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1. general description the sa602a is a low-power vhf monolithic doub le-balanced mixer with input amplifier, on-board oscillator, and voltage regulator. it is intended fo r high-performance, low-power communication systems. the guaranteed para meters of the sa602a make this device well-suited for cellular radio applications. the mixer is a ?gilbert cell? multiplier configuration which typically provides 18 db of gain at 45 mhz. the oscillator op erates to 200 mhz. it can be configured as a crystal oscillator, a tuned tank oscillator, or a buffer for an external lo. for higher frequencies, the lo input may be externally driven. the noise figure at 45 mhz is typically less than 5 db. the gain, intercept performance, low-power and noise characteristics make the sa602a a superior choice for high-performance battery operated equipment. it is available in an 8-lead so (surface-mount miniature package). 2. features and benefits ? low current consumption: 2.4 ma typical ? excellent noise figure: <4.7 db typical at 45 mhz ? high operating frequency ? excellent gain, interc ept and sensitivity ? low external parts count; suitabl e for crystal/ceramic filters ? sa602a meets cellular radio specifications 3. applications ? cellular radio mi xer/oscillator ? portable radio ? vhf transceivers ? rf data links ? hf/vhf frequency conversion ? instrumentation frequency conversion ? broadband lans sa602a double-balanced mixer and oscillator rev. 3 ? 27 may 2014 product data sheet
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 2 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 4. ordering information 4.1 ordering options 5. block diagram table 1. ordering information type number package name description version sa602ad/01 so8 plastic small outline package; 8 leads; body width 3.9 mm sot96-1 table 2. ordering options type number orderable part number package packing method minimum order quantity temperature sa602ad/01 sa602ad/01,112 so8 standard marking * ic?s tube - dsc bulk pack 2000 t amb = ? 40 ? c to +85 ?c sa602ad/01,118 so8 reel 13? q1/t1 standard mark smd 2500 t amb = ? 40 ? c to +85 ?c fig 1. block diagram aaa-013202 876 1234 in_a in_b gnd out_a v cc osc_e osc_b oscillator eb voltage regulator 5 out_b
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 3 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin configuration for so8 sa602ad/01 in_a v cc in_b osc_e gnd osc_b out_a out_b aaa-013201 1 2 3 4 6 5 8 7 table 3. pin description symbol pin description in_a 1 rf input a in_b 2 rf input b gnd 3 ground out_a 4 mixer output a out_b 5 mixer output b osc_b 6 oscillator input (base) osc_e 7 oscillator output (emitter) v cc 8 supply voltage
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 4 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 7. functional description the sa602a is a gilbert cell, an oscillator/ buffer, and a temperat ure-compensated bias network as shown in figure 3 . the gilbert cell is a differen tial amplifier (in_a and in_b pins) that drives a balanced switching cell. th e differential input stage provides gain and determines the noise figure and signal handling performance of the system. the sa602a is designed for optimum low-power performance. when used with the sa604a as a 45 mhz cellular radio second if and demodulator, the sa602a is capable of receiving ? 119 dbm signals with a 12 db s/n ratio. third-order intercept is typically ? 13 dbm (that is approximately +5 dbm output intercept because of the rf gain). the system designer must be cognizant of this large signal limitation. when designing lans or other closed systems where transmission le vels are high, and small-signal or signal-to-noise issues are not critical, the input to the sa602a should be appropriately scaled. besides excellent low-power performance well into vhf, the sa602a is designed to be flexible. the input, rf mixer output and osc illator ports support various configurations provided the designer understands certain constraints, which are explained here. the rf inputs (in_a and in_b pins) are biased internally. they are symmetrical. the equivalent ac input impeda nce is approximately 1.5 k ??? 3 pf through 50 mhz. in_a and in_b pins can be used interchangeably, but they should not be dc biased externally. figure 4 shows three typical input configurations. fig 3. equivalent circuit aaa-013205 18 k 25 k buffer 6 7 bias 1.5 k 4 1.5 k 5 bias 1 1.5 k 3 gnd 1.5 k bias 2
