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luxpia co.,ltd. 948-1, dunsan-li bongdong-eup, wanju-gun, jeonbuk, korea tel 82-70-8671-2500 fax 82-70-8620-8081 comments luxpia co., ltd. date : . . . date : . . . designed by checked by approved by approved by approved by approved by / / / / / / part no. : LRH1032 s p ecification for a pp roval ( tentative 1.0 )
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- contents - 1. features 2. package outline dimensions and materials 3. absolute maximum ratings 4. electro-optical characteristics 5. materials 6. taping 7. packing 8. reliability 9. warranty 10. others 11. characteristic diagrams
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1. features ? package : smd top view type (2chips in 1) ? dimension : 3.5 2.8 1.9 mm (lwh) ? small size surface mount type ? viewing angle : extremely wide(120 ? ) ? soldering methods : ir reflow soldering 2. package outline dimensions and recommended solder patterns (unit : mm)
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3. absolute maximum ratings (t a =25 ? ) item symbol value unit forward current i f 60 ma pulse forward current 1) i fp 100 ma reverse current v r 5 v power dissipation p d 80 mw operating temperature t opr -30 to +85 ? storage temperature t stg -40 to +100 ?
* '1 dpoejujpotqvmtfxjeui ntfdevuzsbujp 4. electro-optical characteristics (t a =25 ? ) item rank symbol condition min typ max unit forward voltage 2) 1 v f i f = 40ma 1.8 - 2.0 v 2 2.0 - 2.2 3 2.2 - 2.4 4 2.4 - 2.6 dominant wavelength 3) - d if= 40ma 620 - 630 nm luminous intensity 4) k iv if= 40ma 500 - 800 mcd l 800 - 1100 m 1100 - 1400 n 1400 - 1700 o 1700 - 2000 reverse current - i r v r =5v - - 50 u 2) forward voltages are tested at a current pulse du ration of 10 ms and an accuracy within 0.1v. 3) dominant wavelength are tested at a current pulse duration of 10 ms and an accuracy within 1nm. 4) the allowance of luminous intensity measurement is within 10%. * to avoid optical difference, please do not mix differently ranked product. * all measurements were made under the standardized environment of luxpia.
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5. materials item material led chip algainp wire gold lead frame copper alloy/ni/ag plating encapsulation silicone resin heat-resistant polymer ppa 6. taping 6.1. tape (material : ps conductive, 10 4 ~10 5 ? ) (unit : mm) cathode anode
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6.2. wheel (color : black) - quantity per reel LRH1032 : 2,000pcs 6.3. label part no. size (l x w) : 85mm 50mm i v rank v f rank LRH1032 m - 2 2 , 000ea (unit : mm)
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7. packing ? the leds are packed in cardboard boxes after tapi ng. the label shows part number, lot number, rank, and quantity. ? in order to protect the leds from mechanical shock, they are packed with cardboard boxes for transportation. ? the leds may be damaged if the boxes are dropped or receive a strong impact against them, so cautions must be taken to prevent any possible damage. ? the boxes are not water-resistant and, therefore, must be kept away from water and moisture. ? when the leds are transported, it is recommended that the same packing method as luxpia's is used. ? if noticeable damage on a box appears upon arrival at the user?s warehouse, the user should submit a claim to luxpia within one week after arrival of the products.
