1 micromodul? connectors, pitch 1.27 mm micromodul? tab header, upright, mics: with retaining hooks, solder contacts dual row staggered state: active approvals: of 4 30 mics 01/2018 ps q k u a r l a i m t y e n e c m a t r i i o f n n d o e c l e a d f n a o b i r t i a c c a i f c i i t o r n e c ps q k u a r l a i m t y e n e c m a t r i i o f n n d o e c l e a d f n a o b i r t i a c c a i f c i i t o r n e c
2 environmental conditions temerature range 0 c0 c 1 1 upper limit temperature (insulating body) rti (electrical) of the ul yellow card materials nsulating bod p 0 according to u contact tab cun renicel and tinlated mc cun renicel and goldlated mc u mechanical data eression orce contact tab rom insulating bod ncontact electrical data (at t amb 20 c) ated current 2 ated voltage 0 c (20 c ohne ercsichtigung der riech und utstrecen nach ec 0dn en 0) material grou (ec)0 (u) (ct 00) creeage distance 0 mm clearance 0 mm nsulation resistance o 30 mics 01/2018
3 *a cranked solder contact (from 20 poles on), all cranked on request *b contact 1 *c printed circuit board layout, solder side view *d necessary space for use of pull-off tongs az30 *e component area (b x 7) *f recommended thickness of circuit board 1.5 0.14 mm *g printed circuit board layout, solder side view, for pole numbers 20 and 26, with bore holes for cranked solder contacts *h bore hole for cranked solder contact of 4 30 mics 01/2018 *g
4 designation pole number pu (pieces) mdq (pieces) dimensions (mm) (mm) c (mm) mc 0 000 2000 mc 0 000 2000 0 mc 0 000 2000 2 mc 0 0 000 2000 0 mc 2 2 00 2000 02 mc 00 2000 2 20 mc 00 000 0 20 22 mc 00 000 2 2 2 mc 20 20 00 000 2 2 2 mc 2 2 00 000 0 mc 0 0 u 000 2000 mc 0 0 u 000 2000 0 mc 0 0 u 000 2000 2 mc 0 0 u 0 000 2000 0 mc 20 0 u 20 00 000 2 2 2 packaging: in bulk, in a cardboard box of 4 30 mics 01/2018
|
