nichia sts-da1-1322d nichia corporation specifications for warm white led NVSL119AT-H3 pb-free reflow soldering application built-in esd protection device rohs compliant
nichia sts-da1-1322d 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 1500 ma pulse forward current i fp 2000 ma allowable reverse current i r 85 ma power dissipation p d 5.25 w operating temperature t opr -40~100 c storage temperature t stg -40~100 c junction temperature t j 150 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =350ma 3 - v luminous flux v i f =350ma 113 - lm luminous intensity i v i f =350ma 37 - cd r8000 color rendering r a i f =350ma 83 - - x - i f =350ma 0.41 - - chromaticity coordinate y - i f =350ma 0.39 - - thermal resistance r js - 7 12 c/w * characteristics at t s =25c. * luminous flux value is traceable to the cie 127:2007-compliant national standards. * the chromaticity coordinates are derived from the cie 1931 chromaticity diagram. * r js is thermal resistance from junction to t s measuring point.
nichia sts-da1-1322d 2 ranks item rank min. max. unit m 3.1 3.5 forward voltage l 2.7 3.1 v b12 120 130 b11 110 120 b10 100 110 luminous flux b09 90 100 lm r a 80 - - color rendering r8000 r 9 0 - - color ranks rank sw27 rank sw30 x 0.4373 0.4562 0.4813 0.4593 x 0.4147 0.4299 0.4562 0.4373 y 0.3893 0.4260 0.4319 0.3944 y 0.3814 0.4165 0.4260 0.3893 rank sw35 rank sw40 x 0.3898 0.3996 0.4299 0.4147 x 0.3670 0.3736 0.3996 0.3898 y 0.3716 0.4015 0.4165 0.3814 y 0.3578 0.3874 0.4015 0.3716 rank sw45 x 0.3515 0.3548 0.3736 0.3670 y 0.3487 0.3736 0.3874 0.3578 * ranking at t s =25c. * tolerance of measurements of the forward voltage is 0.05v. * tolerance of measurements of the luminous flux is 7%. * tolerance of measurements of the color rendering r a is 2. * tolerance of measurements of the color rendering r 9 is 6.5. * the r 9 value for the above rank shall be greater than 0. * tolerance of measurements of the chromaticity coordinate is 0.005. * basically, a shipment shall consist of th e leds of a combination of the above ranks. the percentage of each rank in the shipment shall be determined by nichia. correspondence table of color coordinates, color rendering - luminous flux ranks ranking by luminous flux ranking by color coordinates,color rendering b09 b10 b11 b12 sw27,sw30,sw35 r8000 sw40,sw45 r8000
nichia sts-da1-1322d 3 chromaticity diagram sw27 sw35 sw30 sw40 sw45 0.25 0.30 0.35 0.40 0.45 0.50 0.30 0.35 0.40 0.45 0.50 0.55 x y
nichia sts-da1-1322d 4 outline dimensions sts-da7-0140a nvsx119a-hx ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.2) ka o protection device 0.45 2 1.4 3.17 anode cathode 0.5 3.17 cathode mark 3.5 3.5 2.6 ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials ??| lens materials | weight description ?? ceramics ?`? w? silicone resin (with phosphor) ? au-plated ?`? silicone resin 0.034g (typ)
nichia sts-da1-1322d 5 soldering ? recommended reflow soldering condition(lead-free solder) ? recommended manual soldering condition temperature 350c max soldering time 3sec max recommended soldering pad pattern ( g unit: mm) 4.1 3.5 0.6 * the product is designed to be reflow soldered to a pcb. if you use dip so ldering for the products, nichia cannot guarantee its reliability. * reflow soldering must not be performed more than twice. manual soldering must only be done once. * care should be taken to avoid cooling at a rapid ra te and ensure the peak temperature ramps down slowly. * customer is advised to use nitrogen reflow sold ering as air flow process can cause optical degradation due to the heat and atmosphere of reflow soldering. * since silicone used as en capsulating resin in this prod uct is a soft material, do no t press on the encapsulant. failure to comply might lead to ni cks, chip-outs, delamination and deformat ion of the encapsulant, bump breakage and an adverse effect on product reliability. when using automatic pick and place machine, use a pick up nozzle which does not directly apply stress to the encapsulation of the leds. recommended conditions: it is recommended to use a pick up nozzle designed for the leds. (see figure below.) * avoid direct contact to the resin lens with the picking up nozzle. failure to comply might result in catastrophic failure of the leds due to bump damage or breakage. ( g unit: mm) 0.4 3 3.8 1.9 * repairing should not be done after the leds ha ve been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it should be confirmed beforehand whether the characteri stics of the leds will or will not be damaged by repairing. * when soldering, avoid applying any st ress to the led package while heated. 120sec max pre-heat 180 to 200c 260c max 10sec max 60sec max above 220c 1 to 5c per sec