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 5 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator the mixer outputs (out_a and out_b pins) are also internally biased. each output is connected to the internal positive supply by a 1.5 k ? resistor. this permits direct output termination yet a llows for balanced output as well. figure 5 shows three single-ended output configurations and a balanced output. a. single-ended tuned input b. balanced input (for attenuation of second-order products) c. single-ended untuned input fig 4. input configuration aaa-013216 sa602a 1 2 input aaa-013217 sa602a 1 2 aaa-013218 sa602a 1 2 a. single-ended ceramic filter b. single-ended crystal filter c. single-ended ift d. balanced output fig 5. output configuration sa602a 4 5 aaa-013219 sa602a 4 5 aaa-013220 sa602a 4 5 aaa-013221 sa602a 4 5 aaa-013222
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 6 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator the oscillator can sustain oscillation bey ond 200 mhz in crystal or tuned tank configurations. the upper limit of operation is determined by tank ?q? and required drive levels. the higher the ?q? of the tank or th e smaller the required drive, the higher the permissible oscillation frequency. if the requir ed lo is beyond oscillation limits, or the system calls for an external lo, the external signal can be injected at osc_b (pin 6) through a dc blocking capacitor. external lo should be at least 200 mv (peak-to-peak). figure 6 shows several proven oscillator circuits. figure 6 a is appropriate for cellular radio. as shown, an overtone mode of operation is utilized. capaci tor c3 and inductor l1 suppress oscillation at the crystal fundamental frequency . in the fundamental mode, the suppression network is omitted. figure 7 shows a colpitts varactor tuned tank os cillator suitable for synthesizer-controlled applications. it is important to buffer the outp ut of this circuit to assure that switching spikes from the first counter or prescaler do not end up in the oscillator spectrum. the dual-gate mosfet provides optimum isolation with low current. the fet offers good isolation, simplicity, and lo w current, while the bipolar transistors provide the simple solution for non-critical applications. the resi stive divider in the emitter-follower circuit should be chosen to provide the minimum in put signal that assures correct system operation. when operated above 100 mhz, the oscillator may not start if the q of the tank is too low. a 22 k ? resistor from osc_e (pin 7) to ground increases the dc bias current of the oscillator transistor. this improves the ac ope rating characteristic of the transistor and should help the oscillator to start. a 22 k ? resistor does not upset the other dc biasing internal to the device, but smaller resistance values should be avoided. a. colpitts crystal oscillator (overtone mode) b. colpitts l/c tank oscillator c. hartley l/c tank oscillator fig 6. oscillator circuits sa602a aaa-013237 1 2 3 4 6 5 8 7 c1 c3 c2 xtal l1 sa602a aaa-013238 1 2 3 4 6 5 8 7 sa602a aaa-013239 1 2 3 4 6 5 8 7
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 7 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 8. application design-in information fig 7. colpitts oscillator suitable for sy nthesizer applications and typical buffers sa602a aaa-013258 1 2 3 4 6 5 8 7 0.1 f 5.5 h 10 f 10 nf +6 v to buffer 7 pf 10 pf 1000 pf 0.06 h 1000 pf dc control voltage from synthesizer mv2105 or equivalent 0.01 f 2 k to synthesizer 330 3sk126 0.01 f 100 k 1.0 nf 100 k 100 k 2 pf to synthesizer 2n5484 2n918 fig 8. typical application for cellular radio aaa-013257 sa602a 1 2 45 mhz rf input 47 pf 220 pf 100 nf 0.209 h to 0.283 h 3 4 6 5 8 7 10 pf 1 nf 22 pf 44.545 mhz third overtone crystal 0.5 h to 1.3 h output 10 nf 100 nf 5.5 h v cc 6.8 f sfg455a3 or equivalent
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 8 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 9. limiting values 10. thermal characteristics 11. static characteristics 12. dynamic characteristics table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage - 9 v t stg storage temperature ? 65 +150 ?c t amb ambient temperature operating ? 40 +85 ?c table 5. thermal characteristics symbol parameter conditions min max unit z th(j-a) transient thermal impedance from junction to ambient -90 ? c/w table 6. static characteristics v cc =+6v; t amb =25 ? c; unless specified otherwise. symbol parameter conditions min typ max unit v cc supply voltage 4.5 - 8.0 v i cc supply current - 2.4 2.8 ma table 7. dynamic characteristics t amb =25 ? c; v cc = +6 v; unless specified otherwise. symbol parameter conditions min typ max unit f i input frequency - 500 - mhz f osc oscillator frequency - 200 - mhz nf noise figure at 45 mhz - 5.0 5.5 db ip3 i input third-order intercept point rf input = ? 45 dbm; rf1 = 45.0 mhz; rf2=45.06mhz - ? 13 ? 15 dbm g conv conversion gain at 45 mhz 14 17 - db r i(rf) rf input resistance 1.5 - - k ? c i(rf) rf input capacitance - 3 3.5 pf r o(mix) mixer output resistance out_a, out_b pins - 1.5 - k ?
