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BUK9506-55A; buk9606-55a; buk9e06-55a trenchmos? logic level fet rev. 03 23 july 2001 product data 1. description n-channel enhancement mode ?eld-effect power transistor in a plastic package using trenchmos? technology, featuring very low on-state resistance. product availability: BUK9506-55A in sot78 (to-220ab); buk9606-55a in sot404 (d 2 -pak); buk9e06-55a in sot226 (i 2 -pak). 2. features n trenchmos? technology n q101 compliant n 175 c rated n logic level compatible. 3. applications n automotive and general purpose power switching: u 12 v and 24 v loads u motors, lamps and solenoids. 4. pinning information table 1: pinning - sot78, sot404, sot226 simpli?ed outline and symbol pin description simpli?ed outline symbol 1 gate (g) sot78 (to-220ab) sot404 (d 2 -pak) sot226 (i 2 -pak) 2 drain (d) 3 source (s) mb mounting base, connected to drain (d) mbk106 12 mb 3 13 2 mbk116 mb mbk112 123 mb s d g mbb076
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 ? 23 july 2001 2 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. 5. quick reference data 6. limiting values [1] current is limited by power dissipation chip rating [2] continuous current is limited by package table 2: quick reference data symbol parameter conditions typ max unit v ds drain-source voltage (dc) - 55 v i d drain current (dc) t mb =25 c; v gs =5v [1] - 154 a p tot total power dissipation t mb =25 c - 300 w t j junction temperature - 175 c r dson drain-source on-state resistance t j =25 c; v gs =5v; i d = 25 a 5.3 6.3 m w t j =25 c; v gs = 4.5 v; i d = 25 a 5.5 6.7 m w t j =25 c; v gs = 10 v; i d = 25 a 4.8 5.8 m w table 3: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v ds drain-source voltage (dc) - 55 v v dgr drain-gate voltage (dc) r gs =20k w- 55 v v gs gate-source voltage (dc) - 15 v i d drain current (dc) t mb =25 c; v gs =5v; figure 2 and 3 [1] - 154 a [2] - 75 a t mb = 100 c; v gs =5v; figure 2 [2] - 75 a i dm peak drain current t mb =25 c; pulsed; t p 10 m s; figure 3 - 616 a p tot total power dissipation t mb =25 c; figure 1 - 300 w t stg storage temperature - 55 +175 c t j operating junction temperature - 55 +175 c source-drain diode i dr reverse drain current (dc) t mb =25 c [1] - 154 a [2] - 75 a i drm pulsed reverse drain current t mb =25 c; pulsed; t p 10 m s - 616 a avalanche ruggedness w dss non-repetitive avalanche energy unclamped inductive load; i d =75a; v ds 55 v; v gs =5v; r gs =50 w ; starting t mb =25 c - 1.1 j
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 23 july 2001 3 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. v gs 3 4.5 v fig 1. normalized total power dissipation as a function of mounting base temperature. fig 2. continuous drain current as a function of mounting base temperature. t mb =25 c; i dm single pulse. fig 3. safe operating area; continuous and peak drain currents as a function of drain-source voltage. 03na19 0 20 40 60 80 100 120 0 25 50 75 100 125 150 175 200 p der (%) t mb ( o c) 03ne93 0 20 40 60 80 100 120 140 160 180 25 50 75 100 125 150 175 200 t j (oc) i d (a) capped at 75a due to package p der p tot p tot 25 c () ---------------------- 100 % = i der i d i d25c () ------------------ - 100 % = 03nf02 1 10 10 2 10 3 1 10 10 2 v ds (v) i d (a) d.c. 100 ms 10 ms r dson = v ds / i d 1 ms t p = 10 us 100 us capped at 75 a due to package t p t p t p t t d =
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 23 july 2001 4 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. 7. thermal characteristics 7.1 transient thermal impedance table 4: thermal characteristics symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient vertical in still air; sot78 and sot226 packages 60 k/w mounted on printed circuit board; minimum footprint; sot404 package 50 k/w r th(j-mb) thermal resistance from junction to mounting base figure 4 0.5 k/w fig 4. transient thermal impedance from junction to mounting base as a function of pulse duration. 03nf03 single shot 0.2 0.1 0.05 0.02 10 -3 10 -2 10 -1 1 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 1 t p (s) z th(j-mb) (k/w) d = 0.5 t p t p t p t t d =