nichia sts-da1-1322d 6 tape and reel dimensions ?` / ` trailer and leader ???`?` embossed carrier tape ???` top cover tape feed direction ` 400mm leader without top cover tape 400mm min ?` 160mm ? trailer 160mm min(empty pockets) led ?? loaded pockets 100mm ? leader with top cover tape 100mm min(empty pocket) nxxx119x sts-da7-0106a quantity per reel=3500pcs 1 `?? 3500 ? the tape packing method complies with jis c 0806 (packaging of electronic components on continuous tapes). * jis c 0806 ???`??????? ?`??? tape 1.75 0.1 8 0.1 2 0.05 4 0.1 5.5 0.05 -0 1.5 +0.1 12 +0.3 -0.1 `? reel * 80 1 17.5 1 13.5 1 1 3 0 . 2 330 2 ? label 21 0 . 8 ( g unit: mm) ? no. 1.5 +0.2 cathode mark -0 3.7 0.1 3.7 0.1 0.25 0.05 2.25 0.1
nichia sts-da1-1322d 7 packaging - tape & reel nichia led sts-da7-0006a nxxxxxxx ? label ? label ? no. ????`??????`???? moisture absorbent material ? reel ` ?` seal moisture proof foil bag ?? the reel is placed in the moisture proof bag with a moisture absorbent material. the bag is heat sealed. ??K???`? the moisture proof foil bags are packed in a cardboard box with corrugated partition. customer is advised to pack the products in th e original packaging or equivalent in transit. ??\H?y?B???y? * the cardboard box is not water-resistant. do not expose to water. ?`???????y?????? * do not drop the cardboard box or expose it to shoc k. if the box falls, the products could be damaged. ?QH??n?????u?p?????? * the products are taped and reeled, an d then packed in moisture-proof bags. the moisture-proof bags are packed in cardboard boxes to prevent damage during shipment. * u???`?????n?go??`y? ? for details, see "lot numbering scheme" in this document. * ??????????? if not provided, it is not indicated on the label. ******* is the customer part number. O??????? * ******* ?? the label does not have the rank field for un-ranked products. * ??????????? rohs nxxxxxxx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. ymxxxx-rrr pcs rohs nxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan
nichia sts-da1-1322d 8 lot numbering scheme lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous flux, ranking by forward volt age, ranking by color rendering
nichia sts-da1-1322d 9 derating characteristics nvsx119a-hx sts-da7-0118a ? no. derating1 0 500 10 00 15 00 20 00 0 20406080100120 (71, 1500) (18, 15 00) (0, 122 0) (10 0, 95 2) (10 0, 57 1) (10 0, 40 8) derating2 0 500 10 00 15 00 20 00 0 2 0 40 60 80 100 120 (9 1, 15 00) (100, 1 280) duty 100 1000 10000 1 10 100 15 00 20 00 S allowable forward current ( ma ) `??????-S solder te mpe rature(c athode side) vs allowable forward current ??-S ambient tempe rature vs allowable forward current S allowable forward current(ma) S allo wable forward current(ma) `?????? solder temperature(cathode side)(c) ?? ambient temperature(c) ?` ?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current t a =25c 15c/w 25c/w 35c/w ja r = ja r = ja r =
nichia sts-da1-1322d 10 optical characteristics nvsl119 a-h3 ? no. sts-da7-0119c spectrum 0.0 0.2 0.4 0.6 0.8 1.0 400 4 50 500 5 50 600 650 700 7 50 800 ? relative illuminance(a.u.) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -2 0 -30 -4 0 -50 -6 0 -7 0 -80 -9 0 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.500.5 1 * ??? all characteristics shown are for reference only and are not guaranteed. 35 0ma i fp = t a =25c 35 0ma i fp = t a =25c
nichia sts-da1-1322d 11 forward current characteristics / temperature characteristics nvsl119 a-h3 sts-da7-0120a ? no. tavf 2.0 2.5 3.0 3.5 4.0 4.5 -60 -40 -20 0 20 40 60 80 1 00 120 ta iv 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 1 00 120 vfif 10 100 1000 10000 2.02.53.03.54.04.5 350 2000 relative luminous flux(a.u.) ??- ambient temperature vs relative luminous flux for ward curren t( m a) ifiv 0 1 2 3 4 5 0 500 10 00 150 0 2000 2 500 relative luminous flux(a.u.) - forward current vs relative luminous flux forw ard current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e(v) ?R forward voltage(v) ?? ambient tem p erature ( c ) ?? ambient temperature(c) t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25c i fp = 350 ma i fp = 350 ma
nichia sts-da1-1322d 12 forward current characteristics / temperature characteristics ? no. nvsl119 a-h3 sts-da7-0121a taxy 0.35 0.36 0.37 0.38 0.39 0.34 0.35 0.36 0.37 0 .3 8 -4 0c 0c 25c 50 c 100c x ifxy 0.35 0.36 0.37 0.38 0.39 0.34 0.35 0.36 0 .3 7 0.38 20ma 350ma 2000 ma x y y 350 ma i fp = ? ? -? ambie nt te mperature vs chromaticity c oordinate -? forward current vs chromaticity c oordinate t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. * ??? sw40, sw45( ???e???? ) ???? the graphs above show the characteristics for sw40 and sw45 leds, including sub-bins, of this product.
