? semiconductor components industries, llc, 2016 june, 2016 ? rev. 5 1 publication order number: nlu1gt50/d nlu1gt50 single buffer, non-inverting, ttl level ttl ? compatible inputs the nlu1gt50 minigate is an advanced cmos high ? speed non ? inverting buffer in ultra ? small footprint. the device input is compatible with ttl ? type input thresholds and the output has a full 5.0 v cmos level output swing. the nlu1gt50 input and output structures provide protection when voltages up to 7.0 v are applied, regardless of the supply voltage. features ? designed for 1.65 to 5.5 v v cc operation ? high speed: t pd = 3.5 ns (typ) @ v cc = 5.0 v ? low power dissipation: i cc = 1 a (max) at t a = 25 c ? ttl ? compatible input: v il = 0.8 v; v ih = 2.0 v, v cc = 5.0 v ? cmos ? compatible output: v oh > 0.8 v cc ; v ol < 0.1 v cc @ load ? power down protection provided on inputs ? balanced propagation delays ? ultra ? small packages ? these are pb ? free devices v cc nc in a out y gnd 1 2 3 5 4 in a out y 1 figure 1. pinout (top view) figure 2. logic symbol 6 nc pin assignment 1 2 3 gnd nc in a 4 5nc out y 6v cc function table l h ay l h marking diagrams l = device marking m = date code www. onsemi.com see detailed ordering and shipping information on page 4 of this data sheet. ordering information lm 1 udfn6 mu suffix case 517aa 1 1 ullga6 1.0 x 1.0 case 613ad ullga6 1.45 x 1.0 case 613af lm lm udfn6 1.45 x 1.0 case 517aq udfn6 1.0 x 1.0 case 517bx 1 r m 1 v m
nlu1gt50 www. onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage ? 0.5 to +7.0 v v in dc input voltage ? 0.5 to +7.0 v v out dc output voltage ? 0.5 to +7.0 v i ik dc input diode current v in < gnd ? 20 ma i ok dc output diode current v out < gnd 20 ma i o dc output source/sink current 12.5 ma i cc dc supply current per supply pin 25 ma i gnd dc ground current per ground pin 25 ma t stg storage temperature range ? 65 to +150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v ? 0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) > 2000 > 200 n/a v i latchup1 latchup performance above v cc and below gnd at 125 c (note 5) 500 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. measured with minimum pad spacing on an fr4 board, using 10 mm ? by ? 1 inch, 2 ounce copper trace no air flow. 2. tested to eia / jesd22 ? a114 ? a. 3. tested to eia / jesd22 ? a115 ? a. 4. tested to jesd22 ? c101 ? a. 5. tested to eia / jesd78. recommended operating conditions symbol parameter min max unit v cc positive dc supply voltage 1.65 5.5 v v in digital input voltage 0 5.5 v v out output voltage 0 5.5 v t a operating free ? air temperature ? 55 +125 c t/ v input transition rise or fall rate v cc = 3.3 v 0.3 v v cc = 5.0 v 0.5 v 0 0 100 20 ns/v
nlu1gt50 www. onsemi.com 3 dc electrical characteristics symbol parameter conditions v cc (v) t a = 25 c t a = +85 c t a = ? 55 c to +125 c unit min typ max min max min max v ih low ? level input voltage 1.65 to 2.29 2.3 to 2.99 3.0 4.5 to 5.5 0.50 x v cc 0.45 x v cc 1.4 2.0 0.50 x v cc 0.45 x v cc 1.4 2.0 v v il low ? level input voltage 1.65 to 2.29 2.3 to 2.99 3.0 4.5 to 5.5 0.10 x v cc 0.15 x v cc 0.53 0.8 0.10 x v cc 0.15 x v cc 0.53 0.8 0.10 x v cc 0.15 x v cc 0.53 0.8 v v oh high ? level output voltage v in = v ih or v il i oh = ? 50 a 1.65 to 2.99 3.0 4.5 v cc ? 0.1 2.9 4.4 3.0 4.5 v cc ? 0.1 2.9 4.4 v cc ? 0.1 2.9 4.4 v v in = v ih or v il i oh = ? 4 ma i oh = ? 8 ma 3.0 4.5 2.58 3.94 2.48 3.80 2.34 3.66 v ol low ? level output voltage v in = v ih or v il i ol = 50 a 1.65 to 2.99 3.0 4.5 0 0 0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il i ol = 4 ma i ol = 8 ma 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 i in input leakage current 0 = v in = 5.5 v 0 to 5.5 0.1 1.0 1.0 a i cc quiescent supply current v in = 5.5 v or gnd 5.5 1.0 20 40 a i cct quiescent supply current v in = 3.4 v 5.5 1.35 1.50 1.65 ma i opd output leakage current v out = 5.5 v 0.0 0.5 5.0 10 a