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 ? 23 july 2001 5 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. 8. characteristics table 5: characteristics t j =25 c unless otherwise specited symbol parameter conditions min typ max unit static characteristics v (br)dss drain-source breakdown voltage i d = 0.25 ma; v gs =0v t j =25 c55 -- v t j = - 55 c50 -- v v gs(th) gate-source threshold voltage i d = 1 ma; v ds =v gs ; figure 9 t j =25 c 1 1.5 2 v t j = 175 c 0.5 -- v t j = - 55 c -- 2.3 v i dss drain-source leakage current v ds = 55 v; v gs =0v t j =25 c - 0.05 10 m a t j = 175 c -- 500 m a i gss gate-source leakage current v gs = 10 v; v ds =0v - 2 100 na r dson drain-source on-state resistance v gs =5v; i d =25a; figure 7 and 8 t j =25 c - 5.3 6.3 m w t j = 175 c -- 13.2 m w v gs = 4.5 v; i d =25a -- 6.7 m w v gs =10v; i d =25a - 4.8 5.8 m w dynamic characteristics c iss input capacitance v gs =0v; v ds =25v; f = 1 mhz; figure 12 - 6500 8600 pf c oss output capacitance - 1000 1200 pf c rss reverse transfer capacitance - 650 850 pf t d(on) turn-on delay time v dd = 30 v; r l = 1.2 w ; v gs =5v; r g =10 w - 45 - ns t r rise time - 180 - ns t d(off) turn-off delay time - 420 - ns t f fall time - 235 - ns l d internal drain inductance from drain lead 6 mm from package to centre of die - 4.5 - nh from contact screw on mounting base to centre of die sot78 - 3.5 - nh from upper edge of drain mounting base to centre of die sot404 / sot226 - 2.5 - nh l s internal source inductance from source lead to source bond pad - 7.5 - nh
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 ? 23 july 2001 6 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. source-drain diode v sd source-drain (diode forward) voltage i s = 30 a; v gs =0v; figure 15 - 0.85 1.2 v t rr reverse recovery time i s =20a;di s /dt = - 100 a/ m s v gs = - 10 v; v ds =30v - 80 - ns q r recovered charge - 200 - nc table 5: characteristics continued t j =25 c unless otherwise specited symbol parameter conditions min typ max unit t j =25 c; t p = 300 m st j =25 c; i d =25a fig 5. output characteristics: drain current as a function of drain-source voltage; typical values. fig 6. drain-source on-state resistance as a function of gate-source voltage; typical values. t j =25 c fig 7. drain-source on-state resistance as a function of drain current; typical values. fig 8. normalized drain-source on-state resistance factor as a function of junction temperature. 03ne99 0 50 100 150 200 250 300 350 400 0246810 v ds (v) i d (a) 2.4 3 4 5 6 7 10 v gs (v) = 03ne98 4 5 6 7 8 246810 v gs (v) r dson (m w ) 03nf00 4 5 6 7 8 0 20406080100 i d (a) r dson (m w ) v gs (v) = 3 3.2 3.4 3.6 4 5 03ne89 0 0.6 1.2 1.8 2.4 -60 0 60 120 180 t j ( o c) a a r dson r dson 25 c () ---------------------------- =
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 ? 23 july 2001 7 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. i d = 1 ma; v ds =v gs t j =25 c; v ds =v gs fig 9. gate-source threshold voltage as a function of junction temperature. fig 10. sub-threshold drain current as a function of gate-source voltage. t j =25 c; v ds =25v v gs = 0 v; f = 1 mhz fig 11. forward transconductance as a function of drain current; typical values. fig 12. input, output and reverse transfer capacitances as a function of drain-source voltage; typical values. 03aa33 0 0.5 1 1.5 2 2.5 -60 0 60 120 180 t j ( o c) v gs(th) (v) max typ min 03aa36 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 0 0.5 1 1.5 2 2.5 3 v gs (v) i d (a) max typ min 03ne96 0 20 40 60 80 100 120 140 0 20406080100 i d (a) g fs (s) 03nf01 0 2000 4000 6000 8000 10000 12000 14000 16000 18000 10 -2 10 -1 1 10 10 2 v ds (v) c (pf) ciss coss crss
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 ? 23 july 2001 8 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. v ds =25v t j =25 c; i d =25a fig 13. transfer characteristics: drain current as a function of gate-source voltage; typical values. fig 14. gate-source voltage as a function of turn-on gate charge; typical values. v gs =0v fig 15. reverse diode current as a function of reverse diode voltage; typical values. 03ne97 0 20 40 60 80 100 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 v gs (v) i d (a) t j = 175 o c t j = 25 o c 03ne95 0 1 2 3 4 5 0 20 40 60 80 100 120 q g (nc) v gs (v) v dd = 44 v v dd = 14 v 03ne94 0 20 40 60 80 100 0 0.2 0.4 0.6 0.8 1.0 v sd (v) i s (a) t j = 175 o c t j = 25 o c