nichia sts-da1-1322d 13 forward current characteristics / temperature characteristics ? no. nvsl119 a-h3 sts-da7-0122a taxy 0.37 0.38 0.39 0.40 0.41 0 .38 0.39 0.40 0.41 0 .4 2 -40c 0c 25c 50c 100c x ifxy 0.37 0.38 0.39 0.40 0.41 0 .38 0.39 0.40 0.4 1 0.42 20ma 350ma 2000 ma x y y 350 ma i fp = ? ? -? ambie nt te mperature vs chromaticity c oordinate -? forward current vs chromaticity c oordinate t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. * ??? sw27, sw30, sw35( ???e???? ) ???? the graphs above show the characteristics for sw27, sw30 and sw35 leds, including sub-bins, of this product.
nichia sts-da1-1322d 14 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #2 0/22 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/22 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/22 high temperature storage jeita ed-4701 200 201 t a =100c 1000hours #1 0/22 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/22 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/22 room temperature operating life t a =25c, i f =1000ma test board: see notes below 1000hours #1 0/22 high temperature operating life t a =100c, i f =400ma test board: see notes below 1000hours #1 0/22 temperature humidity operating life 60c, rh=90%, i f =700ma test board: see notes below 500hours #1 0/22 low temperature operating life t a =-40c, i f =350ma test board: see notes below 1000hours #1 0/22 vibration jeita ed-4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/10 electrostatic discharges jeita ed-4701 300 304 hbm, 2kv, 1.5k ? , 100pf, 3pulses, alternately positi ve or negative #1 0/22 notes: 1) test board: fr4 board thickness=1.6mm, copper layer thickness=0.07mm, r ja 35c/w 2) measurements are performed after allo wing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage(v f ) i f =350ma >initial value1.1 #1 luminous flux( v ) i f =350ma nichia sts-da1-1322d 15 cautions (1) storage conditions te m p e ra t u r e humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date storage after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours this product is compliant to jedec msl 3 or equivalent. see ipc/jedec std-020 for the details of the moisture sensitivity leve ls. interface delamination can occur due to vapo rization and expansion of absorbed moisture in the led packages caused by soldering heat, whic h may result in degradation in optical performance. to minimize moisture absorption into the products during the transportation and storage, the products are packed in a moisture-proof aluminum bag. desicc ants (silica gel) inside the packing turn from blue to red as it absorbs moisture. after opening the moisture-proof aluminum bag, the products should be completed soldering process within the range of the conditions above. if unused leds remain, they should be stored with desiccants (silica gel) in hermetically sealed contai ner. nichia recommends using the orig inal moisture-proof bag for storage. after the "period after opening" specified above, or if the desi ccants (silica gel) ar e no longer blue, the products need to b e baked. note that baking must only be done once. although the leads or electrode pads (anode and cathode) of the product are plated with gold, prolonged exposure to a corrosive en vironment might cause the gold plated th e leads or electrode pads to tarnish, and thus leading to difficulties in sold ering. if unused leds remain, they must be stored in a hermetically sealed container . nichia recommends using the or iginal moisture-proof bag for storage. do not use sulfur-containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur . the contaminated plating of leds might cause an open circ uit. silicone rubber is recommen ded as a material for seals. bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. to avoid condensation, the pr oducts must not be stored in the areas wher e temperature and humidity fluctuate greatly. (2) directions for use in designing a circuit, the current through each led must not exceed the absolute maximum rating specified for each led. it is recommended to use circuit b which regulates the current flowing th rough each led. in the meanwhile, when driving leds with a constant voltage in circuit a, the current through the leds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... this product should be operated in forwar d bias. a driving circuit must be designed so that the product is not subjected to either forw ard or reverse voltage while it is off. in particular, if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in led damage. for stabilizing the led characteristics, it is recommended to operate at 10% of the rated current or higher. for outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. (3) handling precautions when handling the product, do not touch it directly with bare hands as it may contaminate the surface and affect on optical characteristics. in the worst cases, excessive force to the product might result in catastrophic failu re due to package damage and/or bump breakage. when handling the product with tweezers, make sure that excess ive force is not applied to the resin portion of the product. failure to comply can cause the resin portion of the pr oduct to be cut, chipped, delaminated and/or deformed, and bump to be broken, and thus resulting in catastrophic failure. if the product is dropped, it might be damaged. do not stack assembled pcbs together. fa ilure to comply can cause the resin portio n of the product to be cut, chipped, delaminated and/or deformed, and bump to be br oken, and thus resulting in catastrophic failure.
