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ic specification mlx10803 high power led driver 3901010803 page 1/25 data sheet rev026 jun/2012 features general low cost power led driver for external n-channel m osfet switching transistor 6v to 32v dc input range applications from ma to several ampere led current possible temperature dependent regulation using ex ternal negative temperature coefficient (ntc) resistor small package allows compact module design with minimised wire runs and short connections to achiev e improved emc performance built-in randomiser for improved emc performance high temperature operation capable load dump protected to 80v led driver high energy efficiency pwm dimming via vs/pwm pin light output has minimised dependency on supply an d temperature variations led regulation parameters set with external resist ors 1 2 3 4 8 7 6 5 vref iref2 iref1 drvgate rsense rosc gnd 10803 (soic8) vs/pwm ordering code product code temperature code package code option code packing form code mlx10803 k dc aaa-000 re legend : temperature code: k for temperature -40c to 125c package code: dc for soic150mil packing form: re for reel ordering example: mlx10803kdc-aaa-000-re general description the mlx10803 is a multi-purpose led driver for high power leds designed for high cu rrent and high voltage applications. the circuit is designed for demanding automotive applications and therefore suitable in all other high intensity led applications. numerous adjustment possibilities allow for the des ign of different led applications using only a few external components. the circuit is load dump protected for 80v load dum p pulse.
ic specification mlx10803 high power led driver 3901010803 page 2/25 data sheet rev026 jun/2012 table of contents features .......................................... ................................................... .............. 1 general description ............................... ................................................... ....... 1 table of contents ................................. ................................................... ......... 2 block diagram ..................................... ................................................... .......... 3 1. typical application data .......................... .................................................. 4 1.1. led driver applications ........................... ........................................... 4 1.1.1. principle complete schematic led driver diagram ... .................. 4 1.1.2. principle soft start up led driver diagram ........ .......................... 5 1.1.3. led driver application notes ...................... ................................. 5 2. application pins .................................. ................................................... .... 7 3. absolute maximum ratings .......................... .............................................. 7 4. electrical characteristics ........................ ................................................... 8 5. esd/emi recommendations for mlx10803 .............. .............................. 11 6. automotive test pulses ............................ ................................................ 12 6.1. test pulse definition ............................. ............................................ 13 7. led driving principle ............................. .................................................. 16 7.1. general ........................................... ................................................. 1 6 7.2. the principle in detail ........................... ............................................ 17 7.3. switching frequency considerations and constant lig ht output ......... 20 8. temperature regulation ............................ ............................................... 21 9. mechanical data ................................... .................................................. 22 9.1. mechanical data of the mlx10803 package ........... ......................... 22 10. standard information regarding manufacturability of melexis products with different soldering processes ............................... ................................................... ..... 23 11. history record .................................... .................................................. 24 12. disclaimer ........................................ ................................................... 25
