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1/ 40 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 tsz02201-0rar1g200150-1-2 13.feb.2015 rev003 figure 1 . simplif ied schematic (1 channel only) operational amplifiers ground sense low voltage operation cmos operational amplifiers bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf general description bu7461g/bu7462xxx/bu7464f are input ground sense, output full swing cmos operational amplifiers. bu7461sg/bu7462sxxx/bu7464sf have an expanded operating temperature range. they have the features of low operating supply voltage, low supply current and lo w input bias current. the se are suitable for portable equipment and sensor amplifiers. features ? low supply current ? low operating supply voltage ? wide temperature range ? low input bias current applications ? sensor amplifier ? portable equipment ? consumer equipment key specifications ? operating supply voltage: +1.7v to +5.5v ? supply current: 150a/ch(typ) ? temperature range: bu7461g/bu7462xxx/bu746 4f -40c to +85c bu7461sg/bu7462sxxx/bu7464sf -40c to +105c ? input offset current: 1pa (typ) ? input bias current: 1pa (typ) packages w(typ) x d(typ) x h(max) ssop5 2.90mm x 2.80mm x 1.25mm sop8 5.00mm x 6.20mm x 1.71mm msop8 2.90mm x 4.00mm x 0.90mm vson008x2030 2.00mm x 3.00mm x 0.60mm sop14 8.70mm x 6.20mm x 1.71mm simplified schematic product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys vdd vss in+ v bias in - out class ab control v bias datashee t downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 2/ 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf pin configuration bu 7461 g, bu7461sg : ssop5 bu7462f, bu7462sf : sop8 bu7462fvm, bu7462sfvm : msop8 bu7462nux, bu7462snux : vson008x2030 bu 7464f, bu 7464sf : sop 14 package ssop5 sop8 msop8 vson008x2030 sop14 bu7461g bu7461 sg bu74 62 f bu74 62 sf bu74 62 f vm bu74 62 sfvm bu7462nux bu7462snux bu74 64 f bu74 64 sf pin no. pin name 1 in + 2 vss 3 in - 4 out 5 vdd pin no. pin name 1 out1 2 in1- 3 in1+ 4 vss 5 in2+ 6 in 2- 7 out2 8 v dd pin no. pin name 1 out1 2 in - 3 in+ 4 vdd 5 in2+ 6 in2- 7 out2 8 out3 9 in3- 10 in3+ 11 vss 12 in4+ 13 in4- 14 out4 ch1 - + ch4 - + ch3 ch2 - + - + 1 2 3 4 14 13 12 11 5 6 7 10 9 8 in1+ in1- out1 vdd in2+ in2- out2 vss out3 in4+ in4- in3+ in3- out4 vss vdd out in - in+ 1 - + 2 3 4 5 + ch 2 - + ch1 - + 1 2 3 4 8 7 6 5 out2 vss vdd out1 in1- in1+ in2+ in2- downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 3/ 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf ordering information b u 7 4 6 x x x x x - x x part number bu74 61g bu7 461 sg bu74 62 xxx bu74 62 sxxx bu74 64f bu74 64 sf package g : i ssop5 f : sop8 f : sop 14 f vm : m sop8 nux : vson008x2030 f packaging and forming specification e2 : embossed tape and reel (sop8/sop14) tr : embossed tape and reel (ssop5/msop8/vson008x2030) line- up t opr channels package o rd erable part number -40c to +85c 1ch ssop5 reel of 3000 bu 7461 g- tr 2ch sop8 reel of 25 00 bu74 62 f- e2 msop8 reel of 3000 bu74 62 fvm- tr vson008x2030 reel of 4000 bu7462nux- tr 4ch sop14 reel of 25 00 bu74 64 f- e2 -40c to +105c 1ch ssop5 reel of 3000 bu 7461s g- tr 2ch sop8 reel of 25 00 bu74 62s f- e2 msop8 reel of 3000 bu74 62s fvm- tr vson008x2030 reel of 4000 bu7462snux- tr 4ch sop14 reel of 25 00 bu74 64s f- e2 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 4/ 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf absolute maximum ratings (t a =25 c ) parameter symbol rating unit bu74 61g bu7462xxx bu7464f supply voltage vdd- vss +7 v power dissipation p d ssop5 0.54 (note1,6) - - w sop8 - 0.55 (note2,6) - msop8 - 0.47 (note3,6) - vson008x2030 - 0.41 (note4,6) - sop14 - - 0.45 (note5,6) differential input voltage (note 7) v id vdd - vss v input common-mode voltage range v icm (vss -0.3) to (vdd+0.3) v input current (note 8) i i 10 ma operating supply voltage v opr +1.7v to +5.5v v operating temperature t opr -40 to + 85 c storage temperature t stg - 55 to + 125 c maximum junction temperature t jmax + 125 c (note 1) to use at temperature above t a = 25 ? c reduce 5.4mw/ ? c. (note 2) to use at temperature above t a = 25 ? c reduce 5.5mw/ ? c. (note 3) to use at temperature above t a = 25 ? c reduce 4.7 mw / ? c. (note 4) to use at temperature above t a = 25 ? c reduce 4.1 mw / ? c. (note 5) to use at temperature above t a = 25 ? c reduce 4.5 mw / ? c. (note 6) mounted on a fr4 glass epoxy pcb 70mm70mm1.6mm (copper foil a rea less than 3%). (note 7) the voltage difference between inverting input and non-inverti ng input is the differential input voltage. then input terminal voltage is set to more than v ss . (note 8) an excessive input current will flow when input voltages of more than vdd+0.6v or less than vss-0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. caution: operating the ic over the absolute maximum ratings may damage the ic. in addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. therefore, it is important to consider circuit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings. parameter symbol rating unit bu7461sg bu7462sxxx bu7464sf supply voltage vdd- vss +7 v power dissipation p d ssop5 0.54 (note9,14) - - w sop8 - 0.55 (note10,14) - msop8 - 0.47 (note11,14) - vson008x2030 - 0.41 (note12,14) - sop14 - - 0.45 (note13,14) differential input voltage (note 15) v id vdd - vss v input common-mode voltage range v icm (vss -0.3) to (vdd+0.3) v input current (note 16) i i 10 ma operating supply voltage v opr +1.7v to +5.5v v operating temperature t opr -40 to + 105 c storage temperature t