clamp0511pq final datasheet rev 3 revision date 11/9/2016 1 of 8 semtech features ? transient protection for data lines to iec 61000-4-2 (esd) 30kv (contact & air) iec 61000-4-4 (eft) 40a (tp = 5/50ns) cable discharge event (cde) ? ultra-small package (1.0 x 0.6 x 0.5mm) ? protects one i/o or power line ? low clamping voltage ? working voltage: 5v ? low leakage current ? solid-state silicon-avalanche technology ? aec-q100 grade 1 qualifed mechanical characteristics ? slp1006p2 package ? pb-free, halogen free, rohs/weee compliant ? molding compound fammability rating: ul 94v-0 ? lead finish: nipdau ? packaging: tape and reel applications ? cellular handsets & accessories ? cordless phones & smart phones ? notebooks & handhelds ? portable instrumentation ? digital cameras ? mp3 players ? automotive applications clamp0511pq clamp? 1-line esd protection description clamp ? series of tvs arrays are designed to protect sensitive electronics from damage or latch-up due to esd. they feature large cross-sectional area junctions for conducting high transient currents. they ofer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. the clamp ? 0511pq is in a 2-pin, slp1006p2 package. it measures 1.0 x 0.6 x 0.5mm. the leads are spaced at a pitch of 0.65mm and are fnished with lead-free nipdau. each device will protect one bidirectional line operating at 5 volts. it gives the designer the fexibility to protect single lines in applications where arrays are not practical. they may be used to meet the esd immunity requirements of iec 61000-4-2 (30kv contact & air discharge). the combination of small size and high esd surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and mp3 players. the clamp0511pq is qualifed to aec-q100 grade 1 for automotive use. package dimension schematic & pin confguration slp1006p2 (bottom view) protection products www.semtech.com
clamp0511pq final datasheet rev 3 revision date 11/9/2016 2 of 8 semtech absolute maximum rating rating symbol value units peak pulse power (t p = 8/20s) p pk 170 w peak pulse current (t p = 8/20s) i pp 12 a esd per iec 61000-4-2 (air) (1) esd per iec 61000-4-2 (contact) (1) v esd 30 30 kv operating temperature t j -40 to +125 o c storage temperature t stg -55 to +150 o c electrical characteristics (t=25 o c unless otherwise specifed) parameter symbol conditions min. typ. max. units reverse stand-of voltage v rwm pin 1 to 2 or 2 to 1 5 v reverse breakdown voltage v br i t = 1ma, pin 1 to 2 or 2 to 1 t=-40 o c to +125 o c 6 8 10 v reverse leakage current i r v rwm = 5v pin 1 to 2 or 2 to 1 t=25 o c 0.025 1 a t=125 o c 1 clamping voltage v c i pp =1a, t p = 8/20s pin 1 to 2 or 2 to 1 11 v i pp =12a, t p = 8/20s pin 1 to 2 or 2 to 1 14 dynamic resistance 2,3 r dyn t p = 0.2/100ns, pin1 to 2 or 2 to 1 0.19 junction capacitance c j v r = 5v, f = 1mhz pin 1 to 2 or 2 to 1 t=25 o c 75 pf t=125 o c 75 notes 1) esd gun return path connected to esd ground reference plane. 2) transmission line pulse test (tlp) settings: t p = 100ns, t r = 0.2ns, i tlp and v tlp averaging window: t 1 = 70ns to t 2 = 90ns. 3) dynamic resistance calculated from i tlp = 4a to i tlp = 16a. www.semtech.com
