wire bondable resistor network arrays chip network array series absolute tolerances to 0.1% tight tcr tracking to 5ppm/c rato match tolerances to 0.05% ultra-stable tantalum nitride resistors ircs tansil ? network array resistors are ideally suited for applicatons that demand a small footprint. the small wire bondable chip package provides higher component density, lower resistor cost and high reliability. the tantalum nitride flm system on silicon provides precision tolerance, exceptonal tcr tracking and low cost. excellent performance in harsh, humid environments is a trademark of ircs self-passivatng tansil ? resistor flm. for applicatons requiring high performance resistor networks in a low cost, wire bondable package, specify irc network array die. wir e bondable r esis t or ne tw ork ar r a y s chip n e tw ork ar r a y series ab solu t e t oler ances t o 0.1% tigh t t cr tr acking t o 5pp m /c ma t ch t oler ances t o 0.05% ultr a-s t able t an t alum nitri d e r esis t or s ir c ? s t ansil ? ne tw ork arr a y r esis t or s ar e ideally sui t ed f or tha t demand a small f ootpri n t. the small wir e bondable chip pack ag e pr o vides higher c ompone n t density , l o w er r esis t or c os t and high r eliabilit y . the t an t alum nitride s y s t em on sili c on pr o vides pr ecision t oler ance, t cr tr acking and lo w c os t. ex cellen t perf ormance in har sh, humid en vir onmen ts is a tr ademark of ir c ? s t ansil ? r esis t or f or r equiring high perf ormance r esis t or ne tw ork s in a lo w c os t, wir e bondable pack ag e, specif y ir c ne tw ork ar r a y die. general note irc reser v es the r ight to mak e changes in product speci? cation without notice or liability . all inf or mation is subject to irc? s o wn data and is considered accur ate at time of going to pr int. a subsidiar y of tt electronics plc ? irc ad v anced film division t elephone: 361 992 7900 ? f acsimile: 361 992 3377 ? w ebsite: www .irctt.com ? 4222 south staples street ? cor pus chr isti t e xas 78411 usa wire bondab le resistor netw or k arr a ys ? absolute toler ances to 0.1% ? tight tcr tr ac king to 5ppm/c ? ratio match toler ances to 0.05% ? ultr a-stab le tantalum nitr ide resistors chip netw ork arra y series irc? s t ansil ? netw or k arr a y resistors are ideally suited f or applications that demand a small f ootpr int. the small wire bondab le chip pac kage pro vides higher component density , lo w er resistor cost and high reliability . the tantalum nitr ide ?lm system on silicon pro vides precision toler ance , e xceptional tcr tr ac king and lo w cost. excellent perf or mance in harsh, humid en vironments is a tr ademar k of irc? s self-passiv ating t ansil ? resistor ?lm. f or applications requir ing high perf or mance resistor netw or ks in a lo w cost, wire bondab le pac kage , specify irc netw or k arr a y die . wbc ser ies issue j an uar y 2009 sheet 1 of 4 absolute tcr commer cial code mil inspection code* 300ppm/c 00 04 100ppm/c 01 05 50ppm/c 02 06 25ppm/c 03 07 tcr/inspection code t ab le *notes: product supplied to class h of mil-prf 38534 include 100% visual inspection p o w er der ating data electr ical data isolated bussed resistance rang e 10? to 2.5m? 10? to 1.25m? absolute t olerance to 0.1% ratio t olerance to r1 to 0.05% to 0.1% absolute tcr to 25ppm/c t rac king tcr to 5ppm/c element p o wer rating 100mw @ 70c 50mw @ 70c p ac ka g e p o wer rating 8-p ad 400mw @ 70c 16-p ad 800mw @ 70c 24-p ad 1.0w @ 70c rated operating v olta g e (not to e xceed p x r) 100v operating t emperature -55c to +150c noise <-30db substrate material oxidiz ed silicon (10k? sio 2 minim um) substrate thic kness 0.016? 0.001 (0.406mm 0.01) bond p ad metallization alumin um 10k? minim um gold 1 15k? minim um bac kside silicon (gold a v ailab le 1 ) p assiv ation silicon dio xide or silicon nitr ide r esis t or s all parts ar e pb- fr ee and c omply with eu 2011/65/eu (r ohs2) 11.17 gener al not e all inf ormation is sub ject to tt electronics? own dat a and is considered accur at e at time of going to print. ? tt electronics plc http://www.tt electronics.com/resistors bi t echnologies ir c w elwyn note 1: not recommended for new designs resistors all parts are pb-free and comply with eu directve 2011/65/eu (rohs2) 11.17 general note tt electronics reserves the right to make changes in product specifcation without notice or liability. all information is subject to tt electronics own data and is considered accurate at time of going to print. ? tt electronics plc http://www.ttelectronics.com/resistors bi technologies irc welwyn