stg - 55 to + 125 c maximum junction temperature t jmax + 125 c (note 9) to use at temperature above t a = 25 ? c reduce 5.4mw/ ? c. (note 10) to use at temperature above t a = 25 ? c reduce 5.5mw/ ? c. (note 11) to use at temperature above t a = 25 ? c reduce 4.7 mw / ? c. (note 12) to use at temperature above t a = 25 ? c reduce 4.1 mw / ? c. (note 13) to use at temperature above t a = 25 ? c reduce 4.5 mw / ? c. (note 14) mounted on a fr4 glass epoxy pcb 70mm70mm1.6mm (copper foil area less than 3%). (note 15) the voltage difference between inverting input and non-inve rting input is the differential input voltage. then input terminal voltage is set to more than v ss . (note 16) an excessive input current will flow when input voltages of mor e than vdd+0.6v or less than vss-0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. caution: operating the ic over the absolute maximum ratings may damage the ic. in addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. therefore, it is important to consider circuit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 5/ 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf electrical characteristics bu 74 61g, bu7461sg unless otherwise specified vdd=+3v, vss=0v, t a =25c) parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 17 ) v io 25 c - 1 6 mv - input offset current (note 17 ) i io 25 c - 1 - pa - input bias current (note 17 ) i b 25 c - 1 - pa - supply current (note 18) i dd 25 c - 150 350 a r l = a v =0db, in +=0.9v full range - - 450 maximum output voltage(high) v oh 25 c vdd-0.1 - - v r l =10k maximum output voltage(low) v ol 25 c - - vss+0.1 v r l =10 k large signal voltage gain a v 25 c 70 95 - db r l =10k input common-mode voltage range v icm 25 c 0 - 1.8 v vss to vdd-1.2v common-mode rejection ratio cmrr 25 c 45 60 - db - power supply rejection ratio psrr 25 c 60 80 - db - output source current (note 19) i source 25 c 4 8 - ma vdd-0.4v output sink current (note 19) i sink 25 c 6 12 - ma vss+0.4v slew rate sr 25 c - 1 - v/s c l =25 pf gain bandwidth gbw 25 c - 1 - mhz c l =25 pf , a v =40db phase margin 25 c - 50 - deg c l =25 pf , a v =40db total harmonic distortion + noise thd +n 25 c - 0.05 - % out=0.8v p-p f=1khz (note 17 ) absolute value (n ote 18) full range: bu7461g: t a =- 40 c to +85c , bu7461sg: t a =- 40 c to +105c (note 19) under the high temperature environment, consider the power dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the output curr ent is reduced to climb to the temperature inside ic. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 6/ 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf electrical characteristics - continued bu 74 62xxx, bu7462sxxx unless otherwise specified vdd=+3v, vss=0v, t a =25c) parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 20 ) v io 25 c - 1 6 mv - input offset current (note 20 ) i io 25 c - 1 - pa - input bias current (note 20 ) i b 25 c - 1 - pa - supply current (note 21 ) i dd 25 c - 300 700 a r l = , all op-amps a v =0db, in +=0.9v full range - - 900 maximum output voltage(high) v oh 25 c vdd-0.1 - - v r l =10k maximum output voltage(low) v ol 25 c - - vss+0.1 v r l =10k large signal voltage gain a v 25 c 70 95 - db r l =10k input common-mode voltage range v icm 25 c 0 - 1.8 v vss to vdd-1.2v common-mode rejection ratio cmrr 25 c 45 60 - db - power supply rejection ratio psrr 25 c 60 80 - db - output source current (note 22 ) i source 25 c 4 8 - ma vdd-0.4v output sink current (note 22 ) i sink 25 c 6 12 - ma vss+0.4v slew rate sr 25 c - 1 - v/s c l =25 pf gain bandwidth gbw 25 c - 1 - mhz c l =25 pf , a v =40db phase margin 25 c - 50 - deg c l =25pf, a v =40 db total harmonic distortion + noise thd +n 25 c - 0.05 - % out=0.8v p-p f=1khz channel separation cs 25 c - 100 - db a v =40 db , out=1vrms (note 20 ) absolute value (note 21 ) full range: bu7462xxx: t a =- 40 c to +85 c , bu7462sxxx: t a =- 40 c to +105 c (note 22 ) under the high temperature environment, consider the power dissipa tion of ic when selecting the output current. when the terminal short circuits are continuously output, the output curr ent is reduced to climb to the temperature inside ic. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 7/ 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf electrical characteristics - continued bu 74 64f, bu7464sf unless otherwise specified vdd=+3v, vss=0v, t a =25c) parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 23 ) v io 25 c - 1 6 mv - input offset current (note 23 ) i io 25 c - 1 - pa - input bias current (note 23 ) i b 25 c - 1 - pa - supply current (note 24 ) i dd 25 c - 600 1400 a r l = , all op-amps a v =0db, in + =0.9v full range - - 1800 maximum output voltage(high) v oh 25 c vdd-0.1 - - v r l =10k maximum output voltage(low) v ol 25 c - - vss+0.1 v r l =10k large signal voltage gain a v 25 c 70 95 - db r l =10k input common-mode voltage range v icm 25 c 0 - 1.8 v vss to vdd-1.2v common-mode rejection ratio cmrr 25 c 45 60 - db - power supply rejection ratio psr r 25 c 60 80 - db - output source current (note 25 ) i source 25 c 4 8 - ma vdd-0.4v output sink current (note 25 ) i sink 25 c 6 12 - ma vss+0.4v slew rate sr 25 c - 1 - v/s c l =25pf gain bandwidth gbw 25 c - 1 - mhz c l =25 pf , a v =40db phase margin 25 c - 50 - deg c l =25 pf , a v =40db total harmonic distortion + noise thd +n 25 c - 0.05 - % out=0.8v p-p f=1khz channel separation cs 25 c - 100 - db a v =40 db , out=1vrms (note 23 ) absolute value (note 24 ) full range: bu7464f: t a =- 40 c to +85 c , bu7464sf: t a =- 40 c to +105 c (note 25 ) under the high temperature environment, consider the power dissipa tion of ic when selecting the output current. when the terminal short circuits are continuously output, the output cur rent is reduced to climb to the temperature inside ic. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 8/ 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf description of electrical characteristics described here are the terms of electric characteristics use d in this technical note. items and symbols used are a lso shown. note that item name and symbol and their meaning may differ from those on another manufactures document or general document. 1. absolute maximum ratings absolute maximum rating item indicates the conditio n which must not be exceeded. application of voltag e in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) supply voltage (vdd/vss) indicates the maximum voltage that can be applied between th e vdd terminal and vss terminal without deterioration or destruction of characteristics of internal circuit. (2) differential input voltage (v id ) indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without deterioration and destruction of characteristics of ic. (3) input common-mode voltage range (v icm ) in dicates the maximum voltage that can be applied to the n on-inverting and inverting terminals without deterioration or destruction of electrical characteristics. input common-mode voltage range of the maximum ratings do es not assure normal operation of ic. for normal operation, use t he ic within the input common-mode voltage range ch aracteristics. (4) power dissipation (p d ) indicates the power that can be consumed by the ic when mounted on a specific board at the ambient tem perature 25c (normal temperature) . as for package product, p d is determined by the temperature that can be permitted by th e ic in the package (maximum junction temperature) and the thermal resis tance of the package. 2. electrical characteristics (1) input offset voltage (v io ) indicates the voltage difference between non-inverting te rminal and inverting terminals. it can be translated into the input voltage difference required for setting the output volt age at 0v. (2) input offset current (i io ) indicates the difference of input bias current between the non-inv erting and inverting terminals. (3) input bias current (i b ) indicates the current that flows into or out of the input terminal . it is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) supply current (i dd ) indicates the current that flows within the ic under specified no-loa d conditions. (5) maximum output voltage(high) / maximum output voltage(low) (v oh /v ol ) indicates the voltage range of the output under specifie d load condition. it is typically divided into maximum output voltage high and low. maximum output voltage high indi cates the upper limit of output voltage. maximum output voltage low indicates the lower limit. (6) large signal voltage gain (a v ) indicates the amplifying rate (gain) of output voltage aga inst the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) w ith reference to dc voltage. a v = (output voltage) / (differential input voltage) (7) input common-mode voltage range (v icm ) indicates the input voltage range where ic operates normally. (8) common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctua tion) (9) power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. ps rr = (change of power supply voltage)/(input offset fluctuation) (10) output source current/ output sink current (i source / i sink ) the maximum current that can be output from the ic under specifi c output conditions. the output source current indicates the current flowing out from the ic, and the output sink curre nt indicates the current flowing into the ic. (11) slew rate (sr) indicates the ratio of the change in output voltage with time when a step input signal is applied. (12) gain bandwidth (gbw) indicates a frequency where the voltage gain of operational ampl ifier is 1. (13) phase margin () indicates the margin of phase from 180 degree phase lag at uni ty gain frequency. (14) total harmonic distortion + noise (thd +n ) indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output vol tage of driven channel. (15) channel separation (cs) indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 9/ 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf figure 4. supply current vs supply voltage typical performance curves bu7461g, bu7461sg (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7461g: - 40 c to +85 c bu7461sg: - 40 c to +105 c 0 50 100 150 200 250 300 1 2 3 4 5 6 supply voltage [v] supply current [a] 0 50 100 150 200 250 300 -50 -25 0 25 50 75 100 125 ambient temperature [c] supply current [a] figure 5. supply current vs ambient temperature 1. 7v 5.5v 3.0v 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] figure 3. power dissipation vs ambient temperature derating curve 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] figure 2. power dissipation vs ambient temperature derating curve 85 105 bu7461sg - 40 25 85 1 05 bu746 1g downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 10 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7461g, bu7461sg (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7461g: - 40 c to +85 c bu7461sg: - 40 c to +105 c figure 9. maximum output voltage ( low ) vs ambient temperature (r l =10k) figure 8. maximum output voltage ( low ) vs supply voltage (r l =10k) figure 7. maximum output voltage (high) vs ambient temperature (r l =10k) figure 6. maximum output voltage (high) vs supply voltage (r l =10k) 0 1 2 3 4 5 6 1 2 3 4 5 6 supply voltage [v] maximum output voltage (high) [v] 0 2 4 6 8 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (high) [v] - 40 c 25 c 85 c 105 c 1. 