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 23 july 2001 9 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. 9. package outline fig 16. sot78 (to-220ab). references outline version european projection issue date iec jedec eiaj sot78 sc-46 3-lead to-220ab d d 1 q p l 123 l 1 (1) b 1 e e b 0 5 10 mm scale plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead to-220ab sot78 dimensions (mm are the original dimensions) a e a 1 c note 1. terminals in this zone are not inned. q l 2 unit a 1 b 1 d 1 e p mm 2.54 qq a b d c l 2 max. 3.0 3 8 3.6 15.0 13.5 3.30 2.79 3.0 2.7 2.6 2.2 0.7 0.4 15.8 15.2 0.9 0.7 1.3 1.0 4.5 4.1 1.39 1.27 6.4 5.9 10.3 9.7 l 1 (1) e l 00 09 07 01-02-16 mounting base
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 23 july 2001 10 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. fig 17. sot404 (d 2 -pak). unit a references outline version european projection issue date iec jedec eiaj mm a 1 d 1 d max. e el p h d q c 2.54 2.60 2 20 15.80 14.80 2.90 2.10 11 1.60 1 20 10 30 9.70 4 50 4.10 1.40 1.27 0.85 0.60 0.64 0.46 b dimensions (mm are the original dimensions) sot404 0 2.5 5 mm scale plastic single-ended surface mounted package (philips version of d 2 -pak); 3 leads (one lead cropped) sot404 e e e b d 1 h d d q l p c a 1 a 13 2 moun ing base 99-06-25 01-02-12
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 23 july 2001 11 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. fig 18. sot226 (i 2 -pak). references outline version european projection issue date iec jedec eiaj sot226 low-profile 3-lead to-220ab d d 1 l 123 l 2 l 1 mounting base b 1 e e q b 0 5 10 mm scale plastic single-ended package; low-profile 3 lead to-220ab sot226 dimensions (mm are the original dimensions) a e a 1 c note 1. terminals in this zone are not tinned. unit a 1 b 1 d 1 eq mm 2.54 l 1 2.6 2.2 3.30 2.79 15.0 13.5 10.3 9.7 1.5 1.1 9.65 8.65 0.7 0.4 1.3 1.0 0 9 0.7 1.40 1.27 4 5 4.1 ab d c 3.0 l 2 (1) max e l 99 05 27 99-09-13
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 23 july 2001 12 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. 10. soldering dimensions in mm. fig 19. re?ow soldering footprint for sot404. msd057 solder lands solder resist occupied area solder paste 10.50 7.40 7 50 1.50 1.70 10.60 1.20 1.30 1.55 5.08 10.85 0 30 2.15 8.35 2.25 4.60 0.20 3 00 4.85 7.95 8.15 8.075 8.275 5.40 1 50
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 ? 23 july 2001 13 of 16 9397 750 08416 ? philips electronics n.v. 2001. all rights reserved. 11. revision history table 6: revision history rev date cpcn description 03 20010723 - product data; third version. data sheet updated to data builder two format, with the addition of sot226 part. 02 19991202 - product specitcation; second version 01 19981011 - product specitcation; initial version
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 ? 23 july 2001 14 of 16 9397 750 08416 ? philips electronics n.v. 2001 all rights reserved. 12. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is ava ilable on the internet at url http://www.semiconductors.philips.com. 13. detnitions short-form specitcation ? the data in a short-form specitcation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values detnition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specitcation is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specited use without further testing or moditcation. 14. disclaimers life support ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specited. data sheet status [1] product status [2] detnition objective data development this data sheet contains data from the objective specitcation for product development. philips semiconductors reserves the right to change the specitcation in any manner without notice. preliminary data qualitcation this data sheet contains data from the preliminary specitcation. supplementary data will be publish ed at a later date. philips semiconductors reserves the right to change the specitcation without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product specitcation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change notitcation (cpcn) procedure snw-sq-650a.
philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a product data rev. 03 23 july 2001 15 of 16 9397 750 08416 ? phil ps electronics n v 2001 a l rights reserved philips semiconductors - a worldwide company argentina: see south america australia: tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: tel. +43 160 101, fax. +43 160 101 1210 belarus: tel. +375 17 220 0733, fax. +375 17 220 0773 belgium: see the netherlands brazil: see south america bulgaria: tel. +359 268 9211, fax. +359 268 9102 canada: tel. +1 800 234 7381 china/hong kong: tel. +852 2 319 7888, fax. +852 2 319 7700 colombia: see south america czech republic: see austria denmark: tel. +45 3 288 2636, fax. +45 3 157 0044 finland: tel. +358 961 5800, fax. +358 96 158 0920 france: tel. +33 1 4728 6600, fax. +33 1 4728 6638 germany: tel. +49 40 23 5360, fax. +49 402 353 6300 hungary: tel. +36 1 382 1700, fax. +36 1 382 1800 india: tel. +91 22 493 8541, fax. +91 22 493 8722 indonesia: see singapore ireland: tel. +353 17 64 0000, fax. +353 17 64 0200 israel: tel. +972 36 45 0444, fax. +972 36 49 1007 italy: tel. +39 039 203 6838, fax +39 039 203 6800 japan: tel. +81 33 740 5130, fax. +81 3 3740 5057 korea: tel. +82 27 09 1412, fax. +82 27 09 1415 malaysia: tel. +60 37 50 5214, fax. +60 37 57 4880 mexico: tel. +9-5 800 234 7381 middle east: see italy netherlands: tel. +31 40 278 2785, fax. +31 40 278 8399 new zealand: tel. +64 98 49 4160, fax. +64 98 49 7811 norway: tel. +47 22 74 8000, fax. +47 22 74 8341 philippines: tel. +63 28 16 6380, fax. +63 28 17 3474 poland: tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: tel. +27 11 471 5401, fax. +27 11 471 5398 south america: tel. +55 11 821 2333, fax. +55 11 829 1849 spain: tel. +34 33 01 6312, fax. +34 33 01 4107 sweden: tel. +46 86 32 2000, fax. +46 86 32 2745 switzerland: tel. +41 14 88 2686, fax. +41 14 81 7730 taiwan: tel. +886 22 134 2451, fax. +886 22 134 2874 thailand: tel. +66 23 61 7910, fax. +66 23 98 3447 turkey: tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine: tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: tel. +44 208 730 5000, fax. +44 208 754 8421 united states: tel. +1 800 234 7381 uruguay: see south america vietnam: see singapore yugoslavia: tel. +381 11 3341 299, fax. +381 11 3342 553 for all other countries apply to: philips semiconductors, marketing communications, building be, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 272 4825 internet: http://www.semiconductors.philips.com (sca72)
? philips electronics n.v. 2001. printed in the netherlands all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 23 july 2001 document order number: 9397 750 08416 contents philips semiconductors BUK9506-55A; buk9606-55a; buk9e06-55a 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 pinning information . . . . . . . . . . . . . . . . . . . . . . 1 5 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 6 limiting values . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 thermal characteristics . . . . . . . . . . . . . . . . . . . 4 7.1 transient thermal impedance . . . . . . . . . . . . . . 4 8 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 12 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 14 13 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

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