ic specification mlx10803 high power led driver 3901010803 page 3/25 data sheet rev026 jun/2012 block diagram vs/pwm vs/pwm iref2 iref1 drvgate rsense debouncing 300 ns off ff on monoflop with pseudo random generator off timer 4.2 s (average value) at f osc = 2.5 mhz on timer 23.4 s (average value) at f osc = 2.5mhz rc oscillator tunable: 0.5 mhz to 5 mhz frequ. tolerance: 20 % start off reference currents trim logic (incl. zener zaps) ... i ref_x clamping max. 12 v rosc gnd por regulator vdd 5.0 v 10 % power on reset vdd vref comp minimal voltage selection 4v 4v divider 1/5 divider 1/10 comp start on comp 20mv 1.25v
ic specification mlx10803 high power led driver 3901010803 page 4/25 data sheet rev026 jun/2012 1. typical application data 1.1. led driver applications 1.1.1. principle complete schematic led driver diag ram rosc iref2 vref gnd rsense drvgate vs/pwm vbat gnd 100nf cap for emc directly on the connector 100nf...1uf ntc vs/pwm vref_set iref1 cnoise rosc iref2 vref gnd rsense drvgate vs/pwm vsup gnd iref1
ic specification mlx10803 high power led driver 3901010803 page 5/25 data sheet rev026 jun/2012 1.1.2. principle soft start up led driver diagram rosc iref2 vref gnd rsense drvgate vs/pwm vbat gnd 100nf cap for emc directly on the connector 100nf...1uf iref1 figure 1: 1.1.3. led driver application notes the mlx10803 is optimised for the use of low cost c oils and n-channel mosfets. for a standard applicat ion with 1 led and an average current of 350ma, a coil of ab out 100h?220h and 1 dc resistance should be chosen. the sense resistor should have a value betw een 0.27 ?0.47 / 250mw. as a general rule: for higher load current lower in ductance of the coil is needed because higher curre nts lengthen the charging time of the coil. thus, switching freq uencies may become lower than 20khz which is often not desired. it is possible to set the peak current and the aver age current of the led by variation of the rsense r esistor, the coil value and the internal oscillator frequency (r ocs resistor). the flyback diode that carries the load current dur ing the passive state (driver off) should be a fast switching and low intrinsic capacitance diode like es1d or byg80 in order to avoid parasitic spikes on rsense. the d iode must be able to carry the led current flowing during the off time of the driver. the n-channel mosfet should have low intrinsic capa citances, a drain-source voltage suitable for the a pplication and must be able to carry the current flowing throu gh the led(s) during the on time. to decrease the t ime of transistor switching and to improve the thermal beh aviour of the module, the lines between transistor and ic should be minimised. for applications that use an ntc resistor for tempe rature sensing, the ntc value has to be selected ac cording to the application requirements. for most applications , a ntc value up to 470k will be suitable. in case of longer lines between the ic and the coil (which should be avoided because of emi), a capaci tor might be placed in parallel to rsense to avoid crosstalk and parasitic switching. well chosen parameters for ex ternal components can help to avoid such conditions. the g oal should be to unload the coil as much as possibl e during the selected off time (see also chapter 7).
ic specification mlx10803 high power led driver 3901010803 page 6/25 data sheet rev026 jun/2012 to reduce an influence of noise which can be couple d to sensitive reference pins iref1, iref2 it is po ssible to connect noise-filtering capacitors in parallel to i ref1 and iref2 resistors (see figure 1, cnoise capa citors). the coupling also should be reduced as much as possible by proper routing of iref1 and iref2 stripes on pc b. iref2 resistor should be placed as close as possibl e to iref2 pin and stripe from iref1 pin to ntc res istor should be shielded by gnd stripe. the schematic diagram under figure 1 is used in app lications where the led is controlled by external c ontrol electronics. a pwm with a frequency between 30hz..5 khz can be applied to the vs/pwm pin in order to dim the light output. this frequency is limited by the time needed for recharging the coil and monoflo p time selected by the resistor connected to rosc as well as by the ic settling time after por. this function can be u sed to achieve different light outputs or also be used in a temperature down regulation. it is recommended to have the pwm frequency at leas t 5-10 times lower than the selected driver switchi ng frequency. diode is placed between drvgate and vs/pwm ic pins serves as discharger of gate of fet transistor. thu s, having switched off ic at vs/pwm voltage=0 drvgate turns to z-state. charge that was stored in gate ca pacitor runs down to vs/pwm module pin via the diode. the minimum schematic diagram under figure 2 is suf ficient for all applications with a constant light output. we also recommend to compare with our other circuit s in the mlx108xx family and study these applicatio n notes for suitable solutions.
