [ 5v/div ] v out [ 2v/div ] sw [10v/div] t - time C 1msec/div figure 15. ocp function (v in =12v, v out 3.3v, l=4.7h, cout=44f, v out is short to gnd) figure 14. load transient response (v in =12v, v out =3.3v, l=4.7h, cout=44f, iout=2a) t - time C 200msec/div en [ 5v / div ] v out [ 2v / div ] sw [10v/div] v out (ac) [100mv/div] iout [1a/div] =+105mv =-100mv t - time - 200sec/div t - time C 1msec/div v out [5v/div] sw [20v/div] il [5a/div] downloaded from: http:///
datasheet d a t a s h e e t 8/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 function explanations 1. basic operations (1) enable control the ic shutdown can be controlled by the voltage applied to the en pin. when v en reaches 2.0 v, the internal circuit is activated and the ic starts up. v en 0 v o 0 t ss v enh v enl the en pin output setting voltage figure 16. on/off switching during enable control (2) protective functions the protective circuits are intended for prevention of damage caused by unexpected accidents. do not u se them for continuous protective operation. (a) short circuit protection function (scp) the short circuit protection block (scp) compares the fb pin voltage with the internal reference voltage vref. when the fb pin voltage fall below v scp = vref C 240mv and with that situation continuing for off latch time, it latches output in off situation. table 1 short circuit protection function en pin fb pin short circuit protection function short circuit protection operation 2.0 v or higher v scp enabled on v scp off 0.8 v or lower - disabled off figure 17. short circuit protection function (scp) timing chart downloaded from: http:///
datasheet d a t a s h e e t 9/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (b) under voltage lockout protection (uvlo) the under voltage lockout protection circuit monitors the vin pin voltage. the operation enters standby when the vin pin voltage is 3.8 v (typ) or lower. the operation starts when the vin pin voltage is 4.0 v (typ) or higher. a y a a a a a : a : w a figure 18. uvlo timing chart (c) thermal shutdown when the chip temperature exceeds tj = 175c (typ), the dc/dc converter output is stopped. the thermal shutdown circuit is intended for shutting down the ic from thermal runaway in an abnormal state with the temperature exceeding tjmax = 150 ? c. it is not meant to protect or guarantee the soundness of the application. do not use the function of this circuit for application protection design. vin en vout tj hg lg scp threshold scp delay time typ:1msec soft start tsd release tsd normal operation normal operation tsd scp (off latch) normal operation tsd release hg : hi side fet gate signal lg : low side fet gate signal figure 19. tsd timing chart downloaded from: http:///
datasheet d a t a s h e e t 10/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (d) over current protection the over current protection operates by using the current mode control to limit the current that flows through the top mosfet at each cycle of the switching frequency. when an abnormal state continues, the output is fixed in a low level. (e) error detection (off latch) release method bd9c301fj-lb enters the state of off latch when the protection function operates. to release the off latch state, the vin pin voltage should be changed to less than uvlo level (=3.8v [typ] ) or, the en pin voltage falls below v enl voltage. application example figure 20. application circuit (v in =12v, v out =3.3v) maker part no input capacitor(cin1) 10f/25v tdk c3225jb1e106k input capacitor(cin2) 0.1f/25v tdk c1608jb1h104k output capacitor(cout) 22f/16v 2 tdk c3216jb1c226m 2 inductor (l) 4.7h tdk spm6530-4r7 fb vo(v) r_up [k ? ] r_dw [k ? ] 5 4.3 0.82 3.3 7.5 2.4 1.8 15 12 1.5 16 18 1.2 (note1) 10 20 1 (note1) 5.1 20 (note 1) v out has restriction with v in. see page 13. downloaded from: http:///
datasheet d a t a s h e e t 11/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 pcb layout design in the step-down dc/dc converter, a large pulse current flows into two loops. the first loop is the one into which the current flows when the top fet is turned on. the flow starts from the input capacitor c in , runs through the fet, inductor l and output capacitor c out and back to gnd of c in via gnd of c out . the second loop is the one into which the current flows when the bottom fet is turned on. the flow starts from the bottom fet, runs through the inductor l and output capacitor c out and back to gnd of the bottom fet via gnd of c out . route these two loops as thick and as short as possible to allow noise to be reduced for improved efficiency. it is reco mmended to connect the input and output capacitors directly to the gnd plane. the pcb layout has a great influence on the dc/dc converter in terms of all of the heat generation, noise and efficiency characteristics. accordingly, design the pcb layout considering the following points. ? connect an input capacitor as close as possible to the ic vin pin on the same plane as the ic. ? if there is any unused area on the pcb, provide a copper foil plane for the gnd node to assist heat dissipation from the ic and the surrounding components. ? switching nodes such as sw are susceptible to noise due to ac coupling with other nodes. route the coil pattern as thick and as short as possible. ? provide lines connected to fb and comp far from the sw nodes. ? place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. figure 22. example of evaluation board layout vout l sw gnd vin ic figure 21. current loop of buck converter mid layer2 bottom layer top layer mid layer1 downloaded from: http:///
datasheet d a t a s h e e t 12/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 selection of components externally connected 1. output lc filter constant the dc/dc converter requires an lc filter for smoothing the out put voltage in order to supply a continuous current to the load. selecting an inductor with a large inductance causes the ripple current ? i l that flows into the inductor to be small. however, decreasing the ripple voltage generated in the output is not advantageous in terms of the load transient response characteristic. an inductor with a small inductance improves the transient response characteristic but causes the inductor ripple current to be large which increases the ripple voltage in the output voltage, showing a trade-off relationship. it is recommended to select an inductance such that the size of the ripple current component of the coil will be 20% to 40% of the average output current (average inductor current). figure 23. waveform of current through inductor figure 24. output lc filter circuit with v in = 12 v, v out = 3.3 v and the switching frequency f osc = 500 khz, the calculation is shown in the following equation. coil ripple current S il = 30% x average output current (3 a) = 0.9 [a] [h] the saturation current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor ripple current ? i l . the output capacitor c out affects the output ripple voltage characteristics. the output