7v 5.5v 3.0v 0 3 6 9 12 1 2 3 4 5 6 supply voltage [v] maximum output voltage (low) [mv] - 40 c 25 c 85 c 105 c 0 2 4 6 8 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (low) [mv] 1. 7v 5.5v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 11 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf figure 1 1. output source current vs ambient temperature (out=vdd-0.4v) typical performance curves C continued bu7461g, bu7461s g (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7461g: - 40 c to +85 c bu7461sg: - 40 c to +105 c 0 10 20 30 40 50 60 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] figure 1 3. output sink current vs ambient temperature (out=vss+0.4v) figure 1 2. output sink current vs output voltage (vdd=3v) figure 1 0. output source current vs output voltage (vdd=3 v) 5.5v 1.7v 3.0v 0 10 20 30 40 0 0.5 1 1.5 2 2.5 3 output voltage [v] output source current [ma] - 40 c 25 c 85 c 105 c 0 5 10 15 20 -50 -25 0 25 50 75 100 125 ambient temperature [c] output source current [ma] 1. 7v 5.5v 3.0v 0 20 40 60 80 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [v] output sink current [ma] - 40 c 25 c 85 c 105 c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 12 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7461g, bu7461s g (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7461g: - 40 c to +85 c bu7461sg: - 40 c to +105 c figure 1 5. input offset voltage vs ambient temperature (v icm =vdd-1.2v, e k =-vdd/2) figure 1 6. input offset voltage vs input voltage (vdd=3v) figure 1 7. large signal voltage gain vs supply voltage figure 1 4. input offset voltage vs supply voltage (v icm =vdd-1.2v, e k =-vdd/2) -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 1 2 3 4 5 6 supply voltage [v] input offset voltage [mv] - 40 25 85 105 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] input offset voltage [mv] 5.5v 1.7v 3.0v 0 20 40 60 80 100 120 140 160 180 200 1 2 3 4 5 6 supply voltage [v] large signal voltage gain [db] - 40 25 85 105 -4 -3 -2 -1 0 1 2 3 4 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 input voltage [v] input offset voltage [mv] - 40 25 85 105 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 13 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7461g, bu7461s g (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7461g: - 40 c to +85 c bu7461sg: - 40 c to +105 c figure 1 8. large signal voltage gain vs ambient temperature figure 1 9. common mode rejection ratio vs supply voltage figure 20. common mode rejection ratio vs ambient temperature figure 21. power supply rejection ratio vs ambient temperature 0 20 40 60 80 100 120 140 160 180 200 -50 -25 0 25 50 75 100 125 ambient temperature [c] large signal voltage gain [db] 5.5v 1.7v 3.0v 0 20 40 60 80 100 120 140 160 180 200 1 2 3 4 5 6 supply voltage [v] common mode rejection ratio [db] - 40 25 105 85 0 20 40 60 80 100 120 140 160 180 200 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db] 5.5v 1.7v 3.0v 0 20 40 60 80 100 120 140 160 180 200 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 14 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7461g, bu7461s g (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7461g: - 40 c to +85 c bu7461sg: - 40 c to +105 c figure 23. slew rate h-l vs ambient temperature figure 22. slew rate l-h vs ambient temperature 0 20 40 60 80 100 1.e+ 00 1.e+ 01 1.e+ 02 1.e+ 03 1.e+ 04 1.e+ 05 1.e+ 06 1.e+ 07 1.e+ 08 frequency [hz] voltage gain[db] 0 50 100 150 200 phase [deg] figure 24. voltage gain ? phase vs frequency (vdd=+3v, vss=0v, t a =25 ) phase gain 1 1 10 1 10 2 10 3 10 4 10 5 10 6 10 7 10 8 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate l-h [v/s] 5.5v 1.7v 3.0v 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate h-l [v/s] 5.5v 1.7v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 15 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves bu7462xxx, bu 7462 s xxx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7462xxx: - 40 c to +85 c bu7462sxxx: - 40 c to +105 c 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] figure 26. power dissipation vs ambient temperature derating curve 0 100 200 300 400 500 600 -50 -25 0 25 50 75 100 125 ambient temperature [c] supply current [a] figure 28. supply current vs ambient temperature 1. 7v 5.5v 3.0v 0 100 200 300 400 500 600 1 2 3 4 5 6 supply voltage [v] supply current [a] figure 27. supply current vs supply voltage 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] figure 25. power dissipation vs ambient temperature derating curve bu7462f 85 105 - 40 25 85 1 05 bu7462f vm bu7462nux bu746 2s f bu746 2s f vm bu7462snux downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 16 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7462xxx, bu 7462 s xxx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7462xxx: - 40 c to +85 c bu7462sxxx: - 40 c to +105 c 0 2 4 6 8 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (low) [mv] figure 31 . maximum output voltage ( low ) vs supply voltage (r l =10k) figure 29 . maximum output voltage (h igh ) vs supply voltage (r l =10k) figure 30 . maximum output voltage (high) vs ambient temperature (r l =10k) 1. 7v 5.5v 3.0v figure 32 . maximum output voltage ( low ) vs am bient temperature (r l =10k) 0 1 2 3 4 5 6 1 2 3 4 5 6 supply voltage [v] maximum output voltage (high) [v] - 40 c 25 c 85 c 105 c 0 2 4 6 8 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (high) [v] 1. 