ic specification mlx10803 high power led driver 3901010803 page 7/25 data sheet rev026 jun/2012 2. application pins nr. name function 1 vref analogue input, setting of led peak current 2 rosc external resistor sets internal oscillator f requency. sets the average discharge time of the co il 3 iref1 external ntc resistor for temperature down regulation 4 iref2 external resistor sets the temperature brea kpoint when the ntc resistor starts down regulation 5 rsense external sense resistor pin for peak curre nt detection 6 gnd ground 7 drvgate pin driving the gate of the switching tra nsistor 8 vs/pwm supply voltage / pwm signal 3. absolute maximum ratings parameter symbol condition min max unit power supply (vs/pwm) vs dc max. 2h -0.3 -0.3 32 36 v v power supply, non operational function max. 0.5s (load dump) vsmax max 0.5s 36 80 v input current in protection circuitry on any pin ip rot in case of maximum supply ratings -10 10 ma input voltage on rsense pin virsense normal operation -0.3 11 input voltage on iref1, iref2, vref pins vrefmax wi thout external resistor protected by external 47k resistor -0.3 -80 (0.5s) 40 80 (0.5s) v v input voltage on rosc pin vroscmax normal operation -0.3 vdd+0.3 v input voltage on drvgate pin vdrvgatmax idrvgatemax current must not be exceeded -0.3 22 v input/output current on drvgate pin idrgatemax puls e mode 500 ma junction temperature lifetime dynamic storage temperature tjunc normal operation. max. 100h -40 -40 -55 140 150 150 c ambient temperature range tambient normal operation -40 125 c thermal resistance junction to ambient rth soic8 1 28.4 k/w
ic specification mlx10803 high power led driver 3901010803 page 8/25 data sheet rev026 jun/2012 4. electrical characteristics following characteristics are valid - for the full temperature range of tambient = -40c to +125c, - a supply range of 32v vs > 6v unless other conditions noted. with 6v vs > vporh analogue parameters can not be guarante ed. note: the correct operation of the mlx10803 as a switchi ng mode power supply for voltages lower than the nominal supply voltage is dependent on the forward bias voltage of the used led. the user must ensure that at low supply voltage the peak current threshold voltage on the rsense pin c an be reached in order to keep the switching principle working. if several pins are charged with transients above v s/pwm and below gnd, the sum of all substrate currents of the influenced pins should not exceed 10ma for correct operation of the device. normal operating supply voltage is supposed to be 1 3.8v. parameter symbol conditions limits units min typ max global parameters maximum current during 80v load dump ihv vs=80v 10 ma normal supply current at highest dc voltage inomdch vs=32v 2 ma normal supply current inom vs=13.8v 400 700 a ic settling time ic settling time after power on reset tsettle 10 s oscillator related parameters the min/max specification influences inversely all derived timings min oscillator frequency foscmin for a selected external resistor rosc of 440k and room temperature 0.4 0.5 0.6 mhz max oscillator frequency foscmax for a selected external resistor rosc of 40k and room temperature 4.0 5.0 6.0 mhz extended min oscillator frequency foscext for a selected external resistor rosc of 1200k and room temperature 1 0.148 0.184 0.221 mhz
ic specification mlx10803 high power led driver 3901010803 page 9/25 data sheet rev026 jun/2012 reset related parameters power on reset level, if vs/pwm is ramped up vporh reset is connected to the internal vdd, but vporh is measured on pin vs/pwm 1.5 4 v power on reset hysteresis, if vs/pwm is drawn down vporhyst reset is connected to the internal vdd, but vporhyst is measured on pin vs/pwm 0.1 0.7 v vdd related parameters (vdd used internal ly only ) internal supply voltage range vdd vs=13.8v 4.5 5.5 v rsense related parameters input leakage current ileakrsense vs=13.8v, vrsense=0v, 5v -20 20 a debounce time after switching on tdeb vs=13.8 200 500 ns vref related parameters leakage current ileakvref vs=13.8v, vvref=0v, 5v -20 20 a drvgate cessation voltage vswoff 2 vs=13.8v 15 20 25 mv sensitive voltage range vvrefrng 2 vs=13.8v vswoff 3.8 v linear voltage range vvreflinrng 2 vs=13.8v 0.1 3.8 v iref1 related parameters output current for external reference measurement iiref1 vs=13.8v, viref1=viref1rng 46.5 50 52.5 a temperature drift of the current iiref1drift -0.1 %/ c sensitive voltage range viref1rng 2 vs=13.8v vswoff 3.6 v linear voltage range viref1linrng 2 vs=13.8v 0.1 3.6 v iref2 related parameters difference of iiref2 to iiref1 difiref12 vs=13.8v, viref1=viref2rng -10 +10 % temperature drift of the current iiref2drift -0.1 %/ c sensitive voltage range viref2rng 2 vs=13.8v vswoff 3.6 v linear voltage range viref2linrng 2 vs=13.8v 0.1 3.6 v drvgate related parameters max output voltage in on state vmaxdrv load current 1 a to gnd, vs=13.8v 10 13 v output resistance of push-pull output rdrvgateout to gnd pin to vs/pwm pin, vs=13.8v 3.5 20 7.8 40 15 60
