cystech electronics corp. spec. no. : c802fp issued date : 2010.01.08 revised date : 2012.01.13 page no. : 1/9 MTN12N65FP cystek product specification n-channel enhancement mode power mosfet MTN12N65FP description the MTN12N65FP is a n-channel enhancement-mode mosfet, providing the designer with the best combination of fast switching, ruggedized device de sign, low on-resistance and cost effectiveness. the to-220fp package is universally preferre d for all commercial-industrial applications features ? low on resistance ? simple drive requirement ? fast switching characteristic ? insulating package, front/back side insulating voltage=2500v(ac) ? rohs compliant package applications ? adapter ? switching mode power supply symbol outline MTN12N65FP to-220fp to-220fp (c forming) (s forming) g gate d drain s source bv dss : 650v g d s g d s i d : 12a r ds(on) : 0.6 (typ.)
cystech electronics corp. spec. no. : c802fp issued date : 2010.01.08 revised date : 2012.01.13 page no. : 2/9 MTN12N65FP cystek product specification absolute maximum ratings (t c =25 c) parameter symbol limits unit drain-source voltage v ds 650 v gate-source voltage v gs 30 v continuous drain current i d 12* a continuous drain current @t c =100c i d 7.2* a pulsed drain current @ v gs =10v (note 1) i dm 48* a single pulse avalanche energy (note 2) e as 624 mj avalanche current (note 1) i ar 12 a repetitive avalanche energy (note 1) e ar 5.1 mj peak diode recovery dv/dt (note 3) dv/dt 4.5 v/ns maximum temperature for solder ing @ lead at 0.125 in(0.318mm) from case for 10 seconds t l 300 c w total power dissipation (t c =25 ) linear derating factor 51 0.41 w/ c operating junction and storage temperature tj, tstg -55~+150 c *drain current limited by maximum junction temperature note : 1 . repetitive rating; pulse width limited by maximum junction temperature. 2 . i as =12a, v dd =50v, l=8mh, r g =25 , starting t j =+25 . 3. i sd 12a, di/dt 100a/ s, v dd bv dss , starting t j =+25 . thermal data parameter symbol value unit thermal resistance, junction-to-case, max r th,j-c 2.43 c/w thermal resistance, junction-to-ambient, max r th,j-a 62.5 c/w
cystech electronics corp. spec. no. : c802fp issued date : 2010.01.08 revised date : 2012.01.13 page no. : 3/9 MTN12N65FP cystek product specification characteristics (tj=25 c, unless otherwise specified) symbol min. typ. max. unit test conditions static bv dss 650 - - v v gs =0, i d =250 a, tj=25 ? bv dss / ? tj - 0.5 - v/ c reference to 25c, i d =250 a v gs(th) 2.0 - 4.0 v v ds = v gs , i d =250 a *g fs - 5 - s v ds =15v, i d =7a i gss - - 100 na v gs = 30 - - 1 v ds =650v, v gs =0 i dss - - 10 a v ds =520v, v gs =0, tj=125 c *r ds(on) - 0.6 0.65 v gs =10v, i d =6a dynamic *qg - 38 49 *qgs - 8.2 - *qgd - 13.7 - nc i d =12a, v ds =520v, v gs =10v *t d(on) - 30 70 *tr - 85 180 *t d(off) - 140 280 *t f - 90 190 ns v ds =325v, i d =12a, v gs =10v, r g =25 ciss - 1835 2385 coss - 185 240 crss - 16 21 pf v gs =0v, v ds =25v, f=1mhz source-drain diode *i s - - 12 *i sm - - 48 a *v sd - - 1.5 v i s =12a, v gs =0v *trr - 420 - ns *qrr - 4.9 - c v gs =0, i f =12a, di/dt=100a/ s *pulse test : pulse width 300 s, duty cycle 2% ordering information device package shipping MTN12N65FP to-220fp(c forming) (rohs compliant) 50 pcs/tube, 20 tubes/box, 4 boxes / carton MTN12N65FPs to-220fp(s forming) (rohs compliant) 50 pcs/tube, 20 tubes/box, 4 boxes / carton
cystech electronics corp. spec. no. : c802fp issued date : 2010.01.08 revised date : 2012.01.13 page no. : 4/9 MTN12N65FP cystek product specification typical characteristics
cystech electronics corp. spec. no. : c802fp issued date : 2010.01.08 revised date : 2012.01.13 page no. : 5/9 MTN12N65FP cystek product specification typical characteristics(cont.)
cystech electronics corp. spec. no. : c802fp issued date : 2010.01.08 revised date : 2012.01.13 page no. : 6/9 MTN12N65FP cystek product specification test circuit and waveforms
cystech electronics corp. spec. no. : c802fp issued date : 2010.01.08 revised date : 2012.01.13 page no. : 7/9 MTN12N65FP cystek product specification test circuit and waveforms(cont.)
cystech electronics corp. spec. no. : c802fp issued date : 2010.01.08 revised date : 2012.01.13 page no. : 8/9 MTN12N65FP cystek product specification to-220fp (c forming) dimension *typical inches millimeters inches millimeters marking: date code device name style: pin 1.gate 2.drain 3.source 3-lead to-220fp plastic package cystek package code: fp dim min. max. dim min. max. min. max. min. max. a 0.169 0.185 4.300 4.700 e 0.583 0.598 14.800 15.200 a1 0.051 ref 1.300 ref e 0.100* 2.540* a2 0.110 0.126 2.800 3.200 f 0.106 ref 2.700 ref a3 0.098 0.114 2.500 2.900 0.138 ref 3.500 ref b 0.020 0.030 0.500 0.750 h 0.000 0.012 0.000 0.300 b1 0.043 0.053 1.100 1.350 l 1.102 1.118 28.000 28.400 b2 0.059 0.069 1.500 1.750 l1 0.067 0.075 1.700 1.900 c 0.020 0.030 0.500 0.750 l2 0.075 0.083 1.900 2.100 d 0.392 0.408 9.960 10.360 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0.
cystech electronics corp. spec. no. : c802fp issued date : 2010.01.08 revised date : 2012.01.13 page no. : 9/9 MTN12N65FP cystek product specification to-220fp (s forming) dimension style: pin 1.gate 2.drain 3.source 3-lead to-220fp plastic package cystek package code: fp marking: date code device name *typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.171 0.183 4.35 4.65 g 0.246 0.258 6.25 6.55 a1 0.051 ref 1.300 ref h 0.138 ref 3.50 ref a2 0.112 0.124 2.85 3.15 h1 0.055 ref 1.40 ref a3 0.102 0.110 2.60 2.80 h2 0.256 0.272 6.50 6.90 b 0.020 0.030 0.50 0.75 j 0.031 ref 0.80 ref b1 0.031 0.041 0.80 1.05 k 0.020 0.50 ref b2 0.047 ref 1.20 ref l 1.102 1.118 28.00 28.40 c 0.020 0.030 0.500 0.750 l1 0.043 0.051 1.10 1.30 d 0.396 0.404 10.06 10.26 l2 0.036 0.043 0.92 1.08 e 0.583 0.598 14.80 15.20 m 0.067 ref 1.70 ref e 0.100 * 2.54* n 0.012 ref 0.30 ref f 0.106 ref 2.70 ref notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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