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BGS12PL6 general purpose rf cmos power spdt switch in ultra small package with 0.77mm 2 footprint data sheet revision 2.4, 2014-05-27 p ower management & multimarket
edition may 27, 2014 published by in?neon technologies ag 81726 munich, germany c 2012 in?neon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, in?neon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest in?neon technologies of?ce ( www.in?neon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest in?neon technologies of?ce. in?neon technologies components may be used in life-support devices or systems only with the express written approval of in?neon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGS12PL6 revision history document no.: BGS12PL6.pdf previous version: v2.3, april 01, 2014 page subjects (major changes since last revision) 10 updated temperature range (table 6) trademarks of in?neon technologies ag aurix tm , c166 tm , canpak tm , cipos tm , cipurse tm ,coolgan tm ,coolmos tm , coolset tm , coolsic tm , corecontrol tm , dave tm , di-pol tm ,easypim tm , econobridge tm , econodual tm , econopack tm , econopim tm , eicedriver tm , eupec tm , fcos tm , hitfet tm , hybridpack tm , isoface tm , i 2 rf tm , isopack tm , mipaq tm , modstack tm , my-d tm , novalithic tm , omnitune tm , optimos tm , origa tm , optiga tm , profet tm , pro-sil tm , primarion tm , primepack tm , rasic tm , reversave tm , satric tm , sieget tm , sipmos tm , solid flash tm , smartlewis tm , tempfet tm , thinq! tm , tricore tm , trenchstop tm . other trademarks advance design system tm (ads) of agilent technologies, amba tm , arm tm , multi-ice tm , primecell tm , realview tm , thumb tm of arm limited, uk. autosar tm is licensed by autosar development partnership. bluetooth tm of bluetooth sig inc. cat-iq tm of dect forum. colossus tm , firstgps tm of trimble navigation ltd. emv tm of emvco, llc (visa holdings inc.). epcos tm of epcos ag. flexgo tm of microsoft corporation. flexray tm is licensed by flexray consortium. hyperterminal tm of hilgraeve incorporated. iec tm of commission electrotechnique internationale. irda tm of infrared data association corporation. iso tm of international organization for standardization. matlab tm of mathworks, inc. maxim tm of maxim integrated products, inc. microtec tm , nucleus tm of mentor graphics corporation. mifare tm of nxp. mipi tm of mipi alliance, inc. mips tm of mips technologies, inc., usa. murata tm of murata manufacturing co., microwave office tm (mwo) of applied wave research inc., omnivision tm of omnivision technologies, inc. openwave tm openwave systems inc. red hat tm red hat, inc. rfmd tm rf micro devices, inc. sirius tm of sirius sattelite radio inc. solaris tm of sun microsystems, inc. spansion tm of spansion llc ltd. symbian tm of symbian software limited. taiyo yuden tm of taiyo yuden co. teaklite tm of ceva, inc. tektronix tm of tektronix inc. toko tm of toko kabushiki kaisha ta. unix tm of x/open company limited. verilog tm , palladium tm of cadence design systems, inc. vlynq tm of texas instruments incorporated. vxworks tm , wind river tm of wind river systems, inc. zetex tm of diodes zetex limited. last trademarks update 2012-12-13 data sheet 3 revision 2.4 - 2014-05-27
BGS12PL6 contents 1 features 7 2 product description 7 3 maximum ratings 9 4 operation ranges 9 5 rf characteristics 10 6 pin description 12 7 package information 12 data sheet 4 revision 2.4 - 2014-05-27