ic specification mlx10803 high power led driver 3901010803 page 10/25 data sheet rev026 jun/2012 rosc related parameters 3 output voltage vrosc vs=13.8v 1 1.5 v resistance on pin to gnd for 0.5mhz roscmin 440 k resistance on pin to gnd for 1mhz roscmid 220 k resistance on pin to gnd for 5mhz roscmax 40 k resistance on pin to gnd for extended min oscillator frequency foscext roscext 1200 k monoflop related parameters minimum off time due to the implemented jitter toffmin1mhz oscillator is set to 1 mhz, in case the oscillator is put to an other frequency, toffmin1mhz scales accordingly 9 s maximum off time due to the implemented jitter toffmax1mhz oscillator is set to 1 mhz, in case the osc is put to an other frequency, toffmax1mhz scales accordingly 16 s average monoflop time for on state of transistor ton1mhz oscillator is set to 1 mhz 60.5 s 1 circuit operation with external resistor rosc > 1200k is not recommended 2 guaranteed by design 3 value for the resistor rosc to be connected to rosc pin is derived from the nee ded monoflop time tmon according to the following expression: ) 02.0 5. 12 ] [ ( 2. 222 ] [ ? ? = s tmon k rosc
ic specification mlx10803 high power led driver 3901010803 page 11/25 data sheet rev026 jun/2012 5. esd/emi recommendations for mlx10803 ? in order to minimise emi, the pcb has to be design ed according to emi guidelines. additional componen ts may be needed, other than what is shown in the appl ication diagrams, in order to comply with the emi requirements. ? the mlx10803 is an esd sensitive device and has to be handled according to en100015 part 1. ? the mlx10803 will fulfil the requirements in the a pplication according to the specification and to di n 40839 part 1. ? the mlx10803 is designed with esd protection >1000 v hbm according to mil883d.
ic specification mlx10803 high power led driver 3901010803 page 12/25 data sheet rev026 jun/2012 6. automotive test pulses the following chapter is valid for a completely ass embled module. that means that automotive test puls es are applied to the module and not to the single ic. in the recommended application according to chapter 1.1, the reverse polarity diode together with the capacitors on the supply and the load dump protected ic itself protect the module against the automotive test pul ses listed below. the exact values of the capacitors for the applicat ion have to be figured out according to the automot ive and emi requirements. no damage occurs for any of the test pulses. a devi ation of the ic?s characteristics is allowed during pulse 1, 2, 4; the module returns to normal operation after the pu lse without any additional action. during test pulse 3a, 3b, 5 the module operates wit hin characteristic limits. parameter symbol min max dim test condition, functional status transient test pulses in accordance to iso7 637 part 1 & 3. pin vref goes outside of module via resistor of 47k ? . module schematic is according to application note s mentioned in 1.1.1. test pulse #1 at module pins vbat, vs/pwm. vref_set, ic pin iref1 -> gnd vpulse1 -100 v 5000 pulses, functional state c test pulse #2 at module pins vbat, vs/pwm. vref_set, ic pin iref1 -> gnd vpulse2 100 v 5000 pulses functional state c test pulse #3a at module pins vbat, vs/pwm. vref_set, ic pin iref1 -> gnd vpulse3a -150 v 1h, functional state a test pulse #3b at module pins vbat, vs/pwm. vref_set, ic pin iref1 -> gnd vpulse3b 100 v 1h, functional state a test pulse #4 at module pin vbat, vs/pwm, vref_set -> gnd vspulse4 vapulse4 -6 -5 -4 -2.5 v v 1 pulse, functional state c test pulse #5 at ic pin vs/pwm -> gnd vpulse5 45 85 v functional state c description of functional status: a: all functions of the module are performed as de signed during and after the disturbance. b: all functions of the module are performed as de signed during and after the disturbance: however, one or more can deviate from specified tol erance. all functions return automatically to normal limits after exposure is removed. memory functions shall remain class a. c: a function of the module is not performed as des igned during disturbance but returns automatically to a normal operation after the disturbance.
