nichia sts - da1 - 2394h nichia corporation specifications for uv led ncsu033b(t) pb built rohs compliant
nichia sts - da1 - 2394h 1 specifications (1) absolute maximum ratings item symbo l absolute maximum rating unit forward current i f 700 ma pulse forward current i fp 1000 ma allowable reverse current i r 85 ma power dissipation p d 3.08 w operating temperature t opr - 10~85 c storage temperature t stg - 40~100 c junction temperature t j 130 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =500ma 3.8 - v radiant flux e i f =500ma 450 - mw peak wavelength p i f =500ma 365 - nm spectr um half width ? i f =500ma 9.0 - nm thermal resistance r js - 4.4 7.3 c/w * characteristics at t s =25c. * radiant flux value as per cie 127:2007 standard. * r js is thermal resistance from junction to t s measuring point. * it is recommended to operat e the leds at a current greater than 10% of the sorting current to stabilize the led characteristics.
nichia sts - da1 - 2394h 2 ranks item rank min max unit forward voltage h 4.0 4.4 v m 3.6 4.0 l 3.2 3.6 radiant flux p34d22 590 640 mw p34d21 540 590 p33d22 495 540 p33d21 455 495 p32d22 415 455 p32d21 380 415 peak wavelength ua 360 370 nm * ranking at t s =25c. * forward voltage tolerance: 0.05v * radiant flux tolerance: 6% * peak wavelength tolerance: 3nm * leds from the above ranks will be shipped . the rank combination ratio per shipment will be decided by nichia.
nichia sts - da1 - 2394h 3 outline dimensions s t s - d a 7 - 0 4 5 4 b n c s u 0 3 3 x n o . ( g u n i t : m m ) t h i s p r o d u c t c o m p l i e s w i t h r o h s d i r e c t i v e . u ? r o h s ? m * ( g u n i t : m m , t o l e r a n c e : 0 . 2 ) ? i t e m ` | p a c k a g e m a t e r i a l s | g l a s s m a t e r i a l s O | e l e c t r o d e s m a t e r i a l s ` | d i e h e a t s i n k m a t e r i a l s | w e i g h t d e s c r i p t i o n c e r a m i c s ? | / ` h a r d g l a s s / k o v a r a u - p l a t e d a u - p l a t e d 0 . 2 9 g ( t y p ) 6 . 8 6 . 8 4 . 3 5 0 . 6 5 2 . 1 0 . 6 5 2 . 8 4 . 2 6 . 6 6 . 6 c a t h o d e m a r k c a t h o d e a n o d e d i e h e a t s i n k ` k a o p r o t e c t i o n d e v i c e ` d i e h e a t s i n k
nichia sts - da1 - 2394h 4 soldering ? recommended reflow soldering condition(lead recommended soldering pad pattern * this led is designed to be reflow soldered on to a pcb. if dip soldered or hand soldered, nichia cannot guarantee its reliability. * reflow soldering must not be performed more than twice. * avoid rapid cooling. ramp down the temperature gradually from the pe ak temperature. * nitrogen reflow soldering is recommended. air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * repairing should not be done after the leds have been soldered. it should be confirmed be forehand whether the characteristics of the leds will or will not be damaged by repairing. * the die heat sink should be soldered to customer pcb. if it is difficult or impossible, use high heat - dissipating adhesive. * when soldering, do not apply st ress to the led while the led is hot. * when using a pick and place machine, choose an appropriate nozzle for this product. * the recommended soldering pad pattern is designed for attachment of the led without problems. when precise mounting accuracy is required, such as high - density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * when flux is used, it should be a halogen free flux. ensure that the manufacturing process is not designed in a manner wh ere the flux will come in contact with the leds. * make sure that there are no issues with the type and amount of solder that is being used. 120sec m ax pre - heat 180 to 200 c 260c m ax 10sec m ax 60sec m ax above 220c 1 to 5c per sec ( g u n i t : m m ) 4 . 2 8 . 4 7 8 . 4 2 . 8