clamp0511pq final datasheet rev 3 revision date 11/9/2016 3 of 8 semtech typical characteristics non-repetitive peak pulse power vs. pulse time power derating curve clamping voltage vs. peak pulse current (t p =8/20s) esd clamping (8kv contact per iec 61000-4-2) 0 2 4 6 8 10 12 14 0 2 4 6 8 10 12 14 clamping voltage - v c (v) peak pulse current - i pp (a) waveform: parameters: tr = 8s td = 20s 0 5 10 15 20 25 30 35 40 45 50 -10 0 10 20 30 40 50 60 70 80 clampng voltage - v c (v) time (ns) t a = 25 o c. waveform iec61000 -4- 2 8kv contact discharge. measured with and corrected for 50 , 40db attenuator. 50 scope input impedance, 2ghz bw. esd gun return connected to esd ground plane. 0 10 20 30 40 50 0 1 2 3 4 5 junction capacitance - c j (pf) reverse volage - v r (v) f = 1 mhz 0 5 10 15 20 25 30 35 0 2 4 6 8 10 12 14 16 tlp current (a) tlp voltage (v) r d = 0.194 ohms transimission line pulse (tlp) settings: t p = 100ns, t r =0.2ns, i tlp and v tlp averaging window: t 1 =70ns to t 2 =90ns 0.01 0.1 1 10 0.1 1 10 100 1000 peak pulse power - p pp (kw) pulse duration - tp (s) dr040412 - 170 t a = 25 o c 0 20 40 60 80 100 120 0 25 50 75 100 125 150 % of rated power or i pp ambient temperature - t a ( o c) dr040514 - 25- 125- 150 capacitance vs. reverse voltage tlp characteristic (positive pulse) www.semtech.com
clamp0511pq final datasheet rev 3 revision date 11/9/2016 4 of 8 semtech typical characteristics junction capacitance vs. temperature leakage current vs. temperature leakage current vs. reverse voltage 0 5 10 15 20 25 30 0 1 2 3 4 5 6 leakage current - i r (na) reverse voltage - v r (v) 7.2 7.4 7.6 7.8 8 8.2 8.4 8.6 -50 -25 0 25 50 75 100 125 150 breakdown voltage - v br (v) temperature ( c) 0 10 20 30 40 50 60 -50 -25 0 25 50 75 100 125 150 capacitance (pf) temperature ( c) v r = ov v r = 5v 0 50 100 150 200 250 -50 -25 0 25 50 75 100 125 150 leakage current - i r (na) temperature ( c) v r = 5v reverse breakdown voltage vs. temperature www.semtech.com
clamp0511pq final datasheet rev 3 revision date 11/9/2016 5 of 8 semtech application information device connection options this tvs diode is designed to protect one data, i/o, or power supply line. the device is bidirectional and may be used on lines where the signal polarity can go above and below ground. the device is symmetrical, and therefore, the orientation of the device is not critical. circuit board layout recommendations for suppression of esd good circuit board layout is critical for the suppression of esd induced transients. the following guidelines are recommended: ? place the tvs near the input terminals or connectors to restrict transient coupling. ? minimize the path length between the tvs and the protected line. ? minimize all conductive loops including power and ground loops. ? the esd transient return path to ground should be kept as short as possible. ? never run critical signals near board edges. ? use ground planes whenever possible. circuit diagram www.semtech.com
clamp0511pq final datasheet rev 3 revision date 11/9/2016 6 of 8 semtech outline drawing - slp1006p2 land pattern - slp1006p2 aaa n e l e dim a 0.30 0.65 0.20 0.55 0 .08 2 0 .25 0 .60 0 .65 bsc millimeters max 0.55 0.53 dimensions min 0.45 nom 0.47 0 .50 0 .50 controlling dimensions are in millimeters (angles in degrees). notes: 1 . bottom view top view a b c b aaa c seating plane bbb c a b d 0.95 1.05 1 .00 bbb 0 .10 d e a1 a bxn a1 0.00 0 .03 0.05 r 2x l pin 1 id r 0.05 0 .10 0.15 e this land pattern is for reference purposes only. consult your manufacturing group to ensure your notes : 2. dim y g c millimeters (0.85) 1.40 0.55 0.30 dimensions company's manufacturing guidelines are met. z y (c) g z x 0.60 x 1. controlling dimensions are in millimeters (angles in degrees). www.semtech.com
clamp0511pq final datasheet rev 3 revision date 11/9/2016 7 of 8 semtech marking code pin 1 id tape and reel specifcation ordering information part number qty per reel reel size clamp0511pqtct 3,000 7 direction of feed uclamp0511p_8 o o pin1 at top closest to sprocket holes device orientation in tape note: device is electrically symmetrical. www.semtech.com
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