capacitor c out must satisfy the required ripple voltage characteristics. the output ripple voltage can be represented by the following equation. [v] also this ic provides 1msec[typ] soft start function to reduce sudden current which flows in output capacitor when startup. but when capacity value of output capacitor c out becomes bigger than the following method, correct soft start waveform may not appear in some cases. ( ex. v out over shoot at soft start .) select output capacitor c out fulfilling the following condition including scattering and margin. [f] caution) concerning c out total the capacity value of every part connected to output line. i l t inductor saturation current > i outmax + S i l /2 i outmax average inductor current S i l frequency switching a is : where os c osc in out i n out f i l f v . . v \ v v l P S capacitor. output the of (esr) resistance series equivalent the is : where es r osc out es r l rp l r f c r i v S S time start soft is value restricted current switch is : where s s oc p out s s oc p out t i v .msmin t .amin i c vout l c out vin driver downloaded from: http:///
datasheet d a t a s h e e t 13/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 2. output voltage setting the output voltage value can be set by the feedback resistance ratio. [v] v out has restriction with v in by the following equation . v outmin : v in 0.125 0.8v v outmax : v in 0.7 figure 25. feedback resistor circuit 3. phase compensation component a current mode control buck dc/dc converter is a two-pole, one-zero system. two poles are formed by an error amplifier and load and the one zero point is added by phase compensation. the phase compensation resistor r cmp determines the crossover frequency f crs where the total loop gain of the dc/dc converter is 0 db. a high value crossover frequency f crs provides a good load transient response characteristic but inferior stability. conversely, a low value crossover frequency f crs greatly stabilizes the characteristics but the load transient response characteristic is impaired. here, select the constant so that the crossover frequency f crs will be 1/20 of the switching frequency. (1) selection of phase compensation resistor r cmp the phase compensation resistance r cmp can be determined by using the following equation. [ ? ] (3-1) (2) selection of phase compensation capacitance c cmp the phase compensation capacitance c cmp can be determined by using the following equation. [f] (3-2) *when capacity value of c cmp and resistance value of r cmp dont meet the following method, correct soft start waveform may not appear in some cases. select c cmp and r cmp fulfilling the following condition including scattering and margin. [v] (3-3 [v] (3-4) v cmp is comp terminal voltage r cmp is resistor connected to comp terminal c cmp is capacitor connected to comp terminal i cmp is error amplifier source current (45ua (min) ) t is scp delay time(500sec (min) ) (typ)) a/v (300 e conductanc trans amplifier error is (typ)) a/v (7.8 gain sense current is (typ)) v (0.8 voltage reference feedback is e capacitanc output is frequency crossover is voltage output is : where m a m p fb out crs out ma mp fb out cr s out cm p g g v c f v g g v c f v r cm p out out out cm p r i c v c . v out r r r . ? ? cm p cm p cm p cm p cm p c t i i r v . ? cm p cm p c t i downloaded from: http:///
datasheet d a t a s h e e t 14/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (3) loop stability to ensure the stability of the dc/dc converter, make sure that a sufficie nt phase margin is provided. a phase margin of at least 45o in the worst conditions is recommended. figure 26. phase compensation circuit figure 27. bode plot i/o equivalent circuit diagram 4.fb 5.comp 6.en 7,8.sw figure 28. fb agnd en agnd phase margi n 180 90 180 90 0 0 a (a) gbw(b) f f gain [db] phase[deg] f cr s downloaded from: http:///
datasheet d a t a s h e e t 15/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity w hen connecting the power supply, such as mounting an external diode between the power supply and the ics p ower supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guar anteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
datasheet d a t a s h e e t 16/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 29. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection ci rcuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic shou ld not be used in applications characterized by continuous operation or transitioning of the protection circuit. downloaded from: http:///
datasheet d a t a s h e e t 17/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 power dissipation when designing the pcb layout and peripheral circuitry, sufficient consideration must be given to ensure that the power dissipation is within the allowable dissipation curve. ordering information b d 9 c 3 0 1 f j - l b h 2 part number package fj: sop-j8 product class lb: for industrial applications packaging and forming specification h2: embossed tape and 18cm reel (quantity : 250pcs) b d 9 c 3 0 1 f j - l b e 2 part number package fj: sop-j8 product class lb: for industrial applications packaging and forming specification e2: embossed tape and 32.8cm reel (quantity : 2500pcs) marking diagram (top view) sop-j8(top view) 9c301 part number marking lot numbe r 1pin mark sop-j8 package j-a =185.2c /w 1 layer board back side copper foil area:70mm 70mm downloaded from: http:///
datasheet d a t a s h e e t 18/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name sop-j8 downloaded from: http:///
datasheet d a t a s h e e t 19/19 bd9c301fj-lb tsz02201-0j3j0aj00540-1-2 ? 2013 rohm co., ltd. all rights reserved. 8.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date draft changes 9.sep.2013 001 new release 8.oct.2014 002 expression change output voltage setting add h2 rank of packaging and forming specification downloaded from: http:///
notice- ss rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extraordinary environments or conditions, as exemplified bel ow . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our pr oducts under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using wate r or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mo unted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommend ed. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range d escribed in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with t he rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice- ss rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin co nsidering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensatio n [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is ind icated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. al l information and data including but not limited to applic ation example contained in this document is for reference only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modifie d, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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