nichia sts - da1 - 2394h 5 packaging - bulk l a b e l n i c h i a l e d s t s - d a 7 - 1 1 0 8 b n x x x x x x x a n t i - s t a t i c i c p a c k b a g i c ` s e a l r o h s n x x x x x x x u v l e d * * * * * * * n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n t y p e l o t q t y . y m x x x x - r r r p c s w a r n i n g a n d e x p l a n a t o r y l a b e l s l e d r a d i a t i o n a v o i d e x p o s u r e t o b e a m c l a s s 3 b l e d p r o d u c t l e d ` ? ? 3 b l e d u ? u v l e d l e d r a d i a t i o n l e d ` ? ? 3 b l e d u ? c l a s s 3 b l e d p r o d u c t a v o i d e x p o s u r e t o b e a m d e s i c c a n t s ? K g ? m o i s t u r e - p r o o f b a g s a r e p a c k e d i n c a r d b o a r d b o x e s w i t h s h o c k a b s o r b i n g m a t e r i a l s t o f i l l e m p t y s p a c e s . m o i s t u r e - p r o o f b a g ? n o . i c ? ` a n t i - s t a t i c i c p a c k s a r e s h i p p e d w i t h d e s i c c a n t s i n h e a t - s e a l e d m o i s t u r e - p r o o f b a g s . * u ? i c ? n o ` y ? \ H y ? B ? y * ` ? y ? ? * ? Q H n u ? p ? ? * p r o d u c t s s h i p p e d i n a n t i - s t a t i c i c p a c k s a r e p a c k e d i n a m o i s t u r e - p r o o f b a g . t h e y a r e s h i p p e d i n c a r d b o a r d b o x e s t o p r o t e c t t h e m f r o m e x t e r n a l f o r c e s d u r i n g t r a n s p o r t a t i o n . d o n o t d r o p o r e x p o s e t h e b o x t o e x t e r n a l f o r c e s a s i t m a y d a m a g e t h e p r o d u c t s . d o n o t e x p o s e t o w a t e r . t h e b o x i s n o t w a t e r - r e s i s t a n t . u s i n g t h e o r i g i n a l p a c k a g e m a t e r i a l o r e q u i v a l e n t i n t r a n s i t i s r e c o m m e n d e d . l a b e l r o h s n x x x x x x x u v l e d * * * * * * * r r r p c s t y p e r a n k q t y . n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n f o r d e t a i l s , s e e " l o t n u m b e r i n g c o d e " i n t h i s d o c u m e n t . * ? i f n o t p r o v i d e d , i t w i l l n o t b e i n d i c a t e d o n t h e l a b e l . * * * * * * * i s t h e c u s t o m e r p a r t n u m b e r . O * * * * * * * * ?
nichia sts - da1 - 2394h 6 tape and reel dimensions 7 . 1 5 0 . 1 0 . 2 9 0 . 1 2 . 5 0 . 1 n x x x 0 3 3 x s t s - d a 7 - 0 1 8 1 a r e e l s i z e : 5 0 0 p c s 1 ` 5 0 0 * t h e t a p e p a c k i n g m e t h o d c o m p l i e s w i t h j i s c 0 8 0 6 ( p a c k a g i n g o f e l e c t r o n i c c o m p o n e n t s o n c o n t i n u o u s t a p e s ) . * j i s c 0 8 0 6 ? ` ( g u n i t : m m ) n o . ` r e e l 1 5 . 4 1 6 0 + 1 - 0 - 0 1 8 0 + 0 - 3 2 1 0 . 8 1 3 0 . 2 l a b e l 1 3 + 1 7 . 1 5 0 . 1 ` t a p e 1 2 2 0 . 0 5 4 0 . 1 1 . 5 + 0 . 1 - 0 1 . 7 5 0 . 1 5 . 5 0 . 0 5 1 2 + 0 . 3 - 0 . 1 ` / ` t r a i l e r a n d l e a d e r ` ` e m b o s s e d c a r r i e r t a p e ` t o p c o v e r t a p e f e e d d i r e c t i o n ` 4 0 0 m m l e a d e r w i t h o u t t o p c o v e r t a p e 4 0 0 m m m i n ` 1 6 0 m m t r a i l e r 1 6 0 m m m i n ( e m p t y p o c k e t s ) l e d ? l o a d e d p o c k e t s 1 0 0 m m l e a d e r w i t h t o p c o v e r t a p e 1 0 0 m m m i n ( e m p t y p o c k e t ) - 0 c a t h o d e 1 . 5 + 0 . 2 5 * g ? I ` ` ? ` ( 1 0 n ) l e d ` ` N w h e n t h e t a p e i s r e w o u n d d u e t o w o r k i n t e r r u p t i o n s , n o m o r e t h a n 1 0 n s h o u l d b e a p p l i e d t o t h e e m b o s s e d c a r r i e r t a p e . t h e l e d s m a y s t i c k t o t h e t o p c o v e r t a p e .