BGS12PL6 list of figures 1 BGS12PL6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 pin con?guration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4 footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 pin 1 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6 tape drawing for tslp-6-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 data sheet 5 revision 2.4 - 2014-05-27
BGS12PL6 list of tables 1 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 operation ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 rf input power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 rf characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 data sheet 6 revision 2.4 - 2014-05-27
BGS12PL6 BGS12PL6 general purpose rf cmos power spdt switch in ultra small package with 0.77mm 2 footprint 1 features 2 high-linearity trx paths with power handling capability of up to 35 dbm all ports fully symmetrical low insertion loss low harmonic generation high port-to-port isolation 0.1 to 4 ghz coverage high esd robustness on-chip control logic very small leadless and halogen free package tslp-6-4 (0.7x1.1mm 2 ) with super low height of 0.31 mm no decoupling capacitors required if no dc applied on rf lines rohs compliant package 2 product description the BGS12PL6 general purpose rf mos power switch is designed to cover a broad range of high power applications from 30 mhz to 4 ghz, mainly in the transmit path of gsm, wcdma and lte mobile phones. the symmetric design of its single pole double throw con?guration, as shown in figure 1 offers high design ?exibility. this single supply chip integrates on-chip cmos logic driven by a simple, single-pin cmos or ttl compatible control input signal. the 0.1 db compression point exceeds the switchs maximum input power level of 35 dbm, resulting in linear performance at all signal levels. the rf switch has a very low insertion loss of 0.36 db in the 1 ghz, 0.46 db in the 2 ghz and 0.6 db in the 3 ghz range. the BGS12PL6 rf switch is manufactured in in?neons patented mos technology, offering the performance of gaas with the economy and integration of conventional cmos including the inherent higher esd robustness. the device has a very small size of only 0.7x 1.1mm 2 and a low height of 0.31mm. no decoupling capacitors are required in typical applications as long as no dc is applied to any rf port. table 1: ordering information type package marking BGS12PL6 tslp-6-4 p data sheet 7 revision 2.4 - 2014-05-27
BGS12PL6 figure 1: BGS12PL6 block diagram table 2: truth table switched paths ctrl rfin - rf1 0 rfin - rf2 1 data sheet 8 revision 2.4 - 2014-05-27 gnd rf1 vdd ctrl decoder +esd rf2 rfin gnd rf1 vdd ctrl decoder +esd rf2 rfin
BGS12PL6 3 maximum ratings table 3: maximum ratings at t a = 25 c, unless otherwise speci?ed parameter symbol values unit note / test condition min. typ. max. supply voltage v dd -0.5 C 5.5 v C control voltage v ctrl -0.3 C 3.6 v C storage temperature range t stg -55 C 150 c C rf input power at all rf ports p rf C C 36 dbm cw junction temperature t j C C 125 c C esd capability human body model 1) v esd _ hbm 1 C +1 kv C esd capability rfin port 2) v esd _ rfin 8 C +8 kv rfin versus gnd, with 27 nh shunt inductor 1) human body model ansi/esda/jedec js-001-2012 ( r = 1.5 k
, c = 100 pf). 2) iec 61000-4-2 ( r = 330