7v 5.5v 3.0v 0 3 6 9 12 1 2 3 4 5 6 supply voltage [v] maximum output voltage (low) [mv] - 40 c 25 c 85 c 105 c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 17 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf figure 34 . output source current vs ambient temperature (out=vdd-0.4v) typical performance curves C continued bu7462xxx, bu 7462 sxxx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7462xxx: - 40 c to +85 c bu7462sxxx: - 40 c to +105 c 0 10 20 30 40 50 60 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] figure 36 . output sink current vs ambient temperature (out=vss+0.4v) figure 35 . output sink current vs output voltage (vdd=3v) figure 33 . output source current vs output voltage (vdd=3 v) 5.5v 1.7v 3.0v 0 10 20 30 40 0 0.5 1 1.5 2 2.5 3 output voltage [v] output source current [ma] - 40 c 25 c 85 c 105 c 0 5 10 15 20 -50 -25 0 25 50 75 100 125 ambient temperature [c] output source current [ma] 1. 7v 5.5v 3.0v 0 20 40 60 80 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [v] output sink current [ma] - 40 c 25 c 85 c 105 c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 18 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7462xxx, bu 7462 sxxx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7462xxx: - 40 c to +85 c bu7462sxxx: - 40 c to +105 c figure 37 . input offset voltage vs supply voltage (v icm =vdd-1.2v, e k =-vdd/2) figure 38 . input offset voltage vs ambient temperature (v icm =vdd-1.2v, e k =-vdd/2) -4 -3 -2 -1 0 1 2 3 4 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 input voltage [v] input offset voltage [mv] figure 39 . input offset voltage vs input voltage (vdd=3v) figure 40 . large signal voltage gain vs supply voltage - 40 25 85 105 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 1 2 3 4 5 6 supply voltage [v] input offset voltage [mv] - 40 25 85 105 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] input offset voltage [mv] 5.5v 1.7v 3.0v 0 20 40 60 80 100 120 140 160 180 200 1 2 3 4 5 6 supply voltage [v] large signal voltage gain [db] - 40 25 85 105 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 19 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7462xxx, bu 7462 sxxx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7462xxx: -40 c to +85 c bu7462sxxx: - 40 c to +105 c figure 42 . common mode rejection ratio vs supply voltage figure 41 . large signal voltage gain vs ambient temperature figure 43. common mode rejection ratio vs ambient temperature 0 20 40 60 80 100 120 140 160 180 200 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] figure 44 . power supply rejection ratio vs ambient temperature 0 20 40 60 80 100 120 140 160 180 200 -50 -25 0 25 50 75 100 125 ambient temperature [c] large signal voltage gain [db] 5.5v 1.7v 3.0v 0 20 40 60 80 100 120 140 160 180 200 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db] 5.5v 1.7v 3.0v 0 20 40 60 80 100 120 140 160 180 200 1 2 3 4 5 6 supply voltage [v] common mode rejection ratio [db] - 40 25 85 105 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 20 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7462xxx, bu 7462 sxxx (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7462xxx: - 40 c to +85 c bu7462sxxx: - 40 c to +105 c 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate l-h [v/s] figure 45 . slew rate l-h vs ambient temperature 0 20 40 60 80 100 1.e+ 00 1.e+ 01 1.e+ 02 1.e+ 03 1.e+ 04 1.e+ 05 1.e+ 06 1.e+ 07 1.e+ 08 frequency [hz] voltage gain[db] 0 50 100 150 200 phase [deg] figure 47. voltage gain ? phase vs frequency (vdd=+3v, vss=0v, t a =25 ) figure 46 . slew rate h-l vs ambient temperature phase gain 1 1 10 1 10 2 10 3 10 4 10 5 10 6 10 7 10 8 5.5v 1.7v 3.0v 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate h-l [v/s] 5.5v 1.7v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 21 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves bu7464f, bu7464sf (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7464f: - 40 c to +85 c bu7464sf: - 40 c to +105 c 0 250 500 750 1000 -60 -30 0 30 60 90 120 ambient temperature [c] supply current [a] figure 51. supply current vs ambient temperature 1. 7v 5.5v 3.0v 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] figure 49. power dissipation vs ambient temperature derating curve 0 250 500 750 1000 1 2 3 4 5 6 supply voltage [v] supply current [a] figure 50. supply current vs supply voltage 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] figure 48. power dissipation vs ambient temperature derating curve bu7464f 85 105 bu7464sf - 40 c 25 c 85 c 1 05 c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 22 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7464f, bu7464sf (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7464f: - 40 c to +85 c bu7464sf: - 40 c to +105 c figure 52 . maximum output voltage (high) vs supply voltage (r l =10k) figure 53 . maximum output voltage (high) vs ambient temperature (r l =1 0k) figure 54 . maximum output voltage ( low ) vs supply voltage (r l =10k) figure 55 . maximum output voltage ( low ) vs ambient temperature (r l =10k) - 40 c 25 c 85 c 105 c 0 1 2 3 4 5 6 1 2 3 4 5 6 supply voltage [v] maximum output voltage (high) [v] 1. 7v 5.5v 3.0v 0 2 4 6 8 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (high) [v] 0 2 4 6 8 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (low) [mv] 1. 