nichia sts - da1 - 2394h 7 packaging - tape & reel ` ? y ? ? * ? \ H y ? B ? y * ? Q H n u ? p ? ? * u s i n g t h e o r i g i n a l p a c k a g e m a t e r i a l o r e q u i v a l e n t i n t r a n s i t i s r e c o m m e n d e d . d o n o t e x p o s e t o w a t e r . t h e b o x i s n o t w a t e r - r e s i s t a n t . d o n o t d r o p o r e x p o s e t h e b o x t o e x t e r n a l f o r c e s a s i t m a y d a m a g e t h e p r o d u c t s . p r o d u c t s s h i p p e d o n t a p e a n d r e e l a r e p a c k e d i n a m o i s t u r e - p r o o f b a g . t h e y a r e s h i p p e d i n c a r d b o a r d b o x e s t o p r o t e c t t h e m f r o m e x t e r n a l f o r c e s d u r i n g t r a n s p o r t a t i o n . * u ? ` ? n o ` y n i c h i a l e d s t s - d a 7 - 1 1 0 9 b n x x x x x x x m o i s t u r e - p r o o f b a g ? ` s e a l r e e l ` l a b e l l a b e l r o h s n x x x x x x x u v l e d * * * * * * * n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n t y p e l o t q t y . y m x x x x - r r r p c s r o h s n x x x x x x x u v l e d * * * * * * * r r r p c s t y p e r a n k q t y . n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n w a r n i n g a n d e x p l a n a t o r y l a b e l s l e d r a d i a t i o n a v o i d e x p o s u r e t o b e a m c l a s s 3 b l e d p r o d u c t l e d ` ? ? 3 b l e d u ? u v l e d l e d r a d i a t i o n l e d ` ? ? 3 b l e d u ? c l a s s 3 b l e d p r o d u c t a v o i d e x p o s u r e t o b e a m r e e l s a r e s h i p p e d w i t h d e s i c c a n t s i n h e a t - s e a l e d m o i s t u r e - p r o o f b a g s . ` ? ` n o . d e s i c c a n t s m o i s t u r e - p r o o f b a g s a r e p a c k e d i n c a r d b o a r d b o x e s w i t h c o r r u g a t e d p a r t i t i o n s . ? K ` i f n o t p r o v i d e d , i t w i l l n o t b e i n d i c a t e d o n t h e l a b e l . * * * * * * * i s t h e c u s t o m e r p a r t n u m b e r . O * * * * * * * * ? f o r d e t a i l s , s e e " l o t n u m b e r i n g c o d e " i n t h i s d o c u m e n t . * ?