, c = 150 pf), contact discharge. attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to ab- solute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 4 operation ranges table 4: operation ranges parameter symbol values unit note / test condition min. typ. max. ambient temperature t a -40 25 85 c C rf frequency f 0.1 C 4 ghz C supply voltage v dd 2.4 C 3.6 v C control voltage low v ctrl _ l -0.3 C 0.3 v C control voltage high v ctrl _ h 1.4 C v dd v C table 5: rf input power parameter symbol values unit note / test condition min. typ. max. rf input power (50
) p in C C 35 dbm C data sheet 9 revision 2.4 - 2014-05-27
BGS12PL6 5 rf characteristics table 6: rf characteristics test conditions (unless otherwise speci?ed): terminating port impedance: z 0 = 50
temperature range: t a = -40 ... +85 c supply voltage: v dd = 2.4 ... 3.6 v input power: p in = 0 dbm parameter symbol values unit note / test condition min. typ. max. insertion loss all rf ports il 0.27 0.36 0.55 db 699-915 mhz 0.36 0.46 0.70 db 1710-1910 mhz 0.46 0.56 0.85 db 2170-2690 mhz 0.61 0.77 1.15 db 3800 mhz insertion loss 1 all rf ports il 0.33 0.36 0.40 db 699-915 mhz 0.40 0.46 0.50 db 1710-1910 mhz 0.52 0.56 0.65 db 2170-2690 mhz 0.65 0.77 0.90 db 3800 mhz return loss all rf ports rl 20 25 35 db 699-915 mhz 16 20 28 db 1710-1910 mhz 14 18 27 db 2170-2690 mhz 12 15 20 db 3800 mhz isolation rfin to rf1/rf2 port iso rfin rfx 34 37 C db 699-915 mhz 27 30 C db 1710-1910 mhz 23 27 C db 2170-2690 mhz 19 22 C db 3800 mhz rf1 to rf2 port iso port port 45 50 C db 699-915 mhz 34 36 C db 1710-1910 mhz 28 31 C db 2170-2690 mhz 24 27 C db 3800 mhz p0.1 db compression point all rf ports p 0.1 db C 38 C dbm 699 - 2700 mhz 1 t a = +25 c, v dd = 3 v data sheet 10 revision 2.4 - 2014-05-27
BGS12PL6 parameter symbol values unit note / test condition min. typ. max. harmonic generation up to 12.75 ghz 1 all rf ports, 2 nd harmonic p harm -90 -80 -70 dbc f = 824 mhz , p in = 27.5 dbm , all rf ports, 3 rd harmonic -100 -90 -80 dbc 50
, 50 % duty cycle intermodulation distortion in rx band 1,2 imd2, low imd 2 low C -110 -100 dbm tx = 15 dbm, interferer = -15 dbm, 50
imd3 imd 3 C -110 -100 dbm imd2, high imd 2 high C -110 -100 dbm switching time and current consumption rf rise time t 10% 90% C 0.55 1.5 s 10% - 90% of rf signal ctrl to rf time t ctrl rf C 1.4 3 s 50% of ctrl signal to 90% of rf signal supply current i dd 80 200 350 a C control current i ctrl C 1 10 a C note: all electrical characteristics are measured with all rf ports terminated by 50
loads. 1 t a = +25 c, v dd = 3 v 2 with external shunt l data sheet 11 revision 2.4 - 2014-05-27
BGS12PL6 6 pin description figure 2: pin con?guration table 7: pin description pin no. name pin type buffer type function 1 rf2 i/o rf port 2 2 gnd gnd ground 3 rf1 i/o rf port 1 4 vdd pwr supply voltage 5 rfin i/o rf port in 6 ctrl i control pin 7 package information table 8: mechanical data parameter symbol value unit x-dimension x 0.7 0.05 mm y-dimension y 1.1 0.05 mm size size 0.77 mm 2 height h 0.31 +0.01/ 0.02 mm data sheet 12 revision 2.4 - 2014-05-27 1 2 3 4 5 6 rf 2 gnd rf 1 ctrl rfin vdd
BGS12PL6 figure 3: package outline figure 4: footprint figure 5: pin 1 marking (top view) data sheet 13 revision 2.4 - 2014-05-27 0.05 max. 0.05 0.7 0.035 0.2 1) 0.035 0.2 1) 1.1 0.05 0.4 0.4 1) dimension applies to plated terminals 5 2 6 4 1 3 top view bottom view pin 1 marking tslp-6-4-po v01 (0.05) (0.05) (0.05) (0.05) +0.01 0.31 -0.02 0.25 0.4 0.25 0.4 0.25 0.4 0.25 0.4 tslp-6-4-fp v01 stencil apertures copper solder mask (stencil thickness 100 m) n s m d
BGS12PL6 figure 6: tape drawing for tslp-6-4 data sheet 14 revision 2.4 - 2014-05-27 2 0.4 pin 1 marking tslp-6-4-tp v01 0.85 1.25 8
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