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1/9 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. class-ab speaker amplifiers 2w + 2w stereo speaker / headphone amplifier BH7881EFV description the BH7881EFV is a low voltage, low noise, high output speaker /headphone amplifier ic, in which a bi-cmos process is used. an on-chip speaker amplifier circuit that is capabl e of 2w+2w output can be used as a headphone amplifier by switching the operating mode. this makes it possible to co nfigure an audio system using few external devices. with a built-in, low saturation regulator with programmable output voltage and outpu t current, clear tone quality is obtained even when directly connected to a digital power supply. a peri pheral analog circuit can also be regulator driven. furthermore , the BH7881EFV provides speaker output and vreg output short-circuit detection functi ons, a thermal shutdown function with hysteresis, and a speaker protection function. features 1) built-in low saturation type regulator (digital power supp ly driver, voltage and current variable, short circuit detection) 2) bass boost mode, gain switching functions 3) speaker mute function (headphone mode) 4) built-in line amplifier output (gain adjustment, lpf setting) active/suspend function (ttl input control pin) 5) hysteretic thermal shutdown function (set for approximately 150 /90 ) 6) ic protection function (sp pin vcc/gnd short circuit detection) 7) speaker protection function (o utput voltage amplitude control) applications notebook computers, lcd tvs, etc. absolute maximum ratings (ta=25 ) parameter ratings unit supply voltage +6.0 v power dissipation 1100 *1 mw storage temperature -55 +125 operating temperature -10 +70 *1 reduced by 11 mw/ at 25 or higher, when mounting on a 70mmx70mmx1.6mm pcb board). operating conditions (ta=25 ) parameter ratings unit supply voltage +3.3 +5.5 v * this ic is not designed to be radiation-resistant. no.10077eat05 downloaded from: http:///
technical note 2/9 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. BH7881EFV electrical characteristics (unless otherwise noted, vcc=3.3v,ta=25 ,f=1khz,r=4 ? ,400hz 30khzbpf) parameter limits unit conditions min. typ. max. 1chip circuit current (active) - 18 30 ma no signal circuit current(suspend) - 0 10 a no signal sp amp voltage gain1 8.5 11.0 13.5 db se,vin=-18dbv voltage gain 2 14.5 17.0 19.5 db btl,vin=-18dbv distortion - 0.04 1.0 % btl,vin=-18dbv maximum output level 1.5 4.5 - dbv btl,dstn=1% output noise level - -90 -80 dbv se,din-audio cross talk - -85 -75 dbv se,din-audio output level on mute - -110 -80 dbv btl,vin=-18dbv hp amp voltage gain 3.0 5.5 8.0 db se,vin=-18dbv,r l =32 ? distortion - 0.02 1.0 % se,vin=-18dbv,r l =32 ? maximum output level -1.6 1.4 - dbv se,dstn=1% ,r l =10k ? output noise level - -95 -80 dbv se,din-audio ,r l =32 ? cross talk - -90 -80 dbv se,din-audio ,r l =32 ? output level on mute - -105 -80 dbv se,vin=-18dbv,r l =32 ? bias output voltage 1.40 1.65 1.90 v no signal regulator output voltage 2.7 3.0 - v no signal psrr - -80 - dbv v in =0.28vpp,1khz control pin actv/spnd ctrl 2pin control pin suspend mode vcc/3+0.8 - vcc v sp/hp® suspend active mode 0 - 0.8 v sp/hp® active sp/hp ctrl 12pin control pin sp&hp mode vcc/3+0.8 - vcc v sp/hp on hp(sp mute) mode 0 - 0.8 v sp off(sp mute),hp on bassboost ctrl 11pin control pin bass-boost mode vcc/3+0.8 - vcc v sp/hp gain up non-boost mode 0 - 0.8 v sp/hp gain normal downloaded from: http:///
technical note 3/9 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. BH7881EFV block diagram fig.1 control pin descriptions 1. active/suspend:2pin control input mode function h suspend suspended state (except reg) l active active state when suspended, the regulator (reg) is in an active state and the sp/hp/line amplifier is in a suspended state. originally, signals from input resistance and feedback resistance leaked into the speaker output even when suspended, because of the series connection of an inverting amplifier. however, since the signals are cut off on their way in this ic, signal leaks d o not occur in speaker output. (signals due to feedb ack resistance are output in line amplifier output.) 2. power level:8pin control input mode function h limiter h 3vf peak limiter on (output approx. 1.25 w) open limiter l 2vf peak limiter on(output approx .0.70w) l limiter off limiter off *vcc=5v,rl=4ohm,vin=-8dbv since a limiter uses diode characteristics, it has temperature characteristics. on the high temperature side, amplitude tends to decrease, which is a characte ristic that protects the ic. since setting in speaker mode is a ssumed, it is ineffective (limi ter off) in headphone mode. moreover, precautions must be ta ken when input is so great, that output becomes a square wave, since this could cause local oscillation. 3. bassboost on/off:11pin control input mode function h on bassboost:on l off bassboost:off the capacitor that constitutes bassboost is elim inated, and also functi ons as a gain switch. 4. sp/hp:12pin control input mode function h sp+hp sp:on, hp:on l hp sp:off,hp:on by using the headphone mode in a speaker mute mode, it is possible to completely cut off the pop noise when switching when vcc on or off, or to actv or spnd. for cont rol sequence and other information, see the following pages. *not all control pins have pull up or pull internal resistors. therefore add pull up or pull down resistors, accordingly (pin8 is an exception.) downloaded from: http:///
