1. 2. 3. material content data sheet sales product name ipp060n06n issued 29. august 2013 ma# MA000963520 package pg-to220-3-1 weight* 2048.19 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 7.602 0.37 0.37 3711 3711 leadframe non noble metal iron 7439-89-6 1.407 0.07 687 inorganic material phosphorus 7723-14-0 0.422 0.02 206 non noble metal copper 7440-50-8 1404.801 68.58 68.67 685873 686766 wire non noble metal aluminium 7429-90-5 3.208 0.16 0.16 1566 1566 encapsulation organic material carbon black 1333-86-4 8.864 0.43 4328 plastics epoxy resin - 97.499 4.76 47603 inorganic material silicondioxide 60676-86-0 484.541 23.66 28.85 236570 288501 leadfinish non noble metal tin 7440-31-5 21.462 1.05 1.05 10479 10479 plating non noble metal nickel 7440-02-0 0.244 0.01 119 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 0 119 solder noble metal silver 7440-22-4 0.454 0.02 221 non noble metal tin 7440-31-5 0.363 0.02 177 non noble metal lead 7439-92-1 17.327 0.85 0.89 8460 8858 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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