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8. reliability 8.1. test items and results no tes t item tes t co nditions no te number of damaged 1 resistance to soldering heat (reflow) t sld =260 o c, 10sec (pre treatment 60 o c,90%,24hrs) 2 times 0/45 2 solderability (reflow) t sld =2155 o c, 3sec 1 time over 95% 0/45 3 temperature cycle -40 o c through +25 o c to +100 ? (30min/5min/30min) 100 cycles 0/45 4 high temperature storage t a =100 ? 1000 hrs 0/45 5 high humidity and temperature storage t a =60 , rh=90% ? 1000 hrs 0/45 6 low temperature storage t a =-40 ? 1000 hrs 0/45 7 steady state operating life condition t a =25 , i ? f =60ma 500 hrs 0/45 8 steady state operating life of high temperature t a =85 , i ? f =15ma 1000 hrs 0/45 9 steady state operating life of high humidity heat t a =60 , rh=90%, i ? f =40ma 500 hrs 0/45 10 steady state operating life of low temperature t a =-30 , i ? f =40ma 1000 hrs 0/45 * led with luxpia standard circuit board 8.2. criteria for judging the damage item symbol test condition criteria for judgement min max forward voltage v f i f = 40ma - u.s.l. 5) 1.1 luminous intensity i v i f = 40ma l.s.l. 6) 0.7 - 5) u.s.l. : upper standard level 6) l.s.l. : lower standard level
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9. cautions the leds are device which are materialized by combin ing blue leds and special phosphors. consequently, the color of white leds is subject to change a little by an operating current. care should be taken after due consideration when using leds. (1) moisture-proof package ? when moisture is absorbed into the smt package it may vaporize and expand products during soldering. there is a possibility that this may cause exfoliation of the contacts and damage to the optical characteristics of the leds. for this reason, the moisture-proof pack age is used to keep moisture to a minimum in the package. ? a package of a moisture-absorbent material (silica gel) is inserted into the shielding bag. the silica gel changes its color from yellow to green as it absorbs moisture. (2) storage ? storage conditions - after opening the package : the leds should be kept at 5 ~40 or less and 30%rh or less. the leds should be used within a year. ?? when storing the leds, moisture-proof packaging wi th moisture-absorbent material (silica gel) is recommended. if unused leds remain, they should be stored in moisture-proof packages, such as sealed containers with packages of moisture -absorbent material (silica gel). it is also recommended to return the leds to the original moisture-proof bag and to reseal the moisture-proof bag again. ? if the moisture-absorbent material (silica gel) has faded away or the leds have exceeded the recommended storage time, baking treatment should be performed using the following conditions. - baking treatment : led bulk: more than 12 hours at 1255 ? led reel: more than 24 hours at 605 ? ? after assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the leds within an end product, and the gases entering into the product from the external atmosphere. the above should be taken into consideration when designing. ? please avoid rapid transitions in ambient temperat ure, especially in high humidity environments where condensation can occur. (3) heat generation ? thermal design of the end product is of paramount importance. please consider the heat generation of the led when the system is designed. the coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of led placement on the board, as well as other components. it is necessary to avoid intense heat generation and operate within the maximum ratings given in the specification. ? the operating current should be decided after considering the ambient maximum temperature of leds. (4) recommended circuit ? in designing a circuit, the current though each led must not exceed its absolute maximum rating. it is recommended to use circuit b which regulates the current flowing through each led. in the meanwhile, when driving leds with a constant voltage in circuit a, the current through the leds may vary due to the variation
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in forward (vf) of the leds. in worst case, some led ma y be subjected to stresses in excess of the absolute maximum rating. ? this product should be operated in forward bias. drivin g circuit must be designed so that the product is not subjected to either forward or reverse voltage while it is off. in particular, if a reverse voltage is continuously applied to the product, such operation ca n cause migration resulting in led damage. ? please determine the operating current with consideration of the ambient temperature local to the led and refer to the plot of ambient temperature vs. allo wable forward current on characteristics in this specifications. please also take measures to remo ve heat from the area near the led to improve the operational characteristics of the led. (5) handling precautions ? bare hand when handling the product, touching encapsulant wi th bare hands will contaminate its surface that could affects optical characteristics. in the worst cases, excessive force the encapsulant by hands might result in catastrophic failure of the leds due to wire deformation and/or breakage. ? tweezers since silicone used as encapsulating resin in this prod uct is a soft material, the upper surface of the product is soft. pressuring onto the product might cause ca tastrophic failure of the leds due to damage to encapsulant (such as scratch, chip-o ut and delamination) and wire (suc h as deformation and breakage) and led detachment. ? pick and place recommended conditions: outer nozzle ?? 2.4mm ? avoid direct contact to the encapsulant with the picking nozzle.
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failure to comply might result in damage to encapsul ant and in the worst cases, catastrophic failure of the leds due to wire deform ation and/or breakage. ? drop please note that a package damage such as cr ack might occur when having dropped the product. ? printed circuit board assembled (pcb with leds soldered) do not stack assembled pcbs together. since silicone is a soft material abrasion between two pcb assembled with encapsulate led might cause catastrophic failure of the leds due to damage to encapsulant (such as scratch, chip-out and delamination) and wire (suc h as deformation and breakage) and led detachment.
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(6) soldering conditions ? the leds can be soldered in place using the re flow soldering method. luxpia does not make any guarantee on the leds after they have been assembled using the dip soldering method. ? recommended soldering conditions reflow soldering hand soldering pre-heat pre-heat time peak temperature soldering time condition lead solder lead-free solder temperature soldering time 350 ? max. 3sec max. (one time only) 120~150 ? 120sec max. 240 ? max. 10sec max. refer to profile y 180~200 ? 120sec max. 260 ? max. 10sec max. refer to profile t * although the recommended soldering conditions are sp ecified in the above table, reflow soldering at the lowest possible temperature is desirable for the leds. * a rapid-rate process is not recommended for cooling the leds down from the peak temperature. [temperature-profile (surface of circuit board)] use the conditions shown to the following figures. < y : lead solder> < t : lead-free solder> ? occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. it is recommended that the user use the nitrogen reflow method. ? repairing should not be done after the leds have b een soldered. when repairing is unavoidable, a double- head soldering iron should be used. it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing.