7v 5.5v 3.0v 0 3 6 9 12 1 2 3 4 5 6 supply voltage [v] maximum output voltage (low) [mv] - 40 c 25 c 85 c 105 c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 23 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf figure 57 . output source current vs ambient temperature (out=vdd-0.4v) typical performance curves C continued bu7464f, bu7464s f (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7464f: - 40 c to +85 c bu7464sf: - 40 c to +105 c 0 10 20 30 40 50 60 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] figure 59 . output sink current vs ambient temperature (out=vss+0.4v) figure 58 . output sink current vs output voltage (vdd=3v) 5.5v 1.7v 3.0v figur e 56 . output source current vs output voltage (vdd=3 v) 0 10 20 30 40 0 0.5 1 1.5 2 2.5 3 output voltage [v] output source current [ma] - 40 c 25 c 85 c 105 c 0 5 10 15 20 -50 -25 0 25 50 75 100 125 ambient temperature [c] output source current [ma] 1. 7v 5.5v 3.0v 0 20 40 60 80 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [v] output sink current [ma] - 40 c 25 c 85 c 105 c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 24 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7464f, bu7464s f (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7464f: - 40 c to +85 c bu7464sf: - 40 c to +105 c figure 61 . input offset voltage vs ambient temperature (v icm =vdd-1.2v, e k =-vdd/2) -4 -3 -2 -1 0 1 2 3 4 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 input voltage [v] input offset voltage [mv] figure 62 . input offset voltage vs input voltage (vdd=3v) figure 63 . large signal voltage gain vs supply voltage - 40 c 25 c 85 c 105 c figure 60 . input offset voltage vs supply voltage (v icm =vdd-1.2v, e k =-vdd/2) -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 1 2 3 4 5 6 supply voltage [v] input offset voltage [mv] - 40 c 25 c 85 c 105 c -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] input offset voltage [mv] 5.5v 1.7v 3.0v 0 20 40 60 80 100 120 140 160 180 200 1 2 3 4 5 6 supply voltage [v] large signal voltage gain [db] - 40 c 25 c 85 c 105 c downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 25 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7464f, bu7464s f (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7464f: - 40 c to +85 c bu7464sf: - 40 c to +105 c figure 64 . large signal voltage gain vs ambient temperature figure 65 . common mode rejection ratio vs supply voltage figure 66 . common mode rejection ratio vs ambient temperature figure 67 . power supply rejection ratio vs ambient temperature 0 20 40 60 80 100 120 140 160 180 200 -50 -25 0 25 50 75 100 125 ambient temperature [c] large signal voltage gain [db] 5.5v 1.7v 3.0v 0 20 40 60 80 100 120 140 160 180 200 1 2 3 4 5 6 supply voltage [v] common mode rejection ratio [db] - 40 c 25 c 85 c 105 c 0 20 40 60 80 100 120 140 160 180 200 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db] 5.5v 1.7v 3.0v 0 20 40 60 80 100 120 140 160 180 200 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 26 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf typical performance curves C continued bu7464f, bu7464s f (*)the above characteristics are measurements of typical s ample, they are not guaranteed. bu7464f: - 40 c to +85 c bu7464sf: - 40 c to +105 c 0 20 40 60 80 100 1.e+ 00 1.e+ 01 1.e+ 02 1.e+ 03 1.e+ 04 1.e+ 05 1.e+ 06 1.e+ 07 1.e+ 08 frequency [hz] voltage gain[db] 0 50 100 150 200 phase [deg] figure 70. voltage gain ? phase vs frequency (vdd=+3v, vss=0v, t a =25 ) figure 69 . slew rate h-l vs ambient temperature phase gain 1 1 10 1 10 2 10 3 10 4 10 5 10 6 10 7 10 8 figure 68 . slew rate l-h vs ambient temperature 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate l-h [v/s] 5.5v 1.7v 3.0v 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate h-l [v/s] 5.5v 1.7v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 27 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf application information null method condition for test circuit 1 vdd, vss, e k , v icm unit:v parameter v f s1 s2 s3 vdd vss e k v icm calculation input offset voltage v f1 on on off 3 0 -1.5 1.8 1 large signal voltage gain v f2 on on on 3 0 -0.5 0.9 2 v f3 -2.5 common-mode rejection ratio (input common-mode voltage range) v f4 on on off 3 0 -1.5 0 3 v f5 1.8 power supply rejection ratio v f6 on on off 1.7 0 -0.9 0 4 v f7 5.5 calculation 1. input offset voltage (v io ) 2. large signal voltage gain (a v ) 3 . common-mode rejection ratio (cmrr) 4. power supply rejection ratio (psrr) figure 71. test circuit 1 (one channel only) v dd r f =50k r i =1m 0. 015 f r s = 50 r l sw 2 500k 500k 0. 01f e k 15v dut v ss v rl 50k v icm sw1 0.015f r i =1m vo v f r s = 50 1000pf 0.1f - 15v null sw3 cmrr |v f4 - v f5 | = v icm (1+r f /r s ) [db] 20log psrr |v f6 - v f7 | = vdd (1+ r f /r s ) [db] 20log = v io |v f1 | 1+r f /r s [v] av |v f2 -v f3 | = e k (1+r f /r s ) [db] 20log downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 28 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf switch condition for test circuit 2 sw no. sw 1 sw 2 sw 3 sw 4 sw 5 sw 6 sw 7 sw 8 sw 9 sw 10 sw 11 sw 12 supply current off off on off on off off off off off off off maximum output voltage r l =10 k off on off off on off off on off off on off output current off on off off on off off off off on off off slew rate off off on off off off on off on off off on gain bandwidth on off off on on off off off on off off on figure 73. slew rate input output wave figure 74. test circuit 3 (channel separation) figure 72 . test circuit 2 (each channel) sw 3 sw1 sw2 sw9 sw10 sw 11 sw8 sw5 sw6 sw7 c l sw12 sw4 r1 1k r2 100k r l vss vdd=3v vo in - in+ input voltage output voltage input wave output wave out2 vdd vss r2=100k r1=1k vdd vss out1 =1vrms in out2 cs=20log 100out1 r2=100k r1//r2 r1//r2 r1=1k t 1 . 