technical note 4/9 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. BH7881EFV description of operations 1. line amplifier 1) the voltage gain of the line amplifier is calculated by the following equations: gain = 20 log(68k/r4 +1k)) [db] gain = 20 log(68k/r9 +1k)) [db] r4 and r9 are resistances connected to pin4 and pin9 2) in order to make it operable with mixing input, the line amplifier can be realized by connecting multiple resistors to pin4 and pin9. since the input pin is al so the feedback of an inverti ng differential amplifier, each individual signal is simply added. 3) to configure lpf and remove unnecessary frequency com ponents, the line amplifier can be realized by connecting capacitors between pin3 and pin4, and between pin9 and pin10. the lpf cut-off frequency at that time is calculated by the following equation: fc = 1/(2 c 68k) [hz] 2. sp amplifier (hp amplifier) 1) the voltage gain of the sp amplifier for non-boost is about 12 [db] (se: single end). 2) the voltage gain of the sp amplifier for bass- boost is calculated by the following equations: gain = 20 log((40k+r22-23)/10k) [db] where r22-23 is the resistance connected between pin22 and pin23. gain = 20 log((40k+r14-15)/10k) [db] where r14-15 is the resistance connected between pin14 and pin15. 3) the cut-off frequency for bass-boost is calculated by the following equations: fc = 1/(2 c22-23 r22-23) [hz] where rc22-23 is connected between pin22 and pin23. fc = 1/(2 c14-15 r14-15) [hz] where rc14-15 is connected between pin14 and pin15. 4) apply power to rchvcc (pin13), for mono only. 3. regulator 1) the reg output voltage is calculated by the follo wing equation, and numeric values are shown below: v = 1.15 [v] (1+r(vlev)/r(vref)) [v] reg setting voltage 3.0 3.3 3.6 4.0 4.6 v supply voltage(vcc) 3.3 3.6 4.0 5.0 5.0 v r(vlev) 30k 30k 30k 30k 30k ? r(vref) 18k 16k 14k 12k 10k ? use 1% resistors to eliminate errors in actual output voltages. 2) the reg maximum output current is determined by the exte rnal tr capability (hfe) of the ic. if more current is necessary, select one icmax with large hfe. dr ive output current to the base is about 5 ma. 3) when using the regulator, connect reg out put to pin6. the line amplifier, bias , and other sections essential to tone quality, are driven by the reg voltage. clear sound output is obtained even if a digital power supply is the vcc. 4) when using the regulator for an applic ation, other than this ic, and driving t he ic by vcc only, apply vcc at pin6. 5) when not using the regulator , it is set to off mode by connecting pin 19 to open and pin18 to open. apply vcc at pin6. 6) do not set a vcc applied voltage that is smaller than the set voltage of the regulator. since the reg output transistor operates in a saturation region, an abnormal circuit current occurs. 7) for the reg output transistor, rohm trans istors 2sa1900 and 2sa933 are recommended. downloaded from: http:///
technical note 5/9 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. BH7881EFV 4. short circuit detection 1) overview of sp amplifier vcc/gnd short circuit detection. if the output pin of the sp amplifier is short circuited to vc c or gnd, the detection function operates to suspend the output stage of the sp amplifier. if the sp output pin is short circuited to reg output, the detection function does not oper ate. it is conf igured so that it resets automatically if the short circuit is canceled. moreover, although a short circuit is detected from the dc voltage of the output pin, and there is a short delay distinguishing it from maximum out put amplitude, malfunction may occur due to factors such as power supply voltage and load. in this case, connect pin7 to gnd. the short circuit function is set to the off mode. 2) sp amplifier vcc/gnd short circuit detection cautions when the output pin of the sp amplifier is short circuited with vcc or gnd, exce ssive current flows in the ic and stress is applied to the chip. accordingly, if it is shorted a number of times, the ic gradually deteriorates and is finally destroyed. the short circuit detection function does not guarantee operation after numerous shorts. 