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 9 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 13. performance curves fig 9. supply current versus temperature fig 10. conversion gain versus temperature fig 11. third-order intercept point versus temperature fig 12. noise figure versus temperature rf1 = 45 mhz; if = 455 khz; rf2 = 45.06 mhz fig 13. third-order inte rcept and compression fig 14. input th ird-order intercept point versus supply voltage 1.5 3.0 2.5 2.0 3.5 i cc (ma) aaa-013241 t amb (c) ?40 90 ?20 0 20 40 60 80 v cc = 8.5 v 6.0 v 4.5 v 16.0 18.0 20.0 g conv (db) 14.0 aaa-013242 t amb (c) ?40 90 ? 200 20406080 v cc = 8.5 v 6.0 v 4.5 v ?14.0 ?12.0 ?10.0 ip3 i (dbm) ?16.0 aaa-013243 t amb (c) ?40 90 ?20 0 20 40 60 80 4.0 5.5 5.0 4.5 6.0 nf (db) aaa-013244 t amb (c) ?40 90 ?20 0 20 40 60 80 v cc = 8.5 v 6.0 v 4.5 v rf input level (dbm) ?80 20 0 ?40 ?20 ?60 aaa-013245 ?40 0 40 ?80 if output power (dbm) third-order product fund. product aaa-013246 v cc (v) 410 8 6 ?18 ?12 ?14 ?16 ?10 ip3 i (dbm)
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 10 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 14. test information fig 15. test configuration aaa-013203 sa602a 1 2 45 mhz rf input 47 pf 220 pf 100 nf 0.209 h to 0.283 h 3 4 6 5 8 7 10 pf 1 nf 22 pf 44.545 mhz third overtone crystal 0.5 h to 1.3 h 303 h to 765 h 100 nf 560 pf 330 pf 455 khz if output 10 nf 100 nf 5.5 h v cc 6.8 f
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 11 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 15. package outline fig 16. package outline sot96-1 (so8) 81,7 $ pd[ $ $ $ e s f ' ( h + ( / / s 4 = \ z y 5()(5(1&(6 287/,1( 9(56,21 (8523($1 352-(&7,21 ,668('$7( ,(& -('(& -(,7$ pp lqfkhv r r ',0(16,216lqfkglphqvlrqvduhghulyhgiurpwkhruljlqdoppgl phqvlrqv 1rwhv 3odvwlfruphwdosurwuxvlrqvripplqfkpd[lpxp shuvlghduhqrwlqfoxghg 3odvwlfruphwdosurwuxvlrqvripplqfkpd[lpxp shuvlghduhqrwlqfoxghg 627 ; z 0 $ $ $ e s ' + ( / s 4 ghwdlo; ( = h f / y 0 $ $ $ slqlqgh[ \ ( 06 pp vfdoh 62sodvwlfvpdoorxwolqhsdfndj hohdgverg\zlgwkpp 627
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 12 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 16. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 16.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 16.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 13 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 16.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 17 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 8 and 9 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 17 . table 8. snpb eutectic process (from j-std-020d) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 ? 350 < 2.5 235 220 ? 2.5 220 220 table 9. lead-free process (from j-std-020d) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 14 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 17. soldering: pcb footprints msl: moisture sensitivity level fig 17. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature fig 18. pcb footprint for sot9 6-1 (so8); reflow soldering vrwbiu rffxslhgduhd vroghuodqgv 'lphqvlrqvlqpp sodfhphqwdffxudf\? ? ?