ic specification mlx10803 high power led driver 3901010803 page 13/25 data sheet rev026 jun/2012 6.1. test pulse definition test pulse 1 ri = 10 vpulse1 10% 90% 1s 2ms 200ms <100s 0.5s?5s 12v v t test pulse 2 ri=10 200ms 1s 50s 0.5?5s 10% 90% vpulse2 12v v t
ic specification mlx10803 high power led driver 3901010803 page 14/25 data sheet rev026 jun/2012 test pulse 3a ri = 50 12v vpulse3a 100s 10ms 90ms 10% 90% 5ns 100ns t v test pulse 3b ri = 50 12v vpulse3b 100s 10ms 90ms 90% 10% 5ns 100ns t v
ic specification mlx10803 high power led driver 3901010803 page 15/25 data sheet rev026 jun/2012 test pulse 4 (cranking) ri = 0.01 12v vapulse4 vspulse4 5ms 0.5-20s v t 15ms 50 ms 100 ms test pulse 5 (load dump) ri = 0.5?4 90% 10% pulse 5 80v td = 40...400ms tr = 0.1...10ms 12v v t vpulse5
ic specification mlx10803 high power led driver 3901010803 page 16/25 data sheet rev026 jun/2012 7. led driving principle 7.1. general the led is driven by a switched mode power supply u sing an inductor as the energy storage element. thi s method has several advantages. the supply voltage has to b e set down to the forward bias voltage of the led. in ordinary applications this is achieved by a resistor with th e following drawbacks: - a resistor dissipates power which is transformed t o heat - efficiency is reduced drastically - the light output of the led is dependent on the su pply and the temperature of the resistor the mlx10803 avoids these disadvantages as shown by the following calculation with l=220h, r sense = 0.1 : supposed: v bat = 13.8v v fled 3.4v example 1 ; 8v example2 ; i fled 4a v f1 0.9v (reverse polarity diode) v f2 0.9v (free wheel diode) v rsense 0.4v (@i fled , r sense =0.1 ) v rds on 0.04v (@i fled ) v coil 0.2v (@i fled ) efficiency using a simple resistor or load dump reg ulation: efficiency n: % 29 = bat fled v v n example1 ; % 58 example2 ; efficiency using the mlx10803: the following calculation is an approximation only, due to the fact that coil current is not constant. it is therefore calculated with average currents. 1) during off time, the coil acts as the storage el ement and delivers its energy to the flyback diode and the led: % 75 2 1 + + = coil f fled fled v v v v n example1 ; % 88 example 2; 2) during on time, current flows through the revers e polarity diode, led, coil , fet driver and rsense , which causes the following voltage drops: % 69 1 2 + + + + = rsense rdson coil f fled fled v v v v v v n example1 ; % 84 example 2 ; 3) on and off times are in ratio of roughly 30:70 f or example 1 and 65:35 for example 2: efficiency n: % 73 3.0 7.0 2 1 ? + ? = n n n example1 ; % 87 example2 ;
ic specification mlx10803 high power led driver 3901010803 page 17/25 data sheet rev026 jun/2012 7.2. the principle in detail after powering on the mlx10803 the switch becomes o pen and the current through the led starts to rise. the rate of current raise is limited by the value of the coi l. when the current through the led reaches half of a maximum value, the on timer is started, and if during 58.5 clocks of the internal oscillator the maximum curre nt value through the led is not reached, the driver switches off. th is maximum current is adjusted by the resistors on the iref2, iref1 or voltage applied to vref pins (voltage on t hese pins is divided by 5). the minimum of these vo ltages is taken as a reference. the driver is switched off fo r a monoflop time, which is equal to 9?16 pulses of oscillator. the frequency of the oscillator can be set by the c ustomer using the rosc value using such formula: ) 44.4 ] [ /(2. 222 ] [ + = k rosc mhz fosc . both parameters, the peak current threshold voltage and the monoflop time, create an on/off period to form an average current through the led. by adjusting these parameters, an adjustment of the average load curr ent is possible in a wide range. i t iavg2 iavg1 imax2 imax1 i t iavg1 iavg2 imax t1 t2 note: the current sense comparator has a typical debounc ing time of 300ns as shown in the block diagram. this delay time prevents the driver from being switched off due to short term switching oscillations. when working with very short monoflop times, this time has to be take n into account for calculations. i t imax iavg tmon_off by applying a pwm signal on vs/pwm, the led can be dimmed from 0% to 100%. vs/pwm = l led permanent off vs/pwm = pwm led dimmed with pwm between 0% to 100% vs/pwm = h led permanent on