8 v p - p 1 . 8 v 0 v t t 1 . 8 v 0 v v 10% 9 0% sr = v / t downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 29 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf examples of circuit voltage follower inverting amplifier non-inverting amplifier figure 76 . inverting amplifier circuit figure 77 . non-inverting amplifier circuit figure 75 . voltage follower circuit voltage gain is 0db. using this circuit, the output voltage (out) is configured to be equal to the input voltage (in). this circuit also stabilizes the output voltage (out) due to high input impedance and low output impedance. computation for output voltage (out) is shown below. out=in for inverting amplifier, input voltage (in) is amplified by a voltage gain and depends on the ratio of r1 and r2. the out- of -phase output voltage is shown in the next expression out=-(r2/r1) ? in this circuit has input impedance equal to r1. for non-inverting amplifier, input voltage (in) is amplified by a voltage gain, which depends on the ratio of r1 and r2. the output voltage (out) is in-phase with the input voltage (in) and is shown in the next expression. out=(1 + r2/r1) ? in effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. r 2 r 1 vss in out vdd vss out in vdd vss r 2 vdd in out r 1 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 30 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf power dissipation power dissipation (total loss) indicates the power that the ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be hig her than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circui t configuration, manufacturing process, and consumable pow er. power dissipation is determined by the allowable temperatur e within the ic (maximum junction temperature) and the therm al resistance of the package used (heat dissipation capabi lity). maximum junction temperature is typically equal to the maximum storage temperature. the heat generated through the c onsumption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, rep resented by the symbol ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 78 (a) shows the model of the thermal resistance of a packag e. the equation below shows how to compute for the thermal resistance ( ja ), given the ambient temperature (t a ), maximum junction temperature (t jmax ), and power dissipation (p d ). ja = (t jmax -t a ) / p d c/w the derating curve in figure 78 (b) indicates the power that the ic can consume with reference to amb ient temperature. power consumption of the ic begins to attenuate at certain tempera tures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumption, package, a mbient temperature, package condition, wind velocity, etc. this may also vary even when the same of package is used . thermal reduction curve indicates a reference value measured at a specified condition. figure 78 (c) to (h) shows an example of the derating curve for bu7461g , bu7461sg, bu7462xxx, bu7462sxxx, bu7464f and bu7464sf. 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] bu7461sg (note 26) (d) bu7461sg (c) bu746 1g bu7461g (note 26) 85 105 ja =( t jmax -t a )/ p d c /w ambient temperature t a [c ] chip surface temperature t j [c ] (a) thermal resistance 0 ambient temperature t a [ ? c] p2 p1 25 125 75 100 50 power dissipation of lsi [w] p dmax t jmax ja2 ja1 ja 2 < ja 1 (b) derating curve power dissipation of ic figure 78. thermal resistance and derating curve downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 31 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf power dissipation C continued (note 26 ) (note 27 ) (note 28) (note 29) (note 30 ) unit 5.4 5.5 4.7 4.1 4. 5 mw/ ? c when using the unit above t a =25 c , subtract the value above per celsius degree. permissible dissipation is t he value when fr4 glass epoxy board 70mm70mm1.6mm (copper foil area below 3 ) is mounted. 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] figure 78. thermal resistance and derating curve bu7464sf (note 30) (h) bu7464sf (g) bu7464f bu7464f (note 30 ) 85 105 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] (f) bu7462s xxx (e) bu7462xxx bu7462f (note 27) 85 105 bu7462fvm (note 28) bu7462nux (note 29) bu7462sf (note 27) bu7462sfvm (note 28) bu7462snux (note 29) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 32 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an externa l diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting th e analog block. furthermore, connect a capacitor to ground at all power s upply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wirin g pattern when using both small-signal and large-current ground tra ces, the two ground traces should be routed separately but connected to a single ground at the reference point of th e application board to avoid fluctuations in the small -signal ground caus ed by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the po wer dissipation rating be exceeded the rise in temperature o f the chip may result in deterioration of the properties of the chip. the absolute maxim um rating of the p d stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass ep oxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of t he ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that t he internal logic may be unstable and inrush current may fl ow ins tantaneously due to the internal powering sequence and d elays, especially if the ic has more than one power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors complete ly after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each o ther especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as met al particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during as sembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance a nd extremely low capacitance. if left unconnected, the electric fiel d from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unl ess otherwise specified, unused input pins should be c onnected to the power supply or ground line. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 33 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf operational notes C continued 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably forme d creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interferen ce among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to ope rate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supp ly voltage is applied, make sure that the input pins hav e vo ltages within the values specified in the electrical characteris tics of this ic. 13. unused circuits when there are unused op-amps, it is recommended that they are connected as in figure 79 , setting the non-inverting input terminal to a potential within the in -phase input voltage range (v icm ). 14. input voltage applying vdd+0.3v to the input terminal is possible without c ausing deterioration of the electrical characteristics or destruction, reg ardless of the supply voltage. however, this does not ensure normal circuit operation. please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 15. power supply(single/dual) the op-amp operates when the voltage supplied is betw een v dd and v ss . therefore, the single supply op-amp can be used as dual supply op -amp as well. 16. output capacitor if a large capacitor is connected between the output pin an d v ss pin, current from the charged capacitor will flow into the output pin and may destroy the ic when the v dd pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 0.1uf between output pin and v ss pin. 17. oscillation by output capacitor please pay attention to the oscillation by output capacito r and in designing an application of negative feedback l oop circuit with these ics. 18. latch up be careful of input voltage that exceed the vdd and vss. when cmos device have sometimes occur latch up and protect the ic from abnormaly noise. 19. decupling capacitor insert the decupling capacitance between vdd and vss, for stable ope ration of operational amplifier. 20. radiation land the vson008x2030 package has a radiation land in the center of the back. please connect to vss potenital or don't connect to other terminal. vss vdd v icm figure 79. example of application circuit for unused op-amp keep this potential in v icm downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 34 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf physical dimensions , tape and reel information package name ssop5 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 35 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf physical dimensions , tape and reel information C continued package name sop8 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 36 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf physical dimensions , tape and reel information C continued package name msop8 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 37 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf physical dimensions, tape and reel information C continued package name vson008x2030 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 38 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf physical dimensions , tape and reel information C continued package name sop14 (unit : mm) pkg : sop14 drawing no. : ex113-5001 (max 9.05 (include.burr)) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 39 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf marking diagrams product name package type marking bu7461 g ssop5 a0 bu7461s b9 bu7462 f sop8 7462 fvm msop8 nux vson008x2030 bu7462s f sop8 7462s fvm msop8 nux vson008x2030 bu 7464 f sop14 bu7464f bu 7464s bu7464sf sop14(top view) part number marking lot number 1pin mark vson008x2030 (top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark sop8(top view) part number marking lot number 1pin mark part number marking ssop5(top view) lot number downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200150-1-2 ? 2013 rohm co., ltd. all rights reserved. 40 / 40 13.feb.2015 rev003 tsz22111 ? 15 ? 001 bu7461g bu7461sg bu7462xxx bu7462sxxx bu7464f bu7464sf land pattern data all dimensions in mm pkg land pitch e land space mie land length R? 2 land width b2 ssop5 0.95 2.4 1.0 0.6 sop8 1.27 4.60 1.10 0.76 msop8 0.65 2.62 0.99 0.35 vson008x2030 0.50 2.20 0.70 0.27 sop14 1.27 4.60 1.10 0.76 all dimensions in mm package radiation land length d3 radiation land width e3 thermal via pitch diameter vson008x2030 1.20 1.60 - 0.3 revision history date revision changes 2 5. sep.2013 001 new release 21.may.2014 00 2 correct ion of errors (page.1 package dimension) 13. feb.2015 00 3 correction of figure number (page.30 power dissipation) vson008x2030 e b2 thermal via e3 d3 mie ? 2 sop8, msop8, sop14 mie ? 2 b2 e ssop5 ? e e ? 2 b2 mie downloaded from: http:///
datasheet d a t a s h e e t notice-ge rev.004 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-ge rev.004 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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