multilayer ceramic chip capacitors 1 of 3 creation date : december 06, 2017 (gmt) cgj3e1x7r0j225k080ac tdk item description cgj3e1x7r0j225kt**** applications high reliability grade feature general general (up to 50v) aec-q200 aec-q200 series cgj3(1608) [eia 0603] status production size length(l) 1.60mm 0.10mm width(w) 0.80mm 0.10mm thickness(t) 0.80mm 0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 2.2f 10% rated voltage 6.3vdc temperature characteristic x7r(15%) dissipation factor (max.) 10% insulation resistance (min.) 45m other soldering method wave (flow) re?ow aec-q200 yes packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : december 06, 2017 (gmt) cgj3e1x7r0j225k080ac characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cgj3e1x7r0j225k080ac esr cgj3e1x7r0j225k080ac capacitance cgj3e1x7r0j225k080ac dc bias characteristic cgj3e1x7r0j225k080ac temperature characteristic cgj3e1x7r0j225k080ac(no bias) cgj3e1x7r0j225k080ac(dc bias = 3.15v ) ripple temperature rising cgj3e1x7r0j225k080ac(100khz) cgj3e1x7r0j225k080ac(500khz) cgj3e1x7r0j225k080ac(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : december 06, 2017 (gmt) cgj3e1x7r0j225k080ac associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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