ic specification mlx10803 high power led driver 3901010803 page 18/25 data sheet rev026 jun/2012 dimming is achieved by applying a pwm directly to t he module supply or by changing the reference volta ge on pin vref or the resistor?s value on iref2 pin. ic settling times must always be considered in pwm mode. please refer also to chapter 1.1.3 for additional pwm frequency considerations. limitation of the on time prevents from exceeding t he allowed average current when the power supply vo ltage is not sufficient for the current to reach its peak va lue and restricts in this case duty cycle of switch ing to 68%. i t imax iavg tmon_off tmon_on imax/2 a pseudo random generator is applied to the monoflo p time. the pseudo random generator runs with the c lock derived out of the monoflop time and adds a random distribution on these 3 lsbs. therefore, the monofl op time gets a random variation from its value. the emi behaviour of the complete module is improved due to the variation of the otherwise fixed switching frequency. i t imax iavg tmon tmon' tmon' the inductance l of a coil describes the amount of magnetic energy that can be stored in it. consequently, high inductive coils will be discharg ed less than low inductive coils in a given time. generally the coil can be driven in two different w ays: 1) the coil is discharged partially only. that mean s the coil still carries a significant amount of en ergy when going from discharging to charging. in that mo ment the charging current rises immediately to the coil current that was flowing just before switc hing. this is connected with large di/dt transients on the rsense pin that have a negative impact on emi. this is mostly preferred way of regulation because of l ow influence of supply voltage and coil value on outpu t current. fast flyback diode is recommended and ex tra important in this case. 2) the coil discharged completely. thus, at the end of a discharging cycle, the coil doesn?t carry ene rgy anymore. with the next charging cycle, current incr eases steadily from around zero. this way, large di /dt transients are completely avoided.
ic specification mlx10803 high power led driver 3901010803 page 19/25 data sheet rev026 jun/2012 because of randomisation, the discharging time is n ot constant but varies within a certain range. it m ust be ensured that only the longest possible monoflop tim e completely discharges the coil. otherwise the coi l is discharged before the monoflop time ends which resu lts in a loss of accuracy. conclusion: in most cases the coil is driven in a combinatio n of both ways. a trade off has to be made between emi behaviour and maximum allowed led current. by v arying these parameters, an optimum can be found for every application. below are some examples for typical parameter sets given for a 4a led current and the following applic ation data: ? rsense = 0.1 / 2 watt ? rosc = 270k ? l = 47h, 4a minimum, 0.05 ? normal nfet switch transistor, rds on < 0,01 remarks: ? 4a and 0.05 results in 0.8 watt power dissipation over the coi l. ? 4a and 0.1 for the rsense resistor results in 1.6 watt, but o nly for 50% of the time in average. ? the led(s) with this current will dissipate 32 wat t if they have 8v forward voltage. i t imax1 iavg toff coil 1 imax2 coil 2 resistance 2 resistance 1 coil 1 > coil 2 resistance 1 > resistance 2
ic specification mlx10803 high power led driver 3901010803 page 20/25 data sheet rev026 jun/2012 7.3. switching frequency considerations and constan t light output as already shown, the switching frequency depends o n the peak current as well as on the monoflop time for a given coil. furthermore it depends on the coil indu ctance itself. due to the principle of switch mode power supplies, the current through the led is kept constant for a ny supply change. the parameter that changes in order to keep the current constant is the switching frequency itself. the lower the supply voltage, the lower the switching frequency. furthermore, the su pply current is affected by supply changes: with an incr easing supply voltage the average supply current de creases. the graph below shows the normalised luminous flux versus the power supply for a standard application with one white luxeon iii led driven at 750ma. the parameter s are optimised for the 24v board net. the luminous flux at 24v has been set to 100%. the graph indicates that the light output is minimally dependent on supply changes over the whole range from 16 to 32v. mlx10803 normalized luminous flux v/ v (24v) vs. supply voltage v/ v (24v) =f(v bat ) 80.00 85.00 90.00 95.00 100.00 105.00 110.00 115.00 120.00 16 18 20 22 24 26 28 30 32 v bat [v] v/ v (24v) [%] iled=750ma, fsw=70khz (@24v)