nlu1gt50 www. onsemi.com 4 ac electrical characteristics (input t r = t f = 3.0 n) symbol parameter v cc (v) test condition t a = 25 c t a = +85 c t a = ? 55 c to +125 c unit min typ max min max min max t plh , t phl propagation delay, input a to output y 1.65 to 1.95 c l = 15 pf 16.6 18.0 22.0 ns 2.3 to 2.7 c l = 15 pf 13.3 14.5 17.5 c l = 50 pf 19.5 22.0 25.5 3.0 to 3.6 c l = 15 pf 4.5 10.0 11.0 13.0 c l = 50 pf 6.3 13.5 15.0 17.5 4.5 to 5.5 c l = 15 pf 3.5 6.7 7.5 8.5 c l = 50 pf 4.3 7.7 8.5 9.5 c in input capacitance 5 10 10 10.0 pf c pd power dissipation capacitance (note 6) 5.0 12 pf 6. c pd is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumpt ion without load. average operating current can be obtained by the equation i cc(opr) = c pd ? v cc ? f in + i cc . c pd is used to determine the no ? load dynamic power consumption: p d = c pd ? v cc 2 ? f in + i cc ? v cc . gnd 50% 50% v cc a y t phl t plh *includes all probe and jig capacitance c l * test point device under test output figure 3. switching waveforms figure 4. test circuit v oh v ol v cc ordering information device package shipping ? nlu1gt50mutcg udfn6, 1.2 x 1.0, 0.4p (pb ? free) 3000 / tape & reel nlu1gt50amx1tcg ullga6, 1.45 x 1.0, 0.5p (pb ? free) 3000 / tape & reel nlu1gt50cmx1tcg ullga6, 1.0 x 1.0, 0.35p (pb ? free) 3000 / tape & reel nlu1gt50amutcg udfn6, 1.45 x 1.0, 0.5p (pb ? free) 3000 / tape & reel NLU1GT50CMUTCG udfn6, 1.0 x 1.0, 0.35p (pb ? free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
nlu1gt50 www. onsemi.com 5 package dimensions udfn6 1.45x1.0, 0.5p case 517aq issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 6x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 b 0.20 0.30 d 1.45 bsc e 1.00 bsc e 0.50 bsc l 0.30 0.40 l1 ??? 0.15 dimensions: millimeters 0.30 6x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint package outline l1 detail a l optional constructions l 0.07 ref 6x a2 detail b detail a
nlu1gt50 www. onsemi.com 6 package dimensions udfn6 1.0x1.0, 0.35p case 517bx issue o ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* recommended dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.12 0.22 d 1.00 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 a b e d 0.10 c pin one reference top view 0.10 c a a1 0.05 c 0.05 c c seating plane side view 2x 2x a3 bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 l1 1 3 4 6 m m dimensions: millimeters 0.22 5x 0.48 6x 1.18 0.53 pitch 0.35 1 pkg outline
nlu1gt50 www. onsemi.com 7 package dimensions udfn6, 1.2x1.0, 0.4p case 517aa issue d notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 2x 0.10 c pin one reference top view 2x 0.10 c 10x a a1 (a3) 0.08 c 0.10 c c seating plane side view l2 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.127 ref b 0.15 0.25 d 1.20 bsc e 1.00 bsc e 0.40 bsc l 0.30 0.40 l1 0.00 0.15 mounting footprint* dimensions: millimeters 0.22 6x 0.42 6x 1.07 0.40 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. l1 detail a bottom view (optional) 0.40 0.50
nlu1gt50 www. onsemi.com 8 package dimensions ullga6 1.0x1.0, 0.35p case 613ad issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view l1 1 3 4 6 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.12 0.22 d 1.00 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 note 4 soldermask defined* dimensions: millimeters 0.22 5x 0.48 6x 1.18 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.35 1 mounting footprint pkg outline
nlu1gt50 www. onsemi.com 9 package dimensions ullga6 1.45x1.0, 0.5p case 613af issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view l1 1 3 4 6 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.45 bsc e 1.00 bsc e 0.50 bsc l 0.25 0.35 l1 0.30 0.40 note 4 soldermask defined* dimensions: millimeters 0.30 5x 0.49 6x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint pkg outline on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent ? marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 nlu1gt50/d minigate is a trademark of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
|
