pk 73 8 (v1.0 ) may 29, 2015 www.xilinx.com 1 pk7 3 8 (v1.0) may 29, 2015 100% material declaration data sheet spartan ? - 6 cu wire fg g 900 package average weight: 4. 11 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.090946 2.213% silicon 7440 - 21 - 3 100.00 main material 0.090946 die attach material 0.016016 0.390% silver 7440 - 22 - 4 77.50 main material 0.012412 bismaleimide monomer trade secret 15.00 main material 0.002402 acrylate monomer trade secret 7.50 main material 0.001201 copper wire 0.008441 0.205% cu 7440 - 50 - 8 98.25 main material 0.008293 pd 7440 - 05 - 3 1.75 dopant 0.000148 mold compound 1.878392 45.703% epoxy resin trade secret 3.00 main material 0.056352 phenol resin a 9003 - 35 - 4 3.00 main material 0.056352 phenol resin b trade secret 3.00 main material 0.056352 silica(amorphous) a 60676 - 86 - 0 72.45 filler 1.360895 silica(amorphous) b 7631 - 86 - 9 15.00 filler 0.281759 metal hydroxide trade secret 3.00 flame retardant 0.056352 carbon black 1333 - 86 - 4 0.55 color agent 0.010331 solder balls 0.751829 18.293% tin (sn) 7440 - 31 - 5 96.50 main material 0.725515 s ilver (ag) 7440 - 22 - 4 3.00 main material 0.022555 copper (cu) 7440 - 50 - 8 0.50 main material 0.003759 ? copyright 201 5 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included h 0. erein are trademarks of xilinx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet spartan - 6 cu wire fg g 900 package pk7 3 8 (v1.0) may 29, 2015 www.xilinx.com 2 component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total substrate 1.364376 33.197% au 7440 - 57 - 5 1.18 main material 0.016077 ni 7440 - 02 - 0 8.36 main material 0.114059 cu foil 7440 - 50 - 8 2.56 main material 0.034922 cu plating 7440 - 50 - 8 18.45 plating 0.251726 continuous filament fiber glass 65997 - 17 - 3 19.06 glass fiber 0.260040 bt core 7440 - 50 - 8 n/a 34.76 core 0.474263 solder mask 14807 - 96 - 6 7727 - 43 - 7 7631 - 86 - 9 34590 - 94 - 8 91 - 20 - 3 85954 - 11 - 6 n/a 11.21 solder mask 0.152928 prepregs na 4.42 prepregs 0.060362
100% material declaration data sheet spartan - 6 cu wire fg g 900 package pk7 3 8 (v1.0) may 29, 2015 www.xilinx.com 3 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware de vices to independent third - party vendors and materials suppliers (contractors). all data provided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products. date version description of revisions 5/29/15 1.0 initial xilinx release
|
