1. 2. 3. material content data sheet sales product name bso080p03ns3e g issued 29. august 2013 ma# MA000650830 package pg-dso-8-39 weight* 83.95 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.479 2.95 2.95 29531 29531 leadframe inorganic material phosphorus 7723-14-0 0.010 0.01 122 non noble metal zinc 7440-66-6 0.041 0.05 488 non noble metal iron 7439-89-6 0.820 0.98 9762 non noble metal copper 7440-50-8 33.276 39.64 40.68 396378 406750 wire non noble metal copper 7440-50-8 0.335 0.40 0.40 3994 3994 encapsulation organic material carbon black 1333-86-4 0.227 0.27 2702 plastics epoxy resin - 7.032 8.38 83763 inorganic material silicondioxide 60676-86-0 38.108 45.39 54.04 453939 540404 leadfinish non noble metal tin 7440-31-5 0.814 0.97 0.97 9694 9694 plating noble metal silver 7440-22-4 0.073 0.09 0.09 865 865 glue plastics epoxy resin - 0.110 0.13 1314 noble metal silver 7440-22-4 0.625 0.74 0.87 7448 8762 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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