? semiconductor components industries, llc, 2013 may, 2013 ? rev. 7 1 publication order number: murhb840ct/d MURHB840CTG, murhb840ctt4g, surhb8840ctt4g power rectifier d 2 pak power surface mount package these state ? of ? the ? art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. features ? package designed for power surface mount applications ? ultrafast 28 nanosecond recovery times ? 175 c operating junction temperature ? epoxy meets ul 94 v ? 0 @ 0.125 in ? high temperature glass passivated junction ? high voltage capability ? low leakage specified @ 150 c case temperature ? short heat sink tab manufactured ? not sheared! ? similar in size to industrial standard to ? 220 package ? surhb8 prefix for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and ppap capable ? surhb8 prefix for automotive and other applications requiring unique site and control change requirements ? these packages are pb-free* mechanical characteristics: ? case: epoxy, molded, epoxy meets ul 94, v ? 0 ? weight: 1.7 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? device meets msl1 requirements ? esd ratings: ? machine model, c (> 400 v) ? human body model, 3b (> 8000 v) *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ? ordering information d 2 pak case 418b style 3 ultrafast rectifier 8.0 amperes, 400 volts 1 3 4 marking diagram http://onsemi.com a = assembly location y = year ww = work week uh840 = device code g = pb ? free package aka = diode polarity ay ww uh840g aka ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. murhb840ctt4g d 2 pak (pb ? free) 800 / tape & reel MURHB840CTG d 2 pak (pb ? free) 50 units/rail surhb8840ctt4g d 2 pak (pb ? free) 800 / tape & reel
MURHB840CTG, murhb840ctt4g, surhb8840ctt4g http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 400 v average rectified forward current (rated v r , t c = 120 c) total device i f(av) 4.0 8.0 a peak repetitive forward current (rated v r , square wave, 20 khz, t c = 120 c) i fm 8.0 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 100 a controlled avalanche energy w aval 20 mj operating junction and storage temperature range t j , t stg ? 65 to +175 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics (per leg) rating symbol value unit maximum thermal resistance, junction ? to ? case r jc 3.0 c/w maximum thermal resistance, junction ? to ? ambient r ja 50 c/w electrical characteristics (per leg) characteristic symbol value unit maximum instantaneous forward voltage (note 1) (i f = 4.0 a, t c = 150 c) (i f = 4.0 a, t c = 25 c) v f 1.9 2.2 v maximum instantaneous reverse current (note 1) (rated dc voltage, t c = 150 c) (rated dc voltage, t c = 25 c) i r 500 10 a maximum reverse recovery time (i f = 1.0 a, di/dt = 50 a/ s) t rr 28 ns typical peak reverse recovery current (i f = 1.0 a, di/dt = 50 a/ s) i rm 0.7 a 1. pulse test: pulse width = 300 s, duty cycle 2.0%
MURHB840CTG, murhb840ctt4g, surhb8840ctt4g http://onsemi.com 3 figure 1. typical forward voltage figure 2. typical reverse current, per leg figure 3. current derating, case figure 4. typical capacitance, per leg 50 20 10 0.1 0.2 0.5 1 2 5 2.4 2.2 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 v f , instantaneous voltage (volts) i f , instantaneous forward current (amp) t j = 150 c 100 c 25 c v r , reverse voltage (volts) i r , reverse current (a) 0.1 0 1000 0.2 0.5 1 5 10 20 50 100 200 500 50 100 150 200 250 300 350 400 i f , average power dissipation (watts) t c , case temperature ( c) 0 110 2 4 6 8 10 120 130 140 150 160 170 180 t j = 150 c 100 c 25 c rated v r applied r jc = 3 c/w dc square wave c, capacitance (pf) v r , reverse voltage (volts) 0.01 1000 100 10 1 0.1 1 10 100 2 100 figure 5. forward power dissipation, per leg p f(av) , average power dissipation (watts) i f(av) , average forward current (amps) 1 20 18 16 14 12 10 8 6 4 2 0 2345678910 t j = 175 c square wave dc
MURHB840CTG, murhb840ctt4g, surhb8840ctt4g http://onsemi.com 4 package dimensions seating plane s g d ? t ? m 0.13 (0.005) t 23 1 4 3 pl k j h v e c a dim min max min max millimeters inches a 0.340 0.380 8.64 9.65 b 0.380 0.405 9.65 10.29 c 0.160 0.190 4.06 4.83 d 0.020 0.035 0.51 0.89 e 0.045 0.055 1.14 1.40 g 0.100 bsc 2.54 bsc h 0.080 0.110 2.03 2.79 j 0.018 0.025 0.46 0.64 k 0.090 0.110 2.29 2.79 s 0.575 0.625 14.60 15.88 v 0.045 0.055 1.14 1.40 ? b ? m b w w notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 418b ? 01 thru 418b ? 03 obsolete, new standard 418b ? 04. f 0.310 0.350 7.87 8.89 l 0.052 0.072 1.32 1.83 m 0.280 0.320 7.11 8.13 n 0.197 ref 5.00 ref p 0.079 ref 2.00 ref r 0.039 ref 0.99 ref m l f m l f m l f variable configuration zone r n p u view w ? w view w ? w view w ? w 123 d 2 pak 3 case 418b ? 04 issue k style 3: pin 1. anode 2. cathode 3. anode 4. cathode *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 8.38 5.080 dimensions: millimeters pitch 2x 16.155 1.016 2x 10.49 3.504
MURHB840CTG, murhb840ctt4g, surhb8840ctt4g http://onsemi.com 5 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 murhb840ct/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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