nichia sts - da1 - 2394h 8 lot numbering code lot number is p resented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2014 e 2015 f 2016 g 2017 h 2018 i 2019 j m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx - nichia's product number rrr - ranking by wavelength, ranking by radiant flux, ranking by forward voltage
nichia sts - da1 - 2394h 9 derating characteristics ncsu033b ? no. sts-da7-2588a 0 200 400 600 800 1000 0 20 40 60 80 100 120 derating1 (25, 700) (85, 300) 0 200 400 600 800 1000 0 20 40 60 80 100 120 derating2 (85, 700) 100 1000 10000 1 10 100 duty 700 S allowable forward current(ma) ???? ( ?`??? ) - S solder temperature(die heat sink) vs allowable forward current ?? - S ambient temperature vs allowable forward current S allowable forward current(ma) S allowable forward current(ma) ???? ( ?`??? ) solder temperature(die heat sink)( c) ?? ambient temperature( c) ?`?` duty ratio(%) ?`?` - S duty ratio vs allowable forward current 35 c/w ja r = t a =25 c
nichia sts - da1 - 2394h 10 optical characteristics ncsu033b ? no. sts-da7-2589 0.0 0.2 0.4 0.6 0.8 1.0 300 350 400 450 500 550 600 spectrum ? relative radiant intensity(a.u.) 90 80 70 60 50 40 30 20 10 0 - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 directivity1 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 * ??? all characteristics shown are for reference only and are not guaranteed. 500ma i fp = t a =25 c 500ma i fp = t a =25 c
nichia sts - da1 - 2394h 11 forward current characteristics / temperature characteristics ncsu033b sts-da7-2590 ? no. 2.5 3.0 3.5 4.0 4.5 5.0 -60 -40 -20 0 20 40 60 80 100 120 tavf 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 taiv 10 100 1000 2.5 3.0 3.5 4.0 4.5 5.0 vfif 500 relative radiant flux(a.u.) ?? - ambient temperature vs relative radiant flux forward current(ma) 0.0 0.5 1.0 1.5 2.0 2.5 0 200 400 600 800 1000 1200 ifiv relative radiant flux(a.u.) - forward current vs relative radiant flux forward current(ma) ?R - forward voltage vs forward current ?? - ?R ambient temperature vs forward voltage ?R forward voltage(v) ?R forward voltage(v) ?? ambient temperature( c) ?? ambient temperature( c) t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25 c i fp = 500ma i fp = 500ma
nichia sts - da1 - 2394h 12 forward current characteristics / temper ature characteristics ? no. ncsu033b sts-da7-2591 359 361 363 365 367 369 371 10 100 1000 if d 359 361 363 365 367 369 371 -60 -40 -20 0 20 40 60 80 100 120 ta d 500ma i fp = - ?`L forward current vs peak wavelength forward current(ma) ?? - ?`L ambient temperature vs peak wavelength peak wavelength(nm) ?`L peak wavelength(nm) ?`L ?? ambient temperature( c) * ??? all characteristics shown are for reference only and are not guaranteed. t a =25 c
nichia sts - da1 - 2394h 13 reliability (1) tests and results test reference standard test conditions test duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed - 4701 300 301 t sld =260c, 10sec, 2reflows, p recondition: 30c, 70%rh, 168hr #1 0/10 temperature cycle jeita ed - 4701 100 105 - 40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/10 high temperature storage jeita ed - 4701 200 201 t a =100c 1000hours #1 0/10 low temperature storage jeita e d - 4701 200 202 t a = - 40c 1000hours #1 0/10 room temperature operating life t a =25c, i f =700ma 1000hours #1 0/10 high temperature operating life t a =85c, i f =300ma 1000hours #1 0/10 temperature humidity operating life 60c, rh=90%, i f =450ma 500hours #1 0 /10 low temperature operating life t a = - 10c, i f =500ma 1000hours #1 0/10 vibration jeita ed - 4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/10 electrostatic discharges jeita ed - 4701 300 304 hbm, 2kv, 1.5k, 100pf, 3pulses, alternately positive or negative #1 0/10 notes: 1) r ja 35c/w 2) measurements are performed after allowing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure c riteria #1 forward voltage(v f ) i f =500ma >initial value1.1 radiant flux( e ) i f =500ma nichia sts - da1 - 2394h 14 cautions (1) storage conditions temperature humidity time storage before opening aluminum bag 30c 90%rh within 1 year from delivery date af ter opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. see ipc/jedec std - 020 for moisture - sensitivity details. absorbed moisture in led packages can vaporize and expand during solde ring, which can cause interface delamination and result in optical performance degradation. products are packed in moisture - proof aluminum bags to minimize moisture absorption during transportation and storage. included silica gel desiccants chang e from blue to red if moisture had penetrated bags. after opening the moisture - proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed containe r, preferably the original moisture - proof bags for storage. after the period after opening storage time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. although the l eads or electrode pads (anode and cathode) of the product are plated with gold, prolonged exposure to a corrosive environment might cause the gold plated the leads or electrode pads to tarnish, and thus leading to difficulties in soldering. if unus ed leds remain, they must be stored in a hermetically sealed container. nichia recommends using the original moisture - proof bag for storage. do not use sulfur - containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur. the contaminated plating of leds might cause an open circuit. silicone rubber is recommended as a material for seals. be ar in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. to prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions. do not store the leds in a dusty environment. do not expose the leds to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (2) directions for use when designing a ci rcuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended. if the leds are operated with constant vo ltage using circuit a, the current through the leds may vary due to the variation in forward voltage characteristics of the leds. this product should be operated using forward current. ensure that the product is not subjected to either forward or reverse voltage while it is not in use. in particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the led die. when used in displays that are not used for a long time, the main power supply should be switched off for safety. it is recommended to operate the leds at a current greater than 10% of the sorting current to stabilize t he led characteristics. ensure that excessive voltages such as lightning surges are not applied to the leds. for outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. this led also emits visible light. ple ase take notice of visible light spectrum, in case you use this led as light source of sensors etc. ( a ) . . . ( b ) . . .