ic specification mlx10803 high power led driver 3901010803 page 21/25 data sheet rev026 jun/2012 8. temperature regulation in normal mode the peak current threshold voltage i s defined by the lowest voltage on pins vref, iref2 and iref1. usually the resistor connected to iref2 pin has a small thermal coefficient and the resistor on iref1 pin has a big negative temperature coefficient (but the y also can be connected vice versa). both of these pins have an output current of 50 a. when the voltage on pin iref1 falls below the vo ltage on pin iref2 or vref, the voltage reference for the actual maximum current is taken f rom pin iref1. this makes the value of the peak cur rent sensitive to temperature and prevents overheating o f led or ic. when the voltage on pin iref1 becomes higher than voltage on iref2 or vref, the reference switch es back to iref2 or vref pin. the thermal behaviour of the system should be chara cterised during the design-in of the product by the user. for a system that is designed for thermal condition s, temperature down regulation may not be needed. i n this case, it is enough to leave the iref1 or iref2 pin unconn ected and the internal current source will pull it up to the voltage vdd ? 0.7v. system behaviour can be configured to compensate th e dependency of led light output versus temperature . the example of such compensation is depicted below. illustration of a possible temperature regulation constantlight savedenergy 40%ofthelightat25c 0 50 100 150 200 250 300 350 400 450 500 0 20 40 60 80 100 120 -20 junctiontemperature,t j ( c) 20 40 80 100 lightoutputfromamberledwithconstantcurrentsupply compensationcurrentfuntion thermalprotectionfunction resultingthermalcompensatedandprotectedlightoutputfromanamberled 60
ic specification mlx10803 high power led driver 3901010803 page 22/25 data sheet rev026 jun/2012 9. mechanical data 9.1. mechanical data of the mlx10803 package package of the mlx10803: soic8 in accordance to the jedec standard. dimensions note inches millimeters min. nom. max min. nom. max a .061 .064 .068 1.55 1.63 1.73 a1 .004 .006 .0098 0.127 0.15 0.25 a0 .055 .058 .061 1.40 1.47 1.55 b .0138 .016 .0192 0.35 0.41 0.49 c .0075 .008 .0098 0.19 0.20 0.25 d .189 .194 .196 4.80 4.93 4.98 e .150 .155 .157 3.81 3.94 3.99 e .050 1.27 h .230 .236 .244 5.84 5.99 6.20 h .010 .013 .016 0.25 0.33 0.41 l .016 .025 .035 0.41 0.64 0.89 oc 0 5 8 0 5 8 degrees x .085 .093 .100 2.16 2.36 2.54 h 1 2 3 8 e/2 d/2 top view bottom view d e h ao a seating plane e a 1 angle 45 c see detail a oc l sideview end view detail a
ic specification mlx10803 high power led driver 3901010803 page 23/25 data sheet rev026 jun/2012 10. standard information regarding manufacturabilit y of melexis products with different soldering processes our products are classified and qualified regarding soldering technology, solderability and moisture s ensitivity level according to following test methods: reflow soldering smd?s (s urface m ount d evices) ? ipc/jedec j-std-020 moisture/reflow sensitivity classification for nonh ermetic solid state surface mount devices (classification reflow profiles according to table 5-2) ? eia/jedec jesd22-a113 preconditioning of nonhermetic surface mount device s prior to reliability testing (reflow profiles according to table 2) wave soldering smd?s (s urface m ount d evices) and thd?s (t hrough h ole d evices) ? en60749-20 resistance of plastic- encapsulated smd?s to combin ed effect of moisture and soldering heat ? eia/jedec jesd22-b106 and en60749-15 resistance to soldering temperature for through-hol e mounted devices iron soldering thd?s (t hrough h ole d evices) ? en60749-15 resistance to soldering temperature for through-hol e mounted devices solderability smd?s (s urface m ount d evices) and thd?s (t hrough h ole d evices) ? eia/jedec jesd22-b102 and en60749-21 solderability for all soldering technologies deviating from above mentioned standard conditions (regarding peak temp erature, temperature gradient, temperature profile etc) addi tional classification and qualification tests have to be agreed upon with melexis. the application of wave soldering for smd?s is allo wed only after consulting melexis regarding assuran ce of adhesive strength between device and board. melexis is contributing to global environmental con servation by promoting lead free solutions. for more information on qualifications of rohs compliant products (rohs = european directive on t he restriction of the use of certain hazardous substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx
ic specification mlx10803 high power led driver 3901010803 page 24/25 data sheet rev026 jun/2012 11. history record rev. no. change date 1 1 creation with mlx10801 specifications as base 25.07.04 2 1 gone through document var,alx,rah,liw 02.08.04 3 1 4-th pin recast from test to vref - linear dimm ing 07.08.04 4 1 revision of kick off meeting 5 1 revision before release rah 6 1 improved packing information rah 7 1 improved block diagram 7.10.04 8 1 design implementation review 15.01.05 9 1 updated schematic diagrams 16.01.05 10 1 pin order changed 3.02.05 11 1 temperature code changed to ?k?, vmaxdrv chang ed, oscillator related parameters changed, vref related parameters changed, rosc rela ted parameters changed 13.06.05 12 1 cosmetic changes 17.06.05 13 1 cosmetic changes 21.06.05 14 1 vref related parameters are changed 12.07.05 15 1 pins? names changed: re_ref vref, ntc iref1, setntc iref2, vs vs/pwm. corresponding parameters? names changed. rs ense related parameters changed 3.08.05 16 1 led driver applications changed 18.08.05 17 1 block diagram changed, electrical characterist ics: global parameters, monoflop related parameters, rsense related parameters, iref 1 related parameters, iref2 related parameters, vref related parameters changed , led driving principle: the principle in detail changed 21.09.05 2 internal review 23.09.05 18 1 chapter 7.3. changed: graph added, cosmetic ch anges 23.09.05 2 cosmetic changes 28.09.05 3 soldering information is changed 31.10.05 19 1 internal review 28.11.05 20 1 monoflop related parameters changed, iref1, ir ef2, vref related parameters changed 6.01.06 21 1 figure1, figure2 changed, 4. electrical charac teristics: changed, 8. temperature regulation: figure added 23.03.06 22 1 ?tbd? removed, cosmetic changes 6.04.06 2 reset related parameters changed, rosc related pa rameters changed 6.04.06 3 cosmetic changes 14.04.06 4 chapter 8, illustration of a possible temperature regulation changed 16.08.06 5 cosmetic changes 17.08.06 23 1 chapter 4 (parameters table ) changed 25.09.06 24 1 iref1 related parameters changed, iref2 relate d parameters changed, drvgate related parameters changed, absolute maximum rating s changed 7.12.06 25 1 oscillator related parameters, rosc related pa rameters changed 2.10.07 26 1 disclaimer, logo, information regarding solder ability 11.06.12
ic specification mlx10803 high power led driver 3901010803 page 25/25 data sheet rev026 jun/2012 12. disclaimer devices sold by melexis are covered by the warranty and patent indemnification provisions appearing in its term of sale. melexis makes no war ranty, express, statutory, implied, or by description regarding the information set forth her ein or regarding the freedom of the described devices from patent infringement. melexis reserves the right to change specifications and prices at any time and without notice. therefore, prior to designing this product into a system, it is necessary to check with melexis for current informa tion. this product is intended for use in normal commercial applications. applications requir ing extended temperature range, unusual environmental requirements, or high reliability app lications, such as military, medical life-support or life-sustaining equipment are specifically not r ecommended without additional processing by melexis for each application. the information furnished by melexis is believed to be correct and accurate. however, melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical dat a herein. no obligation or liability to recipient or any third party shall arise or flow out of melex is? rendering of technical or other services. ? 2012 melexis nv. all rights reserved. for the latest version of this document, go to our website at www.melexis.com or for additional information contact melexis direc t: europe, africa, asia: america: phone: +32 1367 0495 phone: +1 248 306 5400 e-mail: sales_europe@melexis.com e-mail: sales_usa @melexis.com iso/ts 16949 and iso14001 certified

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