pc93 non-silicone thermal conductive pad thermal conductivity: 2 w/mk (w/mk - z axis) in the thermal resistance vs pressure vs defection charts pc93 provides low thermal impedance. as the pressure increases the thermal impedance decreases. pc93 provides good compliance and softness. hardness: 60 (shore 00) (shore 00) low contact thermal impedance good thermal conductivity silicone free long term stability electronic components: ic / cpu / mos led / m/b / p/s / heat sink / lcd-tv / notebook pc / pc / telecom device / wireless hub etc.... ddr ii module / dvd applications / hand-set applications etc... features applications thermal resistance v.s pressure v.s defection properties reach compliant rohs compliant property pc93 unit tolerance test method colour grey - - visual thickness (available thickness range) 0.25 - 5.0 mm - astm d374 0.0098 - 0.1969 inch - astm d374 thermal conductivity 2 w/mk - astm d5470 flammability rating v-0 - - ul 94 dielectric breakdown voltage 10 kv/mm - astm d149 weight loss ?1 % - astm e595 specifc gravity 1.5 g/cm 3 0.2 astm d792 working temperature -30 to 150 ?c - - volume resistance ?10 12 ohm-cm - astm d257 elongation 350 % 13 astm d412 tensile strength 1 kgf/mm 2 2 astm d412 standard shape - sheets 320-320mm - - hardness 60 shore 00 5 astm d2240 available with an adhesive backing 1. part number 2. size x-y-z 3. adhesive backing C 0-none, 1a-one side, 2a-two sides 4. quantity tel: +44 20 8133 2062 email: sales @ tglobaltechnology.com web: www.tglobaltechnology.com skype: tglobal.technology
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