wire bondable resistor network arrays chip network array series ? irc advanced film division telephone: 361 992 7900 ? facsimile: 361 992 3377 ? website: www.irctt.com ? 4222 south staples street ? corpus christi texas 78411 usa wire bondable resistor network arrays manufacturing capabilities data absolute tcr (ppm/c) isolated schematic a bussed schematic b ohmic range (?) available tolerances available ratio tolerances best tcr tracking (ppm/c) ohmic range (?) available tolerances available ratio tolerances best tcr tracking (ppm/c) 300 10 - 25 f g j f g 50 10 - 25 f g j f g 200 26 - 50 d f g j c d f 10 26 - 50 f g j d f g 100 51 - 200 c d f g j c d f g 5 51 - 100 d f g j c d f g 50 201 - 2.5m b c d f g j a b c d f g 5 101 - 200 d f g j b c d f g 25 201 - 500 b c d f g j b c d f g 20 501 - 1.25m b c d f g j a b c d f g 5 100 26 - 50 d f g j c d f g 10 26 - 50 f g j d f g 100 51 - 200 c d f g j c d f g 5 51 - 100 d f g j c d f g 50 201 - 2.5m b c d f g j a b f g 5 101 - 200 d f g j b c d f g 25 201 - 500 b c d f g j b c d f g 20 501 - 350k b c d f g j a b c d f g 5 50 26 - 50 d f g j c d f g 10 51 - 100 d f g j c d f g 50 51 - 200 c d f g j c d f g 5 101 - 200 d f g j b c d f g 25 201 - 2.5m b c d f g j a b f g 5 201 - 500 b c d f g j b c d f g 20 501 - 1.25m b c d f g j a b c d f g 5 25 51 - 200 c d f g j c d f g 5 201 - 500 b c d f g j b c d f g 20 201 - 2.5m b c d f g j a b f g 5 501 - 1.25m b c d f g j a b c d f g 5 wbc series issue january 2009 sheet 2 of 4 11.17 general note tt electronics reserves the right to make changes in product specifcation without notice or liability. all information is subject to tt electronics own data and is considered accurate at time of going to print. ? tt electronics plc http://www.ttelectronics.com/resistors bi technologies irc welwyn
? irc advanced film division telephone: 361 992 7900 ? facsimile: 361 992 3377 ? website: www.irctt.com ? 4222 south staples street ? corpus christi texas 78411 usa wire bondable resistor network arrays physical data dss4x dss8x 1 6 1 r1 2 4 3 15 14 13 6 5 7 12 11 10 8 9 7 10 1 r1 23 16 14 15 45 6 12 13 11 8 9 2 1 87 4 3 65 1 8 23 4 6 7 5 r1 r1 0.004? min bond pads 0.140? 0.001 (3.556mm 0.025) 0.080? 0.001 (2.032mm 0.025) 0.004? min bond pads 0.070? 0.001 (1.778mm 0.025) 0.070? 0.001 (1.778mm 0.025) pad 1 pad 1 wbc series issue january 2009 sheet 3 of 4 wire bondable resistor network arrays chip network array series 11.17 general note tt electronics reserves the right to make changes in product specifcation without notice or liability. all information is subject to tt electronics own data and is considered accurate at time of going to print. ? tt electronics plc http://www.ttelectronics.com/resistors bi technologies irc welwyn
? irc advanced film division telephone: 361 992 7900 ? facsimile: 361 992 3377 ? website: www.irctt.com ? 4222 south staples street ? corpus christi texas 78411 usa wire bondable resistor network arrays wbc series issue january 2009 sheet 4 of 4 ordering data prefix wbd dss8 - b - 01 - 1002 - f - b style dss4 = 8-pad network dss8 = 6-pad network dqsc = 24-pad network schematic and termination a = isolated; b = bussed tcr/inspection code reference tcr/inspection code table resistance code 4-digit resistance code ex: 1002 = 10k ?, 50r1 = 50.1 ? absolute tolerance code j = 5%; g = 2%; f = 1%; d = 0.5%; c = 0.25%; b = 0.1% ratio tolerance code (optional) g = 2%; f = 1%; d = 0.5%; c = 0.25%; b = 0.1%; a = 0.05% packaging standard packaging is 2? x 2? chip tray. for additional information or to discuss your speci?c requirements, please contact our applications team using the contact details below. dqscx physical data 19 12 34 5 24 23 22 21 20 10 8 67 9 12 11 15 17 18 16 13 14 19 1 24 3 2 5 4 22 23 20 21 15 10 8 7 6 9 17 18 16 11 12 14 13 0.004? min bond pads 0.115? 0.001 (2.921mm 0.025) 0.086? 0.001 (2.184mm 0.025) pad 1 test method max ?r typical ?r thermal shock mil-std-202 method 107 test condition f 0.1% 0.02% high temperature exposure mil-std-883 method 1008 150c, 1000 hours 0.1% 0.05% low temperature storage -55c, 1000 hours 0.03% 0.01% life mil-std-202 method 108 70c, 1000 hours 0.5% 0.01% life at elevated temperature mil-std-202 method 108 125c, 1000 hours 0.5% 0.05% environmental data r1 r1 wire bondable resistor network arrays chip network array series 11.17 general note tt electronics reserves the right to make changes in product specifcation without notice or liability. all information is subject to tt electronics own data and is considered accurate at time of going to print. ? tt electronics plc http://www.ttelectronics.com/resistors bi technologies irc welwyn
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