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 15 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 18. abbreviations fig 19. pcb footprint for sot96-1 (so8); wave soldering vrwbiz vroghuuhvlvw rffxslhgduhd vroghuodqgv 'lphqvlrqvlqpp erduggluhfwlrq sodfhphqwdffxuudf\? ? ? ? ? hqodujhgvroghuodqg table 10. abbreviations acronym description fet field-effect transistor hf high frequency if intermediate frequency lan local area network lo local oscillator mosfet metal-oxide semiconductor field-effect transistor rf radio frequency vhf very high frequency
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 16 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 19. revision history table 11. revision history document id release date data sheet status change notice supersedes sa602a v.3 20140527 product data sheet - sa602a v.2 modifications: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? section 1 ? general description ? , last sentence: deleted ?8-lead dual in-line plastic package? ? table 1 ? ordering information ? : ? type number sa602an (dip8 package, sot97-1 pa ckage outline) is discontinued and removed from this data sheet ? type number changed from ?sa602ad? to ?sa602ad/01? ? added section 4.1 ? ordering options ? ? added section 6.2 ? pin description ? ? figure 7 ? colpitts oscillator suitable for synthesizer applications and typical buffers ? : capacitor value corrected from ?0.10 pf? to ?10 nf? (above pin 8) ? figure 8 ? typical application for cellular radio ? : component value corrected from ?34.545 mhz third overtone crystal? to ?44.545 mh z third overtone crystal? ? table 5 ? thermal characteristics ? : deleted characteristic val ues for ?n package? (sa602an) ? old table ?ac/dc electrical c haracteristics? split into table 6 ? static characteristics ? and table 7 ? dynamic characteristics ? ? table 7 ? dynamic characteristics ? , conditions for ip3 i , input third-order intercept point, corrected from ?f 1 ? to ?rf1? and from ?f 2 ? to ?rf2? ? figure 15 ? test configuration ? : component values corrected throughout this drawing ? package outline sot97-1 (dip8) is deleted ? added soldering information ? added section 17 ? soldering: pcb footprints ? ? added section 18 ? abbreviations ? sa602a v.2 19971107 product specification 853-1424 18662 ne/sa602a v.1 ne/sa602a v.1 19900417 product specification 853-1424 99374 -
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 17 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator 20. legal information 20.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. 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stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
sa602a all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all rights rese rved. product data sheet rev. 3 ? 27 may 2014 18 of 19 nxp semiconductors sa602a double-balanced mixer and oscillator export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 20.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 21. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors sa602a double-balanced mixer and oscillator ? nxp semiconductors n.v. 2014. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 27 may 2014 document identifier: sa602a please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 22. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4.1 ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 4 8 application design-in information . . . . . . . . . . 7 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 thermal characteristics . . . . . . . . . . . . . . . . . . 8 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 8 12 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 13 performance curves . . . . . . . . . . . . . . . . . . . . . 9 14 test information . . . . . . . . . . . . . . . . . . . . . . . . 10 15 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 16 soldering of smd packages . . . . . . . . . . . . . . 12 16.1 introduction to soldering . . . . . . . . . . . . . . . . . 12 16.2 wave and reflow soldering . . . . . . . . . . . . . . . 12 16.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 16.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 17 soldering: pcb footprints. . . . . . . . . . . . . . . . 14 18 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 19 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 20 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 20.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 20.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 20.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 20.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 21 contact information. . . . . . . . . . . . . . . . . . . . . 18 22 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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