3) regulator short circuit detection if the output pin of the r egulator is short circuited to gnd, the detection function operat es to suspend the output stage of the regulator. if t he output pin of the regulator is short circuited to vcc, an abnormal current does not occur in any circuit. after the short circuit, the regulator resets autom atically, due to the pull-up re sistance (for example, 2.2 k ? ) connected to pin1, as shown in the full option example of the sample application circuit. (example: 3.9 k is the resistance load for lowering the output im pedance of the regulator when it is no load.) 5. pop noise 1) the following table shows the sequence for eliminating the pop noise that occurs from turning the power supply on or off, or turning control pins on or off. order vcc act/spnd sp/hp conditions 1 off suspend hp power supply on 2 on suspend hp turning on in the suspend 3 on active hp sp mute countermeasure 4 on active sp+hp mute cancellation operation 5 on active sp+hp operation 6 on active hp sp mute counter measure 7 on suspend hp turning off in the suspend 8 off suspend hp power supply off 2) in speaker mute state, pop noise does not occur even when starting or changing modes. it is recommended to use speaker mute (headphone) mode during conditions where pop noise can occur. 3 ) any changes of the components values in the sample appli cation circuit can the effect the pop noise cut-off function. 6. bypass and bias capacitor 1) although this ic is designed so that bypass capacitors are not needed, when bypass capacitors are in fact necessary, place them close to the vcc~gnd pins. 2) similarly, place a bias capacitor close to the gnd pin. 7. capacitive load drive 1) do not connect a capacitive load to the sp amplifier, hp am plifier, or ic pin. there is a possibility of oscillation. 2) adding rc to the hp amplifier output, as in the sample application circuit, makes the output noise, voltage, and distortion sensitive to oscillation. downloaded from: http:///
technical note 6/9 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. BH7881EFV 8. pop noise at start/end when switching actv/spnd pop noise can be suppressed by mode transition due to software as in pop noise above, or by hardware as shown below. this is realized (in sp mode) by forcibly setting hp mode temporarily, using the cr differential circuit. fig.2 9. power package 1) in order to expand the power dissipation of the package, make the gnd pattern, directly below the ic, as wide as possible and solder the gnd pattern to the back of the ic. 2) power dissipation of the package varies greatly depending on fa ctors such as the number of layers, area, film thickness, and material quality of the board used. 10. other beween voltages of vcc=1.4 1.6 v, momentary oscillation sometimes is obser ved at the spout pin. nevertheless, this occurrence is not reproduced on a momentar y rise or fall of vcc. when slowly raising vcc pay attention to transient voltage. in order to avoid such occurrenc es, a sample circuit is illustrated below: fig.3 downloaded from: http:///
technical note 7/9 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. BH7881EFV application circuit fig.4 minimum external components example fig.5 maximum external components example downloaded from: http:///
technical note 8/9 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. BH7881EFV operation notes 1. numbers and data in entries are representative desi gn values and are not guaranteed values of the items. 2. although rohm is confident that the example application circuit reflects the best possible recommendations, be sure to verify circuit characteristics for your particular application. modification of constants for other externally connected circui ts may cause variations in both static and transient characteristi cs for external components as well as this rohm ic. allow for sufficient margins when determining circuit constants. 3. absolute maximum ratings use of the ic in excess of absolute maximum ratings, such as the applied voltage or operating temperature range (topr), may result in ic damage. assumptions should not be made r egarding the state of the ic (short mode or open mode) when such damage is suffered. a physical safety measure, such as a fuse, should be implemented when using the ic at times where the absolute maximum ratings may be exceeded. 4. gnd potential ensure a minimum gnd pin potential in all operating conditions. ma ke sure that no pins are at a voltage below the gnd at any time, regardless of whether it is a transient signal or not. 5. thermal design perform thermal design, in which there are adequate margins, by taking into account the permissible dissipation (pd) in actual states of use. 6. short circuit between terminals and erroneous mounting pay attention to the assembly direction of the ics. wrong m ounting direction or shorts between terminals, gnd, or other components on the circuits, can damage the ic. 7. operation in strong electromagnetic field using the ics in a strong electromagnetic field can cause oper ation malfunction. downloaded from: http:///
technical note 9/9 www.rohm.com 2010.06 - rev.a ? 2010 rohm co., ltd. all rights reserved. BH7881EFV ordering part number b h 7 8 8 1 e f v - e 2 part no. part no. package efv: htssop-b24 packaging and forming specification e2: embossed tape and reel (unit : mm) htssop-b24 0.65 1.0max 0.85 0.05 0.08 0.05 0.24 +0.05 - 0.04 0.08 m s 0.08 1.0 0.2 0.53 0.15 0.17 +0.05 - 0.03 4 + 6 4 s 24 13 11 2 0.325 (3.4) (5.0) 7.8 0.1 7.6 0.2 5.6 0.1 (max 8.15 include burr) 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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