nichia sts - da1 - 2394h 15 (3) handling precautions do not handle the leds with bare hands as it will contaminate the led surface and may affect the optical characteristics: it might cause the led to be deformed and/or the wire to break, which will cause the led not to illuminate. when handling the product with tweezers, be careful not to apply excessive force to the glass. otherwise, the glass can be cut, chipped, d elaminate or deformed, causing wire - bond breaks and catastrophic failures. dropping the product may cause damage. do not stack assembled pcbs together. failure to comply can cause the glass portion of the product to be cut, chipped, delaminated a nd/or deformed. it may cause wire to break, leading to catastrophic failures. (4) design consideration although nichia recommends using a copper pcb for this product, customer is advised to verify the pcb with the products before use. stress during soldering can cause the glass lens to break and/or the solder joints to crack. pcb warpage after mounting the products onto a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow an d twist. the position and orientation of the leds affect how much mechanical stress is exerted on the leds placed near the score lin es. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. if an aluminum pcb is used, customer is advised to verify the pcb with the products before use. thermal stress during use can cause the solder joints to crack. (5) electrost atic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: elim inating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials ensure that tools, jigs and machines that are being used are properly grounded and that proper grounding techniques are used in work areas. for devices/equipment that mount the leds, protection against surge voltages should also be used. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is a dvised to check if the leds are damaged by esd when performing the characteristics inspection of the leds in the application. damage can be detected with a forward voltage measurement at low current (1ma). esd damaged leds may have current flow at a low voltage. failure criteria: v f <2.0v at i f =0.5ma
nichia sts - da1 - 2394h 16 (6) thermal management proper thermal management is an important when designing products with leds. led die temperature is affected by pcb thermal resistance and led spacing on the boar d. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the foll owing equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (die heat sink): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measuring point: c/w w=input power(i f v f ): w (7) cleaning the leds should not be cleaned. other cleaning agents except for freon solvent should be tested prior to use whether they will not affect the package and the glass. please note that freon solvent is prohibited worldwide. ultrasonic cleaning is not recommended since it may have adverse effects on the leds depending on the ul trasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advised to make sure the leds will not be damaged prior to cleaning. (8) eye safety in 2006, the international electrical commission (iec) published iec 6 2471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825 - 1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825 - 1:20112001, which still includes leds in its scope. most of nichia's leds can be classified as belonging into either the exempt group or risk group 1. high - power leds, that emit light containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. the products are uv light leds, and radiate intense uv ligh t during operation. since uv light can be harmful to eyes, do not look directly into the uv light, even through an optical instrument. in case of the light reflection, uv protective glasses are required to use in order to avoid damage by the light. t s p o i n t
nichia sts - da1 - 2394h 17 (9) others the leds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in a dvance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersible rep eaters, nuclear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. the specifications and appearance of this product may change without notice; nichia does not guarantee the contents of this specificat ion. both the customer and nichia will agree on the official specifications of supplied products before the volume production of a program begins.
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