nichia sts-da1-1322d 16 (4) design consideration pcb warpage after mounting the products on to a pcb can cause the package to break. the leds should be placed so as to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechan ical stress is exerted on the leds placed near the score lines. the leds should be placed so as to minimi ze the stress on the leds due to board flexing. board separation must be performed using special jigs, not with hands. if an aluminum pcb is used, customer is advised to verity the pcb with the products before use. thermal stress during use can cause the solder joints to crack. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. an esd event may damage its die or reduce its reliability performance. when handling the products, measures against electro static discharge, including the followings, are strongly recommended. eliminating the charge; wrist strap, esd footwear and garments, esd floors grounding the equipment and tools at workstation esd table/shelf mat (conductive materials) proper grounding techniques are required for all devices, eq uipment and machinery used in the assembly of the products. also note that surge protection should be considered in the design of customer products. if tools or equipment contain insulating materials, such as glass or plastic, proper measures against electro static discharge , including the followings, are strongly recommended. dissipating the charge with conductive materials preventing the charge generation with moisture neutralizing the charge with ionizers when performing the characteristics inspection of the leds in your application, customer is advised to check on the leds whether or not they are damaged by esd. such damage can be detected during forward voltage measurement or light up test at low current. (the recomm ended current is 1ma or lower) esd-damaged leds may have a current flow at low voltage, or no longer light up at low current. failure criteria: v f <2.0v at i f =0.5ma (6) thermal management thermal management is an important factor wh en designing your prod uct by using the leds. the rise in led die temperature can be affected by pcb th ermal resistance or/and led spac ing as mounted on the board. customer is advised to design the product to ensure that the led die temperature does not exceed the required maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measuring point: c/w w=input power(i f v f ): w ts point
nichia sts-da1-1322d 17 (7) cleaning if required, isopropyl alcohol (ipa) should be used. ot her solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. ultrasonic cleaning is not recommended for the leds since it may adverse ly effect on the leds by the ultrasonic power and led assembled condition. if it is unavoidable, customer is advised to check prior to use that the cleaning will not damage the leds. (8) eye safety the international electrical commission (iec) publis hed in 2006, iec 62471:2006 photobiological safety of lamps and lamp systems which includes leds within its scope. meanwhile leds were removed from the scope of the iec 60825-1:2007 laser safety standard, the 2001 edition of which included led sources within its scope. however, keep it mind that some countries and regions have adopted standards based on the iec laser safety standard iec 60825-1:2001 which includes leds within its scope. follo wing iec 62471:2006, most of nichia leds can be classified as belonging to either exempt group or risk group 1. especially a high-power led, that emits light containing blue wavelengt hs, may be in risk group 2. great care should be taken when viewing directly the led driven at high current or the led with optical instruments, which grea tly increase the hazard to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, precaution should be taken to avoid adverse e ffect on human body caused by the light stimulus. (9) others the leds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applicat ions in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuc lear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. customer and nichia shall agree the official specification of su pplied products prior to the star t of a customer?s volume prod uction. the appearance and specifications of the product may be modified for improvement without notice.
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