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? reflow soldering should not be done more than two times. ? when soldering, do not put stress on the leds during heating. ? after soldering, do not warp the circuit board. (7) cleaning ? it is recommended that isopropyl alcohol be used as a solvent for cleaning the leds. when using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. freon solvents should not be used to clean the le ds because of worldwide re gulations. do not clean the leds by the ultrasonic. when it is absolutely necess ary, the influence of ultrasonic cleaning on the leds depends on factors such as ultrasonic power and the asse mbled condition. before cleaning, a pre-test should be done to confirm whether any damage to the leds will occur. (8) static electricity ? static electricity or surge voltage damages the leds. it is recommended that a wrist band or an anti- electrostatic glove be used when handling the leds. ? all devices, equipment and machinery must be proper ly grounded. it is recommended that measurements be taken against surge voltage to the equipment that mounts the leds. ? when inspecting the final products in which leds we re assembled, it is recommended to check whether the assembled leds are damaged by static electricity or not. it is easy to find static-damaged leds by a light-on test or a v f test at a lower current (below 1ma is recommended). ? damaged leds will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the leds do not light at the low current. - criteria : v f > 1.0v at i f =0.5 v (9) others ? this led complies with rohs directive. ? the led light output is strong enough to injure human eyes. precautions must be taken to prevent looking directly at the leds with unaided eyes for more than a few seconds. ? flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. also, people should be cautious when us ing equipment that has had leds incorporated into it. ? the customer not reverse engineer by disassembling or analysis of the leds without having prior written consent from luxpia. when defective leds are found, the user shall inform luxpia directly before disassembling or analysis. ? the warranties of quality set forth herein are excl usive. all previous negotiations and agreements not specifically incorporated herein are superseded and rendered null and void. ? both parties shall sincerely try to find a soluti on when any disagreement occurs regarding these specifications. ? these specifications can be revised upon mutual agreement. ? luxpia understands that the user accepts the content of these specifications, if the user does not return these specifications with signatures within 3 weeks after receipt. ? the leds described in the specification are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, on the app lications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices)
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10. warranty (1) luxpia warrants that its leds conform to the foregoin g specifications and that luxpia will convey good title to all leds sold. (2) luxpia disclaims all other warranties including the implied warranties of merchantability and fitness for a particular purpose. (3) in the event any led supplied by luxpia is found no t to conform to the foregoing specifications within ninety days of receipt, luxpia will repair or replace the led, at luxpia?s discretion, provided that the user (a) promptly notifies luxpia in writing of the details of th e defect (b) ships the leds at the user?s expense to luxpia for examination, and (c) the defect is due to th e negligence of luxpia and not mishandling or misuse by the user. (4) luxpia will not take responsibility for any trouble that is caused by using the le ds at conditions exceeding our specifications. (5) these specifications are applied only when a led st ands alone and it is strongly recommended that the user of the leds confirms the properties upon assembly . luxpia is not responsible for failures caused during and after assembling. it will be excepted from the rule if the failure would caused undoubtedly by luxpia. (6) a claim report stating details about the defect sha ll be made when returning defective leds. luxpia will investigate the report immediately and inform the user of the results. (7) luxpia?s liability for defective lamps shall be limited to replacement and in no event shall luxpia be liable for consequential damage or lost profits.
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11. characteristic diagrams *all characteristics shown are for reference only are not guarantee. (1) forward voltage vs. forward current (3) ambient temperature vs. allowable forward current (4) ambient temperature vs. relative luminosity (t a =25 ? ) forward current i f [ma] forward voltage v f [v] (2) forward current vs. relative luminosity (t a =25 ? ) forward current i f [ma] relative luminosity [a.u.] allowable forward current i af [ma] relative luminosity[a.u.] ambient temperature t a [ ? ] ambient temperature t a [ ? ] (i f =40ma)
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(t a =25 ? , i f =40ma) (6) radiation characteristics (t a =25 ? , i f =40ma) (5) relative spectral emission intensity [a.u] wavelength [nm] relative luminous intensity iv[%]

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